CN113485540A - Test protector is confirmed in burning of wafer aluminum strip - Google Patents
Test protector is confirmed in burning of wafer aluminum strip Download PDFInfo
- Publication number
- CN113485540A CN113485540A CN202110806186.XA CN202110806186A CN113485540A CN 113485540 A CN113485540 A CN 113485540A CN 202110806186 A CN202110806186 A CN 202110806186A CN 113485540 A CN113485540 A CN 113485540A
- Authority
- CN
- China
- Prior art keywords
- box
- mounting box
- wafer
- pipe
- burn
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 15
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 15
- 230000001012 protector Effects 0.000 title claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 49
- 238000001816 cooling Methods 0.000 claims abstract description 25
- 238000010521 absorption reaction Methods 0.000 claims abstract description 10
- 239000000428 dust Substances 0.000 claims description 4
- 238000010200 validation analysis Methods 0.000 claims 5
- 238000009434 installation Methods 0.000 abstract description 15
- 230000017525 heat dissipation Effects 0.000 abstract description 6
- 238000012790 confirmation Methods 0.000 abstract description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 239000013078 crystal Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F8/00—Arrangements for software engineering
- G06F8/60—Software deployment
- G06F8/61—Installation
- G06F8/63—Image based installation; Cloning; Build to order
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Software Systems (AREA)
- Human Computer Interaction (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention discloses a test protection device for burn-in confirmation of a wafer aluminum strip in the field of wafer processing, which comprises an installation box, wherein a burn-in device is installed in the installation box, a burn-in box is installed on the right side of the burn-in device in the installation box, two wafer fixing devices are installed in the burn-in box, a top cover device is installed at the top of the installation box, a locking device for fixing the top cover device is installed on the right side of the installation box, a water cooling device extending into the installation box is installed at the bottom of the installation box, and the water cooling device comprises: the water tank is installed in the bottom of mounting box, installs the water pump in the water tank, and a main part pipe is installed respectively to the inside left and right sides of mounting box, is provided with a plurality of heat absorption balls on the main part pipe, and the water pump leads to pipe and links to each other with the main part pipe, and the main part pipe leads to pipe and links to each other with the cooling tube, and the cooling tube leads to pipe and links to each other with the water tank. The invention has simple structure, good heat dissipation and strong protection.
Description
Technical Field
The invention relates to the field of wafer processing, in particular to a wafer aluminum strip programming confirmation test protection device.
Background
Wafer refers to a silicon wafer used for making silicon semiconductor circuits, the starting material of which is silicon. And dissolving the high-purity polycrystalline silicon, doping the dissolved high-purity polycrystalline silicon into silicon crystal seed crystals, and slowly pulling out the silicon crystal seed crystals to form cylindrical monocrystalline silicon. After the silicon crystal bar is ground, polished and sliced, a silicon wafer, namely a wafer, is formed.
The programming refers to writing a specific program into a wafer, a large amount of heat is generated in the process, and the wafer may be damaged due to high temperature caused by long-time programming.
Disclosure of Invention
The invention aims to provide a wafer aluminum strip programming confirmation test protection device to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme:
the utility model provides a test protector is confirmed to wafer aluminum strip fever writing, includes the mounting box, install in the mounting box and burn the ware of writing, burn the right side of writing the ware and install in the mounting box and burn the box of writing, burn and install two wafer fixing device in the box, top cap device is installed at the top of mounting box, locking device who is used for fixed top cap device is installed on the right side of mounting box, a plurality of louvres have all been seted up to the left and right sides of mounting box, a dust removal net is all installed at both ends about the inside of mounting box, the water cooling plant who extends to its inside is installed to the bottom of mounting box, water cooling plant includes: the water tank is installed at the bottom of the installation box, the water pump is installed in the water tank, the main body pipe is installed on the left side and the right side of the inside of the installation box respectively, a plurality of heat absorption balls are arranged on the main body pipe, the water pump is connected with the main body pipe through a water pipe, the main body pipe is connected with the cooling pipe through a water pipe, and the cooling pipe is connected with the water tank through a water pipe.
As a further scheme of the invention: the two wafer fixing devices are arranged in an up-and-down symmetrical mode relative to the axis of the programming box.
As a still further scheme of the invention: the wafer fixing device comprises: sliding sleeve, guide arm, first spring and grip block, the sliding sleeve is installed on the inner wall of writing the box, sliding connection has the guide arm that extends to its outside in the sliding sleeve, the one end of guide arm is through first spring and the inner wall elastic connection who writes the box, the other end and the grip block of guide arm link to each other.
As a still further scheme of the invention: the cap device includes: the novel mounting box comprises a cover plate, a shaft sleeve, a pin shaft and a handle, wherein the shaft sleeve is mounted at the left end of the top of the mounting box, the pin shaft is connected in the shaft sleeve in a rotating mode, the cover plate extending to the outside of the shaft sleeve is mounted on the pin shaft, and the handle is mounted on the cover plate.
As a still further scheme of the invention: the locking device includes: backup pad, pivot, eccentric cam, clamp plate and second spring, the backup pad is installed in the right side of mounting box, install the pivot in the backup pad, the top of pivot links to each other with eccentric cam, the clamp plate is installed to eccentric cam's downside, the upside of clamp plate is laminated with eccentric cam through the second spring mutually, the bottom and the apron of clamp plate closely laminate.
As a still further scheme of the invention: the cooling pipe is composed of a plurality of U-shaped pipes.
Compared with the prior art, the invention has the beneficial effects that: the wafer aluminum strip programming confirmation test protection device is used for placing a wafer into a programming box, clamping the wafer by driving a guide rod and a clamping plate through the elasticity of a first spring, programming a program into the wafer through a programming device, generating a large amount of heat in the programming process, accelerating air circulation through heat dissipation holes, reducing the temperature, meanwhile, conveying cold water into a main body pipe and a heat absorption ball through a water pump, absorbing the heat in an installation box through the main body pipe and the heat absorption ball, and cooling the water after absorbing the heat through a cooling pipe and then refluxing the water into a water tank, so that the heat dissipation efficiency is improved; after the programming is finished, the eccentric cam is rotated, the pressing plate is driven to move through the eccentric cam, so that the pressing plate is separated from the cover plate, the wafer can be turned over, and the wafer can be taken out. In conclusion, the LED lamp is simple in structure, good in heat dissipation performance and strong in protection performance.
Drawings
FIG. 1 is a schematic structural diagram of the present invention.
FIG. 2 is a view from A-A in the structural schematic diagram of the present invention.
Fig. 3 is a partial view at B in the structural schematic of the present invention.
In the figure: 1-mounting box, 101-heat dissipation hole, 2-top cover device, 201-cover plate, 202-shaft sleeve, 203-pin shaft, 204-handle, 3-writer, 4-writer box, 5-wafer fixing device, 501-sliding sleeve, 502-guide rod, 503-first spring, 504-clamping plate, 6-locking device, 601-supporting plate, 602-rotating shaft, 603-eccentric cam, 604-pressing plate, 605-second spring, 7-dust removal net, 8-water cooling device, 801-water tank, 802-water pump, 803-main body pipe, 804-heat absorption ball and 805-cooling pipe.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the embodiments of the present invention, it should be noted that the terms "first", "second" and "third" are used for the sake of clarity in describing the numbering of the components of the product and do not represent any substantial difference, unless explicitly stated or limited otherwise. The directions of "up", "down", "left" and "right" are all based on the directions shown in the attached drawings. Specific meanings of the above terms in the embodiments of the present invention can be understood by those of ordinary skill in the art according to specific situations.
It is to be understood that, unless otherwise expressly specified or limited, the term "coupled" is used broadly, and may, for example, refer to directly coupled devices or indirectly coupled devices through intervening media. Specific meanings of the above terms in the embodiments of the invention will be understood to those of ordinary skill in the art in specific cases.
Examples
Referring to fig. 1 to 3, in an embodiment of the present invention, a test protection device for burn-in confirmation of a wafer aluminum strip includes an installation box 1, a burn-in device 3 is installed in the installation box 1, a burn-in box 4 is installed in the installation box 1 on the right side of the burn-in device 3, the burn-in device 3 is connected to the burn-in box 4 through a wire, two wafer fixing devices 5 are installed in the burn-in box 4, the two wafer fixing devices 5 are symmetrically arranged up and down with respect to an axis of the burn-in box 4, and the wafer fixing devices 5 include: sliding sleeve 501, guide arm 502, first spring 503 and clamping plate 504, sliding sleeve 501 installs on the inner wall of box 4 writes, sliding connection has the guide arm 502 that extends to its outside in sliding sleeve 501, the one end of guide arm 502 is through first spring 503 and the inner wall elastic connection who writes box 4 writes, the other end of guide arm 502 links to each other with clamping plate 504, clamping plate 504's outward appearance is arc, capping device 2 is installed at the top of installation box 1, capping device 2 includes: apron 201, axle sleeve 202, round pin axle 203 and handle 204, axle sleeve 202 is installed to the top left end of mounting box 1, the axle sleeve 202 internal rotation is connected with round pin axle 203, install on the round pin axle 203 and extend to the outside apron 201 of axle sleeve 202, install handle 204 on the apron 201, locking device 6 that is used for fixed top cap device 2 is installed on the right side of mounting box 1, locking device 6 includes: backup pad 601, pivot 602, eccentric cam 603, clamp plate 604 and second spring 605, backup pad 601 is installed in the right side of mounting box 1, install pivot 602 on the backup pad 601, the top of pivot 602 links to each other with eccentric cam 603, clamp plate 604 is installed to the downside of eccentric cam 603, the upside of clamp plate 604 is laminated with eccentric cam 603 through second spring 605, the bottom and the apron 201 of clamp plate 604 closely laminate, a plurality of louvres 101 have all been seted up to the left and right sides of mounting box 1, a dust removal net 7 is all installed at both ends about the inside of mounting box 1, water cooling plant 8 that extends to its inside is installed to the bottom of mounting box 1, water cooling plant 8 includes: the water tank 801 is mounted at the bottom of the mounting box 1, the water pump 802 is mounted in the water tank 801, the main body pipes 803 are mounted on the left side and the right side of the interior of the mounting box 1 respectively, a plurality of heat absorption balls 804 are arranged on the main body pipes 803, the water pump 802 is connected with the main body pipes 803 through water pipes, the main body pipes 803 are connected with the cooling pipes 805 through water pipes, the cooling pipes 805 are connected with the water tank 801 through water pipes, and the cooling pipes 805 are composed of a plurality of U-shaped pipes, so that the water tank has a larger surface area and can be cooled more quickly.
The working principle of the invention is as follows: when the protection device for confirming test of wafer aluminum strip programming is used, a wafer is placed in a programming box 4, the guide rod 502 and the clamping plate 504 are driven by the elasticity of the first spring 503 to clamp the wafer, then a program is programmed into the wafer through the programming device 3, a large amount of heat is generated in the programming process, air circulation is accelerated through the heat dissipation hole 101, the temperature is reduced, meanwhile, cold water is conveyed into the main body pipe 803 and the heat absorption ball 804 through the water pump 802, the heat in the installation box 1 is absorbed through the main body pipe 803 and the heat absorption ball 804, and the water after absorbing the heat flows back into the water tank 801 after being cooled through the cooling pipe 805, so that the heat dissipation efficiency is improved; after the programming is finished, the eccentric cam 603 is rotated, the pressing plate 604 is driven to move through the eccentric cam 603, so that the pressing plate 604 is separated from the cover plate 201, the cover plate 201 can be opened, and the wafer can be taken out.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (6)
1. The utility model provides a test protector is confirmed in burning of wafer aluminum strip, includes mounting box (1), its characterized in that: install in mounting box (1) and burn and write ware (3), burn and write the right side of ware (3) and install in mounting box (1) and burn and write box (4), burn and write and install two wafer fixing device (5) in box (4), top cap device (2) are installed at the top of mounting box (1), locking device (6) that are used for fixed top cap device (2) are installed on the right side of mounting box (1), a plurality of louvre (101) have all been seted up to the left and right sides of mounting box (1), one dust removal net (7) are all installed at both ends about the inside of mounting box (1), water cooling plant (8) that extend to its inside are installed to the bottom of mounting box (1), water cooling plant (8) include: water tank (801), water pump (802), main part pipe (803), heat absorption ball (804) and cooling tube (805), the bottom in mounting box (1) is installed to water tank (801), install water pump (802) in water tank (801), a main part pipe (803) are installed respectively to the inside left and right sides of mounting box (1), be provided with a plurality of heat absorption balls (804) on main part pipe (803), water pump (802) lead to pipe and main part pipe (803) link to each other, main part pipe (803) lead to pipe and cooling tube (805) link to each other, cooling tube (805) lead to pipe and water tank (801) link to each other.
2. The wafer aluminum strip programming validation test guard of claim 1, wherein: the two wafer fixing devices (5) are arranged in an up-and-down symmetrical mode relative to the axis of the programming box (4).
3. The wafer aluminum strip programming validation test guard of claim 2, wherein: the wafer fixing device (5) comprises: sliding sleeve (501), guide arm (502), first spring (503) and clamping plate (504), sliding sleeve (501) are installed on the inner wall of writing box (4), sliding sleeve (501) sliding connection has guide arm (502) that extends to its outside, the one end of guide arm (502) is through first spring (503) and the inner wall elastic connection who writes box (4), the other end and the clamping plate (504) of guide arm (502) link to each other.
4. The wafer aluminum strip programming validation test guard of claim 1, wherein: the cover device (2) comprises: apron (201), axle sleeve (202), round pin axle (203) and handle (204), axle sleeve (202) are installed to the top left end of mounting box (1), axle sleeve (202) internal rotation is connected with round pin axle (203), install apron (201) that extend to axle sleeve (202) outside on round pin axle (203), install handle (204) on apron (201).
5. The wafer aluminum strip programming validation test guard of claim 4, wherein: the locking device (6) comprises: the novel mounting box comprises a supporting plate (601), a rotating shaft (602), an eccentric cam (603), a pressing plate (604) and a second spring (605), wherein the supporting plate (601) is mounted on the right side of the mounting box (1), the rotating shaft (602) is mounted on the supporting plate (601), the top of the rotating shaft (602) is connected with the eccentric cam (603), the pressing plate (604) is mounted on the lower side of the eccentric cam (603), the upper side of the pressing plate (604) is attached to the eccentric cam (603) through the second spring (605), and the bottom of the pressing plate (604) is closely attached to a cover plate (201).
6. The wafer aluminum strip programming validation test guard of claim 1, wherein: the cooling pipe (805) is composed of a plurality of U-shaped pipes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110806186.XA CN113485540B (en) | 2021-07-16 | 2021-07-16 | Protection device for confirming test of burning of wafer aluminum strips |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110806186.XA CN113485540B (en) | 2021-07-16 | 2021-07-16 | Protection device for confirming test of burning of wafer aluminum strips |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113485540A true CN113485540A (en) | 2021-10-08 |
| CN113485540B CN113485540B (en) | 2024-02-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110806186.XA Active CN113485540B (en) | 2021-07-16 | 2021-07-16 | Protection device for confirming test of burning of wafer aluminum strips |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113485540B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW399278B (en) * | 1996-05-13 | 2000-07-21 | Aehr Test Systems Inc | Reuasable die carrier for burn-in and burn-in process |
| CN209103237U (en) * | 2018-09-17 | 2019-07-12 | 北京中渝工程技术研究院 | A kind of technological development dedicated hardware heat dissipation equipment |
| CN210328413U (en) * | 2019-08-02 | 2020-04-14 | 青岛中茂电子有限公司 | Multipurpose programming device |
| CN211928094U (en) * | 2019-12-31 | 2020-11-13 | 南京野果信息技术有限公司 | Intelligent SOP8 chip programming and testing device |
-
2021
- 2021-07-16 CN CN202110806186.XA patent/CN113485540B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW399278B (en) * | 1996-05-13 | 2000-07-21 | Aehr Test Systems Inc | Reuasable die carrier for burn-in and burn-in process |
| CN209103237U (en) * | 2018-09-17 | 2019-07-12 | 北京中渝工程技术研究院 | A kind of technological development dedicated hardware heat dissipation equipment |
| CN210328413U (en) * | 2019-08-02 | 2020-04-14 | 青岛中茂电子有限公司 | Multipurpose programming device |
| CN211928094U (en) * | 2019-12-31 | 2020-11-13 | 南京野果信息技术有限公司 | Intelligent SOP8 chip programming and testing device |
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| Publication number | Publication date |
|---|---|
| CN113485540B (en) | 2024-02-09 |
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