JPH05109831A - Bonding device and its method - Google Patents

Abstract

PURPOSE:To press a plurality of leads against the junction of a semiconductor equally by clamping the bases of leads and pressing the middle parts of the leads, and pressing the tops to the side of the semiconductor, resisting spring property. CONSTITUTION:This device comprises a material feeding mechanism, which feeds a semiconductor 1 onto a semiconductor cradle 3, a positioning means, which places a lead 9 on the semiconductor 1 and positions it, and a junction means, which joins the lead 9 with the semiconductor 1. Time positioning mechanism is equipped with a clamp means 5 consisting of a pair of holders 6 and 7n which clamp the base of the lead 9. On side of a pair of holders 6 and 7 is extended to the middle part of the lead 9, and this extension end is provided with a pressing projection 7a which presses the top of the this lead to the side of the semiconductor, resisting the spring property of this lead 9. And, laser equipment is arranged, as a junction means, above the semiconductor 1. Hereby, a device, which can press the lead 9 pressed equally, and also is highly accurate, can be obtained.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding apparatus and a bonding method for connecting leads to a semiconductor.

[0002]

2. Description of the Related Art FIG. 2 is a side view of essential parts of a general conventional bonding apparatus. In the figure, reference numeral 1 denotes a semiconductor, and a plurality of bumps 2 serving as connection terminals are arranged in two rows on both side edges of the upper surface. Reference numeral 3 denotes a semiconductor pedestal on which the semiconductor 1 is mounted horizontally, and an upper end surface on which the semiconductor 1 is mounted is flat and held horizontally. 15 is an insulating tape 1
Leads 17 formed on 6 are reciprocating vertically bonding tools for joining the leads 15 to the bumps 2.

Next, the operation of the bonding method in the bonding apparatus having such a structure will be described. First, the semiconductor 1 is fed to the semiconductor cradle 3 by a semiconductor feeding mechanism (not shown) and placed at a predetermined center position. Next, the tips of the leads 15 to which the tape 16 is attached are positioned and mounted on the bumps 2 of the semiconductor 1 by a positioning means (not shown). Finally, the bonding tool 17 is lowered from above to pressurize and heat the lead 15 at the tip portion, thereby joining the lead 15 to the semiconductor 1.

[0004]

Since the conventional bonding apparatus and bonding method are configured as described above, the plurality of leads 15 bonded to the plurality of bumps 2 of the semiconductor 1 are evenly formed on the bumps 2 or the semiconductor 1. Therefore, the semiconductor pedestal 3 is tilted, the upper end surface of the semiconductor pedestal 3 is not level, or the lead 15 is not properly placed on the semiconductor pedestal 3. However, there is a problem in that the parallelism between the leads 15 and the bumps 2 does not appear, and thus the bonding state becomes non-uniform. In addition, since it is necessary to press the leads onto the semiconductor by the bonding tool itself during bonding, the type of bonding tool to be used is limited. there were. The present invention is
The present invention has been made in view of the above-mentioned conventional problems or drawbacks, and an object thereof is to provide a bonding apparatus and a bonding method that can press a lead evenly on a semiconductor and have high accuracy.

[0005]

To achieve this object, in a bonding apparatus according to the present invention, a material feeding mechanism for feeding a semiconductor to a semiconductor pedestal and a lead is placed and positioned on the semiconductor. The positioning mechanism includes a joining means for joining the lead to the semiconductor, and the positioning mechanism includes a clamping means including a pair of gripping portions for clamping the root of the lead, and one of the pair of gripping portions is A lead is extended to the middle portion of the lead, and a pressing projection is provided at this extended end to push the tip end of the lead against the semiconductor side against the springiness of the lead. It was placed in. Further, the bonding method according to the present invention is a method for feeding a semiconductor to a semiconductor pedestal, positioning and mounting the leads on the semiconductor, and then bonding the leads to the semiconductor. When mounting, the root part of the lead is clamped, the middle part of the lead is pressed, and the tip part of the lead is pressed against the semiconductor side against the spring property of the lead, and then the tip part of the lead is pressed from above. It is bonded to a semiconductor by heating with radiant heat.

[0006]

In the present invention, the tips of the leads are temporarily pressed against the semiconductor side against the springiness of the leads. Further, since the pressure is applied by the clamp means and the pressurizing part is performed by the middle part of the lead, the pressurization by the bonding tool is unnecessary, and the clamp means is present above the tip part of the lead which is the bonding part. do not do.

[0007]

An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a side view of a main part of a bonding apparatus according to the present invention. In the figure, the positioning and mounting mechanism of the lead 9 on the bump 2 is provided with a clamp means 5 having a pair of upper and lower grips 6 and 7 for clamping the root of the lead 9. The tip of the upper grip portion 7 is extended to the vicinity of the middle portion of the lead 9 as compared with the lower grip portion 6,
A protrusion 7a protruding downward is provided at this extension end. Reference numeral 10 denotes a heat ray from a laser device for heating (not shown) which is arranged above the bump 2 which is a bonding portion by a joining means of the lead 9 and the bump 2.

The operation will be described below. The semiconductor 1 is placed on the semiconductor cradle 3, and thereafter, the root portions of the leads 9 are clamped by the both gripping portions 6 and 7 of the clamp means 5, and the tips of the leads 9 are placed on the semiconductor by the positioning and placing means (not shown). Positioning and mounting on the bump 2 of 1. At this time, the protrusions 7a of the grip portion 7 forcibly press the tip portions of the leads 9 against the springiness of the leads 9, so that the leads 9 are tentatively applied to the bumps 2 of the semiconductor 1. It is pressed uniformly in a flat state. Then, the tip end of the lead 9 and the bump 2 are joined by the heat wire 10 from the laser device.

[0009]

As described above, according to the present invention, when the lead is positioned on the semiconductor, the root portion of the lead is clamped and the middle portion of the lead is pressed so that the tip end portion of the lead is held by the spring of the lead. Since it pressed against the semiconductor side against the property, it is possible to uniformly press multiple leads to the semiconductor junction,
Therefore, it is possible to prevent the contact failure of the leads. Also, the lead is already pressed before joining with the bonding tool,
Moreover, since the clamp means is not present above the tip of the lead, which is the bonding portion, the bonding tool does not necessarily need to apply pressure and contact to the lead. There is an effect that laser equipment can be used.

[Brief description of drawings]

FIG. 1 is a side view of a main part of a bonding apparatus according to the present invention.

FIG. 2 is a side view of a main part of a conventional bonding apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor 2 Bump 3 Semiconductor pedestal 5 Clamping means 7a Protrusion 9 Lead 10 Hot wire

Claims (2)

[Claims] 1. A bonding apparatus comprising a material supplying mechanism for supplying a semiconductor to a semiconductor pedestal, a positioning means for mounting and positioning a lead on the semiconductor, and a bonding means for bonding the lead to the semiconductor. The positioning mechanism is provided with a clamp means composed of a pair of grips for clamping the root of the lead, and one of the pair of grips is extended to an intermediate part of the lead, and the spring property of the lead is provided at the extension end. The bonding apparatus is characterized in that a pressing projection for pressing the tip end portion of the lead against the semiconductor is provided against the above, and a laser device is arranged above the semiconductor as the joining means. 2. A bonding method in which a semiconductor is supplied to a semiconductor pedestal, leads are positioned and mounted on the semiconductor, and then the leads are bonded to the semiconductor. In the bonding method, the leads are positioned and mounted. While clamping the root part, pressing the middle part of the lead to press the tip part of the lead against the semiconductor side against the spring property of the lead, and then the tip part of the lead is heated by radiant heat from above. A bonding method characterized by being bonded to.