TW409944U - BGA printed circuit board plating thickness tester - Google Patents

BGA printed circuit board plating thickness tester

Info

Publication number
TW409944U
TW409944U TW88201575U TW88201575U TW409944U TW 409944 U TW409944 U TW 409944U TW 88201575 U TW88201575 U TW 88201575U TW 88201575 U TW88201575 U TW 88201575U TW 409944 U TW409944 U TW 409944U
Authority
TW
Taiwan
Prior art keywords
circuit board
printed circuit
plating thickness
thickness tester
board plating
Prior art date
Application number
TW88201575U
Other languages
Chinese (zh)
Inventor
Yi-Hung Lin
Bing-Huan Li
Original Assignee
Lin Yi Hung
Contrel Semiconductor Tech Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lin Yi Hung, Contrel Semiconductor Tech Co filed Critical Lin Yi Hung
Priority to TW88201575U priority Critical patent/TW409944U/en
Publication of TW409944U publication Critical patent/TW409944U/en

Links

TW88201575U 1999-01-28 1999-01-28 BGA printed circuit board plating thickness tester TW409944U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW88201575U TW409944U (en) 1999-01-28 1999-01-28 BGA printed circuit board plating thickness tester

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW88201575U TW409944U (en) 1999-01-28 1999-01-28 BGA printed circuit board plating thickness tester

Publications (1)

Publication Number Publication Date
TW409944U true TW409944U (en) 2000-10-21

Family

ID=21644504

Family Applications (1)

Application Number Title Priority Date Filing Date
TW88201575U TW409944U (en) 1999-01-28 1999-01-28 BGA printed circuit board plating thickness tester

Country Status (1)

Country Link
TW (1) TW409944U (en)

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees