432648 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（/ ) 本發明係關於一種半導體封裝之覆晶灌膠方法及裝置 ’尤指一種可有效增進製程效率並減少灌膠孔洞（v〇id)且 不存在清模問題之半導體封裝模具灌膠方法。 如第九圖所示，其揭露有一晶片（7〇)固定在一基 板（7 1 )上的剖面構造，其中晶片（7 0 )表面以矩陣 形式埴設有多數錫球（70 1)，以便於裝晶時，透過倒 裝接合方法（flip chip bonding)由各锡球（7 0 1 )與 基板（7 1 )上對應的線路接點（7 1 1 )接合，又基板 (7 1 )表、底面分設線路接點（7 1 1 ) (712)， 其間係透過基板（7 1 )夾層中的内部線路構成連接，其 中基板（7 1 )底部的各個線路接點（7 1 2 )上將植設 錫球（圖中未示），供外部連接之用。 前述構造係完成裝晶後之型態，其下一步驟係進行灌 膠’不論是採取灌膠或是模具注膠方式進行封膠，必要的 條件是晶片（7 0 )與基板（7 1 )之間的空隙必須予以 充分填實以增加錫球（7 0 1 )之連接強度，然而，由於 晶片（7 0 )與基板（7 1 )的空隙極小，原不利於封膠 流動’復以晶片（7 0 )底部四周植佈的多數錫球（7 0 1 )將進一步對封膠的流動形成障礙。 在既有專利文獻中，曾對前述的狀況提出相對的因應 方案，如美國第5385869號發明專利案係於基板（7 1 ) 上對應晶片（7 0 )預設處開設一穿槽（7 1 〇 )(如第 十圖所示）’並利用注膠模具（7 2)進行封膠（如第十 一圖所示）’該模具（72)的下模（722)將基板（ 3 — — — — — — — — — In — - I I I I I I I ^ (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中圏國家標準（CNS)A4規格（2】0 x 297公釐 經 濟 部 智 慧 財 產 局 員 工 消 費 合 作 社 印 製 A7 B7 五、發明說明（>) 7 1 )上的穿槽（7 1 0 )封閉’其上模（7 2 1 )則將 晶片（7 0)及基板（7 1 )表面線路完全涵蓋，再由上 模（72 1 )注入封膠。由於基板（71 )上形成有穿槽 (710) ’因而在晶片（70)下方形成有較大的封膠 流動空間’藉此令封膠更迅速的流動至晶片（7 〇 )下方 而填滿空隙。 前述方式確實有助於封膠的流動，但僅能有限度的解 決封膠不易在晶片（7 0 )下方流動的困擾，其作業效率 依然不甚理想’主要原因在於前述專利案雖提供較大的封 膠流動空間，以提高封膠流動速度，但封膠在自然流動的 狀態下’速度雖有增進’卻仍然相當緩慢，且其結構為密 閉’封膠過程中無法逃氣以致封膠完成後極易留下孔洞 (void)，進而影響晶片封裝良率，因此其改善效果依然有 限。 又如第十二圖所示，為美國第5866442號發明專利案 ’其提供另一種解決方案，主要係於基板1 )上對應 晶片（70)的下方處形成有多數抽氣孔（713)，又 於完成裝晶後，將前述基板（7 i )置於一封閉空間（8 〇)内，該封閉空間（8 〇)内部的上層為加壓室（8丄 )，下層為抽氣室（82)，前述基板（71)即跨設於 加壓室（8 1 )與抽氣室（8 2)之間，並在加屋室（8 1 )内進行注膠，將封膠注入至晶片（7 〇)與基板（7 1 )表面之間’在此同時，加壓室（8 1 )開始加壓，而 抽氣至（8 2 )則同時向外抽氣，以形成真空，在加壓與 本紙張尺度適用中圏仏標準（⑽“.規格（2iQ χ 297 ^--------訂---------線 <請先閲讀背面之注意事項再填寫本頁) 五、發明說明（}) 真空抽氣的交替作用下，將提高封膠於晶片（7〇)與基 板（7 1 )之間的流動速率。 前述專利案提出之解決方案雖有助於增進單一封膠製 程的效率，但仍存在兩個顯著缺點，一是需要增設特殊設 備，根據前述專利案之設計，該基板（7 j )之注膠作業 必須在特殊設計的封閉空間（8 〇)中進行’而對於星^ ^A(encapsulation)技術而言，其為必須另外增設的特 殊設備，且因該設備之利用，將使原有的作業方式有所改 變。二是此一發明一次只能對一组晶片進行封膠，即使單 一封膠時間可以縮短，但對整體的生產效率而言仍屬不 由上述可知，既有專利文獻雖已公開針對晶片與基板 間空隙狹小不利於封膠流動之狀況提出解決方案，但分別 存在未盡周延之處，故仍有進一步檢討，並謀求較佳解決 方案之必要。 因此，本發明主要目的在提供一種可有效增進製程效 率之模具封膠方法。 為達成前述目的採取的主要技術手段係於基板上之特 定位置形成以至少一組的抽氣孔，該抽氣孔適對應於晶片 下方，並位於晶片表面植佈錫球之相對内側； 又於灌膠模具之下模上於特定位置預設有非直線之曲 徑式抽氣通道； 當完成裝晶後的基板置於模具中進行灌膠，下模上各 抽氣通道將分別對正於基板上各個柚氣孔，而在灌膠的同 本紙張尺度翻中關家縣（CNS>A4 -----I 1-----11 ^ -II (锖先閱讀背面之注意事項再填寫本頁) 訂 線 絰 濟 部 智 慧 財 產 局 貝 X 消 t 合 作 钍 印 製 ρ'4 326 4 8432648 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the Invention (/) The present invention relates to a method and device for flip chip encapsulation of semiconductor packages, especially a method which can effectively improve the process efficiency and reduce the injection hole ( v〇id) and the method of filling the semiconductor package mold without the problem of mold removal. As shown in the ninth figure, a cross-sectional structure of a wafer (70) fixed on a substrate (7 1) is disclosed. The surface of the wafer (70) is provided with a plurality of solder balls (70 1) in a matrix form so that During chip mounting, each of the solder balls (7 0 1) and the corresponding line contact (7 1 1) on the substrate (7 1) are bonded by flip chip bonding, and the substrate (7 1) is The bottom surface is provided with a line contact (7 1 1) (712), which is connected through the internal circuit in the substrate (7 1) interlayer, wherein each line contact (7 1 2) at the bottom of the substrate (7 1) is connected. A solder ball (not shown) will be planted for external connection. The aforementioned structure is the form after the crystal is mounted, and the next step is to perform the potting. Whether the potting is performed by potting or mold pouring, the necessary conditions are the wafer (7 0) and the substrate (7 1). The gap between them must be fully filled to increase the connection strength of the solder ball (7 0 1). However, because the gap between the wafer (70) and the substrate (7 1) is extremely small, it is not conducive to the flow of the sealant. (7 0) Most of the solder balls (7 0 1) planted around the bottom will further hinder the flow of the sealant. In the existing patent documents, a corresponding response plan has been proposed for the foregoing situation. For example, the US patent No. 5385869 is a case in which a through slot (7 1) is preset on the substrate (7 1) corresponding to the wafer (70). 〇) (as shown in the tenth figure) 'and use a plastic injection mold (7 2) for sealing (as shown in the eleventh figure)' The lower mold (722) of the mold (72) — — — — — — — In —-IIIIIII ^ (Please read the notes on the back before filling out this page) This paper size applies to China National Standard (CNS) A4 specification (2) 0 x 297 mm Intellectual Property of the Ministry of Economic Affairs Printed by the Consumer Cooperative of the Bureau A7 B7 V. Description of the invention (>) 7 1) The slot (7 1 0) on the invention is closed. 'The upper die (7 2 1) is the wafer (7 0) and the substrate (7 1). ) The surface circuit is completely covered, and then the upper mold (72 1) is injected into the sealant. Because the substrate (71) is formed with a through groove (710), 'a larger sealant flow space is formed below the wafer (70)' This allows the sealant to flow more quickly under the wafer (70) and fill the gap. The aforementioned method does help The flow of the sealant can only solve the problem that the sealant is not easy to flow under the wafer (70), and the operation efficiency is still not ideal. The main reason is that although the aforementioned patent case provides a large sealant flow space, In order to increase the flow rate of the sealant, the sealant's speed is still quite slow in the state of natural flow, and its structure is hermetic. The gas cannot be escaped during the sealant process, so it is easy to leave holes after the sealant is completed. (void), which in turn affects the yield of the chip package, so its improvement effect is still limited. As shown in Figure 12, it provides another solution for US Patent No. 5,866,442 invention patent, which is mainly based on the substrate 1) A plurality of suction holes (713) are formed at the lower portion of the corresponding wafer (70), and after the wafer is mounted, the aforementioned substrate (7i) is placed in a closed space (80), and the inside of the closed space (80) The upper layer is a pressure chamber (8 丄) and the lower layer is a suction chamber (82). The aforementioned substrate (71) is located between the pressure chamber (8 1) and the suction chamber (8 2), and is Glue injection is performed in the room (8 1), and the sealant is injected into the crystal. Between the sheet (70) and the surface of the substrate (71), at the same time, the pressurizing chamber (81) starts to pressurize, and the pumping to (8) is simultaneously pumping outward to form a vacuum. The pressurization and the paper size apply the medium standard (圏 仏 ". Specifications (2iQ χ 297 ^ -------- Order --------- line < Please read the precautions on the back before (Fill in this page) V. Description of the invention (}) Under the alternating action of vacuum pumping, the flow rate of the sealant between the wafer (70) and the substrate (71) will be increased. Although the solution proposed in the aforementioned patent case helps to improve the efficiency of a single glue process, there are still two significant shortcomings. One is the need to add special equipment. According to the design of the aforementioned patent case, the substrate (7 j) is injected with glue. The operation must be carried out in a specially designed enclosed space (80), and for Star ^ A (encapsulation) technology, it is a special equipment that must be added separately, and the use of this equipment will make the original operation The way has changed. The second is that this invention can only seal a group of wafers at a time. Even if the time of a single glue can be shortened, the overall production efficiency is still not known from the above. Although the existing patent documents have disclosed the gap between the wafer and the substrate The narrow gap is not conducive to the solution of the sealant flow situation, but there are unresolved delays, so there is still a need for further review and the need for better solutions. Therefore, the main object of the present invention is to provide a mold sealing method which can effectively improve the process efficiency. The main technical means adopted to achieve the aforementioned purpose is to form at least one set of air vents at a specific position on the substrate, the air vents corresponding to the lower part of the wafer and located on the inner side of the wafer on which the solder balls are planted; and A non-linear curved path suction channel is preset on the mold at a specific position under the mold; when the substrate after the crystal is mounted is placed in the mold for filling, each suction channel on the lower mold will be aligned on the substrate separately. Each pomelo air hole, and the size of the same paper filled with glue in Zhongguan County (CNS > A4 ----- I 1 ----- 11 ^ -II (锖 Please read the precautions on the back before filling this page ) Ordering by the Intellectual Property Bureau of the Ministry of Economic Affairs and Cooperation X Xt. Cooperative print ρ'4 326 4 8
五、發明說明（/ ) (請先閱讀背*之注意事項再填寫本頁) 時，下模透過抽氣通道開始向外抽氣，此時封膠受模具内 外壓差影響，將迅速經由晶片底部各錫球間之空隙進入， 而快速填滿晶片與基板之間隙，且由於模穴為真空狀態， 封膠完成後可大幅減少孔洞（V〇id)殘留於封膠體内’藉此 可有效增進模具封膠製裡之效率與品質。 本發明次一目的在提供一種可增進製程效率與品質之 覆晶灌膠模具，其包括有： 一上模，其上於各特定位置分別形成有灌膠口及逃氣 Π ; 一下模，其上於特定位置上形成有至少一組的抽氣通 道，該抽氣通道係呈非直線的曲徑狀，其一端將對正於基 板上預設的柚氣孔。 月1J述的抽乱通道係呈-[形狀’其具有一水平端及—連 通於水平端一端部之垂直端，其中：該水平端係位於下模 内表面，並呈開放狀，其相對垂直端之另端係對正於基板 上之抽氣孔；又垂直端相對於水平端之另端則與真空抽氣 設備連接。 經濟部智慧財產局員工消费合作社印製 前述水平端在與基板上抽氣孔對正之其中一端具有較 大的面積，其面積惶大於基板上之抽氣孔孔徑，以容許適 當程度的對位偏差。 前述水平端於對正基板上抽氣孔之一端上形成有一槽 部，該槽部之深度係在水平端之平面以下，藉以形成較大 容膠空間，則若封膠過程中膠體未能完全凝固於基板之抽 氣孔内，此π形抽氣通道設計或一較深槽部之設置即可阻 6 本紙張尺度適用令國國家標準（CNS)A4規格（210 * 297公釐） ^432648 A7 B7 五、發明說明（Γ ) 止封勝溢流至垂直端；因此’當封膠完成後，殘餘於柚氣 孔底部及前述槽部間之餘膠將可輕易隨基板脫離下模，換 言之’將無餘膠殘留下模上’故無須經過清模步驟，即可 直接重覆使用。 前述的槽部係呈矩形狀。 前述的槽部係呈圓形狀》 為使責審查委員進一步瞭解前述目的及本發明之技 術特徵’茲附以圖式詳細說明如后： (—)圖式部分：V. Description of the invention (/) (Please read the notes on the back * before filling this page), the lower mold starts to extract air through the exhaust channel. At this time, the sealant is affected by the pressure difference between the inside and outside of the mold and will pass through the wafer quickly. The gap between the solder balls at the bottom enters, and the gap between the wafer and the substrate is quickly filled. Since the cavity is in a vacuum state, the holes (Voids) remaining in the sealant can be greatly reduced after the sealant is completed. Improve the efficiency and quality in mold sealing. A second object of the present invention is to provide a chip-on-mold encapsulation mold that can improve process efficiency and quality, which includes: an upper mold on which a glue-filling port and an escape gas are formed at specific positions; a lower mold, which At least one set of suction channels is formed at a specific position. The suction channels have a non-linear curved path shape, and one end of the suction channels is aligned with a pomelo air hole preset on the substrate. The chaotic channel system described in January 1J is-[shape 'which has a horizontal end and-a vertical end connected to one end of the horizontal end, where: the horizontal end is located on the inner surface of the lower mold and is open and relatively vertical The other end of the end is aligned with the suction hole on the substrate; the other end of the vertical end opposite to the horizontal end is connected to the vacuum suction device. Printed by the Employees' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs The aforementioned horizontal end has a large area on one end aligned with the suction holes on the substrate, and its area is larger than the suction hole diameter on the substrate to allow a proper degree of misalignment. The horizontal end has a groove formed on one end of the air-exhaust hole on the alignment substrate, and the depth of the groove is below the plane of the horizontal end, so as to form a large space for glue, if the gel does not completely solidify during the sealing process In the suction holes of the substrate, the design of the π-shaped suction channel or the setting of a deeper groove can block 6 This paper size is applicable to the national standard (CNS) A4 specification (210 * 297 mm) ^ 432648 A7 B7 V. Description of the invention (Γ) Stop the seal from overflowing to the vertical end; therefore, 'After the sealing is completed, the remaining glue remaining at the bottom of the pomelo air hole and the aforementioned groove portion can be easily separated from the lower mold with the substrate, in other words, there will be no remaining The glue remains on the lower mold, so it can be used repeatedly without going through the mold cleaning step. The aforementioned grooves are rectangular. The aforementioned grooves have a circular shape. "In order to make the review committee better understand the aforementioned purpose and the technical features of the present invention," a detailed description is attached as follows: (-) Schematic part:
第一圖 第二圖 墙一团 弟二圃 第四A -----；---------A--- (請先Μ讚背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 係本發明之基板剖視圖。 係本發明之模具剖視圖。 係本發明模具上模之底視平面圖。 四C圖：係本發明模具下模不同實施例之俯視平 面圖。 五B圖：係本發明模具下模不同實施例之局部剖 視圖。 係本發明之使用狀態剖視圖。 係本杳明基板脫模後之剖視圖。 係本發明基板於外部植設錫球後之剖視圖。 係基板以倒裝接合方法接合晶片之構造示意圖。 係美國第5385869號發明專利案之構造示意圖》 第十一圖：係美國第5866442號發明專利案之一構造示意 圖。 第十二圖：係美國第5866442號發明專利案之一構造示意 第五A 第六圖 第七圖 第八圖 第九圖 第十圖 卜紙張尺度適用中國國家標半（CNS)A4規格（210 X 297公釐〉 訂· -線- 「膠432648 A7 B7 五、發明說明（4) 圖。 (二）圖號部分： (1 0 )模具 (1 1 0 )上模穴 (1 1 2 )逃氣口 (1 2 0)下模六 (1 3 1 )水平端 (1 3 1 B )槽部 (2 0)基板 (2 2 )下線路接點 (2 3)晶片 (7 0)晶片 (7 1 )基板 r ^。 (713)抽氣孔(711) (712)線路接點 (7 2 )模具 (” n (7 2 1 )上模 (7 2 2 )下模 f Q Λ、 (8 Ο )封閉空間 (II) 上模 (III) 灌膠口 (1 2)下模 (1 3)抽氣通道 (1 3 1 A)槽部 (1 3 2 )垂直端 (21)上線路接點 ( 2 2 0 ) ( 2 3 0 )錫球 (2 4)抽氣孔 (7 〇 1 )錫球 ^1 ^1 ^1 ^1 ^1 ^1 ^1 ^1 I n 1 l=»J —fl J— I e (請先w讀背面之注意事項再填寫本頁) (8 1 )加壓+室 C 8 2 )抽氣室 經濟部智慧財產局員工消費合作社印製 有關本發明之技術特徵首先請參閱第一圖所示，主要 係於-基板（2 0 )表、底面分卿成有上、下線路接點 (2 1 ) (2 2 ) ’該上、下線路接點（2工）（2 2) 間並透過基板（2 G)夾層内預設的線路對應連接，其中 上線路接點（2 1 )係供連接晶# ( 2 3)表面植設之錫 球（2 3 0)，下線路接點（2 2 )則供外部連接之用； 又基板（2 0)於特定位置形成有一组或一組以上的 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 經濟部智慧財產局員工消費合作社印製 *^326 4 8 A7 ______Βϊ___ 五、發明說明（；？） 抽氣孔（2 4 )’該抽氣孔（2 4 )係對應位於晶片（2 3 )下方及其植設錫球（2 3 0 )的相對内侧；以前述完 成裝晶後的基板（2 0)將利用一特殊設計的模具進行覆 晶灌膠，其灌膠時將透過前述抽氣孔（2 4)向外抽氣， 令封膠得以迅速而確實的流入基板（2〇)與晶片（23 )之間且不生氣孔。 有關該模具部分，請參閱第二圖所示，該模具（1 ◦ )包括有：一上模（1 1 )及一相對於前述上模（1 1 ) 的下模（1 2);其中： 該上模（1 1 )内底面形成有適當空間的上模穴（1 1 0) ’以供形成覆蓋基板（2 0)表面的封膠層，於本 實施例中’該上模穴（1 1〇)係呈矩形狀，其於一角落 處形成有灌膠口（ 1 1 1 )(請配合參閱第三圖所示）， 又於對角的相對角落處設至少一逃氣口（112)，該逃 氣口（ 1 1 2 )可進一步與真空抽氣設備連接，以便於灌 模時’令上模穴（1 1 〇)内部形成真空狀態更增封膠效 率。 又請參閱第二、四圖所示，該下模（1 2)上表面形 成有適當容積之下模穴（12〇)，供容設基板（20) ’又下模（1 2)於下模穴（1 20)上形成有若干抽氣 通道（1 3 )，該抽氣通道（1 3 )係呈非直線之曲徑形 式’意即抽氣通道（1 3 )之進氣口與出氣口係呈錯開狀 ’而未位於同一直線上；於本實施例中，該抽氣通道（1 3 )係呈一η形狀，其具有一水平端（1 3 1 )及一連通 9 本紙張尺度適用t困國家標準（CNS)A4規格⑵(jx297公爱） — — — — — — — — — — — — — — — — — — — II βιιι — lltt (請先閱讀背面之注意事項再填寫本頁) A7 B7 1432648 五、發明說明（方） 於前述水平端（131)—端部之垂直端（132)(如 第四A圖所示），其中： 該水平端（1 3 1)係位於下模穴（1 2〇)的内表 面’並呈開放狀’其相對垂直端（1 3 2)之另端係對正 於基板（2 0)上之抽氣孔（2 4 );又垂直端（1 3 2 )相對於水平端（1 3 1 )之另端則與真空抽氣設備連接 〇 又前述水平端（1 3 1 )對正於基板（2 〇)上抽氣 孔（24)的一端具有較大的面積，其面積恆大於基板（ 2 0 )上之抽氣孔（2 4)孔徑；以前述之較大面積設計 ’主要在容許該抽氣孔（2 4)與抽氣通道（1 3 )間一 適當程度的對位偏差，意即，當基板（2 〇)上之抽氣孔 (2 4)並非完全對正於水平端（1 3 1 )對應端之中心 點，透過水平端（1 3 1 )該端之較大面積設計，仍可使 二者達到相對且連通之目的。 再者’前述抽氣通道（13)之水平端（131)需 具有適當之深度與長度以充分確保膠體至多流至水平端（ 1 3 1 )時即行凝固（j e 1)而不會繼續溢流至垂直端（13 2) 造成不易脫模’舉例而言，若本實施例係選用shinetsu 公司編號X-43-2646之封膠材料（Compound)，因其膠體顆 粒直徑平均約為5 micron，故水平端（131)之深度至 多為 15 micron ’ 最佳為 1〇 micron。 又前述水平端（1 3 1 )於較大面積端上可形成一槽 部（131A)(如第二圖及第四a圖所示），該槽部（ 本紙張尺度適用令國國家標準（CNS)A4規格（210 X 297公；t ) 1'1----I* 及--------訂------線 (請先閱讀背面之注意事項再填窝本頁) 經濟部智慧財產局員工消費合作社印數 A7 B7 *432648 五、發明說明（，） {請先閱讀背面之注意事項再填寫本頁j 1 3 1Α)之深度係在水平端（i 3丄）之平面以下，藉 以形成較大容膠空間，並可緩衝或阻止封膠於抽氣過程中 過度溢流至垂直端（132):此^形抽氣通道設計或一 較深槽部之设置用意即在若封膠過程中勝體未能完全凝固 於基板之抽氣孔内而繼續向下溢流時，是項設計即可使得 封夥凝固於抽氣通道之槽部或水平端，B止封料一步溢 流至垂直端；且當封膠完成後，殘餘於抽氣孔底部及前述 槽部間之餘膠將隨基板脫離下模，換言之，將無餘膠殘留 下模上，故無須經過清模步驟，即直 又前述槽部（131A)及垂直端（13吏2)截面均 呈矩形狀，除該等形狀外，另可為其他不特定之適當形狀 ’如第四丑圖所示’該水平端（1 3 1 )於較大面積端上 形成之槽部（1 3 1 B)係呈圓形狀，又垂直端（1 32 )之載面亦呈圓形狀。 再請參閱第四C圖及第5 B圖所示，係前述抽氣通道 (1 3 )的又一實施例，與前述實施例不同處在於：本實 施例之水平端（1 3 1 )維持同-深度，並未於較大面積 端形成槽部。 經 濟 部 智 慧 財 產 局 員 X 消 費 合 作 社 印 製 由上述說明可看出本發明之構造特徵，至於其實施方 法請參閱第六圖所示： 當前述基板（2 0 )置於模具（i 〇 )中，基板（2 0)本身係對應谷设於下模（1 2)的下模穴（1 2〇) 中，位於基板（2 0 )上表面的晶片（2 3 )則突出於上 模（1 1 )的上模穴（1 i 0)間，其中基板（2 〇)上The first picture, the second picture, a group of brothers, two gardens, fourth A -----; --------- A --- (please pay attention to the back of M Zan before filling out this page) Ministry of Economic Affairs Printed by the Intellectual Property Bureau employee consumer cooperative is a cross-sectional view of the substrate of the present invention. It is a sectional view of the mold of the present invention. It is a bottom plan view of the upper mold of the mold of the present invention. Figure 4C is a top plan view of different embodiments of the lower mold of the mold of the present invention. Figure 5B is a partial cross-sectional view of different embodiments of the lower mold of the mold of the present invention. It is a sectional view of the use state of the present invention. This is a cross-sectional view after the substrate is demolded. It is a cross-sectional view of the substrate of the present invention after the solder balls are planted outside. Schematic diagram of the structure where the substrate is bonded to the wafer by flip-chip bonding. It is a schematic diagram of the structure of the invention patent case of the United States No. 5385869. Figure 11: It is a schematic diagram of the structure of the invention patent case of the United States No. 5864642. Twelfth picture: It is one of the US Patent No. 5866442, which is a schematic illustration of the structure. Fifth A. Sixth. Seventh. Eighth. Ninth. X 297 mm> Order · -line-"Glue 432648 A7 B7 V. Description of the invention (4) Figure. (II) Drawing number part: (1 0) Mold (1 1 0) Upper mold cavity (1 1 2) escape Port (1 2 0) Lower die six (1 3 1) Horizontal end (1 3 1 B) Groove (2 0) Substrate (2 2) Lower line contact (2 3) Chip (7 0) Chip (7 1 ) Substrate r ^ (713) exhaust hole (711) (712) line contact (7 2) mold ("n (7 2 1) upper mold (7 2 2) lower mold f Q Λ, (8 Ο) closed Space (II) Upper mold (III) Glue filling port (1 2) Lower mold (1 3) Suction channel (1 3 1 A) Groove (1 3 2) Vertical contact (21) on the line contact (2 2 0) (2 3 0) solder ball (2 4) suction hole (7 〇1) solder ball ^ 1 ^ 1 ^ 1 ^ 1 ^ 1 ^ 1 ^ 1 ^ 1 I n 1 l = »J —fl J— I e (please read the precautions on the back before filling this page) (8 1) Pressurization + room C 8 2) Extraction room Intellectual Property Bureau of the Ministry of Economic Affairs Employee Consumption Cooperative printed on the technical features of the invention One picture It is mainly shown in the bottom board (2 0) table and the bottom surface of the upper and lower line contacts (2 1) (2 2) 'The upper and lower line contacts (2 workers) (2 2) and Corresponding connections are preset through the substrate (2 G) interlayer, where the upper line contact (2 1) is a solder ball (2 3 0) planted on the surface of the connecting crystal # (2 3), and the lower line contact ( 2 2) is used for external connection; and the substrate (20) is formed with a set of one or more sets of this paper in a specific position. This paper applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm). Intellectual property of the Ministry of Economic Affairs Printed by the Bureau ’s Consumer Cooperatives * ^ 326 4 8 A7 ______ Βϊ ___ V. Description of the Invention (;?) Vent (2 4) 'The vent (2 4) corresponds to the bottom of the chip (2 3) and its solder ball (2 3 0) is opposite to the inner side; the substrate (20) after completion of the above-mentioned chip mounting will use a specially designed mold to perform chip-on-chip filling, and when it is filled, it will be pumped out through the aforementioned suction hole (2 4). Gas, so that the sealant can flow quickly and surely into the hole between the substrate (20) and the wafer (23) without improper holes. For the part of the mold, see As shown in the figure, the mold (1 ◦) includes: an upper mold (1 1) and a lower mold (1 2) opposite to the aforementioned upper mold (1 1); wherein: the inner bottom surface of the upper mold (1 1) An upper mold cavity (1 1 0) with an appropriate space is formed for forming a sealant layer covering the surface of the substrate (20). In this embodiment, 'the upper mold cavity (1 10) is rectangular, and A glue filling port (1 1 1) is formed at one corner (see the third figure for cooperation), and at least one escape port (112) is provided at the opposite corner of the diagonal, and the escape port (1 1 2) It can be further connected with a vacuum pumping device, so that when the mold is filled, a vacuum state is formed inside the upper mold cavity (110) to increase the sealing efficiency. Please also refer to the second and fourth figures, the lower mold (1 2) has a lower cavity (12) with an appropriate volume formed on the upper surface, for holding the substrate (20), and the lower mold (1 2) is lower. A plurality of suction channels (1 3) are formed on the cavity (1 20), and the suction channels (1 3) are in a non-linear curved path form, which means that the air inlets and outlets of the suction channels (1 3) The air ports are staggered and not on the same straight line. In this embodiment, the air suction channel (1 3) is in a shape of η, which has a horizontal end (1 3 1) and a 9-paper scale. Applicable National Standard (CNS) A4 specification⑵ (jx297 公 爱) — — — — — — — — — — — — — — — II βιιι — lltt (Please read the precautions on the back before filling in this Page) A7 B7 1432648 V. Description of the invention (square) At the aforementioned horizontal end (131)-the vertical end (132) of the end (as shown in the fourth A picture), where: the horizontal end (1 3 1) is located at The inner surface of the lower cavity (1 2 0) is 'opened' and the opposite end of the opposite vertical end (1 2 2) is aligned with the suction hole (2 4) on the substrate (2 0); The other end of the straight end (1 3 2) relative to the horizontal end (1 3 1) is connected to a vacuum extraction device. The horizontal end (1 3 1) is aligned with the exhaust hole (24) on the base plate (2). One end has a larger area, the area of which is always larger than the hole diameter of the suction holes (24) on the substrate (20); the aforementioned larger area design is mainly to allow the suction holes (24) and the suction channel ( 1 3) an appropriate degree of misalignment, that is, when the suction holes (2 4) on the substrate (20) are not completely aligned with the center point of the corresponding end of the horizontal end (1 3 1), the horizontal end is transmitted through (1 3 1) The larger area design of the end still allows the two to achieve relative and connected purposes. Furthermore, the horizontal end (131) of the aforementioned suction channel (13) needs to have a proper depth and length to fully ensure that the colloid will solidify (je 1) when it flows up to the horizontal end (1 3 1) without continuing to overflow. To the vertical end (13 2), it is difficult to release the mold. 'For example, if this embodiment uses Shintsutsu Company No. X-43-2646 sealing compound (Compound), the average diameter of the colloidal particles is about 5 micron, so The depth of the horizontal end (131) is at most 15 micron ', preferably 10 micron. The horizontal end (1 3 1) can form a groove portion (131A) on the larger area end (as shown in the second and fourth a), the groove portion (this paper size applies the national standard ( CNS) A4 specification (210 X 297 male; t) 1'1 ---- I * and -------- order ------ line (please read the precautions on the back before filling the book Page) Employee Cooperative Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 * 432648 V. Description of the invention (,) {Please read the notes on the back before filling in this page j 1 3 1Α) The depth is at the horizontal end (i 3 丄) Below the plane, so as to form a larger glue-holding space, and can buffer or prevent the sealant from overflowing to the vertical end (132) during the pumping process: this ^ -shaped pumping channel design or the setting of a deeper groove The intention is that if the winning body fails to completely solidify in the suction hole of the substrate during the sealing process and continues to overflow, this design can make the seal solidify at the groove or horizontal end of the suction channel. The sealing material overflows to the vertical end in one step; and after the sealing is completed, the residual glue remaining between the bottom of the suction hole and the aforementioned groove will be separated from the lower mold with the substrate, in other words, the The remaining glue remains on the lower mold, so there is no need to go through the mold cleaning step, that is, the cross-section of the groove (131A) and the vertical end (13-2) are rectangular in shape. In addition to these shapes, other unspecified Appropriate shape 'as shown in the fourth ugly figure' The groove (1 3 1 B) formed by the horizontal end (1 3 1) on the larger area end has a circular shape and the load surface of the vertical end (1 32) Also round shape. Please refer to FIG. 4C and FIG. 5B again, which is another embodiment of the foregoing suction channel (1 3), which is different from the foregoing embodiment in that the horizontal end (1 3 1) of this embodiment is maintained With the same depth, no groove is formed at the end of the larger area. Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, X Consumer Cooperative, the structural features of the present invention can be seen from the above description. As for the implementation method, please refer to the sixth figure: When the aforementioned substrate (20) is placed in the mold (i), The base plate (2 0) itself corresponds to the lower die cavity (1 2 0) provided in the lower die (1 2), and the wafer (2 3) located on the upper surface of the base plate (2 0) protrudes from the upper die (1 1). ) Between the upper mold cavity (1 i 0), where the substrate (2 〇)
經濟部智慧財產局員工消費合作社印製 Γ 14 326 4 8 Α7 ____ Β7____ 五、發明說明（1°) 各個抽氣孔（2 4)將分別對正於下模穴（1 20)上的 抽氣通道（1 3 ); 由於上模（1 1 )上的逃氣口（ 1 1 2)及位於下模 (1 2)處的抽氣通道（1 3 )係共同連接至真空抽氣言史 備，當封膠開始由上模（1 1 )的灌膠口（ 1 1 1 )灌入 ，真空抽氣設備亦開始抽氣，此時，模具（1 1 )内外的 壓差逐漸擴大，基板（2 0)上抽氣孔（24)的抽氣動 作，亦對灌入之灌膠產生牽制作用，因此，封膠將迅速而 確實的流入基板（2 0 )與晶片（2 3 )之間，藉此，達 成迅速完成灌膠步驟且不生氣孔之目的。在抽氣通道（1 3)透過基板（20)上的抽氣孔（24)向外抽氣時， 部分封膠將受吸引而進入抽氣孔（2 4 )，甚至溢流至抽 氣通道（1 3);由於模具（1 〇)係一重覆使用的機具 ’其最佳狀態係脫膜後可直接進入下一作業次，如必須經 過清模動作，則將顯著影響灌模之作業效率，而前述非直 線的曲徑式抽氣通道（1 3)設計，即可有效避免封膠殘 留於下模（1 2 )上，其無需清模，即可直接重複使用： 在灌膠作業進行時，封膠適度的流入柚氣孔（2 4) 内’可將該抽氣孔（2 4)填實，而使封裝效果更為確實 ’惟實際上封膠灌入模具（1 〇)之量，較難嚴格控制封 膠在填實柚氣孔（2 4)後即不再溢流，因此，本發明令 下模（1 2)上的抽氣通道（1 3)於一端形成有較大面 積且深度較深的槽部（13 1A)，以提供較大的餘膠溢 流空間，透過溢膠空間的形成，當抽氣孔（2 4)被填實 12 本紙張及度適用中圉國家標準（CNS)A4規格（210 X 297公楚） ' .^1 n i I n n 1 n ϋ 一一nJ 1_ n n I {請先閱讀背面之注意事項再填寫本頁> A7 B7 f4 3 2 6 4 8 五、發明說明（If ) 後’封膠仍繼續流動時，前述槽部（1 3 1 A)即可用以 容納多餘的封膠’並使封膠不致流至抽氣通道（1 3 )的 垂直端（1 3 2 )’由於餘膠係被侷限在槽部（1 3 1 A )中’且與抽氣孔（24)内的封膠仍為連結狀態，則在 基板（2 0 )脫模時，餘膠將附著於基板（2 〇 )底部， 而隨基板（20)脫離下模（12)(如第七圖所示）， 由於餘膠未殘留於下模穴（1 2 〇 )的抽氣通道（1 3 ) 間’故無須經過清模，即可繼續重複使用。 至於’附著於基板（2 0 )底部的餘膠，並無須加以 清除’其亦不致影響封裝後積體電路之正常使用，主要原 因在於：前述經過封膠後的基板（2 〇 )仍須於底部的下 線路接點（2 2 )上分別植設錫球（2 2 0 )(如第八圖 所示），該錫球（2 2 0 )直徑恆大於基板（2 〇 )餘膠 之厚度’故不虞影響錫球（2 2 0)之正常接合’進而不 影響封裝後積體電路之正常使用。 由上述說明可看出本發明之具體技術手段及工作方式 ’以該等設計至少具備下列優點： 1 ,大幅增進灌膠製程效率：以往利用模具進行灌膠 ，封膠將因晶片與基板之間隙過小，且受錫球阻擋而影響 封膠之流動速度，進而影響作業效率，透過本發明之曲徑 式抽氣設計，可顯著提升封膠之流動速度，故得有效增進 作業效率β 2 ·無須增設額外的特殊設備，不變更製程步驟：本 發明係於模具上設以曲徑式抽氣通道，而模具係灌模必備 本紙張尺度適用中圏國家標準（CNS>A4規格（210 X 297公f -^ ^ ^ ^ ^ ^ ^ n n n 1 I I ^ I ^ ^ 1· 1·』6J n n 1 ^ a— n It I !. (請先閱讀背面之注意事項再填寫本頁) 經 濟 部 智 慧 財 產 局 消 賢 合 作 社 印 製 經濟部智慧財產局負工消費合作社印製 Γ P4326 4 8 五、發明說明（ο ) 的原始機具，而真空抽氣設備亦為原始製程中之基本配備 (供對逃氣口抽氣之用），故無須增設額外的特殊設備； 又經設以抽氣通道後，其工作方式並未因而改變，故無須 變更流程步驟。 3 ♦無清模問題，可直接重複使用模具：由於本發明 抽氣通道具有特殊的設計，可防止餘膠殘留模具上，故得 避免清模問題，而間接增進製程效率。 4、覆晶封膠方法可區分為模具注腾（mo 1 d i ng)與點 膠（underfill) ’模具注膠（molding)的優點在於灌一模即 可將六或八組以上晶片一次封膠完成’適合大量生產；惟 缺點在於耀體不易將晶片與基板間的空隙充分填實。至於 傳統的點膠（underfill)雖較能完全填實晶片與基板間的 空隙，但其膠体流動速度緩慢且一次僅能對一組晶片進行 封膠’生產效率難以提昇。是以本發明之設計正解決了模 具注膠（molding)膠體不易將晶片與基板間的空隙充分填 實的缺點，使模具注躍·（molding)能得宜地運用在覆晶封 膠上以大幅提昇產能。 綜上所述，本發明確已具備前揭所述各項優點，其已 兼具產業上可利用性與進步性，並符合發明專利要件，麦 依法提起申請。 I τ I-----Λ---------------線！ (請先閲讀背面之注意事項再填寫本頁> 14Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Γ 14 326 4 8 Α7 ____ Β7 ____ V. Description of the invention (1 °) Each exhaust hole (2 4) will be aligned with the exhaust channel on the lower mold cavity (1 20) (1 3); Because the escape port (1 1 2) on the upper mold (1 1) and the exhaust channel (1 3) at the lower mold (1 2) are connected to the vacuum pumping history, when The sealant starts to be filled through the filling port (1 1 1) of the upper mold (1 1), and the vacuum pumping equipment also starts to evacuate. At this time, the pressure difference between the inside and outside of the mold (1 1) gradually expands, and the base plate (2 0 The pumping action of the suction hole (24) on the upper side also produces a draw effect for the injected glue. Therefore, the sealing glue will quickly and surely flow between the substrate (2 0) and the wafer (2 3), thereby, Achieve the goal of quickly completing the glue filling step without angering the holes. When the suction channel (1 3) is sucked out through the suction hole (24) on the substrate (20), part of the sealant will be attracted and enter the suction hole (2 4), and even overflow to the suction channel (1 3); Since the mold (1〇) is a tool repeatedly used, its best condition is that it can go directly to the next operation after removing the film. If the mold clearing action must be performed, it will significantly affect the operation efficiency of the mold filling, and The aforementioned non-linear curved path suction channel (1 3) design can effectively prevent the sealant from remaining on the lower mold (1 2), which can be reused directly without the need to clear the mold: During the filling operation, The sealant flows into the pomelo air holes (2 4) moderately. 'The air holes (2 4) can be filled to make the packaging effect more reliable.' However, the amount of the sealant injected into the mold (1 0) is difficult. Strictly control that the sealant no longer overflows after filling the pomelo air holes (2 4). Therefore, the present invention causes the suction channel (1 3) on the lower mold (1 2) to have a larger area at one end and a greater depth. Deep groove (13 1A) to provide a large excess glue overflow space, through the formation of overflow space, when the suction hole (2 4) is filled 12 The paper and degree are in accordance with China National Standard (CNS) A4 specification (210 X 297 cm) '. ^ 1 ni I nn 1 n ϋ 一一 nJ 1_ nn I {Please read the precautions on the back before filling this page & gt A7 B7 f4 3 2 6 4 8 V. After the description of the invention (If), when the sealant still flows, the aforementioned groove portion (1 3 1 A) can be used to accommodate the excess sealant and prevent the sealant from flowing to The vertical end (1 3 2) of the suction channel (1 3) 'is confined to the groove part (1 3 1 A)' due to the residual rubber system 'and is still connected to the sealant in the suction hole (24), then When the substrate (20) is demolded, the residual glue will adhere to the bottom of the substrate (20), and as the substrate (20) is released from the lower mold (12) (as shown in the seventh figure), the residual glue does not remain on The suction channel (1 3) of the mold cavity (1 2 0) can be reused without cleaning the mold. As for the 'residual glue attached to the bottom of the substrate (20), there is no need to remove it' will not affect the normal use of the integrated circuit after packaging. The main reason is that the aforementioned substrate (20) after sealing must still be used in Tin balls (2 2 0) are respectively arranged on the bottom line contacts (2 2) at the bottom (as shown in the eighth figure), and the diameter of the solder balls (2 2 0) is always larger than the thickness of the remaining glue of the substrate (2 0). 'So it does not affect the normal bonding of the solder balls (2 2 0)' and thus does not affect the normal use of the integrated circuit after packaging. From the above description, it can be seen that the specific technical means and working methods of the present invention have at least the following advantages with these designs: 1. Significantly improve the efficiency of the potting process: In the past, potting was performed using a mold, and the sealant will be caused by the gap between the wafer and the substrate. It is too small, and it is blocked by the solder ball, which affects the flow speed of the sealant, and then affects the operation efficiency. Through the curved path suction design of the present invention, the flow speed of the sealant can be significantly improved, so the operation efficiency β 2 can be effectively improved. Add extra special equipment without changing the process steps: The present invention is provided with a tortuous-type extraction channel on the mold, and the mold is necessary for the filling of the mold. f-^ ^ ^ ^ ^ ^ ^ nnn 1 II ^ I ^ ^ 1 · 1 · "6J nn 1 ^ a— n It I!. (Please read the notes on the back before filling this page) Intellectual Property Bureau of the Ministry of Economic Affairs Printed by Xiaoxian Cooperative Co., Ltd. Printed by the Consumer Property Cooperative of Intellectual Property Bureau of the Ministry of Economy Γ P4326 4 8 V. Original equipment of invention description (ο), and the vacuum extraction equipment is also the basic equipment in the original process (for For the purpose of pumping air from the escape port), there is no need to add additional special equipment; after the pumping channel is set, its working mode has not been changed accordingly, so there is no need to change the process steps. 3 ♦ No mold cleaning problem, can be reused directly Mould: Because the suction channel of the present invention has a special design, it can prevent the residual rubber from remaining on the mold, so it is necessary to avoid the problem of mold cleaning and indirectly improve the process efficiency. 4. The method of chip-on-sealing can be divided into mold injection (mo 1 di ng) and underfill. The advantage of mold injection is that it can seal more than six or eight groups of wafers at a time by filling a mold. It is suitable for mass production; but the disadvantage is that it is not easy to use the wafer and the substrate. The gap between the two is fully filled. As for the traditional underfill, it is more complete to fill the gap between the wafer and the substrate, but its colloidal flow is slow and only one group of wafers can be sealed at a time. Production efficiency is difficult to improve The design of the present invention is solving the shortcomings of the mold molding colloid that it is not easy to fully fill the gap between the wafer and the substrate, so that the mold injection can be appropriately performed. It can be used on flip chip sealant to greatly increase the production capacity. In summary, the present invention does have all the advantages mentioned in the previous disclosure, it has both industrial availability and progress, and meets the requirements of invention patents. Mai filed an application according to law. I τ I ----- Λ --------------- line! (Please read the precautions on the back before filling in this page> 14