EP1091831A1 - Improved polishing pad with reduced moisture absorption - Google Patents
Improved polishing pad with reduced moisture absorptionInfo
- Publication number
- EP1091831A1 EP1091831A1 EP99955238A EP99955238A EP1091831A1 EP 1091831 A1 EP1091831 A1 EP 1091831A1 EP 99955238 A EP99955238 A EP 99955238A EP 99955238 A EP99955238 A EP 99955238A EP 1091831 A1 EP1091831 A1 EP 1091831A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- pad
- additive
- hydrophilic
- polishing
- polishing pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/001—Manufacture of flexible abrasive materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/22—Rubbers synthetic or natural
- B24D3/26—Rubbers synthetic or natural for porous or cellular structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
Definitions
- the purpose of this invention is to produce a polishing pad or belt or other device with increased resistance to moisture absorption for improved planarizing effectiveness and consistency.
- polishing pads typically polyurethane foam
- polishing pads are in continuous contact with aqueous slurries and cleaning solutions.
- Moisture absorption affects the performance of polishing pads in the following two ways:
- This invention comprises a relatively moisture resistant polishing pad with additives to improve wetting of the pad surface for good slurry distribution.
- the invention can be in any suitable form or shape, including but not limited to sheets, belts, disks, rollers and bobs.
- the polishing pad matrix material can be any polymeric material or any combination of polymeric materials, including thermoplastic and cross-linked materials, that absorbs less than 4% moisture after soaking for 24 hours.
- the polishing pad can include a porous structure.
- the porosity can be achieved by any suitable method, including but not limited to blowing, frothing, and inclusion of filled or unfilled hollow microelements.
- the pores can be any combination or distribution of size, shape, and quality (open or closed cell) .
- the polishing pad can include any type of texturing, formed naturally or by any suitable methods.
- the texturing can be created during the manufacturing process, or it can be created during use.
- the additives suitable for improving wetting and distribution of slurry include any type of hydrophilic additives like surfactants, and relatively polar polymeric materials including but limited to polyurethanes, polyamides, and polyesters.
- the additives can be liquid, solid, semi-solid, or combinations of solid and liquid.
- the additives can be reactive cr non-reactive with the other materials in the polishing pad.
- the additives can be located within the polymer matrix or within the pores of the polishing material.
- the additives can be any shape, size, or distribution, and can perform additional functions (e.g., hydrophilic hollow beads used to increase wetting and to create porosity) .
- the additives can remain in place and wear away with the polishing material, or they can pop out or smear to coat, fill in, or otherwise improve the interaction between the pad surface and slurry.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
Claims
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US8774298P | 1998-06-02 | 1998-06-02 | |
PCT/GB1999/001515 WO1999062673A1 (en) | 1998-06-02 | 1999-06-01 | Improved polishing pad with reduced moisture absorption |
US87742P | 2008-08-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
EP1091831A1 true EP1091831A1 (en) | 2001-04-18 |
Family
ID=22206976
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP99955238A Withdrawn EP1091831A1 (en) | 1998-06-02 | 1999-06-01 | Improved polishing pad with reduced moisture absorption |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP1091831A1 (en) |
JP (1) | JP2002516764A (en) |
KR (1) | KR100563172B1 (en) |
AU (1) | AU4272499A (en) |
TW (1) | TW449528B (en) |
WO (1) | WO1999062673A1 (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6596388B1 (en) | 2000-11-29 | 2003-07-22 | Psiloquest | Method of introducing organic and inorganic grafted compounds throughout a thermoplastic polishing pad using a supercritical fluid and applications therefor |
US6579604B2 (en) | 2000-11-29 | 2003-06-17 | Psiloquest Inc. | Method of altering and preserving the surface properties of a polishing pad and specific applications therefor |
US6846225B2 (en) | 2000-11-29 | 2005-01-25 | Psiloquest, Inc. | Selective chemical-mechanical polishing properties of a cross-linked polymer and specific applications therefor |
WO2002043922A1 (en) * | 2000-11-29 | 2002-06-06 | Psiloquest, Inc. | Crosslinked polyethylene polishing pad for chemical-mechnical polishing, polishing apparatus and polishing method |
US7059946B1 (en) | 2000-11-29 | 2006-06-13 | Psiloquest Inc. | Compacted polishing pads for improved chemical mechanical polishing longevity |
US6688956B1 (en) | 2000-11-29 | 2004-02-10 | Psiloquest Inc. | Substrate polishing device and method |
US6764574B1 (en) | 2001-03-06 | 2004-07-20 | Psiloquest | Polishing pad composition and method of use |
US6575823B1 (en) | 2001-03-06 | 2003-06-10 | Psiloquest Inc. | Polishing pad and method for in situ delivery of chemical mechanical polishing slurry modifiers and applications thereof |
US6838169B2 (en) | 2002-09-11 | 2005-01-04 | Psiloquest, Inc. | Polishing pad resistant to delamination |
JP2008221367A (en) * | 2007-03-09 | 2008-09-25 | Toyo Tire & Rubber Co Ltd | Polishing pad |
KR101225436B1 (en) | 2011-01-27 | 2013-01-22 | 삼성전자주식회사 | Polishing pad and manufacturing method thereof |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4728552A (en) * | 1984-07-06 | 1988-03-01 | Rodel, Inc. | Substrate containing fibers of predetermined orientation and process of making the same |
US4613345A (en) * | 1985-08-12 | 1986-09-23 | International Business Machines Corporation | Fixed abrasive polishing media |
JPS62156365A (en) * | 1985-12-27 | 1987-07-11 | Kanebo Ltd | Production of suede-like sheet material |
JPH0288229A (en) * | 1988-09-26 | 1990-03-28 | Rodeele Nitta Kk | Laminate and support of abrasive member in which the laminate is used and abrasive cloth |
JPH074769B2 (en) * | 1991-10-11 | 1995-01-25 | ロデール・ニッタ株式会社 | Polishing cloth |
JP3354744B2 (en) * | 1995-04-25 | 2002-12-09 | ニッタ株式会社 | Polishing cloth and method for attaching and detaching the polishing cloth to and from a polishing machine surface plate |
JPH09248756A (en) * | 1996-03-08 | 1997-09-22 | Chiyoda Kk | Polishing cloth |
JPH10550A (en) * | 1996-06-11 | 1998-01-06 | Toshiba Mach Co Ltd | Abrasive cloth dressing method and its device |
JPH10146754A (en) * | 1996-11-14 | 1998-06-02 | Hitachi Chem Co Ltd | Polishing template material |
-
1999
- 1999-06-01 WO PCT/GB1999/001515 patent/WO1999062673A1/en not_active Application Discontinuation
- 1999-06-01 JP JP2000551920A patent/JP2002516764A/en active Pending
- 1999-06-01 AU AU42724/99A patent/AU4272499A/en not_active Abandoned
- 1999-06-01 EP EP99955238A patent/EP1091831A1/en not_active Withdrawn
- 1999-06-01 KR KR1020007013658A patent/KR100563172B1/en not_active IP Right Cessation
- 1999-06-02 TW TW088109099A patent/TW449528B/en not_active IP Right Cessation
Non-Patent Citations (1)
Title |
---|
See references of WO9962673A1 * |
Also Published As
Publication number | Publication date |
---|---|
WO1999062673A1 (en) | 1999-12-09 |
TW449528B (en) | 2001-08-11 |
JP2002516764A (en) | 2002-06-11 |
KR100563172B1 (en) | 2006-03-27 |
KR20010071381A (en) | 2001-07-28 |
AU4272499A (en) | 1999-12-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20001220 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): DE FR GB IE IT |
|
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: LAM RESEARCH CORPORATION Owner name: MADISON CMP 3 INC. Owner name: MADISON FILTER GROUP INC. Owner name: MADISON FILTER 2 LIMITED |
|
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: LAM RESEARCH CORPORATION Owner name: PERIPHERAL PRODUCTS INC |
|
17Q | First examination report despatched |
Effective date: 20020725 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN |
|
18W | Application withdrawn |
Effective date: 20061201 |