TW409941U - Adapting device - Google Patents

Adapting device

Info

Publication number
TW409941U
TW409941U TW088201405U TW88201405U TW409941U TW 409941 U TW409941 U TW 409941U TW 088201405 U TW088201405 U TW 088201405U TW 88201405 U TW88201405 U TW 88201405U TW 409941 U TW409941 U TW 409941U
Authority
TW
Taiwan
Prior art keywords
adapting device
adapting
Prior art date
Application number
TW088201405U
Other languages
English (en)
Inventor
Shigeru Hayata
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of TW409941U publication Critical patent/TW409941U/zh

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Wire Bonding (AREA)
TW088201405U 1998-02-02 1999-01-28 Adapting device TW409941U (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10035488A JPH11218412A (ja) 1998-02-02 1998-02-02 ボンディング装置

Publications (1)

Publication Number Publication Date
TW409941U true TW409941U (en) 2000-10-21

Family

ID=12443144

Family Applications (1)

Application Number Title Priority Date Filing Date
TW088201405U TW409941U (en) 1998-02-02 1999-01-28 Adapting device

Country Status (4)

Country Link
US (1) US6381359B1 (zh)
JP (1) JPH11218412A (zh)
KR (1) KR100306637B1 (zh)
TW (1) TW409941U (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3416091B2 (ja) * 2000-01-21 2003-06-16 株式会社新川 ボンディング装置およびボンディング方法
JP4088232B2 (ja) * 2003-10-07 2008-05-21 株式会社新川 ボンディング方法、ボンディング装置及びボンディングプログラム
JP4128513B2 (ja) * 2003-10-07 2008-07-30 株式会社新川 ボンディング用パターン識別方法、ボンディング用パターン識別装置及びボンディング用パターン識別プログラム

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4592636A (en) * 1984-05-07 1986-06-03 Canon Kabushiki Kaisha View finder optical system
US5059559A (en) * 1987-11-02 1991-10-22 Hitachi, Ltd. Method of aligning and bonding tab inner leads
JP2789387B2 (ja) * 1990-11-30 1998-08-20 株式会社新川 ボンディング装置
JPH0628272A (ja) 1992-07-10 1994-02-04 Hitachi Ltd 試験機能を備えた入出力装置
JP3507122B2 (ja) * 1994-04-11 2004-03-15 キヤノン株式会社 色分解光学系、あるいは色分解光学系を有するテレビカメラ
JPH0843057A (ja) * 1994-07-28 1996-02-16 Copal Co Ltd 整列確認装置
DE4429913C1 (de) * 1994-08-23 1996-03-21 Fraunhofer Ges Forschung Vorrichtung und Verfahren zum Plattieren
JP2001517361A (ja) * 1995-06-30 2001-10-02 デザイン・コンポーネンツ・インコーポレーテッド 要素配置用の自動化されたシステム

Also Published As

Publication number Publication date
KR19990072316A (ko) 1999-09-27
JPH11218412A (ja) 1999-08-10
US6381359B1 (en) 2002-04-30
KR100306637B1 (ko) 2001-09-26

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees