TW417414B - Device and method for developing and etching dry printed circuit board - Google Patents

Abstract

The present invention relates to a device for developing and etching dry printed circuit board, which comprises a first pipe, a second pipe and a nozzle. The first pipe has an end connected to a high pressure gas and another end connected to the nozzle. The second pipe has an end connected to a storage tank of the developing solution or the etching solution, and another end connected to the wall of the first tube. When the high pressure gas is sprayed out of the nozzle, the developing solution or etching solution enters the first pipe via the second pipe to mix with gas, thereby forming high speed developing solution particles or etching solution particles. The high speed developing solution particles or etching solution particles are sprayed to the surface of a printed circuit board via the nozzle. The method of the present invention comprises: (a) forming high speed developing solution particles or etching solution particles from developing solution or etching solution and high pressure gas; (b) spraying the high speed developing solution particles or etching solution particles to the surface of a printed circuit board; and (c) using the high pressure gas to bump off the high speed developing solution particles or etching solution particles aggregated on the surface of the printed circuit board, and using new high speed developing solution particles or etching solution particles to bump on the printed circuit board.

Description

[Field of the Invention] The present invention relates to a method and method, in particular on the surface of a circuit board. [Prior art] A device and method for developing and etching a dry sheet of a circuit board using a developing solution or an etching solution. After the development and etching equipment is mixed, it is sprayed to the printing brush ::::: Road board 10, v The first picture shows the dry film development and copper surface 1 0 矣 2 The nozzle 11 sprays a large amount of developing solution or etching solution to The printed circuit board anvil causes chemical development on the surface of the printed circuit board 10 for development ^ 4 1 η The main nozzle 11 sprays a developing solution or an etching solution onto a printed circuit board by a pump. The developing solution or the etching solution After the surface of the printed circuit board 10 is developed or etched, the developed or etched developing solution or etching solution 12 is collected on the surface of the printed circuit board 10, thus generating a "pool effect". As shown in the first figure, 'The developed or etched developing solution or etching solution 丨 2 prevents the new developing solution or etching solution sprayed from the nozzle U 丨 3 further developing or etching the surface of the printed circuit board 〇 'And produce a pool effect. The pool effect γ should be different in depth and depth to the new developer or etchant. 3 The degree of resistance is also different. 'If the pool effect is deeper, the new developer or etchant is developed. 3 The more difficult the engraving is, 'the unevenness of the ice cream or the icing liquid 12 due to the pool effect' causes the printed circuit board 10 to have the disadvantage of uneven or incomplete development or etching. Since the conventional process mainly uses the etching solution 12 collected on the printed circuit board 10 to soak the printed circuit board 10 and the pool effect acts on the printed circuit board 10, the deeper the # etched part is, the more the pool effect reduces the etching. The more obvious the speed is, the deeper the groove 14 of the printed circuit board 10 is, the narrower the width of the groove 14 is. As shown in the third figure, due to the etched area

5. Description of the invention (2) ----- The deeper the pool effect, the lower the etch rate becomes. When the entire etched part is etched, the surface etch rate is higher and the etch rate is deeper. Low, so that after the wiring 15 of the printed circuit board 10 is etched, the cross-section of the wiring 15 forms a ladder shape, and the cross-section of the wiring 15 has a large etching factor [Etching Factor], wherein the etching coefficient is defined as eight and / K, the etching coefficient is also the inverse of the slope of the 15 slope of the line. The larger the etching coefficient, the larger the pool effect, and the smaller the etching coefficient, the smaller the pool effect. In view of this, the dry sheet developing and etching device and method of the present invention improve the above disadvantages. After mixing the developing solution or etching solution with a high-pressure gas, high-speed developing solution particles or etching solution particles are sprayed onto the surface of the printed circuit board. The printed circuit board surface is subjected to more uniform development or etching, and the developing solution particles or the silver etching solution particles are mixed with a gas to increase the oxidation / oxidation strength of the developing solution or the etching solution to improve the etching efficiency. When the high-speed developing solution particles or etching solution particles are sprayed onto the surface of the printed circuit board, the high-pressure gas collides with the developing solution particles or etching solution particles that have previously acted on the surface of the printed circuit board and hit the surface of the printed circuit board. 'And the impact of new high-speed developer particles or etchant particles on the surface of the printed circuit board can promote the chemical action of development or etching and reduce the time required for the development or etching process. [Summary of the Invention] The main object of the present invention is to provide a dry sheet developing and etching device and method for a printed circuit board, which has the effect of uniform development or engraving. A secondary object of the present invention is to provide a dry sheet developing and etching device and method for a printed circuit board, which have the effect of improving the development or etching efficiency.

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V. Description of the invention (3) Another object of the present invention is to provide a dry film developing and after-etching device and method for a printed circuit board, which has the effect of reducing the time required for developing or silver engraving process. It mainly includes a first pipeline, a second pipeline and a nozzle. One end of the first line is connected to a high-pressure gas, and the other end is connected to the nozzle. One end of the first pipeline is connected to a storage tank for a developing solution or a nickname, and the other end is connected to a wall of the first pipeline to form the first pipeline and the second pipeline passage. When the high-pressure gas is sprayed from the nozzle, a pressure difference is generated between the first pipe and the second pipe. Since the internal pressure of the second pipe is greater than the pressure in the first pipe, the developer or money is engraved. The liquid enters the first pipeline from the second pipeline and is mixed with the high-pressure gas to form high-speed developing solution particles or surnamed liquid particles, and the high-speed development solution particles or surnamed liquid particles are ejected from a nozzle to a printed circuit board. D < The method according to the present invention, the main steps of which include: a. Forming a developing solution or a nicking solution with a south pressure gas to form high-speed developing solution particles or etching solution particles; b, the high-speed developing solution particles or etching The liquid particles are sprayed onto the surface of a printed circuit board; c. The developer particles or silver engraved liquid particles collected on the surface of the printed circuit board are impinged from the surface of the printed circuit board with the high-pressure gas, and then the new The developing solution particles or the etching solution particles hit the surface of the printed circuit board. # 5 In the present invention, after the developing solution or the etching solution is mixed with a high-pressure gas, the particles of the liquid crystal or the etching solution are sprayed onto the surface of the printed circuit board, and the printed circuit board is subjected to more uniform development. Or etching, and developing solution particles ;, the etching solution particles and the gas are sufficiently mixed to increase the developing solution or the etching solution

Page 7 Carved on the surface of a circuit board with printed circuit board The printed circuit board The printed circuit etchant particles should be clear from the description of the invention. Use developing solution or developing solution or intent; Brush circuit board line invention is better. Invention is better. Brush circuit board surface board or etching solution is better. Other examples are better. Aspect 5: Description of the invention (4) Adding oxidation strength, the particles attached to the printing liquid collided with the particles of the liquid liquid and collided with the particles of the developing liquid, or the pool effect was avoided. [Schematic description] In order to make this feature obvious, the following is _ The detailed description is as shown in the first picture: the second picture: the second picture: the third picture: the fourth picture: the book and the fifth picture: the first picture [illustration of the drawing number] 10 printed electric developer Π tank 2 0 printed circuit board 22 The second pipeline H contacting the high-pressure gas will previously touch the new Guwu factory to the magic developing solution particles or erosion, and its elimination, characteristics, and advantages that are avoided on the surface of the printed circuit board will be clearer. A schematic view of the embodiment and the accompanying drawings; a plan view gathered on the surface of a printed circuit board; a schematic view of a shadow and etching device; a shadow molecule or an etching molecule is sprayed on the intention. 11 Nozzle 13 Developer or etching solution 15 Circuit 21 First line 23 Nozzle u Jade, description of the invention (5) 24 Development 2 6 The above table [Examples] The process of the invention is the main device of the preferred embodiment. The present invention compares the engraving liquid with b, and the liquid particles or surname surface on the surface of the south plate, and then the new surface can reduce the development. Please refer to the liquid particle or etching liquid particle surface again. In order to be applicable to each of the techniques of the present invention, the development and etching of 2 5 dry film or copper layer 27 grooves need to use a potion to act on an object. The content is easy to understand. The process of the present invention illustrates the method and the preferred embodiment of the invention. Gas-speed developing solution; c. Because the developing solution of the engraved liquid particles can be engraved as shown in the fourth figure, a second first pipe 21 is connected to a high-pressure gas at the end, and a display is connected to the end of the pipe 22 to When the high-pressure gas plate 20 of the first pipeline 21 is shot, the law of effort makes the pressure difference of the nozzle 23 of the printed circuit [the white method mainly forms high-speed visible particles or silver engraving gathered on the printed The time required for the conventional process of eliminating high-pressure gas particles or silver engraving is shown. In the pipeline 22 and the other end of the present invention, the shadow liquid or the remaining camp wall forms the and developing liquid. When the high-step enveloping liquid particle liquid particle brush circuit body collides with the liquid particle, the product contains: a. Spraying particles or surname engraving liquid on the surface of a printing plate, the printed circuit impacts the printing water tank developing solution Particles; the circuit board of the developing board of the brush circuit should be, and the preferred embodiment mainly includes a nozzle 23 connected to the nozzle 23. The first line 21 and the second line of hydraulic gas are described. A pipeline 2 1 — the second liquid storage tank, and the other end is sprayed with the pipeline 22 between the first pipeline 21 and the second pipeline 23 through the first pipeline 21 The pressure in the circuit 22 produces a pressure greater than

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In the first pipeline 21, the developing solution or etching solution is allowed to enter the first pipeline 21 from the second pipeline 22 and mixed with the high-pressure gas to form high-speed developing solution particles or etching solution particles 24. The rapid development The liquid particles or etching solution particles 24 are sprayed to the surface of the printed circuit board 2 by the nozzle 23, and the high-speed developing solution particles or the etching solution particles 24 are sprayed to the printed circuit board 2 from top to bottom. On the surface. Since the developing solution particles or etching solution particles are continuously and uniformly sprayed on the surface of the printed circuit board, the developing solution particles or etching solution particles that have been attached to the surface of the printed circuit board are constantly being blown away by the high pressure gas. The surface of the printed circuit board makes the surface of the printed circuit board interact with the particles of the developing solution or the particles of the etching solution uniformly, so that the invention has the effect of uniform development or etching. When the developing solution or the etching solution is mixed with a high-pressure gas, the gas promotes the oxidation of the developing solution particles or the etching solution particles, thereby forming the developing solution particles or the etching solution particles with an increased oxidation strength, thereby improving the etching efficiency. _ Please refer to the fifth figure again. 'The developer particles or etchant particles 24 啧 · After the nozzle 23 is sprayed onto a dry piece or copper layer 25 of a printed circuit board 20, the developer particles or etchant particles 24 are processed. Develop or etch the upper surface 26 and several grooves 27 of one of the dry sheet or copper layer 25. The developing solution particles or etch solution particles 24 are attached to the upper surface 26 and several of one of the dry sheet or copper layer 25 after the action. Groove 27, and the high-pressure gas sprayed from the nozzle 23 will strike the developing solution particles or etching solution particles 24, causing the developing solution particles or etching solution particles 24 to be knocked off the dry sheet or copper layer 25 is one of the upper surface 26 and several grooves 27. Therefore, when the nozzle 23 is continuously ejected, 'the high-pressure air constantly brings new developer particles or etchant particles 24, and it has finished attaching to the printed circuit board 2. Is constantly being smashed away from the printed circuit board 20 'so that the conventional process does not occur

Page 10 V. Description of the invention (7) The pool effect. The developing solution particles or etching solution particles 24 which hit the upper surface 26 and several grooves of one of the dry sheet or the copper layer 25 are compared with the conventionally sprayed developing solution. Or the engraving liquid has the effect of promoting development or etching. 凊 Referring to the second and fifth figures, the conventional process is affected by the pool effect. The deeper the remaining part, the more the pool effect reduces the etching rate, which makes the printed circuit board. The groove of 10 has a deeper depth, and the width of the groove is narrower and has a larger engraving coefficient. The diameter of the etching liquid particles 24 in the present invention is smaller than that of the groove 27 of the printed circuit board 20, and thus the etching liquid particles 24 can directly enter the slot 27 for etching, and the etching solution particles 24 that have been applied can be hit by the high-pressure gas away from the slot 27, so that the slot 27 does not have a pool effect, so it has a better money carving effect and makes The wall surface of the groove 27 has a vertical slope, that is, has a smaller etching coefficient. ^ Although the present invention has been disclosed in the foregoing preferred embodiment, it is not intended to limit the present invention to anyone skilled in the art, without departing from The essence of the invention And the range, as defined by the modifications and can be variously modified so that the protective scope of the present invention \ attached around when the range of the patent, whichever view.

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Claims (1)

A developing and etching device comprising: connected to the high-pressure gas and the other end connected to the dry piece of the ~ printed circuit board ~ high-pressure gas; ~ a nozzle; a first pipeline having one end connected to the nozzle; a liquid 'which has a chemical action; and The second pipeline has one end connected to the liquid and the other end connected to the first S channel to form a passage to the nozzle; therefore, when the high-pressure gas is sprayed through the first tube to the nozzle, the body passes through the second The pipeline enters the first pipeline, and the liquid and high gas form liquid particles in the first pipeline, and the liquid particles are sprayed by the nozzle. φ Dry and engraving device of printed circuit board according to item 1 of the scope of the patent application 'wherein the liquid is a developing solution D for development, dry and silver engraving device of printed circuit board according to item 1 of the scope of the patent application' The liquid is an etching liquid. Development, dry film and food engraving device for printed circuit boards according to item 1 of the scope of application patents * wherein the liquid molecules are ejected from the nozzle with a nozzle from the top to the development, a dry film development and etching method for printed circuit boards, which The package steps are as follows: a. The liquid and the high-pressure gas are formed into high-speed liquid particles; b. The high-speed liquid particles are sprayed onto the surface of a printed circuit board. C. The liquid particles gathered on the surface of the printed circuit board are # 'and Page 12 Page 13