AU4272499A - Improved polishing pad with reduced moisture absorption - Google Patents

Improved polishing pad with reduced moisture absorption

Info

Publication number
AU4272499A
AU4272499A AU42724/99A AU4272499A AU4272499A AU 4272499 A AU4272499 A AU 4272499A AU 42724/99 A AU42724/99 A AU 42724/99A AU 4272499 A AU4272499 A AU 4272499A AU 4272499 A AU4272499 A AU 4272499A
Authority
AU
Australia
Prior art keywords
polishing pad
moisture absorption
reduced moisture
improved polishing
improved
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU42724/99A
Inventor
Rajeev Bajaj
Brian Lombardo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Scapa Group Ltd
Lam Research Corp
Original Assignee
Scapa Group Ltd
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Scapa Group Ltd, Lam Research Corp filed Critical Scapa Group Ltd
Publication of AU4272499A publication Critical patent/AU4272499A/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/22—Rubbers synthetic or natural
    • B24D3/26—Rubbers synthetic or natural for porous or cellular structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
AU42724/99A 1998-06-02 1999-06-01 Improved polishing pad with reduced moisture absorption Abandoned AU4272499A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US8774298P 1998-06-02 1998-06-02
US60087742 1998-06-02
PCT/GB1999/001515 WO1999062673A1 (en) 1998-06-02 1999-06-01 Improved polishing pad with reduced moisture absorption

Publications (1)

Publication Number Publication Date
AU4272499A true AU4272499A (en) 1999-12-20

Family

ID=22206976

Family Applications (1)

Application Number Title Priority Date Filing Date
AU42724/99A Abandoned AU4272499A (en) 1998-06-02 1999-06-01 Improved polishing pad with reduced moisture absorption

Country Status (6)

Country Link
EP (1) EP1091831A1 (en)
JP (1) JP2002516764A (en)
KR (1) KR100563172B1 (en)
AU (1) AU4272499A (en)
TW (1) TW449528B (en)
WO (1) WO1999062673A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6579604B2 (en) 2000-11-29 2003-06-17 Psiloquest Inc. Method of altering and preserving the surface properties of a polishing pad and specific applications therefor
US6596388B1 (en) 2000-11-29 2003-07-22 Psiloquest Method of introducing organic and inorganic grafted compounds throughout a thermoplastic polishing pad using a supercritical fluid and applications therefor
US7059946B1 (en) 2000-11-29 2006-06-13 Psiloquest Inc. Compacted polishing pads for improved chemical mechanical polishing longevity
US6846225B2 (en) 2000-11-29 2005-01-25 Psiloquest, Inc. Selective chemical-mechanical polishing properties of a cross-linked polymer and specific applications therefor
WO2002043922A1 (en) * 2000-11-29 2002-06-06 Psiloquest, Inc. Crosslinked polyethylene polishing pad for chemical-mechnical polishing, polishing apparatus and polishing method
US6688956B1 (en) 2000-11-29 2004-02-10 Psiloquest Inc. Substrate polishing device and method
US6575823B1 (en) 2001-03-06 2003-06-10 Psiloquest Inc. Polishing pad and method for in situ delivery of chemical mechanical polishing slurry modifiers and applications thereof
US6764574B1 (en) 2001-03-06 2004-07-20 Psiloquest Polishing pad composition and method of use
US6838169B2 (en) 2002-09-11 2005-01-04 Psiloquest, Inc. Polishing pad resistant to delamination
JP2008221367A (en) * 2007-03-09 2008-09-25 Toyo Tire & Rubber Co Ltd Polishing pad
KR101225436B1 (en) 2011-01-27 2013-01-22 삼성전자주식회사 Polishing pad and manufacturing method thereof

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1158000A (en) * 1956-10-05 1958-06-05 Impregnated Diamond Prod Ltd Composition for cutting or abrasion tools
DE2556448A1 (en) * 1975-12-15 1977-06-23 Bosch Gmbh Robert Plastics-coated polishers for crystalline, esp. quartz, articles - in which porous layer of pulverised and sintered plastics absorbs polishing agent
GB1575867A (en) * 1978-02-23 1980-10-01 Brueckner Trockentechnik Kg Article for preparation of critical surfaces
US4728552A (en) * 1984-07-06 1988-03-01 Rodel, Inc. Substrate containing fibers of predetermined orientation and process of making the same
US4613345A (en) * 1985-08-12 1986-09-23 International Business Machines Corporation Fixed abrasive polishing media
JPS62156365A (en) * 1985-12-27 1987-07-11 Kanebo Ltd Production of suede-like sheet material
JPH0288229A (en) * 1988-09-26 1990-03-28 Rodeele Nitta Kk Laminate and support of abrasive member in which the laminate is used and abrasive cloth
JPH074769B2 (en) * 1991-10-11 1995-01-25 ロデール・ニッタ株式会社 Polishing cloth
MY114512A (en) * 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
JP3354744B2 (en) * 1995-04-25 2002-12-09 ニッタ株式会社 Polishing cloth and method for attaching and detaching the polishing cloth to and from a polishing machine surface plate
JPH09248756A (en) * 1996-03-08 1997-09-22 Chiyoda Kk Polishing cloth
JPH10550A (en) * 1996-06-11 1998-01-06 Toshiba Mach Co Ltd Abrasive cloth dressing method and its device
JPH10146754A (en) * 1996-11-14 1998-06-02 Hitachi Chem Co Ltd Polishing template material
WO1998047662A1 (en) * 1997-04-18 1998-10-29 Cabot Corporation Polishing pad for a semiconductor substrate

Also Published As

Publication number Publication date
TW449528B (en) 2001-08-11
KR100563172B1 (en) 2006-03-27
JP2002516764A (en) 2002-06-11
EP1091831A1 (en) 2001-04-18
WO1999062673A1 (en) 1999-12-09
KR20010071381A (en) 2001-07-28

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase