A7 B7 經濟部中央揉準局貝工消費合作社印装 五、發明説明（1 ) 發明背景 一‘ 1 ·發明镅域 本發明是關於一般積體電路或其它半導體裝置的測試 之固定器及其相關的製程。特別是提出了一種可重複使用 的載具。該載具的作用乃是暫時地放置一個半導體晶粒， 包裝前或包裝後均適用，並可在燒錄及電性測試中重複使 用。 2 ·現有相關發明 在生產稹體電路或其它半導體元件如記億體及不連續 電晶體元件的過程中，當晶圓製造的程序完成後，這些半 導體元件必須在運送給顧客前接受燒錄及電性測試以發現 並剔除不良品》燒錄指的是將半導體元件放在一個可控制 溫度的髙溫爐中，再施以一些特定的電流信號讓它連續運 轉。高溫的用意乃在於加速半導體元件因使用而損粍的效 果，如此一來，那些在不良邊緣而可能在消費者使用後不 久即壞掉的產品在燒錄時就可被發現，而不會被誤送給顧 客。在電性測試中，一組較完整的偏壓及訊號被送至這半 導體元件以做較徹底的功能方面的測試。 目前業界的作法是，燒錄及電性測試要等到晶粒做完 封裝後才進行。燒錄時，封裝好的晶片被暫時地插在特殊 燒錄板的插槽上。這燒錄板上有線路與晶片的接腳或接墊 接觸以在燒錄時施以足夠的偏壓或訊號。在一些燒錄的製 程中，我們只須接通晶片的部份接腳或接墊即可。在接下 (請先閲讀背面之注意事項再填寫本頁) 1KI . '裝_ 訂. 本紙張尺度遄用中國國家揉準（CNS ) A4规格（2丨0X297公釐）_ 4 _ 經濟部中央梂準局貝工消費合作社印装 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） A7 B7 五、發明説明（2 ) 來的電性測試中，晶片將從燒錄板被移到測試用的載具上 ，此時，所有接腳或接墊都須被接通· 在燒錄或電性測試中判定不良的晶片將被淘汰，而它 們的包裝材料也跟著報廢。因此，多年以來，人們都希望 能在封裝前就對晶粒做燒錄或電性測試。另一方面，多晶 片模組的出現也使得製造商必須以晶粒出貨以便之後組裝 成此類產品。但是多晶片模組的修改困難又昂貴，所以晶 粒的燒錄或電性測試須在上述之組裝前就進行。目前有許 多人提出不同方法來做晶粒的燒錄或電性測試，但是這些 方法尙不能被廣泛地應用•造成燒錄或電性測試較難針對 晶粒進行的一個重要原因乃是缺乏一種適合的晶粒載具， 它須在燒錄或電性測試中固定並保護晶粒，且必須滿足某 些嚴苛的條件。 在另一方面，晶粒可能以一種^等晶粒尺寸#的包裝 方式，此時它的外殼只比晶粒稍大。以這種包裝方式封裝 的晶片，它的可接觸面積很小，而且外殻的形狀與晶粒相 似，這使得標準的插槽無法處理它。所以，我們也須要一 種可用在燒錄或電性測試這種晶片的專用載具。 發明摘要 基於上述之種種問題及需求，本發明的目標就是提供 —種新的可重複使用之_載具，以放置半導體晶粒，或是由 t等晶粒尺寸，方式包裝的成品。本發明的目標尙包括 以下幾點：前述的可重複使用之晶粒載具不僅可用於燒錄 5 - l·-—. · —----裝------訂-----11/K. (請先閲讀背面之注意事項再填寫本頁) A7 B7 五、發明説明（3 ) ，亦可用於電性測試。提供一種製程，使用前述之載具進 行晶粒的燒錄。提供一種製程*使用相同之載具再進行晶 粒的電性測試。前述可重複使用之晶粒載具可適用傳統的 燒錄系統及燒錄板。前述可重複使用之晶粒載具有各種不 同尺寸的選擇，以適用不同尺寸或有不同接腳數的晶粒。 這種可重複使用之晶粒載具須提供半導體晶粒一個保護的 UB 上★ 環境。 上述的目標可藉著後文中將介紹的可重複使用之晶粒 載具與燒錄及電性測試的製程來達成。本發明中的可重複 使用之晶粒載具有一個底座，其週邊有數個接點用來導通 該晶粒與外界的電訊源。底座上亦另有線路以連通晶粒的 接腳與前述之接點》可利用某種設計來做晶粒的定位以確 保接腳的接觸良好。上述載具還有個蓋子，它可以蓋住晶 粒並有散熱的效用，當它蓋上後須被固定。一種施力的裝 置可施力於晶粒上讓接觸更爲緊密，它也可以被設計得將 力均勻地施在晶粒上。 經濟部中央橾準局貝工消费合作社印裝 (請先M讀背面之注意事項再填寫本頁) 本發明中所提到的關於未包裝晶粒的燒錄及電性測試 的製程說明如下。先將晶粒插在這具有數個接點的載具中》 ，然後提高至一特定的溫度•對於燒錄的製程來說，燒錄 的偏壓或電訊由一外界的電訊源經過載具上的接點及接線 傳遞到晶粒上。如果有任何訊號會由晶粒傳出，也是藉由 載具上的接線及接點傳遞。這些傳出的訊號可用來評判晶 粒的品質，比如說是否爲不良品。電性測試的作法與上述 的燒錄類似，也可籍由輸入測試電訊再經由對晶粒傳出的 本纸張尺度適用中國國家橾準（CNS ) A4規格（210X297公釐）_ R _ 經濟部中央橾準局貞工消费合作社印製 A7 ____B7 五、發明説明（4 ) 訊號分析，以判斷晶粒的品質。 以上所述之本發明的目標及特點，在閱讀完後文之詳 細解說並配合附圖之說明後，應有更清楚的了解。 本發明詳細描述 附圖1 一 4是關於一個可在燒錄及電性測試中用來放 置積體電路元件1 2的可重複使用的載具。它是由底座 1 4與蓋子1 6組成，其中1 6是以銷1 8爲樞軸與1 4 組合。底座1 4上以某種黏合劑貼上一層有彈性的物質， 稱爲基層1 9。基層的材質以聚合物較佳，例如聚亞醞胺 (polyimide)。基層也可以較硬的材質製作，例如陶瓷 或矽材，以應用在一些如C 4或須翻轉晶片做接線的晶片 產品上。基座上有四個對準塊2 0，積體電路元件1 2放 下時可藉其四個角24抵在對準塊的斜邊上來準確地定位 在基靥的表面2 6上。載具的蓋子1 6上有一個受彈簧張 力的閂，它可將基座凹槽3 2中的突起3 0卡住以將蓋子 固定在關閉的位置。另外，在沒有對準塊或是想要一個輔 助對準設計的情形下，可以開一個窗來觀察積體電路元件 ， 1 2在基層1 9上的定位狀況。 基層的表面2 6上有一些線路，在設計上可加上接觸 用的突起與積體電路旳接墊或是接點的接觸，以導通它與 基層1 9週邊的接墊。蓋子上有一個彈簧42，在蓋子蓋 上時會向下壓迫稹體電路元件12以增加接墊間接觸的效 果。 l·.,.-------·ί、裝----7--訂--^--11 JL. (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度逋用中國國家標準（CNS } Α4規格（210X297公釐） ~ 7 - 經濟部中央揉準局員工消費合作社印簟 A7 _B7 __ 五、發明说明（5 ) 上述的突起會造成稹體電路元件的底面無法靠到基層 的表面上，這樣的問題可藉著在底座與基層間加入一層橡 膠或其它撓性的物質來解決。若積體電路元件上有突起的 銲塊則可略去上述之撓性物質，因銲塊本身較爲柔軟；如 此也可改善銲塊在燒錄及測試後的平坦度。 如圖3 2與3 3所晝出的，前述在基層1 9底下之撓 性物質2 0 0可設計成只保留有突起的下方區域，積體電 路元件的中央部份則不保留•如此可使力量集中在有突起 的區域，進而只需較小的力量來幫助積體電路元件與載具 上線路的接觸。甚至可將道整塊再簡化爲只在突起之下的 小塊，這樣可進一步使力量集中，並可減少須加在積體電 路元件上的力量。 如圖3 2與3 3也畫出了一塊上板2 0 2 *其上有一 個洞2 0 4可讓積體電路元件從中穿過。這上板是以類似 4 2號合金（資料得自Computer Technology Corporation)的材料製成，而且其位置是在基層的上面 。當一個積體電路元件被放入這個載具中，它被限制在前 述上板的洞中，可確保積體電路元件的接墊與基層上的突 起相接觸。上板的存在可取代圖1 — 4中的對準塊，並且 ，如果基層是以彈性物質製成*可將基層壓得較平。 上述上板的材料選擇是考慮了熱膨脹係數的結果。因 爲整個系統將被加熱，所以在載具上用來定位積體電路元 件的機構須與該元件有著極接近的熱膨脹係數，否則在高 溫的燒錄過程中，接觸點的定位可能偏掉，而原本的導通 民張尺度逍用中國國家榇準（〇阳>八4規格（2丨0父297公嫠）_8_ — I,--- ------'{1 裝----Ί---Η 訂 I ^-- (請先閲讀背面之注意事項再填寫本頁) —.1 1 -I In m HI I - I-1 -I- - —I -11 經濟部中央揲準局貴工消費合作杜印装 A7 _B7五、發明説明（6 ) 也可能因此而中斷-ά製作基層的材料聚亞醞胺的熱膨脹係 數與矽極爲不同，而4 2號合金的熱膨脹係數則與矽較爲 接近。因此，較佳的作法是將基餍夾在兩層4 2號合金板 中或是以某種黏合劑在基層上貼上一層4 2號合金板，以 使得基層在加熱的過程中膨脹的程度不致與積體電路元件 相差太大· 基於上一段的說明，用另一塊4 2號合金下板與前述 之上板將基層夾住。這樣做還可免去最下面的基底2 0 8 及上面閂軸座2 1 0須爲4 2號合金的限制，於是它們就 可以較便宜的材料來製造，比如塑膠。上述基底2 0 8及 上面閂軸座210是以螺栓212鎖在一起》 參照圓2，4，5可看到一個穿過底座14，基層 19與撓性物質的真空接頭，它用來引進真空以將積體電 路元件吸附在基層19上。在實用上，基層通常是以既有 的商業材料製成，目前已有數家廠商供應基層材料，例如 ，Nitto Denko 公司的 A sAa Τ。 上述可重複使用的載具可爲未封裝的稹體電路晶粒 1 2提供一可靠的環境，而不必非要在潔淨室中處理。所 以這個載具，也可以應用在標準的燒錄及測試系統。 進行燒錄時，裝有晶粒的載具被插入燒錄板5 0上的 插槽4 8中，然後這整個板子會被放入一個燒錄的系統以 開始預始的製程。載具基層1 9上的接墊3 8會與插槽 4 8的導線相接觸。在傳統的燒錄製程中，可能的測試方 式有：1.只對晶粒輸入操作電壓；2.輸入操作電壓及 L.^--.-----裝----V--,訂--Γ--； — II (請先閲讀背面之注意事項再填寫本頁) 本纸浪尺度適用中國國家標準（CNS)A4規格（2!〇X297公釐} _ 9 _ 經濟部中夬揉率局貝工消费合作社印装 A7 __B7___五、發明説明（7 ) 操作電訊讓這晶粒試行運轉；或是3.如2般輸入操作電 壓及操作電訊並接收输出訊號。 圖5 — 6 B中描繪的是另一種可重複使用的載具6 0 ，其上已放了一個積體電路記憶體6 2 »基座上有四個對 準塊6 4，它們的斜邊設計可將積體電路6 2準確地定位 ，使得它的接墊與在基靥7 0上的突起相接觸。與圖1 -4中的應用例類似，該基層上的銅質線路有著接觸用的突 起，它們與稹體電路旳接墊接觸，以導通它與基層7 0週 邊7 7的接墊6 8。其它未說明的結構與操作的部份都與 上一個應用例相同。 圖7中描繪的是另一個可重複使用的載具8 0，在基 層8 4上有多出用於電性測試的接墊8 2 »電性測試往往 須要接通較多的晶粒接腳。載具8 0現在須放入一個測試 器的探針卡8 6上，該探針卡是以環氣樹脂或是聚亞醞胺 作成的板，上面有一些線路8 8連至探針9 0上用來導通 晶粒上的接墊與測試器的接子9 2。在此爲了清楚起見只 畫出1 2個探針，事實上一塊探針卡上可有數以百計的探 針。載具基層上多出的電性測試用接墊8 2以線路9 3連 至測性中的晶粒。這樣的載具基層設計使得燒錄用的插槽 4 8可有較少的腳，通常若這插槽亦需用於電性測試，它 須要多出非常多的腳來傳遞足夠的電訊。而燒錄用的插槽 數目往往是探針卡的數百倍，因此較少的腳可節省可觀的 燒錄成本。上述的電性測試可在燒錄之前或之後進行。 圖10及11中描繪了一個晶粒載具100的部份； (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（〇奶）八4规格（2丨0/297公羞）-1〇- 經濟部中夬樣準局身工消費合作社印製 A7 _B7 _五、發明说明（8 ) 這個載具的晶粒對準機構是固定的對準塊1 〇 2與彈簧 1 0 4的組合。對準塊用來將晶粒的兩鄰邊1 1 0及 1 1 2固定以確定晶粒在基層1 0 8上的位置。彈簧 1 0 4對晶粒的兩鄰邊1 1 8施力將晶粒推向對準塊，對 準塊與彈簧底部的斜面設計同時對晶粒產生一個向下的推 力將它緊靠在基層上。這個推力在晶粒由定位系統（未畫 出）釋放時發生作用以避免因晶粒與定位系統表面間任何 靜電力使晶粒上移；同樣的作用也在載具的蓋子在燒錄或 電性測試後打開時發生。其它未說明的結構與操作的部份 都與上一個應用例相同。 圖4中的壓力彈簧可以其它可將力量較均勻地傳遞到 晶粒表面的機構來取代。這樣的機構可以是一個面接觸的 壓力系統，幾個不同的應用例將在以下的篇幅裡介紹。 圓1 2 — 1 6 D是一個有兩件式壓力平衡系統的晶粒 載具，它可以使得沿Z軸與X軸的施力均勻》從圖中可看 出，這個系統包括了一個平衡塊2 2 2及一根可轉動的銷 2 2 4，該平衡塊就固定在這根銷上。蓋子2 2 8有兩個 延伸出來的邊塊2 2 6，前述的銷裝在這兩邊塊上，該銷 可依Y軸轉動亦可在Z軸方向移動，所以平衡塊也可以Y 軸轉動以保持在X方向對晶粒的施力均勻。推力彈簧 2 3 2 —端固定，一端壓迫著銷及平衡塊，同時在蓋子蓋 下時施以一向下的壓力以抵住晶粒。從圖1 6A及1 6B 中可看出，銷可在槽2 3 4中前後滑動以容許平衡塊在Z 軸方向的移動，而彈簧2 3 2也跟著被壓縮。圖1 6 D描 (請先閲讀背面之注意事項再填寫本頁) 裝---- 訂— 本纸張尺度適用中國國家揉準（CNS ) A4規格（210X 297公釐）_ j j ------------------ 經濟部中央橾準局員工消费合作社印裝 A7 B7五、發明説明（9 ) 繪了平衡塊依Y軸轉動的動作，X方向的施力得以均勻β 我們也可從圖1 6 D看出，平衡塊可依X軸做些許的轉動 ，此時彈簧會產生另一種變形。 操作時，半導體晶粒被放在載具2 2 0中，圖1 4及 1 5描繪了載具的蓋子從關閉到打開的狀態。當蓋子被關 上時，平衡塊2 2 2與晶粒2 3 0接觸*因爲平衡塊可依 Υ軸轉動，它對晶粒在X方向的施力會較均勻，減小了因 施力不均而只有一部份受力的可能。施力不均也可能造成 晶粒翹起，並導致晶粒偏位或在蓋子完全蓋住時壓壞晶粒 。蓋子關上的同時彈簧2 3 2被壓縮，間接使得平衡塊施 在晶粒上的力量改變，而彈簧的撓性則有助於力量分佈均 勻。當蓋子接近關閉位置時，閂鎖2 3 8被蓋子的邊綠推 開並移至圖中虛線的位置，等到蓋子完全關閉了，彈簧將 閂鎖彈回它原來的位置並將蓋子固定在關閉旳狀態。 圖1 7 — 2 1 C是一個有四件式壓力平衡系統的晶粒 載具，它可以使得沿Ζ軸，X軸與 Υ軸的施力均勻。從 圖中可看出，這個系統包括了一個平衡塊2 5 2，一根可 轉動的銷2 5 4以及兩塊壓力板。蓋子2 5 8同樣有兩個 延伸出來的邊塊2 5 7，前述的銷就裝在這兩邊塊上，該 銷亦可在Ζ軸方向移動。該平衡塊2 5 2固定在銷2 5 4 上，可依銷也就是Υ軸做轉動。推力彈簧2 3 2 —端固定 在蓋子上，另一端與銷相接，同時在蓋子蓋下時拖以一向 下的壓力以抵住晶粒2 6 0 ·平衡塊的下方裝有兩個墊塊 ，前述之兩個壓力板以銷固定在這兩墊塊上，使得它們可 (請先聞讀背面之注意事項再填寫本頁) -裝. 訂 本紙張尺度逋用中國國家梂準（CNS ) Α4規格（210X297公嫠）_ 12 - 經濟部中央樣準局貝工消費合作社印製 A7 ___B7五、發明説明（10 ) 以沿X軸方向轉動4平衡塊在γ軸方向的轉動可使X方向 的施力均勻，而壓力板在X軸方向的轉動則可使γ方向的 施力均勻。從圖2 1A中，彈簧26 2控制著銷254及 平衡塊2 5 2在Z軸方向的移動。圖2 1 B描繪了前述壓 力板在X軸方向的轉動以分散Y方向施力的情形，圖2 1 C則描繪了前述平衡塊在γ軸方向的轉動以分散X方向施 力的情形。 如圆2 0及1 9所顯示，當一半導體晶粒被放入載具 2 5 0後，蓋子2 5 8就從開啓的狀態移動到關閉的狀態 ’同時上述之壓力板也與晶粒相接觸•如上節所述，壓力 板可在X軸方向轉動而平衡塊可在Y軸方向轉動，這些動 作使施力在Y軸與X軸方向得以分佈均勻，減小了因施力 不均而造成晶粒翹起或是受在損害的可能。蓋子關上的同 時彈簧2 6 2被壓縮，間接使得平衡塊施在晶粒上的力量 改變，也使得施力得到緩衝•當蓋子到達關閉位置時，閂 鎖2 6 4扣在蓋子的邊綠2 6 6上並將蓋子固定在關閉旳 狀態。這種四件式壓力平衡系統特別適用於較大型晶粒或 是全陣列接點式的半導體以避免如前述的翹起發生。 圖2 2 — 2 6是一個有點接觸壓力系統的可重複使用 晶粒載具2 7 9，它有一個壓力板2 7 2，在這壓力板的 底面273上有一個孔271，而這壓力板是以銷274 裝在蓋子2 7 8上。孔2 7 1是以纘埋頭孔的方式從壓力 板的內部向外鑽出的|它在壓力板的內部形成一個凹洞以 容納球軸承2 7 6，這個球軸承由這孔中向外稍微突出》 (請先聞讀背面之注意事項再填寫本頁) -裝- ;^ 本紙張尺度遴用中國國家揉準（CNS > A4規格（210X297公釐）_ 13 _ 經濟部中央揉準局貞工消费合作社印装 A7 B7___五、發明説明（11 ) 前述孔的側面是傾斜的，這樣可限制球軸承與壓力板的底 面的相對運動，我們也可以藉著在壓力板的內壁製造一些 突出物來達到同樣的目的。在蓋子與球軸承間有一個壓力 彈簧2 8 0，它的彈簧力使得球軸承緊靠在壓力板上。在 這點接觸壓力系統中*上述球軸承是用來對半導體晶粒施 力的元件。從圖23，24中可看出，壓力板的底面是由 一些斜面所組成，這樣的設計可減少壓力板本身壓到晶粒 的可能性，並確保球軸承是這個系統中第一個接觸到晶粒 的元件。 操作時，半導髖晶粒被放置在載具中，蓋子開始進入 關閉的狀態。因銷2 7 4的位置稍許偏離了壓力板的中心 線，以及底面的斜面設計，球軸承第一個接觸到晶粒的表 面。底面的斜面設計容許球軸承與晶粒表面接觸的任何角 度偏移，同時壓力彈簧也提供了在Z軸方向施力的緩衝。 雖然壓力板可依球軸承做些許的轉動，但轉動量應小於面 接觸的系統，因爲一般來說壓力板並不會碰到晶粒。 這樣的點接觸壓力系統可用在具有突起銲塊的晶粒或 是其它的積體電路以增加施力的對稱性以及整個晶粒面積 的力量分佈均勻性（在圖中的Y軸與X軸方向）。另外， 接觸面稹由面縮小到點，可減少接觸面間的吸引力。這樣 的吸引力是應盡量避免的，因爲它會使得載具蓋子打開時 將晶粒帶離原來的位置。當面接觸系統遇到上述吸引力的 間題時，我們可在壓力板的表面製造一些不平整的紋路如 細點，細溝或是網紋來避免接觸面間吸引力的產生* (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度逋用中國國家標準（CNS)A4規格（ 210X297公釐）_ _ 經濟部中央標準局貞工消f合作社印取 A7 B7 五、發明説明（12 ) 圖2 7 — 3 1是另一個面接觸壓力系統的可重複使用 晶粒載具2 9 0，它有以球軸承施壓的壓力板2 9 2。該 壓力板是以螺栓2 9 4組裝在蓋子2 9 8延伸出來的兩個 邊塊2 9 1上，前述的螺栓作用如同銷，讓壓力板可以轉 動。前述之螺栓穿過邊塊2 9 1上的槽2 9 3，可用螺帽 從邊塊的內部鎖住。邊塊上的槽容許螺栓2 9 4在其中轉 動，並在Z方向移動。壓力板的底部有一個以鑽埋頭孔的 方式纘出的孔，它與壓力板內的一個球軸承3 0 0相靠， 並可限制球軸承與壓力板的底面的相對運動。該壓力板可 依球軸承做任何角度的轉動。另有一個彈簧在蓋子2 9 8 與球軸承之間被壓縮並間接地對壓力板施力。 在這個應用實例中，螺栓2 9 4並不位於壓力板中心 線上而是較偏向蓋子的樞軸3 0 4 *這樣的設計使得彈簧 將壓力板斜推向基底的方向，在蓋子關下時，壓力板的底 面與晶粒的表面的夾角會變小並接近平行的關係，結果可 使施力較爲均勻*晶粒翹起或移位的可能性也降低了。螺 栓2 9 4也可設計於壓力板中心線上，但此時壓力板的底 面與晶粒的表面的夾角會變大· 當半導體晶粒被放入此載具且蓋子被蓋下時，壓力板 會以接近與晶粒表面平行的角度碰到該晶粒。壓力板可依 球軸承做轉動以均勻施力，彈簧3 0 2則提供這樣的壓力 。當蓋子到達關閉位置時，閂鎖3 1 0會將其固定住*這 個應用實例中的閂鎖3 1 0與蓋子2 9 8上的閂鎖面 3 1 1都有做改善，請參考圖2 7A — 2 7C。閂鎖面· 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐）_ 15 _ 1.-----------II 訂—II--ΓΓ (請先閲讀背面之注意事項再填寫本頁) 經濟部中央標準局負工消费合作社印製 A7 B7 五、發明説明（13) 3 1 1上有一個突出3 1 2，當閂鎖3 1 0將蓋子固定時 ，該突出是在閂鎖3 1 0上方，可避免閂鎖不預期地跳開 •在其它的閂鎖設計中，如圖1 4中的* —旦有一個向上 的力將可能使得閂鎖跳開，而蓋子也跟著打開，這是極不 願見到的。而前述之改良式的設計可降低這種可能而保持 蓋子在關閉的狀態。另外，下閂鎖面3 1 6與閂鎖底面 3 1 8都是斜面，當蓋子有向上的傾向時，向上的力量會 被前述的斜面抵消而不致讓閂鎖跳開。這樣的設計可應用 在任何可重複使用的晶粒載具上。 圖3 4是如圖2 7 — 3 1之面接觸壓力系統的另一種 設計，目的是要使整個載具的高度降到最低》固定銷軸 3 5 2所需的槽3 5 0設在壓力板3 5 4上而不在蓋子 3 5 6上，彈簧3 5 8則位於銷軸與壓力板之間，其它未 說明的結構與操作的部份都與圖27_31D中的應用例 相同。 以上所述的種種系統也可加上散熱的功能。例如，壓 力板，球軸承或其它零件可用某些金靥如鋅或是鋁作爲材 料，這些材料有較好的熱傳導性，而且也適用於需要從晶 粒的背面加上偏壓的情形。另外，雖然圖中都使用X軸， Y軸和Z軸作參考座標，這些系統也可應用於非直角座標 上》 到這裡應可清楚地看出，我們提供了一個新型用於燒 錄及電性測試的可重複使用晶粒載具，它並滿足了本文開 頭所述的種種要求。這個晶粒載具可暫時地裝載一個半導 I-_---^-----.f 裝------訂--r--ΓΙΜ (請先閲讀背面之注意事項再填寫本頁) 本紙张尺度適用中國國家標準（CNS )八4洗格（210><297公釐） -16 - 經濟部中央標準局負工消费合作社印製 A7 B7 五、發明説明（H ) 體晶粒，它不但可用於燒錄亦可用於電性測試。它可觀地 節省燒錄插槽的費用因爲插槽所需的腳數減少了，至於電 性測試時所需較多的接腳可以增加前述載具上的接墊來解 決》使用本載具進行燒錄的製程也可用來進行電性測試。 在燒錄的製程中，本載具可用在傳統的燒錄板與燒錄系統 上。另外，這載具可有不同的選擇以裝載不同尺寸或不同 腳數的晶粒。對於不同的晶粒，也許只須對載具的底層做 修改就可以同一個燒錄板來處理，包括須要不同的測試電 訊在內。這樣的設計概念是朝向一個萬用燒錄板的方向。 這載具並可提供晶粒一個保護晶粒的環境。 許多人應也可清楚地看出*此載具在不同的方面還可 做相關的變化。例如，平衡塊或壓力板的表面可設計成不 規則的形狀以避免與晶粒接觸面可能的引吸力。諸如此類 的變化都是羼於稍後之專利申請的精神與範圍。 附圖簡述 圖1是本發明中的可重複使用之晶粒載具的分解圖。 圖2是圖一中的載具的剖面圖，此時它是在一組合後， 的成品的狀態。 圖3是這個載具的平面圓。 圖4是另一張剖面圖，此時道個載具的蓋子呈打開的 狀態。 圖5是與圖二類似的一張剖面圖，但是靥於本發明的 第二個應用實例。 本紙张尺度適用中國國家標準（CNS )八4胁（210X297公釐）_ 17 _ " (請先閲讀背面之注意事項再填寫本頁) 訂---- V、—· A7 __B7___ 五、發明説明（15) 圓6是與圖二類似的一張平面圓，但是靥於園五中的 第二個應用實例》 圖6 A是一個載具底-座的^平面圖.，靥於圖五中的第二 個應用實例。 圔6B是圖6A中6B部份的剖面圖。 圖7是本發明的第三個應用實例之載具的平面圖。 圖8是圖7中之載具放在一固定器上使用時的平面圖 〇 圖9是前述固定器與載具沿圖8中9 一 9方向的剖面 圖。 圖1 0是本發明的另一個應用實例之部份的平面圖。 圖11是圓10中晶粒載具的側視圖。 圖1 2是一個有兩件式壓力平衡系統的載具的立體圖 9 圖1 3是圖1 2中的載具在打開狀態的立體圖。 圖1 4是圖1 2中的載具在關閉狀態下沿1 4 — 1 4 方向的剖面圖，其中有一個晶粒。 經濟部中央標準局負工消费合作社印掣 (請先聞讀背面之注意事項再填寫本頁) 圖1 5是圖1 2中的載具在打開狀態的剖面圖。 圖1 6A是圖1 2中的載具的蓋子部份的剖面圖，沿 圖15的16A— 16A方向。 圖1 6B是與圚1 6A相同的剖面圖，但描繪了其中 的平衡塊在Z軸上的運動狀態。 圖1 6 C與圖1 6 B相同，但描繪了平衡塊沿X軸的 運動狀態。 本紙张尺度適用中國國家梯準（CNS ) A4規格（210X297公釐） 18 - 經濟部中央標準局貝工消費合作社印製 A7 B7 五、發明説明（ie) 圖1 6D與圖1 6B類似，但是沿圖1 5的1 6D- 1 6 D方向，描繪了平衡塊沿Y軸的運動狀態。 圖1 7是一個有四件·式壓*力平衡系統的載具的立體圖 e 圖18是圖17中的載具在打開狀態的立體圖。 圖1 9是圖1 7中的載具在關閉狀態下沿1 9 — 1 9 方向的剖面圚，其中有一個晶粒。 圖2 0是圚1 7中的載具在打開狀態的剖面圖。 圖2 1 A是圖1 7中的載具的蓋子部份的剖面圖，沿 圖2 0的21A — 2 1A方向，描繪了其中的平衡塊在Z 軸上的運動狀態。 圖2 1B與圚2 1類似，但是沿圖20的2 1B- 2 1 B方向，描繪了平衡塊沿X軸的運動狀態。 圓21C與圖21B類似，沿圖21A的21C— 2 1 C方向，描繪了平衡塊沿Y軸的運動狀態。 圖2 2是一個有球軸承的點接觸壓力系統的載具之立 體圖。 圖2 3是圖2 2中的載具在打開狀態的立體圖。 圖2 4是圖2 2中的載具在關閉狀態的剖面圖。 圖2 5是圖2 2中的載具在打開狀態的剖面圖。 圖2 6 A是圖2 2中的載具的蓋子部份的剖面圖’沿 圖25的26A—26A方向》 圖2 6 B是與圖2 6 A相同的剖面圖，但描繪了其中 的平衡塊在Z軸上的運動狀態。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閱讀背面之注$項再填寫本頁) 4? ----tr A7 _ B7___' 五、發明説明（17) 圖2 6 C與圖2 6 B相同，但描繪了平衡塊沿X軸的 運動狀態。 圖26〇與_268類似，但:是沿圖26的26D-2 6 D方向，描繪了平衡塊沿Y軸的運動狀態。 圖2 7是一個有球軸承壓力系統的載具之立體圖。 圖2 7A是圖2 7中的載具之蓋子的立體圖，可看出 一個改良的閂鎖機構的設計。 圖2 7 B是圖2 7中的載具的閂鎖的立體圖。 圖2 7 C是該改良閂鎖機構的放大剖面圖。 圖2 8是圖2 7中的載具在打開狀態的立體圖。 圖2 9是圖2 7中的載具在關閉狀態下沿2 9 — 2 9 方向的剖面圖，其中有一個晶粒。 圖30是圖27中的載具在打開狀態的剖面圖。 圖3 1 A是圖2 7中的載具的蓋子部份的剖面圖，沿 圖30的31 — 31方向。 圚3 1 B是與圖3 1 A相同的剖面圖，但描繪了其中 的平衡塊在Z軸上的運動狀態。 經濟部中央標準局貞工消费合作杜印裝 ——^-----— (請先閲讀背面之注意事項再填寫本頁) 圖3 1C與圖3 1 B相同，但描繪了平衡塊沿X軸的， 運動狀態。 圖31D與圖31B類似，但是沿不同方向，描繪了 平衡塊沿Y軸的運動狀態。 圖3 2是前述可重複使用的載具的底座的分解圖，採 由下往上的角度。 圖33是圓32中所述底座的剖面圖。 本紙浪尺度適用中國囷家標準（CNS ) A4規格（210X297公瘦) -20 -A7 B7 Printed by the Central Working Group of the Ministry of Economic Affairs, Shellfish Consumer Cooperative, V. Description of the Invention (1) Background of the Invention 1 '1) Field of Invention The present invention relates to fixtures for the testing of general integrated circuits or other semiconductor devices and their related Process. In particular, a reusable vehicle is proposed. The role of the carrier is to temporarily place a semiconductor die, which is suitable before or after packaging, and can be repeatedly used in programming and electrical testing. 2 · Existing related inventions In the production of semiconductor circuits or other semiconductor components such as terahertz and discontinuous transistor components, after the wafer manufacturing process is completed, these semiconductor components must be burned and shipped before being shipped to customers. "Electrical test to find and eliminate defective products" burning refers to placing the semiconductor device in a temperature-controlled oven and applying certain current signals to make it run continuously. The purpose of high temperature is to accelerate the damage effect of semiconductor components due to use. In this way, products that are on the edge of the bad and may be damaged shortly after use by consumers can be found during burning without being damaged. Send to customer by mistake. In the electrical test, a more complete set of bias voltages and signals are sent to this semiconductor element for a more thorough functional test. The current industry practice is that programming and electrical testing are not performed until the die is packaged. During programming, the packaged chip is temporarily inserted into the slot of the special programming board. There are wires on the board to make contact with the pins or pads of the chip to apply a sufficient bias or signal during programming. In some programming processes, we only need to turn on some pins or pads of the chip. Next (please read the notes on the back before filling in this page) 1KI. 'Binding_ Binding. This paper size uses China National Standard (CNS) A4 size (2 丨 0X297mm) _ 4 _ Central Ministry of Economy The paper size of the printed papers of the Zhuhai Bureau Shellfisher Consumer Cooperative is applicable to the Chinese National Standard (CNS) A4 (210X297 mm) A7 B7 5. In the electrical test from (2), the chip will be removed from the burner board On the carrier for testing, at this time, all pins or pads must be turned on. Chips that are judged to be bad during burning or electrical testing will be eliminated, and their packaging materials will be scrapped. Therefore, for many years, people have hoped that the die can be burned or electrically tested before packaging. On the other hand, the advent of polycrystalline silicon modules has also made it necessary for manufacturers to ship in dice for later assembly into such products. However, the modification of the multi-chip module is difficult and expensive, so the burning or electrical testing of the crystal must be performed before the above assembly. At present, many people have proposed different methods for programming or electrical testing of the die, but these methods cannot be widely used. • An important reason for the difficulty of programming or electrical testing for the die is the lack of a Suitable die carrier, it must fix and protect the die during burning or electrical testing, and must meet certain severe conditions. On the other hand, the crystal grains may be packed in a grain size #, and the outer shell is only slightly larger than the crystal grains. The chip packaged in this package has a small contact area and the shape of the shell is similar to the die, which makes it impossible for a standard socket to handle it. Therefore, we also need a special carrier that can be used for programming or electrical testing of such chips. Summary of the Invention Based on the above problems and needs, the object of the present invention is to provide a new reusable carrier for placing semiconductor die or a finished product packed in a grain size such as t. The objective of the present invention includes the following points: The aforementioned reusable die carrier can not only be used for programming 5-l ·--. · ----- equipment -------- order ---- -11 / K. (Please read the precautions on the back before filling this page) A7 B7 V. Description of the invention (3) can also be used for electrical test. A process is provided for die burning using the aforementioned carrier. Provide a process * to use the same carrier for electrical testing of the grains. The aforementioned reusable die carrier can be applied to conventional programming systems and programming boards. The aforementioned reusable die contains a variety of different size options to accommodate different sizes or different numbers of pins. This reusable die carrier must provide semiconductor die with a protected UB environment. The above goals can be achieved by the reusable die carrier and the process of burning and electrical testing which will be described later. The reusable die in the present invention has a base, and there are several contacts around the die for conducting the die and the external telecommunications source. There is also a line on the base to connect the pins of the die with the aforementioned contacts. A certain design can be used to locate the die to ensure good contact of the pins. The above-mentioned carrier also has a cover, which can cover the crystal grains and has the function of heat dissipation. When it is covered, it must be fixed. A force-applying device can apply force to the die to make the contact closer, and it can also be designed to apply the force evenly to the die. Printed by the Central Working Group of the Ministry of Economic Affairs, Shellfish Consumer Cooperative (please read the precautions on the back, and then fill out this page). The process of burning and electrical testing of unpackaged grains mentioned in the present invention is described below. First insert the die in this carrier with several contacts ", and then raise it to a specific temperature. For the programming process, the programming bias or telecommunications passes through the carrier from an external telecommunications source. The contacts and wiring are transferred to the die. If any signal is transmitted from the die, it is also transmitted through the wiring and contacts on the carrier. These outgoing signals can be used to judge the quality of the crystals, such as whether they are defective. The electrical test method is similar to the above-mentioned programming, and it can also apply the Chinese National Standard (CNS) A4 specification (210X297 mm) by inputting the test telecommunications and then transmitting the paper size to the grain. R_ Economy Printed A7 ____B7 printed by Zhengong Consumer Cooperative of the Ministry of Standards and Technology of the People's Republic of China V. Description of the invention (4) Signal analysis to judge the quality of the crystal grains. The objectives and features of the present invention described above should be more clearly understood after reading the detailed explanations in the following text and the description with the accompanying drawings. Detailed description of the present invention Figures 1 to 4 are about a reusable carrier that can be used to place integrated circuit components 12 during programming and electrical testing. It is composed of a base 14 and a cover 16, of which 16 is a combination of a pin 1 8 and a pin 4. A layer of elastic material is attached to the base 14 with an adhesive, which is called a base layer 19. The material of the base layer is preferably a polymer, such as polyimide. The base layer can also be made of a harder material, such as ceramic or silicon, to be applied to some chip products such as C 4 or the chip that must be flipped for wiring. There are four alignment blocks 20 on the base. When the integrated circuit element 12 is lowered, it can be accurately positioned on the surface 26 of the base by its four corners 24 against the hypotenuse of the alignment block. A spring-loaded latch is provided on the lid 16 of the vehicle to hold the protrusion 30 in the groove 32 of the base to secure the lid in the closed position. In addition, if there is no alignment block or if you want an auxiliary alignment design, you can open a window to observe the integrated circuit components, 1 2 on the base layer 19 positioning. There are some circuits on the surface 26 of the base layer, and the contact protrusions can be added to the integrated circuit 旳 pads or contacts in the design to conduct it to the pads around the base layer 19. The cover has a spring 42 which presses the body circuit component 12 downward when the cover is closed to increase the effect of contact between the pads. l ·., .------- · ί, installed ---- 7--ordered-^-11 JL. (Please read the precautions on the back before filling out this page) This paper is used for the standard China National Standard (CNS) Α4 Specification (210X297 mm) ~ 7-Seal of Consumer Cooperatives, Employees Cooperative of the Central Bureau of the Ministry of Economic Affairs A7 _B7 __ V. Description of the Invention (5) The above protrusions will cause the bottom surface of the carcass circuit components to become unreliable On the surface of the base layer, such problems can be solved by adding a layer of rubber or other flexible material between the base and the base layer. If there are protruding solder bumps on the integrated circuit components, the above flexible materials can be omitted. Because the solder bump itself is relatively soft; this can also improve the flatness of the solder bump after burning and testing. As shown in Figures 3 2 and 33, the aforementioned flexible material 2 0 0 under the base layer 19 can be Designed to retain only the lower area of the protrusion, the central part of the integrated circuit component is not retained. This allows the force to be concentrated in the area of the protrusion, which requires less force to help the integrated circuit component and the carrier. The contact of the circuit. The entire block can even be reduced to a small piece only under the protrusion, so It further concentrates the power and can reduce the force that must be added to the integrated circuit components. As shown in Figures 3 2 and 3, an upper plate 2 0 2 is also drawn * A hole 2 0 4 can be used to integrate the integrated circuit components Pass it through. This upper plate is made of a material similar to No. 4 2 alloy (sourced from Computer Technology Corporation), and its position is on the base layer. When a integrated circuit component is placed in this carrier, It is confined to the hole on the upper board to ensure that the pads of the integrated circuit components are in contact with the protrusions on the base layer. The presence of the upper plate can replace the alignment block in Figures 1-4, and if the base layer is The base material is made of elastic material. * The substrate can be laminated flat. The material selection of the upper plate is a result of considering the thermal expansion coefficient. Because the entire system will be heated, the mechanism used to position the integrated circuit components on the carrier must be This component has a very close thermal expansion coefficient, otherwise the positioning of the contact points may deviate during the high-temperature burning process, and the original open-scale standard is not used in accordance with the Chinese national standard (〇 阳 > 8 4 specifications (2 丨0 Father 297 ) _8_ — I, --- ------ '{1 Pack ---- Ί --- Η Order I ^-(Please read the notes on the back before filling this page) —.1 1- I In m HI I-I-1 -I--—I -11 The Consumers ’Cooperative Cooperation of the Ministry of Economic Affairs of the Central Bureau of Commerce of the People ’s Republic of China Du Yinzhuang A7 _B7 V. Explanation of the Invention (6) May be interrupted because of this The coefficient of thermal expansion of polyimide is very different from that of silicon, and the coefficient of thermal expansion of alloy No. 4 and 2 is closer to that of silicon. Therefore, it is better to sandwich the substrate in two layers of No. 4 alloy plate or A certain adhesive is pasted on the base layer with a layer 4 alloy plate, so that the degree of expansion of the base layer during heating is not too different from that of the integrated circuit components. Based on the description in the previous paragraph, use another piece of alloy 4 4 The lower plate and the aforementioned upper plate sandwich the base layer. This also eliminates the limitation that the lowermost base 2 08 and the upper bolt shaft seat 2 1 0 must be No. 4 alloy, so they can be made of cheaper materials, such as plastic. The above-mentioned base 208 and the upper latch shaft seat 210 are locked together by bolts 212. With reference to circles 2, 4, and 5, a vacuum joint passing through the base 14, the base 19 and the flexible substance can be seen, which is used to introduce a vacuum In order to attract the integrated circuit element on the base layer 19. In practice, the base layer is usually made of existing commercial materials. At present, several manufacturers supply the base material, for example, A sAa T of Nitto Denko Company. The above-mentioned reusable carrier can provide a reliable environment for the unpackaged body circuit die 12 without having to be processed in a clean room. Therefore, this vehicle can also be used in standard programming and testing systems. During the programming, the carrier containing the die is inserted into the slot 4 8 on the programming board 50, and then the entire board is put into a programming system to start the preparatory process. The pads 3 8 on the base 19 of the vehicle will contact the wires of the slots 4 8. In the traditional programming process, the possible test methods are: 1. Only input the operating voltage to the die; 2. Input the operating voltage and L. ^ --.----- installation ---- V--, Order --Γ--;-II (Please read the notes on the back before filling out this page) This paper applies the Chinese National Standard (CNS) A4 specification (2! 〇X297 mm) _ 9 _ Ministry of Economic Affairs Kneading Bureau Shellfish Consumer Cooperative Co., Ltd. printed A7 __B7___ V. Description of the invention (7) Operate telecommunications to make this chip test run; or 3. Input operating voltage and operating telecommunications as in 2. and receive output signals. Figure 5-6 Depicted in B is another reusable vehicle 60, on which a integrated circuit memory 6 2 has been placed. There are four alignment blocks 6 4 on the base. The body circuit 62 is accurately positioned so that its pad is in contact with the protrusion on the base 70. Similar to the application example in Fig. 1-4, the copper circuit on the base layer has protrusions for contact. They Contact with the body circuit pads to connect it to the pads 7 of the base layer 7 0 periphery 7 7. Other unexplained structures and operations are the same as the previous application The same is shown in Fig. 7. Another reusable carrier 80 is depicted, and there are more pads 8 for electrical testing on the base layer 84. »Electrical testing often requires more grains to be connected. Pins. The carrier 80 must now be placed on a probe card 86 of a tester, which is made of a gas-resin or polyimide board with some wires 88 connected to the probe. The pin 90 is used to connect the pad on the die and the connector 9 2 of the tester. Only 12 probes are drawn here for clarity. In fact, there can be hundreds of probes on a probe card. Probes. The extra electrical test pads 8 2 on the carrier base layer are connected to the grains under test by lines 9 3. This carrier base layer design allows fewer slots 4 8 for programming. Generally, if this slot is also used for electrical testing, it needs a lot of extra pins to transmit enough telecommunications. The number of slots used for programming is often hundreds of times that of probe cards, so Fewer pins can save considerable programming costs. The electrical tests described above can be performed before or after programming. Figures 10 and 11 depict the (Please read the notes on the back before filling out this page) This paper size applies to the Chinese National Standard (〇 奶) 8 4 specifications (2 丨 0/297 public shame) -1〇- The Ministry of Economic Affairs of China Printed by the Industrial and Consumer Cooperatives A7 _B7 _ V. Description of the Invention (8) The grain alignment mechanism of this vehicle is a combination of a fixed alignment block 1 0 2 and a spring 104. The alignment block is used to combine the The two adjacent edges 1 1 0 and 1 1 2 are fixed to determine the position of the crystal grains on the base layer 108. The spring 10 4 exerts a force on the two adjacent edges 1 1 8 of the crystal grains to push the crystal grains toward the alignment block. At the same time, the quasi-block and the beveled design of the bottom of the spring produce a downward thrust on the crystal grain and abut it against the base layer. This thrust force works when the die is released by the positioning system (not shown) to avoid the die from moving up due to any electrostatic force between the die and the surface of the positioning system; the same effect is also during the burning or electrical process of the cover of the carrier. Occurs when turned on after sexual testing. Other unexplained structures and operations are the same as the previous application example. The pressure spring in Fig. 4 can be replaced by other mechanisms that can transmit the force to the surface of the crystal grains more uniformly. Such a mechanism can be a surface-contact pressure system. Several different application examples will be introduced in the following pages. The circle 1 2 — 1 6 D is a grain carrier with a two-piece pressure balance system, which can make the force along the Z axis and X axis uniform. As can be seen from the figure, this system includes a balance block 2 2 2 and a rotatable pin 2 2 4, the balance weight is fixed on this pin. The cover 2 2 8 has two extended side blocks 2 2 6. The aforementioned pin is mounted on the two side blocks. The pin can be rotated in the Y axis or in the Z axis direction, so the balance block can also be rotated in the Y axis to The force applied to the crystal grains in the X direction is kept uniform. Thrust spring 2 3 2-One end is fixed, one end presses the pin and the balance weight, and at the same time, a downward pressure is applied when the cover is under the cover to resist the crystal grains. It can be seen from FIGS. 16A and 16B that the pin can slide back and forth in the groove 2 3 4 to allow the weight to move in the Z-axis direction, and the spring 2 3 2 is compressed accordingly. Figure 1 6 D drawing (please read the precautions on the back before filling this page) Loading ---- Order — This paper size applies to China National Standard (CNS) A4 (210X 297 mm) _ jj --- --------------- A7 B7 is printed by the Consumer Cooperatives of the Central Procurement Bureau of the Ministry of Economic Affairs 5. Description of the Invention (9) The movement of the balance block in the Y axis is plotted, and the application in the X direction The force is uniform β. We can also see from Figure 16D that the balance weight can be rotated slightly according to the X axis. At this time, the spring will produce another deformation. During operation, the semiconductor die is placed in the carrier 220. Figures 14 and 15 depict the state of the lid of the carrier from closed to open. When the lid is closed, the weight 2 2 2 is in contact with the grain 2 3 0 * Because the weight can rotate according to the axis, its force on the grain in the X direction will be more uniform, which reduces the uneven force due to the force But only part of it is possible. Uneven application of force may also cause the grains to lift up and cause the grains to be misaligned or crush the grains when the lid is completely covered. When the lid is closed, the spring 2 3 2 is compressed, which indirectly changes the force exerted by the balance weight on the crystal grains, and the flexibility of the spring helps to evenly distribute the force. When the lid is close to the closed position, the latch 2 3 8 is pushed green by the edge of the lid and moved to the dotted position in the figure. When the lid is completely closed, the spring springs the latch back to its original position and fixes the lid in the closed position.旳 state. Figure 17 — 2 1 C is a die carrier with a four-piece pressure balancing system, which can make the force uniform along the Z axis, X axis and Υ axis. As can be seen from the figure, this system includes a balance block 2 5 2, a rotatable pin 2 5 4 and two pressure plates. The cover 2 5 8 also has two extended side blocks 2 5 7. The aforementioned pin is mounted on these two side blocks, and the pin can also move in the direction of the Z axis. The balance block 2 5 2 is fixed on the pin 2 5 4 and can be rotated according to the pin, that is, the stern shaft. Thrust spring 2 3 2 —The end is fixed on the cover, and the other end is connected with the pin. At the same time, when the cover is under the cover, a downward pressure is applied to resist the crystal grain 2 6 0 The two pressure plates mentioned above are fixed on the two pads with pins, so that they can be used (please read the precautions on the back before filling out this page)-binding. The paper size of the booklet is in accordance with China National Standards (CNS) Α4 Specification (210X297) _ 12-Printed by the Central Samples Bureau of the Ministry of Economic Affairs, Shellfish Consumer Cooperative, A7 ___B7 V. Description of the invention (10) Rotation of the balance weight in the X-axis direction 4 The X-direction can make the X-direction The force applied is uniform, and the rotation of the pressure plate in the X axis direction can make the force applied in the γ direction uniform. From FIG. 21A, the spring 26 2 controls the movement of the pin 254 and the weight 2 5 2 in the Z-axis direction. Figure 2B depicts the rotation of the pressure plate in the X-axis direction to disperse the force applied in the Y direction, and Figure 2C illustrates the rotation of the aforementioned weight in the γ-axis direction to disperse the force applied in the X direction. As shown by circles 20 and 19, when a semiconductor die is placed in the carrier 250, the cover 2 58 moves from the open state to the closed state. At the same time, the pressure plate described above is also in phase with the die. Contact • As mentioned in the previous section, the pressure plate can be rotated in the X-axis direction and the balance weight can be rotated in the Y-axis direction. These actions make the force distribution even in the Y-axis and X-axis directions, reducing the It may cause the crystal grains to be lifted up or damaged. When the lid is closed, the spring 2 6 2 is compressed, which indirectly changes the force exerted by the balance weight on the crystal grains, and also buffers the force. When the lid reaches the closed position, the latch 2 6 4 buckles on the edge of the lid. 2 6 6 and secure the lid in the closed position. This four-piece pressure balancing system is particularly suitable for larger die or full-array contact type semiconductors to avoid warping as described above. Figure 2 2-2 6 is a reusable die carrier 2 7 9 with a little contact pressure system. It has a pressure plate 2 7 2 and a hole 271 in the bottom surface 273 of the pressure plate. The pin 274 is attached to the cover 2 7 8. Hole 2 7 1 is drilled outward from the inside of the pressure plate in the form of a countersunk hole. It forms a recess in the pressure plate to accommodate the ball bearing 2 7 6. This ball bearing is slightly outward from the hole. "Outstanding" (please read the notes on the back before filling out this page) -pack-; ^ This paper size is selected from the Chinese National Standard (CNS > A4 size (210X297mm) _ 13 _ Central Standards Bureau, Ministry of Economic Affairs Printed by Zhengong Cooperative Cooperative A7 B7___ V. Description of the invention (11) The side of the hole is inclined, so that the relative movement of the ball bearing and the bottom surface of the pressure plate can be restricted. We can also manufacture it on the inner wall of the pressure plate Some protrusions achieve the same purpose. There is a pressure spring 2 80 between the cover and the ball bearing, and its spring force makes the ball bearing close to the pressure plate. In this point contact pressure system * The above ball bearing is used It can be seen from Figures 23 and 24 that the bottom surface of the pressure plate is composed of some inclined surfaces. This design can reduce the possibility of the pressure plate itself pressing on the crystal grains and ensure the ball Bearings are the first in this system The element in contact with the die. During operation, the semiconducting hip die is placed in the carrier, and the lid begins to close. Because the position of the pin 2 7 4 is slightly off the centerline of the pressure plate, and the slope design of the bottom surface The ball bearing is the first to contact the surface of the grain. The beveled design of the bottom surface allows any angular offset between the ball bearing and the surface of the grain. At the same time, the pressure spring also provides cushioning for the force in the Z axis direction. Although the pressure plate can The ball bearings make a small amount of rotation, but the amount of rotation should be less than the surface contact system, because generally the pressure plate does not touch the grains. Such a point contact pressure system can be used for grains with protruding bumps or other Integrated circuit to increase the symmetry of the applied force and the uniformity of the force distribution of the entire grain area (in the Y-axis and X-axis directions in the figure). In addition, the contact surface is reduced from the surface to the point, which can reduce the contact surface. This kind of attraction should be avoided as much as possible, because it will cause the die to move away from the original position when the lid of the carrier is opened. When the surface contact system encounters the above problem of attraction We can make some uneven textures such as fine dots, fine grooves or textures on the surface of the pressure plate to avoid the attraction between the contact surfaces * (Please read the precautions on the back before filling this page) This paper size is not used China National Standard (CNS) A4 Specification (210X297 mm) _ _ Printed by A7 B7 of the Central Standards Bureau of the Ministry of Economic Affairs, F7. V. Description of the Invention (12) Figure 2 7 — 3 1 is another surface contact pressure system Reusable die carrier 2 9 0, which has a pressure plate 2 9 2 pressured by a ball bearing. The pressure plate is assembled with bolts 2 9 4 on the two side blocks extending from the cover 2 9 8 In the above, the aforementioned bolt acts like a pin, allowing the pressure plate to rotate. The aforementioned bolt passes through the slot 2 9 3 on the side block 2 9 1 and can be locked from the inside of the side block with a nut. The slot on the side block allows the bolt 2 9 4 to rotate in it and move in the Z direction. The bottom of the pressure plate has a hole punched out by drilling a countersunk hole. It abuts on a ball bearing 300 in the pressure plate and can restrict the relative movement of the ball bearing and the bottom surface of the pressure plate. The pressure plate can rotate at any angle according to the ball bearing. Another spring is compressed between the cover 2 9 8 and the ball bearing and indirectly urges the pressure plate. In this application example, the bolt 2 9 4 is not located on the centerline of the pressure plate, but is more inclined to the pivot axis 3 0 4 * This design allows the spring to push the pressure plate diagonally toward the base. When the cover is closed, The angle between the bottom surface of the pressure plate and the surface of the crystal grains will become smaller and approach a parallel relationship. As a result, the applied force will be more uniform. The probability of the crystal grains being lifted or displaced is also reduced. The bolt 2 9 4 can also be designed on the centerline of the pressure plate, but the angle between the bottom surface of the pressure plate and the surface of the die will become larger. When the semiconductor die is placed in this carrier and the cover is covered, the pressure plate The grain is encountered at an angle that is approximately parallel to the surface of the grain. The pressure plate can be rotated according to the ball bearing to apply the force uniformly, and the spring 3 2 provides this pressure. When the lid reaches the closed position, the latch 3 1 0 will fix it * The latch 3 1 0 in this application example and the latch surface 3 1 1 on the lid 2 9 8 are improved, please refer to Figure 2 7A — 2 7C. Latching surface · This paper size is applicable to Chinese National Standard (CNS) A4 specification (210X297 mm) _ 15 _ 1 .----------- II Order—II--ΓΓ (Please read the Note for refilling this page) Printed by the Central Bureau of Standards of the Ministry of Economic Affairs and Consumer Cooperatives A7 B7 V. Description of the invention (13) 3 1 1 has a protrusion 3 1 2 when the latch 3 1 0 secures the cover. The protrusion is above the latch 3 1 0 to prevent the latch from jumping off unexpectedly. • In other latch designs, as shown in * in Figure 14-once an upward force may cause the latch to jump off, The lid also opened, which was extremely unwilling to see. The aforementioned improved design reduces this possibility and keeps the lid closed. In addition, both the lower latch surface 3 1 6 and the latch bottom surface 3 1 8 are inclined surfaces. When the lid has an upward tendency, the upward force will be offset by the aforementioned inclined surface so that the latch will not jump off. This design can be applied to any reusable die carrier. Figure 3 4 is another design of the surface contact pressure system as shown in Figure 2 7 — 31. The purpose is to minimize the height of the entire vehicle. The groove 3 5 0 required for the fixed pin 3 5 2 is set under pressure. The plate 3 5 4 is not on the cover 3 5 6, and the spring 3 5 8 is located between the pin and the pressure plate. Other unexplained structures and operation parts are the same as the application example in FIG. 27_31D. The various systems described above can also be added with a heat dissipation function. For example, pressure plates, ball bearings, or other parts can be made of certain materials such as zinc or aluminum. These materials have better thermal conductivity and are also suitable for situations where a bias voltage needs to be applied from the back of the crystal grains. In addition, although the X, Y, and Z axes are used as reference coordinates in the figure, these systems can also be applied to non-right-angled coordinates. "It should be clear here that we have provided a new Reusable die carrier for performance testing, and it meets the requirements described at the beginning of this article. This die carrier can temporarily load a semiconducting I -_--- ^ -----. F device ------ order--r--ΓΙΜ (Please read the precautions on the back before filling (This page) This paper is in accordance with Chinese National Standards (CNS), 8 4 grids (210 > < 297 mm). -16-Printed by A7 B7, Consumer Cooperatives, Central Standards Bureau, Ministry of Economic Affairs. Die, it can be used not only for programming but also for electrical testing. It significantly saves the cost of burning the slot because the number of pins required for the slot is reduced. As for the more pins required for electrical testing, the pads on the aforementioned carrier can be added to solve the problem. The burning process can also be used for electrical testing. In the programming process, this carrier can be used on traditional programming boards and systems. In addition, the carrier can have different options to load die of different sizes or different pin counts. For different die, only the bottom layer of the carrier needs to be modified to handle the same burning board, including the need for different test telecommunications. This design concept is toward a universal flash board. This carrier can also provide a die-protected environment. It should also be clear to many people * that this vehicle can be changed in different ways. For example, the surface of the balance weight or pressure plate can be designed to be irregularly shaped to avoid possible attraction forces on the interface with the grains. Changes such as these lie in the spirit and scope of later patent applications. Brief Description of the Drawings Figure 1 is an exploded view of a reusable die carrier in the present invention. FIG. 2 is a cross-sectional view of the carrier in FIG. 1. At this time, it is a finished product after being assembled. Figure 3 is the plane circle of this vehicle. Fig. 4 is another cross-sectional view when the cover of each vehicle is opened. Fig. 5 is a cross-sectional view similar to Fig. 2, but is limited to a second application example of the present invention. This paper size applies to the Chinese National Standard (CNS) Ya 4 threats (210X297 mm) _ 17 _ " (Please read the precautions on the back before filling out this page) Order ---- V,-A7 __B7___ V. Invention Explanation (15) Circle 6 is a plane circle similar to Figure 2, but it is the second application example in the fifth garden. Figure 6 A is a ^ plan view of the bottom and seat of the vehicle. The second application example. 6B is a cross-sectional view of a portion 6B in FIG. 6A. FIG. 7 is a plan view of a carrier according to a third application example of the present invention. Fig. 8 is a plan view when the carrier in Fig. 7 is placed on a holder. Fig. 9 is a sectional view of the holder and the carrier in the direction of 9 to 9 in Fig. 8. FIG. 10 is a plan view of a part of another application example of the present invention. FIG. 11 is a side view of a die carrier in a circle 10. Fig. 12 is a perspective view of a carrier having a two-piece pressure balancing system. Fig. 13 is a perspective view of the carrier in Fig. 12 in an opened state. FIG. 14 is a cross-sectional view of the carrier in FIG. 12 in a direction of 1 4-1 4 in a closed state, and there is a grain therein. Printed by the Central Standards Bureau of the Ministry of Economic Affairs and Consumer Cooperatives (please read the precautions on the back before filling out this page) Figure 15 is a cross-sectional view of the vehicle in Figure 12 in the open state. FIG. 16A is a cross-sectional view of the cover portion of the carrier in FIG. 12, taken along the direction 16A-16A of FIG. 15. Fig. 16B is the same cross-sectional view as 圚 16A, but depicts the movement state of the balance weight in the Z axis. Figure 16C is the same as Figure 16B, but depicts the movement of the balance weight along the X axis. This paper size applies to the Chinese National Standard (CNS) A4 specification (210X297 mm) 18-Printed by the Shellfish Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (ie) Figure 16D is similar to Figure 16B In the direction of 16D- 16D of Fig. 15, the movement state of the balance weight along the Y axis is depicted. Fig. 17 is a perspective view of a vehicle having a four-piece pressure-force balancing system. E Fig. 18 is a perspective view of the vehicle of Fig. 17 in an opened state. FIG. 19 is a cross section 圚 of the carrier in FIG. 17 in a direction of 19-19 in a closed state, and there is a crystal grain therein. Fig. 20 is a cross-sectional view of the carrier in Fig. 17 in an opened state. FIG. 2A is a cross-sectional view of the cover part of the vehicle in FIG. 17, and along the 21A to 21A direction of FIG. 20, the movement state of the balance weight on the Z axis is depicted. FIG. 2B is similar to 圚 21, but along the 2 1B- 2 1 B direction of FIG. 20, the movement state of the balance weight along the X axis is depicted. The circle 21C is similar to FIG. 21B, and along the 21C-2 1 C direction of FIG. 21A, the movement state of the balance weight along the Y axis is depicted. Figure 22 is a perspective view of a carrier with a ball bearing point contact pressure system. FIG. 23 is a perspective view of the carrier in FIG. 22 in an opened state. FIG. 24 is a cross-sectional view of the carrier in FIG. 22 in a closed state. FIG. 25 is a cross-sectional view of the carrier in FIG. 22 in an opened state. Figure 2 6A is a cross-sectional view of the cover portion of the vehicle in Figure 22 'in the direction of 26A-26A of Figure 25 "Figure 2 6B is the same cross-sectional view as Figure 2 6A, but depicts the balance in it The motion state of the block on the Z axis. This paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read the note on the back before filling in this page) 4? ---- tr A7 _ B7___ 'V. Description of the invention (17) Figure 2 6 C is the same as Figure 2 6 B, but depicts the movement of the balance weight along the X axis. Fig. 26〇 is similar to _268, but: It is along the 26D-2 6 D direction of Fig. 26, and depicts the movement state of the balance weight along the Y axis. Figure 27 is a perspective view of a carrier with a ball bearing pressure system. Fig. 27A is a perspective view of the cover of the carrier in Fig. 27, and the design of an improved latch mechanism can be seen. FIG. 2B is a perspective view of the latch of the vehicle in FIG. Fig. 2 7C is an enlarged sectional view of the improved latch mechanism. FIG. 28 is a perspective view of the carrier in FIG. 27 in an opened state. FIG. 29 is a cross-sectional view of the carrier in FIG. 30 is a cross-sectional view of the carrier in FIG. 27 in an opened state. FIG. 3A is a cross-sectional view of the cover portion of the carrier in FIG. 27, taken along the direction 31-31 of FIG. 30. FIG.圚 3 1 B is the same cross-sectional view as Fig. 3 A, but depicts the movement of the balance weight on the Z axis. Du Jinzhuang, Consumer Goods Cooperation, Central Standards Bureau, Ministry of Economic Affairs (^ ------- (Please read the notes on the back before filling out this page) Figure 3 1C is the same as Figure 3 1 B, but depicts the balance weight along X-axis, state of motion. Fig. 31D is similar to Fig. 31B, but depicts the movement state of the balance weight along the Y axis in different directions. Figure 32 is an exploded view of the base of the aforementioned reusable carrier, taken from the bottom up. FIG. 33 is a sectional view of the base in circle 32. FIG. The paper scale is applicable to the Chinese family standard (CNS) A4 specification (210X297 male thin) -20-
A 明 説 明 發 另 的 明 發 本 是 4 3圖 圖 面 剖 的 具戟 之 例 實 用應 個 —p— -I- -1 ml·. I- -I - - I - - -I— KsovI -I n (請先閲讀背面之注意事項再填寫本頁) ΪΤ-' 經濟部中央標隼局男工消贽合作社印製 本紙悵尺度適用中國國家標準（CNS)A4規格（2丨0X297公釐）_ 21A shows that the other Mingfa is an example of a halberd with 4 3 figures. Practical application —p— -I- -1 ml ·. I- -I--I---I— KsovI -I n (Please read the precautions on the back before filling this page) ΪΤ- 'The paper printed by the Male Workers' Consumers Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs is compliant with China National Standard (CNS) A4 (2 丨 0X297 mm) twenty one