TW425657B - Method for fabricating a semiconductor device - Google Patents

Method for fabricating a semiconductor device Download PDF

Info

Publication number
TW425657B
TW425657B TW088113790A TW88113790A TW425657B TW 425657 B TW425657 B TW 425657B TW 088113790 A TW088113790 A TW 088113790A TW 88113790 A TW88113790 A TW 88113790A TW 425657 B TW425657 B TW 425657B
Authority
TW
Taiwan
Prior art keywords
layer
gas
patent application
item
scope
Prior art date
Application number
TW088113790A
Other languages
English (en)
Chinese (zh)
Inventor
Chul-Ju Hwang
Original Assignee
Hwang Chul Ju
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hwang Chul Ju filed Critical Hwang Chul Ju
Application granted granted Critical
Publication of TW425657B publication Critical patent/TW425657B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/60—Capacitors
    • H10D1/68—Capacitors having no potential barriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6326—Deposition processes
    • H10P14/6328—Deposition from the gas or vapour phase
    • H10P14/6334—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/65—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials
    • H10P14/6502—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed before formation of the materials
    • H10P14/6504—In-situ cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/69—Inorganic materials
    • H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
    • H10P14/6938—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides
    • H10P14/6939—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides characterised by the metal
    • H10P14/69393—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides characterised by the metal the material containing tantalum, e.g. Ta2O5

Landscapes

  • Semiconductor Memories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Drying Of Semiconductors (AREA)
TW088113790A 1998-08-07 1999-08-12 Method for fabricating a semiconductor device TW425657B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019980032106A KR100292088B1 (ko) 1998-08-07 1998-08-07 반도체소자 제조방법

Publications (1)

Publication Number Publication Date
TW425657B true TW425657B (en) 2001-03-11

Family

ID=19546649

Family Applications (1)

Application Number Title Priority Date Filing Date
TW088113790A TW425657B (en) 1998-08-07 1999-08-12 Method for fabricating a semiconductor device

Country Status (3)

Country Link
JP (1) JP2000100806A (enExample)
KR (1) KR100292088B1 (enExample)
TW (1) TW425657B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020051062A (ko) * 2000-12-22 2002-06-28 박종섭 탄탈륨 옥시 나이트라이드 캐퍼시터의 형성 방법
KR100428655B1 (ko) * 2002-07-19 2004-04-28 주식회사 하이닉스반도체 캐패시터의 제조 방법

Also Published As

Publication number Publication date
JP2000100806A (ja) 2000-04-07
KR100292088B1 (ko) 2001-07-12
KR20000013319A (ko) 2000-03-06

Similar Documents

Publication Publication Date Title
JP4314413B2 (ja) Ta▲下2▼O▲下5▼誘電体層の製造方法
JP2764472B2 (ja) 半導体の成膜方法
US5733816A (en) Method for depositing a tungsten layer on silicon
US6201276B1 (en) Method of fabricating semiconductor devices utilizing in situ passivation of dielectric thin films
TWI242812B (en) Method for forming a metal oxide film
KR20020094933A (ko) 반도체장치 및 그 제조방법
KR960005681B1 (ko) 반도체 메모리 장치의 캐패시터 제조방법
US6180542B1 (en) Method for forming a high-permittivity dielectric film use in a semiconductor device
GB2362032A (en) Method for fabricating capacitors of a semiconductor device
US6338995B1 (en) High-permittivity dielectric capacitor for a semiconductor device and method for fabricating the same
KR100703833B1 (ko) 이중 유전막을 구비한 캐패시터의 제조 방법
KR100670747B1 (ko) 반도체소자의 캐패시터 제조 방법
KR100390938B1 (ko) 반도체 소자의 캐패시터 제조 방법
US20060261441A1 (en) Process for forming a low carbon, low resistance metal film during the manufacture of a semiconductor device and systems including same
US20120138850A1 (en) Etchant gas
KR100671604B1 (ko) 반도체 소자의 캐패시터 제조 방법
KR20030042106A (ko) 반도체 소자의 캐패시터 및 그 제조방법
JPH09199445A (ja) 半導体装置の製造方法
KR100551884B1 (ko) 반도체 소자의 캐패시터 제조방법
KR100292218B1 (ko) 반도체소자제조방법
KR100399073B1 (ko) 반도체 소자의 캐패시터 및 그 제조방법
KR100523658B1 (ko) 구리 확산 장벽 제조 방법
KR100292088B1 (ko) 반도체소자 제조방법
KR100646923B1 (ko) 반도체 소자의 커패시터 제조 방법
JP2000100806A5 (enExample)

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent