TW449528B - Improved polishing pad with reduced moisture absorption - Google Patents

Abstract

A polishing pad or belt or other device with increased resistance to moisture absorption for improved planarizing effectiveness and consistency. The relatively moisture resistant polishing pad contains additives to improve wetting of the pad surface for good slurry distribution.

Description

Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs on employee consumption 4495 2 8 A7 __B7___ V. Description of the Invention (/) Related Application = This case is the complete provisional application numbered 60 / 087,742, filed in the United States on June 2, 1998 Application. BACKGROUND OF THE INVENTION = The purpose of the present invention is to manufacture a polishing pad, belt or other device having increased resistance to moisture absorption in order to improve the flattening effect and uniformity. The polishing pads currently available are typically polyurethane foams, and because they absorb moisture easily, their effectiveness and uniformity are limited. During operation, the polishing pads are in continuous contact with the water-soluble slurry and the wipe solution. The absorbed moisture will affect the function of the polishing pad in the following ways: Softening, swelling or loss of rigidity due to the decline of physical properties and chemical properties. As a result, the flattening effect and life of the polishing pad are reduced. Gradually changing the nature and integrity of the polishing pad results in unstable and inconsistent performance. Because the previous polishing pad was too hydrophobic, so the wettability was poor, the slurry could not be fully distributed, and the removal rate would be reduced, so the previous manufacturing of polishing pads that have reduced moisture absorption or increased resistance to decay Attempts have been limited. The present invention overcomes the limitations of conventional hydrophobic polishing pads through the use of hydrophilic additives. Summary of the Invention: The present invention includes a relatively moisture-resistant polishing pad with additives that can improve the wettability of the surface of the polishing pad, so that the slurry is well distributed. Brief description of the invention = Although the description of the present invention is about pads *, the present invention can also be used for any 3 IIII 1 1 ^^ · II *-1-I «II III! II {Please read the notes on the back before filling (This page) This paper size is in accordance with the Chinese National Standard (CNS) A4 (210 X 297 mm). This is the “495 2 8 A7. __B7_- _” _5_7_7__ _ 5 What is the invention description (α)? The type or shape includes, but is not limited to, sheet, belt, disc, roller, and pendulum. The base material of the polishing pad can be any polymer material or any combination of polymer materials, including thermoplastic and crosslinked materials, which absorb less than 4% of moisture after soaking for 24 hours. The polishing pad may include a porous structure. This porosity can be achieved by any suitable method, including (but not limited to) air blowing, foaming, and inclusion of filled or unfilled hollow micro-elements. This hole can be any combination or distribution of size, shape and quality (open or closed cells). The polishing pad may contain any type of tissue texture, which may be formed naturally or by any suitable method. This tissue texture can be generated during the manufacturing process or during use. Additives suitable for improving wettability and slurry distribution include any type of hydrophilic additives, such as surfactants, and relatively polar polymer materials, including (but not limited to) polyurethane 'polyamines, and polymers ester. Additives can be liquid, solid, semi-solid, or a combination of solid and liquid. The additive can be reactive or non-reactive with other materials in the polishing pad. Additives can be located in the polymer substrate or in the holes of the polishing material. Adding Maki may be any shape, size, or distribution, and can perform additional functions (such as hydrophilic hollow beads, used to increase wetting and produce porosity. The material can be maintained in the original position and together with the polishing material Wear away, or the additive can be suddenly released or attached as a layer of coating, penetration, or other -square g to improve the interaction between the surface of the pad and the slurry .. 4 — 111 — — —--- > — I. — — — --- I ii II I__I_I (Please read the notes on the back before filling out this page) This paper size applies to Chinese national standard (CNSDA4 specification (210x 297mm t))

Claims (1)

A8 B8 C8 D8 4495 2 8 881 090 93 VI. Scope of patent application 1_ A relatively moisture-resistant polishing pad that provides sufficient wettability of the surface of the polishing pad to allow good slurry distribution, and the polishing pad contains a polymer Base material and a hydrophilic or relatively polar polymerizable additive. 2. The pad as described in item 1 of the patent scope of claim g, wherein the pad is of the type or shape of a sheet, a tape, a disc, a roller or a pendulum. 3. The pad as described in item 1 of the scope of the patent application, wherein the polymeric material is a thermoplastic or crosslinked material that absorbs less than 4% of moisture after soaking for 24 hours. 4. The pad described in item 1 of the scope of patent application, wherein the pad is porous and has open or closed cells. 5. The pad as described in item 1 of the patent application scope, wherein the pad has a tissue texture. 6. The pad according to item 1 of the scope of patent application, wherein the hydrophilic additive is a hydrophilic surfactant. 7. The pad according to item 1 of the scope of patent application, wherein the relatively polar polymerizable additive is polyurethane, polyamide 'or polyester. 8. The pad according to item 1 of the scope of patent application, wherein the additive is liquid, solid, semi-solid, or a combination of solid and liquid. 9. The pad according to item 1 of the scope of patent application, wherein the additive is reactive or non-reactive with other materials in the pad. 10. The pad described in item 1 of the scope of patent application, wherein the additive is located in the polymer substrate. 11. The pad described in item 4 of the scope of patent application, wherein the additive is located in the hole of the pad. The size of this paper is applicable to the national standard (CNS) A4 (2 丨 0x297 公 #) of 1f1 countries. ---------------- Order ------ line (please read the precautions on the back before filling in this Page) Printed by the Consumer Cooperatives of the Central Ramp Bureau of the Ministry of Economic Affairs 4495 2 8 A8 B8 §__ VI. Patent Application Range 12. The pad as described in item 1 of the patent application range, in which the additives are hydrophilic hollow beads. To increase wetting and porosity. 13. The pad as described in item 1 of the scope of the patent application, wherein the additive is maintained in its original position or worn away with the polishing material, or the additive can be suddenly released or adhered to a layer of coating, penetration, or Other ways improve the interaction between the pad surface and the slurry. (Please read the precautions on the back before filling out this page) Printed by the Consumer Cooperatives of the Central Government Bureau of the Ministry of Economic Affairs This paper is sized for the Chinese National Standard (CNS) A4 (210 X 297 mm)