TW397255U - A testing device for the thermo-stresses of IC package - Google Patents

A testing device for the thermo-stresses of IC package

Info

Publication number
TW397255U
TW397255U TW87216547U TW87216547U TW397255U TW 397255 U TW397255 U TW 397255U TW 87216547 U TW87216547 U TW 87216547U TW 87216547 U TW87216547 U TW 87216547U TW 397255 U TW397255 U TW 397255U
Authority
TW
Taiwan
Prior art keywords
thermo
stresses
package
testing device
testing
Prior art date
Application number
TW87216547U
Other languages
Chinese (zh)
Inventor
Jia-Shing Lin
Original Assignee
Sanyo Electronic Taichung Co L
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electronic Taichung Co L filed Critical Sanyo Electronic Taichung Co L
Priority to TW87216547U priority Critical patent/TW397255U/en
Publication of TW397255U publication Critical patent/TW397255U/en

Links

TW87216547U 1998-10-06 1998-10-06 A testing device for the thermo-stresses of IC package TW397255U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW87216547U TW397255U (en) 1998-10-06 1998-10-06 A testing device for the thermo-stresses of IC package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW87216547U TW397255U (en) 1998-10-06 1998-10-06 A testing device for the thermo-stresses of IC package

Publications (1)

Publication Number Publication Date
TW397255U true TW397255U (en) 2000-07-01

Family

ID=21636646

Family Applications (1)

Application Number Title Priority Date Filing Date
TW87216547U TW397255U (en) 1998-10-06 1998-10-06 A testing device for the thermo-stresses of IC package

Country Status (1)

Country Link
TW (1) TW397255U (en)

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