經濟部智慧財產局員工消費合作社印製 445497 Λ7 __-_ _ Β7 五、發明說明（1 ) 發明領域 本發明係有關於半導體元件之自動焊接組裝系统及該元 件之製造方法β 發明背景 一般而言，講究功率的元件(POWER DEVICES)若使用打 線機（WIRE BONDER) ’除了鋁線（或其他金屬線）必須粗大 或數條之外’機器設備的產能效率也因而降低，連帶影響 整個製造成本。而傳統的整流器（DI〇DE RECTIFIER)製 造上則常用氮氣或混合爐，上使用相當多的人工以及銲接 治具’不僅費事費時、佔空間、且成本居高不下β 本發明之目的乃針對以上的技術瓶頸加以突破，完成占 地狹小、高自動化、高產能的一貫化銲接組裝系統，其應 用也不侷限於半導體元件’而是需要用到銲接組裝的元件 成品皆可適用，其不僅改變傳統的製造方式，同時大幅節 省人力、空間、能源、氣體等等，同時提高了產品的品質 也降低了成本。 發明概述 本發明提供一種半導體元件之自動焊接组裝系統，其包 含一自動導線架供給裝置，用以供應導線架給多個晶片； 一耦接於該自動導線架供給裝置之自動多針點錫膏裝置， 用以於一晶片區提供多針點之錫膏給晶片；至少兩套耦接 於該自動多針點錫膏裝置之自動晶片搖盤裝載裝置，交替 地運作以搖盤方式達成大量且高速之晶片裝載；一耦接於 自動晶片搖盤裝載裝置之吸附裝置，用以分別將晶片吸附 -4- 本紙張尺度適用中國國家標準（CNS)A4規格（210 x 297公釐） -----------裝 - ----— —訂---------線 - 『 C 、 (請先閱讀背面之注意事項再填寫本頁) 4454 97 Α7 Β7 五、發明說明（2 ) ~ 至導線架上；一耦接於該吸附裝置之預熱裝置，用以預熱 錫膏以將晶片黏牢於該導線架上；一耦接於該預熱裝置之 .自動多針點銲膏裝置，用以施加銲膏於晶片之多個針點； 以及一耦接於該自動多針點銲膏裝置之焊接裝置，將蟲片 夾持並同時焊接其多個針點而快速JL大量地完成焊接组 裝之過程。 本發明亦揭示一種半導體元件之自動焊接組裝方法，包 含步騾有：提供導線架給多個晶片；同時提供多针點之錫 膏給晶片；以至少兩套自動為片搖盤裝載裝置，交替地以 搖盤方式達成大量且高速之晶片裝載；分別將晶片吸附至 導線架上；預熱錫膏而將晶片黏牢於導線架上；同時施加 銲膏於晶片之多個針點；以及將晶片夾持並同時焊接其多 個針點，而快速且大量地完成焊接組裝之過程。 圖式簡單說明 圖1係顯示根據本發明之半導體元件之自動焊接組裝系 統之方塊圖。 圖2係顯示根據本發明之半導體元件之自動焊接组裝之 流程圖β ‘ 元件符號說明 11 第一自動導線架供給裝置； 12 自動多針點錫膏裝置； 13 自動晶片搖盤裝載裝置； 14 吸附裝置； 15 預熱裝置； -5- 本纸張尺度適用令國國家標準（CNS)A4規格（2JD X 297公楚） ---------------- (請先閱讀背面之注意事項再填寫本頁) * .線· 經濟部智慧財產局員工消費合作社印製 4454 9 7 A7 五、發明說明（3 ) - 16 自動多針點銲膏裝置； 17 第二自動導線架供給裝置；以及 Ϊ8 焊接裝置。 發明之詳細說明 圓1係顯示根據本發明之半等體元件之自動焊接組装系 統之方塊囷。第一自動導線架供給裝置（11)供應導線架給 多個晶片《—耦接於該自動導線架供給裝置（11)之自動多 針點錫膏裝置（12)衿一晶片區提供多針點之錫膏給晶片’ 其取代傳統低效率且整體成皂高之單針鍚膏裝置。至少兩 套耦接於該自動多針點錫膏裝置（12)之自動晶片搖盤袭載 裝置（13)，交替地運作以搖盤方式達成大量且高速之晶片 裝載，其中使用至少兩套自動晶片搖盤裝載裝置（13)之目 的在於將停機時間縮短，技術上而言，當然亦可以一套單 獨運作之。一耦接於自動晶片搖盤裝載裝置（13)之吸附裝 置（14) ’用以分別將晶片吸附至導線架上。該吸附裝置 (14)可包含一機械手臂及—吸盤，以由該機械手臂以該吸 盤吸附晶片而移置於導線架上。一耦接於該吸附裝置（14) 之預熱裝置（15)，用以預熱錫膏以將晶片黏牢.於導線架上 ’一般預熱溫度約為室溫至400 °C，其中預熱的目的在於 將錫膏（fl u X)中之溶劑蒸發，以及將晶片黏牢，所以對於 錫膏中溶劑含量不多’或於製程中易於將該溶劑蒸發出來 ’或對晶片定位要求不太高…等情況下，此預熱裝置（丨5 ) 則不是必要的。一耦接於該預熱裝置（15)之自動多針點銲 膏裝置（16)，用以施加銲膏於晶片之多個針點，以利後績 -6- 本紙張尺度適用令國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注急事項再填寫本頁) -丨線- 經濟部智慧財產局員工消費合作社印製 A 45.4 91 A7 B7 五、發明說明（4 ) 之焊接。依需要，可以於此後由第二自動導線架供給裝.置 (17)，供應另一個導線架給晶片，並以導銷方式定位之， 使知·每 Βθ片此與为別位於上下兩侧之導線架導通。_焊 接裝置（1S)，其較佳地為一電熱烙鐵塊（Heater Β丨〇ck)，耦 接於該第二自動導線架供給零置（17)，或者不需要該第二 自動導線架供給裝置（17)的話，直接耦接於該自動多針點 #膏裝置（16) ’而用以將晶片夾持並同時焊接其多個針點 ’而快速且大量地茸成焊接組裝之過程。最後之成品輸出 至料片盒’而繼續完成清洗二.封裝、測試等後段工程。尤 其是’此一利用電熱鉻鐵塊之過程僅需2〇至3〇秒，相較於 傳統銲接爐之需時1小時，實為一大突破。 圖2係顯示根據本發明之半導體元件之自動焊接组裝之 流程圖"步驟（21)提供一導線架給多個晶片。步驟（2幻同 時提供多針點之錫膏給晶片。步驟（23)以至少兩套自動晶 片搖盤裝載裝置，交替地以搖盤方式達成大量且高速之晶 片裝载。步驟（24)分別將晶片吸附至導線架上。步驟（25) 預熱錫膏而將晶片黏牢於該導線架上。步騾（26)同時施加 銲膏於晶片之多個針點。步騾（27)將晶片夾持.並同時焊接 其多個弁點，，而快速且大量地完成焊接组裝之過程。 本發明不僅節省人力、空間、能源、及氣體等等，同時 提向了產品的品質也降低了成本。而整體的機電與製程整 合則開技術與風氣之先。熟知此項技藝之人士當可由以上 說明書所教示之内容，做出可能的變更而仍不跳脫本發明 之精神範疇。 -7- 本紙張尺度適用中囷國家標準（CNS)A4規格（21〇 x 297公釐） ---------I! 農 i I (請先閱讀背面之注意事項再^:寫本頁} --線· 經濟部智慧財產局員工消費合作社印製Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 445497 Λ7 __-_ _ B7 V. Description of the Invention (1) Field of the Invention The present invention relates to an automatic soldering and assembling system for semiconductor components and a method for manufacturing the components. BACKGROUND OF THE INVENTION If a power-deployed component (POWER DEVICES) uses a wire bonder (in addition to aluminum wires (or other metal wires) must be thick or several), the productivity of machine equipment is also reduced, which affects the overall manufacturing cost. In the traditional rectifier (DIODECTIFIER) manufacturing, nitrogen or mixing furnaces are often used, and a lot of labor and welding fixtures are used on it. Not only is it time-consuming, time-consuming, space-consuming, and costly. Β The purpose of the present invention is to The above technical bottlenecks have been broken through to complete a consistent soldering and assembly system with a small footprint, high automation and high productivity. Its application is not limited to semiconductor components, but component finished products that require soldering and assembly can be applied, which not only changes The traditional manufacturing method greatly saves manpower, space, energy, gas, etc., while improving the quality of products and reducing costs. SUMMARY OF THE INVENTION The present invention provides an automatic soldering and assembling system for semiconductor components, which includes an automatic lead frame supply device for supplying a lead frame to a plurality of wafers; an automatic multi-pin spot soldering coupled to the automatic lead frame supply device. A paste device for providing multi-pin solder paste to a wafer in a wafer area; at least two sets of automatic wafer cradle loading devices coupled to the automatic multi-pin solder paste device alternately operate to achieve a large number of craters And high-speed wafer loading; an adsorption device coupled to an automatic wafer cradle loading device to adsorb the wafers separately -4- This paper size applies to China National Standard (CNS) A4 (210 x 297 mm)- --------- Installation------ -Order --------- Line- 『C 、 (Please read the precautions on the back before filling this page) 4454 97 Α7 Β7 Five 2. Description of the invention (2) ~ to the lead frame; a preheating device coupled to the adsorption device for preheating the solder paste to adhere the chip to the lead frame; a coupling to the preheating device .Automatic multi-pin spot solder paste device for applying solder paste to multiple pin points of a wafer; And a welding device coupled to the automatic multi-pin spot solder paste device, clamps the worm blades and welds multiple pin points at the same time, and quickly completes the welding assembly process in large quantities. The invention also discloses a method for automatically soldering and assembling a semiconductor component, which includes the steps of: providing a lead frame to a plurality of wafers; and simultaneously providing multi-pin point solder paste to the wafer; at least two sets of automatic wafer cradle loading devices, alternately Ground to achieve a large number of high-speed wafer loading by means of a shaker; respectively, the wafers are attached to the lead frame; the solder paste is preheated to adhere the wafer to the lead frame; solder paste is simultaneously applied to multiple pin points of the wafer; and The wafer is clamped and soldered at the same time, and the solder assembly process is completed quickly and in large quantities. Brief Description of the Drawings Fig. 1 is a block diagram showing an automatic soldering and assembling system of a semiconductor element according to the present invention. FIG. 2 is a flowchart showing automatic soldering and assembly of a semiconductor component according to the present invention. Β 'Description of component symbols 11 First automatic lead frame supply device; 12 Automatic multi-pin spot solder paste device; 13 Automatic wafer shaker loading device; 14 Adsorption device; 15 preheating device; -5- This paper size is applicable to the national standard (CNS) A4 specification (2JD X 297). ---------------- (Please (Please read the notes on the back before filling in this page) *. Line · Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 4454 9 7 A7 V. Description of the Invention (3)-16 Automatic multi-pin spot solder paste device; 17 Second automatic Lead frame supply device; and Ϊ8 welding device. Detailed description of the invention Circle 1 is a block 囷 showing an automatic welding assembly system for a semi-isomeric element according to the present invention. The first automatic lead frame supply device (11) supplies a lead frame to a plurality of wafers "—an automatic multi-needle point solder paste device (12) coupled to the automatic lead frame supply device (11), providing multiple pin points in a wafer area The solder paste to the wafer 'replaces the traditional low-efficiency and high-solubility single-needle solder paste device. At least two sets of automatic wafer shaker loading devices (13) coupled to the automatic multi-needle point solder paste device (12) alternately operate to achieve large and high-speed wafer loading by means of a shaker, of which at least two sets of automatic The purpose of the wafer cradle loading device (13) is to shorten the downtime. Technically, of course, it can also be operated separately. An adsorption device (14) 'coupled to the automatic wafer cradle loading device (13) is used to adsorb the wafers to the lead frame, respectively. The suction device (14) may include a robot arm and a suction cup, so that the robot arm sucks the wafer with the suction cup and is placed on the lead frame. A preheating device (15) coupled to the adsorption device (14) is used to preheat the solder paste to adhere the chip. On the lead frame, the general preheating temperature is about room temperature to 400 ° C, where The purpose of heat is to evaporate the solvent in the solder paste (fl u X) and stick the wafer firmly, so the solvent content in the solder paste is not much 'or the solvent is easy to evaporate in the process' or the wafer positioning requirements are not Too high ... In other cases, this preheating device (丨 5) is not necessary. An automatic multi-needle spot solder paste device (16) coupled to the preheating device (15) is used to apply solder paste to multiple pin points of the wafer for the benefit of future results. Standard (CNS) A4 specification (210 X 297 mm) (Please read the urgent notes on the back before filling this page)-丨 Line-Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A 45.4 91 A7 B7 V. Description of Invention (4) Welding. As needed, a second automatic lead frame supply device (17) can be supplied thereafter, another lead frame is supplied to the wafer, and it is positioned by the guide pin method, so that each and every θ block is located on the upper and lower sides. The lead frame is conducting. _Welding device (1S), which is preferably an electric soldering iron block (Heater Β 丨 〇ck), is coupled to the second automatic lead frame to supply zero (17), or the second automatic lead frame is not required to be supplied The device (17) is directly coupled to the automatic multi-needle point #paste device (16) 'for clamping and welding a plurality of pin points of a wafer at the same time' to quickly and massively assemble the welding assembly process. The final product is output to the material box 'and the cleaning, packaging, testing and other post-processes are continued. In particular, this process of using electro-thermal chromium iron ingot only takes 20 to 30 seconds, which is a major breakthrough compared to the one-hour time required by traditional welding furnaces. Fig. 2 is a flowchart showing an automatic soldering assembly of a semiconductor element according to the present invention. "Step (21) provides a lead frame to a plurality of wafers. Step (2) Simultaneously provide multi-pin solder paste to the wafer. Step (23) uses at least two sets of automatic wafer shaker loading devices to alternately achieve a large and high-speed wafer loading by the shaker. Step (24) respectively Adhere the wafer to the lead frame. Step (25) Preheat the solder paste to adhere the wafer to the lead frame. Step (26) applies solder paste to multiple pin points of the wafer at the same time. Step (27) applies The wafer is clamped and soldered at the same time to complete the welding and assembly process quickly and in large quantities. The invention not only saves manpower, space, energy, gas, etc., but also improves the quality of the product and reduces the quality Costs. And the overall integration of electromechanical and process development is the first of technology and ethos. Those who are familiar with this technology can make possible changes from the content taught in the above description without departing from the spirit of the invention.- 7- The size of this paper applies to China National Standard (CNS) A4 (21 × 297 mm) --------- I! Agriculture i I (Please read the notes on the back before writing ^: Page} --line · Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs