TW394716B - Method and apparatus for placing and attaching solder balls to substrates - Google Patents

Abstract

A method and apparatus for placing and attaching solder balls to a substrate having conductive pads in a predetermined pattern is disclosed. The substrate is placed on a carrier plate. An alignment plate having holes corresponding to the predetermined pattern is mated to the carrier plate with its holes aligned with the predetermine pattern on the substrate. Solder balls are loaded into each hole of the alignment plate. The solder balls maybe loaded with a vacuum plate which uses vacuum to pick up solder balls in the predetermined pattern and place them over the holes on the alignment plate. The vacuum is released for dropping the balls in the holes of the alignment plate. Alternatively a shutter plate having holes corresponding to the holes on the alignment plate is fitted on the alignment plate and afforded slidable movement between an offset position and an aligned position. A ball is loaded in each hole in the shutter plate when it is in its offset position. The shutter plate is then slid its aligned position wherein alignment plate is then heated in a non-processing atmosphere in a furnace casing the solder balls to reflow and attach to pails the substrate.

Description

I. Poor quality: ΓΪ * The central government bureau of the Ministry of Economic Affairs of the People's Republic of China printed the patent application No. 87102286 of the patent application for the invention's specification amendment page. Date of revision: When the diameter was July 1987, the hole was appropriately about 01. Leaf diameter. All corner surfaces 32 (see Sections 5A, 5B and 5C) are provided on the top and bottom of the hole. This top chamfered surface is provided to allow movement in contact between the solder ball and the conductive wear pad, as discussed below. The thickness of the alignment plate at the base 38 of the well 37 is typically about twice the thickness of the solder ball. This alignment plate also includes an opening 3 * on its peripheral edge 45 to accommodate the set pin 26 of the carrier 20 And the drain opening% 乂 This cavity is loaded with a BGA package 23, which is aligned in a straight line via the positioning pin 24 appropriately. The alignment plate 30 is then matched to the carrier such that the set pins 26 fit into the openings 34 of the alignment plate 30 so that the two plates are aligned in a straight line. The drainage 28 of the clamping plate is aligned linearly with the drainage device 36 of the alignment plate. A gap 60 exists between the BGA package and the alignment plate (Figures 5A, 5] 3 and 5 €). If the opening 34 is not perforated, that is, does not penetrate the entire thickness of the periphery and edges, the gap can be controlled by the length of the setting pin 26. Alternatively, the cavity 22 of the carrier can be selected in advance The depth required to provide the desired gap between the BGA package and the alignment plate 30 should be understood when the alignment plate 30 is matched by the peripheral edges of the carrier 20, that is, any suitable method to provide the desired gap is can use. For example, if the clamping pin 24 is tapered toward its free end, the gap can be controlled by the diameter of the opening 34. ....... ...... ..... One-to-one—the gap 60 between the quasi ^ and the BGA package allows the ball to be centered on the BGA package 23 ^ G (In the case of the first hole 31 ', because it is appropriate that the diameter of the hole 31 is larger than the diameter of the solder ball by not more than 0.001 pairs, they cannot be moved to the ground. When this solder ball arrives at this paper size, the Chinese National Standard (CNS) A4 specifications (21〇χ297 public attack-

A7 B7 V. Description of the Invention (1) Cross Reference to Related Patent Applications This patent application claims priority from the following patent applications and is fully incorporated herein: US Patent Application No. 60 / 038,097, 1997 Filed on the 18th, and have Docket number 30493 / DAD / E228: US Patent Application No. 60/071751, filed on January 16, 1998, and have Docket number 32003 / CM / E228; And the U.S. patent application entitled "Method for Placing and Bonding Solder Balls to a Substrate" was proposed on February 6, 1998, and has Docket number 32103 / CM / E228 of the agent. BACKGROUND OF THE INVENTION The present invention has: Regarding methods and devices for placing and soldering solder balls to a substrate, in particular, solder ball grid array (BGA) packages do not require an agent. Printed by the Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs (please read the precautions on the back before filling this page) The method currently used to solder the balls to the BGA package refers to a solvent, a substance that prevents the balls from softening Formation of oxidation. In a typical "solvent" method, the surface of the substrate's electrical conductor wear-increasing pad is coated, for example, with a barrier, a solvent, and solder balls placed in a position on the package. When the solvent dries, the ball becomes sticky to the pad surface. Occasionally, two solder balls may cling to a single pad surface or, conversely, no ball may adhere to a particular pad surface. The combination is placed on a conveyor and the ball is softened-welded to a BGA pad in a furnace. When the combination is heated during the softening procedure, the solvent is liquefied, and the solvent is broken between the ball and the pad. As a result, the ball moves freely during the hot transport through the furnace. Its impact, such as vacancies, the crossing of adjacent balls This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm)

Weaknesses such as the printing of employee cooperatives by the Central Bureau of Standards of the Ministry of Economic Affairs and the loss of location accuracy have arisen. At the same time, the solvent residue was trapped between the puppet and the poor surface of the ball and was completely removed. These unclean residues, depending on the type of solvent used, may cause a high degree of resistance, short circuit and / or corruption will follow the welding operation of the final assembly. Therefore, this solvent must be removed every time. This will require a separate cleaning step and device. Moreover, many of the cleaners used today to remove solvents are not environmentally friendly. Both U.S. Patent Nos. 5,499,487 and 5,551,216 are incorporated herein by reference. This section discloses the use of solder balls. Traditional methods and devices placed on BGA packages. The demand for BGA devices6 has steadily increased, and more efficient methods for high-volume manufacturing combinations need to be developed to keep pace with the times, and product production needs to be improved so that production costs can be reduced. Accordingly, a new and more cost-effective method for placing and soldering solder balls on BGA packages is needed. Summary of the invention: The applicant has developed a new and improved "solvent-free," or "solvent-free" method of pre-determined patterns for placing and welding solder balls on the substrate's conductivity increase pad. All the problems in the material below_. But it can be a good idea__. This new method uses specially designed tools to load and keep the package and ball in the required position during processing. This soldering operation is performed at Operate in the atmosphere without the control of one of the solvents. This substrate can be any substrate on which solder balls can be soldered. Examples of substrates include ceramic and plastic BGA packages, mini or micro bga = packaging, die-bonding wafers, die-bonding Chips, micro_electromechanical "country" .-- ^ _ II (Please read the precautions on the back before writing this page)

, 1T • 1®. -6- A7 —_____ B7. V. Description of the invention (3) Internet and similar products. In this method, a substrate, and more suitably a plurality of substrates, are loaded into a carrier or holder. An alignment plate containing a plurality of through-holes is removably assembled in a suitable position on the carcass and is separated from the base by a distance not less than the diameter of the solder ball. The pattern of the through-hole pattern in the alignment plate is equivalent to the pattern of the conductivity increase pad of the substrate in the carrier. The solder ball will be soldered to it. A solder ball is then loaded into the holes of the alignment plate, so that the solder ball falls into contact with the conductive wear-increasing pad of the substrate by gravity. The alignment plate keeps this solder in contact with the wear pad. The carrier and the alignment plate are suitably made of graphite, but may be made of any other suitable material, such as ceramics, alumina, and the like. It is more appropriate that the alignment plate is made of a material that will not be wetted or adhered by the molten solder balls. The solder ball may be made of the same substance from the inside to the outside, or, for example, a substance having a center with a higher melting temperature and a shell with a lower melting temperature. Both are available in malls and are well known in the industry. For example, suitable solder balls are available from A Metal Metals Inc. of New Jersey and described in the company's Technical Bulletin SM-480 through SM_487, and Application Bulletin SM-487 through SM-490 No. and all of these bulletins are incorporated herein by reference. Any size solder ball can be used, and the appropriate size includes those with a diameter of more than 2000 inches. Once the solder has been loaded into the alignment plate, the alignment plate and the carrier are then heated in an inert atmosphere to a temperature sufficient to dissolve or soften the surface of the solder ball. This alignment plate and carrier combination is then cooled to the solder ball

-7- A7 B7 V. Description of the invention (4) Quality re-cure 'It is bonded to the substrate's conductive power-increasing pad. The alignment plate is then detached from the carrier and the base system is removed from the carrier. The carrier and alignment plate are appropriately heated to time and at a temperature and reduced pressure, such as 1 Torr to millitor 'and in a suitable atmosphere, for example, under an inert gas such as nitrogen. In the presentation, it is sufficient to remove any oxides present on the surface of the solder ball, all of which are more appropriate. Thereafter, the substrate and the alignment plate are heated to a time and under a temperature and pressure, and in a suitable atmosphere such as nitrogen, sufficient to at least partially melt or soften the solder of the solder ball so that the solder flows in The substrate's conductive loss increasing pad is combined with it. Heating can also be done by any suitable method. In the preferred method, the alignment plate and carrier are made of graphite. Heating includes electrically connecting the graphite carrier and the alignment plate to the electrodes and transmitting an electric current through the carrier and the alignment plate. Due to the resistance of graphite, the temperature of the carrier and the alignment plate rises sharply. Instead of resistance heating, the carrier and the alignment plate can also be placed, such as on a hot plate, or in an oven, or by some other suitable heating device. Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs. In a particularly preferred embodiment of the present invention, the BGA package is placed in an upside down position in a holder or carrier, that is, the consumption increasing pad is turned upward. . An alignment plate is fixed on the carrier and is removably fixed thereto. This alignment board has a perforation pattern which is equivalent to a pattern of power dissipation pads on a BGA package. The diameter of this hole is slightly larger than the diameter of the ball. Balls are loaded in this hole (one ball per hole). Since the alignment plate is fixed to the carrier, the well prevents the ball from moving. This ball contacts the surface of the wear-increasing pad when it is accurately fixed in the required position. This alignment plate / carrier combination is automatically placed on the inside of a graphite sheet. The paper size is applicable to the Chinese National Standard (CNS) A4 (210X297 mm). Printed by the Ministry of Economic Affairs and Industry Cooperatives. A7 B7. V. Invention Instructions (5) on the platform. The lid is closed. The chamber is concealed with inert gas, and the current is transmitted through the platform. This graphite material acts as a resistance heater, and the thermal system is rapidly generated and transferred into the alignment plate / carrier combination. The load in this chamber is heated to the welding temperature, at which the welding layer of the ball melts to form a ball / 球 joint or bond. The time required for welding (chamber load, heating period, pause time, and cooling period) is typically ⑺ minutes or less. This welding operation is completed without the use of solvents). In this way, cleaning of the solder beforehand is not required. This solder ball can also be loaded into the holes in the alignment plate by any suitable method and device. A preferred method refers to a range door / alignment plate combination that includes a range door panel slidably positioned above the alignment plate. This door panel contains a pattern of perforations equivalent to the perforation pattern of the alignment plate). This door panel is biased (more appropriately, spring biased) into the first position, where the hole of the door panel is offset from the hole of the alignment plate. The holes in each door in this position are loaded with a solder ball:. The door is then slid to a second position by the force of the spring, wherein the hole is aligned linearly with the hole of the alignment plate. When aligned, the solder ball passes through the holes of the alignment plate by gravity and comes into contact with the conductive wear-increasing pad of the substrate, and the carrier is already loaded into the carrier. This door is then released and the spring force biases it to its original first or off position. The door panel catches the solder ball in the hole of the alignment plate in its first position. Another method of flipping the solder balls into the holes of the alignment plate is to provide a vacuum loader plate connected to a vacuum pump. The vacuum loader plate has a plurality of perforations', each of which is connected to a vacuum pump. These holes are in the same pattern as the holes of the alignment plate. At least a part of each hole is smaller in diameter than the solder ball's paper size. Applicable to China National Standard (CNS) M specification (21〇 < 297 mm) (Please read the note on the back first # 'Congratulate this page )

-9- A7

-10- V. Description of the invention (7) A7 B7 The entire combination is then reversed up and down to enable the solder ball to fall into contact with the substrate's wear-increasing pad by gravity. This combination is then heated. Brief description of the drawings: FIG. 1A is a top view of a typical carrier plate; FIG. 1B is a cross-sectional view of a carrier portion of the carrier plate shown in FIG. Α; FIG. 2A is a top view of a typical alignment plate Figure 2B is a partial cross-sectional view of the alignment plate shown in Figure 2A; Figure 3A is a top view of a typical door panel; Figure 3B is a partial cross-sectional view of one of the door panels shown in Figure 3A Figure 4 is a top view of one of a combination of a carrier plate, an alignment plate and a door plate; Figure 5A is a partial cross-sectional view of a combination in a solder ball loading position; Figure 5B is a partial cross-section of a combination in a solder ball drop position; Sectional view (please read the precautions on the back before writing this page) 4 Figure 5C is a partial cross-sectional view assembled in the welding position; Figure 6 is a solder ball interconnection (solder block) formed by the present invention ) Side view Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs. Figure 7 is a partial cross-sectional view of the combination shown in Figure 4, illustrating the gap between the alignment plate and a BGA package; Figure 8 A Designed for the hole pattern shown in Figure 2 A-Vacuum Loader Plate A top view; Figure 8B is a cross-sectional view of the loader plate shown in Figure 8A. Figure 8C is one of the vacuum loader plates shown in Figure 1A— '° 丨 Household Standard (6 ^ 7Er (210 > < 297stone-11-printed by A7 B7, Consumer Cooperative of the Central Standards Bureau, Ministry of Economic Affairs, V. 5. Description of the invention (8) A surface view illustrating the geometry of a typical hole on the vacuum loader plate. Figure 9A is a partial cross-sectional view of a vacuum loader board, alignment plate, BGA package and carrier board combination, illustrating a vacuum loader board of another alternative embodiment; Figure 9B is an alignment board matched to a load A partial cross-sectional view of the board, with a solder ball in the position for bonding to the BGA package; 'Figure 10 is a partial cross-sectional view of a combination of another alternative embodiment, where the vacuum loader board is also Figure 11A is a partial cross-sectional view of another alternative combination of real beetle cases, including a carrier board, a BGA package, and an unperforated alignment board; Figure 11B is another A partial cross-sectional view of an alternative embodiment combination, including a carrier board, a BGA package, and an alignment board As well as a person does not pass through the top plate;. *, Figure 12 another alternative embodiment of a system in combination partial cross sectional view of the embodiment

, Including the carrier board? A BGA package, an alignment plate with perforations, and a top plate V. Description of the preferred embodiment: According to the method of the present invention, the solder bonding is performed in a controlled atmosphere furnace, such as the MV-2200 furnace from EDM Supplies in Downey, California. Products supplied by the Scientific Sealing Technology division of Inc. The description of this MV-200 type furnace system is described in the introduction titled "Reinforced Vacuum Processing Furnace, Model MV-2200 'since Scientific Sealing Technology and is incorporated herein by reference. The loading or tooling system for solder ball bonding includes two Sheets and plates—the carrier paper is sized for Chinese National Standards (CNS) A4 (------- -12 · (Read the precautions on the back before filling out this page)

Printed by the Consumers' Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs A7 B7 V. Description of the invention (9) and-Alignment plate 30, made of graphite material appropriately mechanically. This carrier 20 (also referred to as a boat-shaped basin 'fixing plate, positioning plate or holder) is specially machined with a cavity 22 to receive the BGA package or other suitable substrate (Figures 1A and 1B). The depth of this cavity is slightly larger than the thickness of the substrate. Although the present invention is described here in the name of a BGA package that already has a power-increasing pad, the present invention can also be used to place and combine balls on other substrates, such as mini or micro BGA packages, and soldered wafers. Those with scaled soldered wafers, microelectromechanical system interconnections, and the like have metallization increase pads, or are connected through them, or have other appropriate features. Therefore, the term "BGA package" should be constituted in this article to include all applicable bases. The carrier 20 in Figures 1A and 1B includes two cavities for holding eight BGA packages. This is an exemplary carrier board. However, other carriers can only be used with one or a large number of BGA packages. This carrier may have a separate r cavity for each BGA package. However, for the purpose of illustration, the present invention is described with reference to the carrier shown in Figs. 1A and 1B. Each cavity 22 includes a positioning pin 24 for positioning the BGA package. The carrier 20 also includes a drainage device 28 and two setting pins 26. The furnace top plate or alignment plate 30 (Figures 2A and 2B) contains a drilled through hole in a pattern 39, which exactly corresponds to the special wear-increasing pad pattern 39 of the BGA package loaded into the carrier 20. The alignment plate has a "tub-shaped" well 37 above it, which is surrounded by a peripheral edge 45 (Figure 2B). This hole pattern 39 is passed through the base 38 of the through-hole 37 to conform to each BGA package placed in the carrier 20. The hole 31 forming the hole pattern 39 is slightly larger in diameter than the solder ball (see Fig. 5B). For example, if the solder ball 33 is 010 inches straight, the paper size applies the Chinese National Standard (CNS) A4 (210X297 mm) (Please read the precautions on the back before filling this page) Order -13-

I. Poor quality: ΓΪ * The central government bureau of the Ministry of Economic Affairs of the People's Republic of China printed the patent application No. 87102286 of the patent application for the invention's specification amendment page. Date of revision: When the diameter was July 1987, the hole was appropriately about 01. Leaf diameter. All corner surfaces 32 (see Sections 5A, 5B and 5C) are provided on the top and bottom of the hole. This top chamfered surface is provided to allow movement in contact between the solder ball and the conductive wear pad, as discussed below. The thickness of the alignment plate at the base 38 of the well 37 is typically about twice the thickness of the solder ball. This alignment plate also includes an opening 3 * on its peripheral edge 45 to accommodate the set pin 26 of the carrier 20 And the drain opening% 乂 This cavity is loaded with a BGA package 23, which is aligned in a straight line via the positioning pin 24 appropriately. The alignment plate 30 is then matched to the carrier such that the set pins 26 fit into the openings 34 of the alignment plate 30 so that the two plates are aligned in a straight line. The drainage 28 of the clamping plate is aligned linearly with the drainage device 36 of the alignment plate. A gap 60 exists between the BGA package and the alignment plate (Figures 5A, 5] 3 and 5 €). If the opening 34 is not perforated, that is, does not penetrate the entire thickness of the periphery and edges, the gap can be controlled by the length of the setting pin 26. Alternatively, the cavity 22 of the carrier can be selected in advance The depth required to provide the desired gap between the BGA package and the alignment plate 30 should be understood when the alignment plate 30 is matched by the peripheral edges of the carrier 20, that is, any suitable method to provide the desired gap is can use. For example, if the clamping pin 24 is tapered toward its free end, the gap can be controlled by the diameter of the opening 34. ....... ...... ..... One-to-one—the gap 60 between the quasi ^ and the BGA package allows the ball to be centered on the BGA package 23 ^ G (In the case of the first hole 31 ', because it is appropriate that the diameter of the hole 31 is larger than the diameter of the solder ball by not more than 0.001 pairs, they cannot be moved to the ground. When this solder ball arrives at this paper size, the Chinese National Standard (CNS) is applied A4 specifications (21〇χ297 public attack-

A7 B7 11 V. Description of the invention (When resting on the bga package by this pad, the main part of the ball is in the gap 60, this part is smaller than the diameter of the solder ball, and approximately 75 ° / °. That is, if the diameter of the solder ball is 0.005 inch, the interval between the carrier and the alignment plate is suitably from about 0.0003 to about 0.004 inch .: As a result, only the ball The upper part of the smaller diameter is pressed into the increased diameter chamfered edge 32 of the wall 66 of the hole 31 on the alignment plate. Therefore, the solder ball is allowed to move a larger standard than the separation between the hole wall and the ball. 〇1 inch distance. This available motion gives the ball to center itself on the pad by moving to the position illustrated by the dashed line on Figure 7. This motion is applied by melting the pad on the solder ball It is caused by surface tension. Typically, the solder-resistant portion 69 surrounds the pad. This solder-resistant portion does not provide surface tension to the molten solder ball. As far as its influence is concerned, the molten outer surface of the solder ball causes the solder ball to be centered in a The center of the pad of surface tension. The “centering” system is extremely important because it provides less than perfect match between the hole pattern of the alignment plate and the pad on the package. In addition, it gives a poor coordination of thermal expansion between the alignment plate and the BGA package. When the door is roughly rectangular, the plate 40 (also referred to as a door in this article) is shown in Figures 3A and 3B. It is also suitably made of graphite and is slidably assembled on the door. Inside the well 37 of the standard plate 30. The width of the door plate 40 is approximately the width of the well 37 of the alignment plate 30. The length of the door plate 40 is less than the length of the well 37 of the alignment plate 30, and the An amount equivalent to about half the diameter of the solder ball. In this way, the door panel 40 is only sufficient to withstand sliding movement in the length direction between the first position and the second position. The surface 44a is joined to form the end wall 45 & of the well 37 aligned with the plate, and this paper size applies the Chinese National Standard (CNS) A4 specification (210X297 feet) (Please read the precautions on the back before writing this page) Ministry of Economy Printed by the Consumer Standards Cooperative of the Central Bureau of Standards .-- IT, Γ ---------- ^ -------

Printed by the Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economy. The terminal surface 44b of the middle-range door panel in the second position is joined to form the opposite end wall 45b of the well 37 of the alignment plate 30. This door panel has a bathtub-shaped well 46 on its upper side for receiving and receiving solder balls, and the peripheral edge 44 of the door panel forms the wall of the well 46. The bottom surface of the door panel 40 is flat. This door panel 40 has a hole pattern 59 in the base 50 of the well, which is equivalent to aligning the hole pattern 39 on the plate. The hole 49 of the hole pattern 59 is slightly larger in diameter than the diameter of the solder ball, and is standardized to the same diameter as the hole 31 in the plate. The base 50 of the shutter plate well has a thickness smaller than the diameter of the solder ball, such as about half, and suitably less than about 80%. One edge 43 of the door panel has a non-through transverse hole 42. When the door is attached to the alignment plate, the two retaining plates 54 are installed on the opposite edges of the alignment plate to hold the door plate 40 in accordance with the A alignment plate 30 without obstructing the door. Sliding motion (Figure 2A). When the door panel 40 is in the position in the well 37 of the alignment plate 30, the spring 45 engages the end wall 45b of the alignment plate 30 to bias the door panel 40 toward its first position. A position 'where the hole 49 and the hole pattern 59 deviate from the alignment plate hole 3 and the hole pattern 39, suitably by about a half of the diameter of a solder ball, as shown in Fig. 58. In this first position, the clamping plate, the alignment plate and the drain openings 28, 36 and 52 of the door are aligned linearly, respectively (Fig. 4). _Drain pin (not shown) can also be used to plug the drain port aligned in a straight line. The solder ball is then loaded into the well of the gate 40 (Figure 5A). Loading can be by any suitable method. For example, a certain amount of solder balls is simply poured into a well. This combination includes the carrier 20, the BGA package, the alignment plate and the door (not shown in Figure 4), and then it is tilted and rolled back and forth to enable the solder ball to fill the paper. The Chinese standard (CNS) applies ) Λ4 specification (210X297mm) (Please read the notes on the back before filling this page) Order d -16- — A7 ---'-___ · B7 V. Description of the invention (13) '': 'All files Hole 49 on the door. Only one ball can fit into each hole 49. The mouth is a strong contrast between a typical black graphite grooved door panel and silver solder balls, and the holes that are not filled with solder balls are highly visible. To help the visibility of the unfilled holes, we can appropriately make the door panels a darker winter color. Once each hole is filled with a solder ball, the drain pin is removed if it is installed, and the combination is tilted towards the drain to cause the remaining balls to fall through gravity through the drain. However, it is more appropriate for this combination to keep the linearly aligned rows of holes in the __n solder ball and then pour into the gate plate well from the highest wall of the well. This poured ball fills this hole or travels down to the well and is discharged through the drain. The ball system is continuously poured until all the door plate holes 49 are filled with +. Printed by the member of the Central Bureau of Economic Affairs-X Consumer Cooperative (please read the precautions on the back before writing this page). If it is obvious, it means that the door panel is removed from the door panel before the alignment of the web panel and the alignment web panel. Excessive ball tilt may not be needed. For example, the “slot door panel” has a thickness at the base or in its well approximately equal to the diameter of a solder ball that may be used. In this connection, a ball filled with this hole in the door panel will not extend beyond the upper surface of the door panel. These excess balls can be transmitted across the top of the door panel for the purpose of sweeping the excess solder balls to the drainage device, or separate the excess ball from the door panel in different ways. Once the excess solder ball is removed from the well 46, the door panel then slides by this spring force until it stops in its second position against the edge 45a of the alignment plate. In this position, the door hole system is aligned with the hole 31 of the alignment plate in a straight line (Fig. 53). When this happens, the solder ball falls into the hole of the alignment plate and enters by relying on the pad on the BGA package to prevent any solder ball from falling into its corresponding alignment plate hole. This is highly visible. Zhang Congit's wealth manager (21Gx297 public director) ----——, -17- and easy to identify. Taping with tape may be needed to facilitate any welding that does not immediately fall into the hole 31 in the alignment plate. Once all the balls have fallen into the holes of the alignment plate, the baffle is released, and the spring 45 urges the door panel to slide back to the first position, where the door panel hole 49 is the hole of the self-alignment plate. 31 deviation (Figure 5C in its deviation position, this door panel sends solder balls in the alignment plate hole 31 and prevents it from escaping when this combination is placed in a furnace or heated by different methods. As the words of this artist are very obvious, the alignment plate and the door need not be fixed on the carrier until the solder ball system has been loaded into the door hole. Those who are skilled in this technology are also obvious. That is, instead of manually loading the solder ball into the door hole, the solder ball can be automatically loaded, for example, by true empty loading, such as the following month, or other applicable methods. In an alternative embodiment, the solder ball is loaded onto the alignment plate using a vacuum loader. The vacuum load P includes a vacuum pump, a vacuum loader plate, and a suitable vacuum circuit between the vacuum pump and the vacuum loader plate. In this embodiment, the alignment plate does not need to be A well. An alignment plate of normal and constant thickness can be used. Referring to Figures 8A and 8B, the details of this vacuum loader plate 62 have the same equivalent hole pattern as the owner of the alignment plate 30. However, the vacuum loader plate The cross-sectional geometry of the hole is not the same as the cross-sectional geometry of the plate hole (Figure 9A). The solder ball is held by a vacuum relying on the vacuum loader. The opening or hole 65 on the outer surface of the plate ^ The vacuum'loader plate is used to convey the balls held in a predetermined pattern held by the vacuum to the alignment plate. The hole 65 has a smaller diameter than the ball diameter, so 'the ball does not pass through this hole and Enter the vacuum line printed by the Consumers Cooperative of the Central Standard Bureau of the Ministry of Economic Affairs A7 B7 V. Invention Description (15) Road (not shown in the figure). The more appropriate, the hole 65-part of the surface 64 adjacent to the loader board is the warp Enlarge to form a cup with a diameter slightly larger than the diameter of the solder ball, but a depth slightly smaller than the diameter of the solder ball. In this example, the solder ball will be self-loaded when it is loaded in the hole The outer surface 64 of the plate slightly protrudes as shown in Figure 9A. In the embodiment shown, a cavity or airbag 67 (figure 1) is formed in the vacuum loader plate 62 to communicate with the vacuum, and the inside enters the vacuum port 68, which is sequentially connected To a vacuum pump (not shown in the figure, when a vacuum system occurs, that is, the pressure in the cavity 67 of the vacuum loader plate 62 is reduced, and the vacuum loader plate is set on a solder ball bed or bed Inside, the solder ball is sucked into the hole of the plate. The excess ball can be swept away. The loaded vacuum loader plate is then extended by the positioning lock 26 through the hole on the plate or by individual positioning pins (Figure (Not shown) joined to the alignment plate 30 in a manner protruding beyond the upper surface of the alignment plate (Figure 9). When matched with the alignment plate, the hole pattern of the vacuum loader plate 62 is aligned and aligned The hole pattern of the plate 30 is aligned linearly. The vacuum was released and the ball fell into the alignment plate hole by gravity. If necessary, the loader can be backfilled with gas to a pressure sufficient to drive the solder balls away from the loader plate into the holes in the alignment plate. As a result, the ball was exactly placed on the BGA pad and held by the wall of the alignment plate hole (Figure 9B). In an alternative embodiment, the vacuum loader plate may also be an alignment plate, such as shown in Figure 10 for example. This vacuum loader / alignment plate 43 is used to pick up solder balls as described above. This vacuum loader / alignment plate is then matched to this carrier ', making its opening 65 and the BGA package pad pattern. The paper size is applicable to China National Standard (CNS) A4 (210X297 mm) (Please read the back first (Notes 4 · Write this page) Ken

-19- Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs A7 ________ Β7 _ ^ _ V. Description of the Invention (16) Alignment is straight, and a gap between the carrier and the vacuum loader / alignment plate is provided. As explained above. This vacuum is released, and the solder ball 33 drops and contacts the appropriate pad, as shown by the dashed line in FIG. 10. In another embodiment of the present invention shown in FIG. 11A, this alignment The plate 230 contains unperforated instead of perforated. For example, the hole 231 may be extended by a portion of the thickness of the alignment plate 230 and a thickness of at least one solder ball diameter as appropriate. This solder ball is then loaded onto the alignment plate using the door plate method, vacuum plate method, manually or automatically. This carrier, together with the BGA package 23, is then fitted on top of the alignment plate using dowel pins. The two boards are held tightly together. The entire assembly is then reversed upside down to enable the solder ball to fall into contact with the pad due to gravity. This combination can then be placed in the furnace. To minimize the displacement between the alignment plate and the BGA package, it is better for the alignment plate to have a thermal expansion coefficient similar to that of the BGA package. Minimal displacement is particularly desirable when small diameter solder balls (e.g., 'approximately 0.05 inch diameter) are used. When a small-diameter ball is used, the extremely small displacement can cause the ball to misalign itself. In many cases, it may not be feasible to have an alignment plate with an appropriate coefficient of thermal expansion that is capable of generating or conducting heat. In this case, we would rather use the furnace roof plate 78, which is separated from the alignment plate 330 as shown in Figure 11B. Similarly, when a solder ball is placed and combined on a silicon wafer 333, a silicon alignment plate 33 is more suitable. A separate furnace top plate is then fitted over the alignment plate. As obvious to those skilled in this art, in any of the above embodiments. —I——m— 丨 (Please read the notes on the back before filling this page) Order 20-

Printed by the Staff of the Central Bureau of Standards, Ministry of Economic Affairs, Cooperative Cooperative, V. Invention Description (17 towels, this alignment plate is not intended as a ceiling in the furnace. In any of these embodiments, a furnace top plate can be used to match the alignment In addition, in the embodiment where the alignment plate is not perforated, the same function and effect can be obtained by providing the alignment plate with a perforation 331, and a top plate 78 is also provided for holding the welding in the alignment plate. The ball is in the loading procedure (Figure 12). Once the solder ball is in place on the pad of the BGA package, the entire assembly is connected to the electrode or placed on the heating element inside the furnace chamber. A suitable furnace profile It is planned to be the memory of the furnace microcomputer. The lid of the chamber is closed and the air is properly withdrawn to a pressure in the range of about 1 Torr to 1 mTorr. This chamber is then backfilled with nitrogen or other inert gas to A pressure of about 10 psig, but suitably to a pressure of about 1 to 4 psig. The chamber is once again returned to a pressure of about 1 Torr to about 丨 mtorr and a current is transmitted through the tool, that is, Carrier and pair Standard plate. When the plate is connected to the furnace electrode, the plate is rapidly heated because the carrier and the alignment plate are graphite materials with poor electrical conductivity. When the plate is placed in the heating element, The heating element is heated and the graphite plate is used to transfer this heat to the solder ball and the BGA package. Appropriate furnace outline for one of 63Sn / 37Pb or 62Sn / 36Pb / 2Ag ball: Known for the following table, GAS2 and GAS3 refer to the inert gas in the first table. The appropriate one is nitrogen. The paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) 1 ^^ 1. I 1-ί- ... --1 m I-ϋ (Please read the notes on the back before writing this page 4) Order. ΙΦ. Ι:.: ·· -1ι '. &Quot; .e' · -1 .. -21-5 Description of the invention (18) A7 B7 Time action HRO MINO SEC 1 VAC ON HRO MINO SEC 40 VAC OFF HRO MINO SEC 42 GAS 2 ON HRO MINO SEC 50 GAS 2 OFF (to -10 psig) HRO MINO SEC 52 "EXHAUST ON HRO MINO SEC 56 EXHAUST OFF HRO MINO SEC 58 VACUUM ON HRO MIN 1 SECO HEAT ON HRO MIN 1 SEC 30 170 ° C HRO MIN 4 SEC 30 170 ° C HRO MIN 4 SEC 32 VACUUM OFF HRO MIN 4 SEC 34 GAS 2 ON HRO MIN 4 SEC 38 GAS 2 OFF (to 1-4 psig) HRO MIN 5 SEC 0 225〇-325〇C HRO MIN 7 SECO 225. One 325. . HRO MIN 7 SEC 1 HEAT OFF HRO MIN 7 SEC 30 EXHAUST ON HRO MIN 7 SEC 34 GAS 3 ON HRO MIN 7 SEC 58 GAS 3 OFF HRO MIN 8 SECO EXHAUST OFF Table 1 · 63Sn / For 37Pb or 62Sn / 36Pb / 2Ag solder balls, please read the "Notes on the back" and fill in the 'write this page. It is printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economics. Typically, this temperature is raised to 170 ° C and held for 3 minutes In a vacuum atmosphere, it helps to remove oxides from the surface of the solder balls. This chamber may also be an environment where the temperature is raised to about 170 ° and / or flushed and filled with nitrogen several times simultaneously to generate an inert gas in the chamber. Thereafter, the chamber is filled with nitrogen to a pressure of about 1 to 4 psig, and the temperature is raised to about 225 ° -'325 ° C and held for about two minutes. This is sufficient to allow the solder balls to melt and flow on the pad. When cooled, the solder ball 33 is bonded to the BGA package 23 in a letter Ω shape as shown in FIG. 6. Thereafter, the assembly was removed from the chamber and the component was removed from the tool. Because this soldering process is solvent-free, and because this solder ball does not contain solvents, cleaning before softening is not required. It should be understood that any appropriate furnace shape can be used. A paper size is applicable to the Chinese National Standard (CNS) A4 specification (nOX297 mm). -22- Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A7-— ___ B7 Fifth invention description (19) ~-:-If the person skilled in this skill is the most obvious person b. By the method of cypress tree, the solder ball (solder block) is formed on the substrate and it has a general improvement. The planarity, that is, the product consistency that is uniform in height and improved in pitch moments, that is, the interval. It is more appropriate that the change in coplanarity between the solder balls of the interconnect is less than ι0%, and more appropriate is 5% of the average height of the solder ball interconnect. The resulting solder ball interconnect has a unique mother-shaped shape with a generally hemispherical head region. Field 53 and a curved or half-neck neck region 55 abutting the surface of the substrate. The minimum and maximum diameters of the neck region are smaller than the maximum diameter of the head region, and are substantially as shown in FIG. If it is obvious to a person skilled in this art, the entire procedure described above can be automated or manually implemented. Automation can occur through the use of robots. Electronic devices can also be used to determine if the holes in the door panel are filled with solder balls. The furnaces described above typically can accommodate more than one tool set (ie, an alignment plate and a carrier plate). Because of this, the present invention can be used to simultaneously place and combine solder balls on multiple substrates on multiple carrier boards. In fact, this treatment method is capable of high-volume products and extremely high productivity. As an example, a BQA for 3,300 wafer calibration can be processed in each load. This would be equivalent to approximately 198,000 components per hour. This method will accommodate any package size, as well as 0.05-35 inches of ball diameter. Since this assembly, including solder balls and pads, is fixed during processing, all vacancies, bridging, and placement of defective systems can be avoided. Defects associated with solvents, such as blank spots, are completely avoidable because this method is solvent-free. This paper size applies to China National Standard (CNS) A4 (210X297 mm) (Please read the precautions on the back before dining and writing this page) .4: .11. • 23--A7 -------— —___ B7 V. Description of the invention (20) — ~ —————— This graphite tool can be designed so that it can be used for multiple operations. Auxiliary parts can be added as needed to meet the special goals of the specified operation, but the same basic guards can be used for all welding operations. In this way, tool costs can be minimized. In addition, because useful time is not spent transferring components from one particular single-purpose tool to another, the cost of the assembly set is significantly reduced. As is apparent to those skilled in the art, with the present invention, the ball system is precisely set in the required position, and the solder joint system is free of defects, and these defects are generally associated with current methods (Ie, vacancy, overlap of two adjacent balls, loss of positioning accuracy, blank, etc.). As a result, product productivity is greatly improved. Since all welding operations are performed without solvents, prior welding cleaning is not required. ——— — — QII (please read the precautions on the back before writing this page), 1Τ 'Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs :: fc .... rL ”This paper size applies to Chinese national standards (CNS) A4 specification (210X297 mm) -24- V. Description of the invention (21) A7 B7 The component numbers are printed against the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs. 20. Carrier board 44 .. · Peripheral edge 22 .. Cavity 45 .... Peripheral edge 23. BGA package 45a ... End wall 24 ... Positioning pin 45b, ... Opposite end wall 26 ... Positioning pin 45 ... Spring 28 ... Drainage device 46 .. Bathtub-shaped well 30 .. Alignment plate 49 .. Sub-hole 31 .. Hole 50 .. Well base 32 .. Angled surface 52 .. Drainage port 32 .. • Chamfered edge 53 .. Head area 33 .. Solder ball 54 .. Holding plate 34 .. • Opening 55 .. Neck area 36 ... Row opening 59 .. Hole pattern 37 ··· tub-shaped well 60 ··· void 38 ·· well base 60 ··· vacuum loader plate 39 ··· pad pattern 61 ···· pad 39 ···· hole pattern 62._ · loading plate 40. _.Door plate 64 .. Outer surface 42 ... Unperforated 65 ... Hole, opening 43 .. Door edge 66 ··. Hole wall 44a ... Surface 67 ··-Airbag 44b .. End surface 68 .. Vacuum port ---- r. — 丨 dl — (Please read the precautions on the back first Fill in this page) Order, Γ This paper size applies to Chinese National Standard (CNS) A4 specification (210X297 mm) i -25-A7 B7 V. Description of the invention (22) 6 9 ... Solder resistance part 78 ... Furnace Top plate 230, 130 ... Alignment plate 231 ... Hole 330. Alignment plate 331 ... Perforation 333 ... Hard wafer 430 ... Vacuum loader / alignment plate (Please read the precautions on the back first Again ^-write this page)-. Order IΦ. Central Standards Officer of the Ministry of Economic Affairs-^: The paper size printed by the consumer cooperative is applicable to the Chinese National Standard (CNS) A4 (210X297 mm)

Claims (1)

Printed by Staff Consumer Cooperative of 4- 夬 Standards Bureau, Ministry of Economic Affairs This paper Jiapi (c called A4mri plate placed this alignment plate on the substrate, so that the perforation system of the alignment plate / the predetermined pattern on the soil is aligned linearly; "Load solder balls into the holes of the alignment plate Inside, so that each solder ball is inserted into the contact at the position defining the predetermined pattern on the substrate; heating the alignment plate in a non-oxidizing atmosphere to a temperature sufficient to dazzle the solder ball; and the cold part The alignment plate and the carrier are sufficiently re-solidified to the solder balls bonded to the base body. 2. The method of the second range of the patent application, wherein the base body includes conductive conductive pads arranged in a predetermined pattern. 3. If a patent is applied for The method of scope item 1 includes the additional steps: providing a carrier for the substrate; and loading the substrate into the carrier. (Please read the precautions on the back before writing this page) -27- A8 B8 C8 D8 Printed by the Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs. The scope of patent application is equal to approximately 75% of the diameter of the solder ball. The method of applying for the patent & ϋ item 丨 wherein the steps of loading solder balls into the holes of the alignment plate include: _ positioning a door panel containing a plurality of perforators on the alignment plate, so the perforations are- The figure is equivalent to the hole pattern on the alignment plate; the door is moved between the first position and the second position, and the hole of the door panel in the ★ -position is deviated from the hole of the solution plate and in the second position The holes of the door panel are aligned with the holes of the alignment plate in a straight line; they are loaded and welded in the holes of the door panel when the door panel is in its first position; and, the door panel is moved to its second position to allow This solder ball falls into the hole of the alignment plate and is on the substrate in a predetermined pattern. 8. The method according to item 7 of the patent application scope, further comprising, after the door panel is moved from its first position to its second position to allow the solder ball to fall into the hole of the alignment plate, moving the door panel back Steps to the first position. 9. The method according to item 1 of the scope of patent application, wherein the step of loading solder balls into the holes of the alignment plate includes the following steps: 1. Provide a vacuum plate with a vacuum hole in a pattern, which is equivalent to this reservation Figure, at least a part of each hole has a smaller diameter than the diameter of the solder ball; v establish a vacuum in each vacuum hole; load the solder ball into each vacuum hole, so that the vacuum holds the solder ball in the hole; set this vacuum The plate is on the alignment plate, and the vacuum plate is vacuumed. (Please read the notes on the back before writing 4.) -28- Six 'patent application scope A8 B8 C8 D8 The holes are aligned with the through holes of the alignment plate in a straight line; and the vacuum in the vacuum holes is released, so that the solder balls fall into the holes of the alignment plate and make this reservation The graphic is on the substrate. 〇 · If the scope of the patent application is 9th, the step of releasing in the heart-warming tool also includes the step of instigating-the gas passes the ball through the vacuum hole of the vacuum plate to the outside of the vacuum hole. A method for combining a solder ball to a substrate with a predetermined pattern defined on the substrate, comprising the steps of: providing an alignment plate including a plurality of holes to form a pattern, and the pattern is equivalent to the predetermined pattern Graphic; Load solder balls into the holes of the alignment plate; Align the holes of the alignment plate with the predetermined shape defined by the substrate on the substrate in a straight line; Let the solder balls fall into the conductive increase pad of the substrate by gravity R I-, 1_ ^ β! In the contact diagram (please read the precautions on the back before filling out this page)-Order _ Printed by the Central Standards Bureau of the Ministry of Economic Affairs and Consumer Cooperatives to heat this alignment plate enough to melt this Solder balls; and cooling the alignment plate is sufficient to re-solidify the solder balls to the substrate in a predetermined pattern. 12. The method according to item 11 of the patent application scope, wherein the base body comprises a conductive energy-increasing pad arranged in the predetermined pattern. 13. The method according to item 11 of the patent application scope, further comprising the steps of: providing a carrier for the substrate; and loading the substrate into the carrier. ! 4 · A type of paper used to weld solder balls to a substrate in a furnace chamber without solvent from a general Zhongguanjia (c called (21Qx297)) 29- Economics Department of the Shiyang Bureau of Standards Consumer Cooperatives Printing A8 B $ C8 '-------------- D8 Patent Application Scope ----- Method, this method includes the steps as follows: Place a group of people — ^, to within, this The combination includes a base and an alignment plate fixed on the base. The alignment plate includes a plurality of holes and a boundary defined on the base—a predetermined pattern is aligned linearly, and the holes of the alignment plate are loaded with Solder ball, which falls into the connection with the substrate in a predetermined pattern; fills the chamber with an emotional gas; heats this to about 17 ° C and keeps this temperature to about 3 minutes; ^ 4 it j ^ ^-If ^ J. ^ ij_ 4 psig ^ pressure; heat the chamber to a temperature-sufficient to melt the solder ball and maintain the temperature to about 2 minutes; and allow the combination to cool. Method, further comprising pre-rinsing the chamber before filling the chamber with at least-inert gas. 16. The method according to item 14 of the scope of the patent application, wherein the step of filling the chamber with at least one inert gas includes the step of filling the chamber to a pressure of about 100 psig "17. If you claim the scope of patent, please The method of item 1, wherein the step of heating the method includes the step of filling and rinsing the chamber more than once. 18. · As the method of the scope of patent application No. 14, β heating the chamber a temperature of 2 is sufficient to melt the solder ball, including heating This room has a temperature in the range of about 225 ° to 25.0 °, and is maintained at this temperature for 2 minutes. This paper is used by the Chinese National Standards (CNS) from the secret (21QX297 public director) (please read the note on the back first) (I write this page again) -30- Printed A8 by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs ------------ D8 VI. Application for Patent Scope 19. For the method of applying for the scope of patent No. 14, in which at least one The step of filling the chamber with an inert gas includes the step of filling the chamber with nitrogen. 20. The method of claim 14, wherein the step of filling the chamber with at least one inert gas includes The step of refilling the chamber with nitrogen. 21. —A method of combining solder balls to a substrate with a predetermined pattern defined on the substrate, comprising: providing an alignment plate including a plurality of openings in a pattern, the pattern being equivalent to the predetermined pattern; embedding the solder The ball enters into the opening of the alignment plate; " Place this substrate on top of the alignment plate so that the holes of the alignment plate are aligned with the predetermined pattern defined on the substrate in a straight line; flip the alignment plate and the substrate, Causing the ball in the hole of the alignment plate to fall into contact with the substrate in the predetermined pattern; heating the alignment plate and substrate is sufficient to at least partially melt the solder ball; and cooling the alignment plate and substrate is sufficient to resolidify The solder ball, the ball is bonded to the base body to increase the power consumption in a predetermined pattern. 22. The method of claim 21, wherein the step of placing the substrate on the top of the alignment plate includes the steps of: providing a carrier for the substrate; securing the substrate into the carrier; and placing the carrier so that The substrate is on top of the alignment plate, so that the alignment plate (please read the precautions on the back before writing this page) 31 The holes in the scope of the patent application are defined on the substrate. 23 · As in the scope of the patent application, the entire thickness of the plate is aligned. The predetermined pattern is aligned linearly. Method, wherein the opening does not penetrate the method of item 21, and further includes the step of providing a plate under the standard plate, wherein the opening of the alignment plate penetrates through the thickness of the alignment plate 'and its inversion The steps include the steps of flipping the plate, the alignment poles, and the body to cause the balls in the holes of the alignment plate to fall and contact the base in the predetermined figure. Consider the method of claim 21, wherein the step of providing-aligning the plate includes the step of providing-aligning the plate with a thermal expansion coefficient similar to that of the substrate. 26 · A device for combining a solder ball to a substrate with a predetermined pattern defined on the substrate, the device comprising: a carrier for holding at least one substrate; an alignment plate including a plurality of perforated bottom edges In addition, the pattern is equivalent to the predetermined pattern on the substrate, and the alignment plate can be fixed on the carrier, so that when the carrier is loaded with the substrate, the hole system of the alignment plate and the conduction loss of at least one substrate increase. The pads are aligned straight. 27. The device according to item 26 of the patent application, wherein the device for loading a solder ball into each hole of the alignment plate includes a door plate slidably positioned on the alignment plate, and the door plate includes perforations Presenting a figure is equivalent to a perforation on an alignment plate, wherein the door panel is capable of sliding movement between a first position and a second position, and its holes deviate from the holes of the alignment plate when in the first position, And when it is in the second position, its hole system and alignment are in accordance with the Chinese national standard (CNS) A4 specification (210X297 mm) -32- Printed by the Consumers Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs A8 Β8 C8 D8 Application The holes in the patent range plate are aligned straight. 28. The device under the scope of patent application No. 26, further includes a device for biasing the door panel toward its first position. 29. If the device in the scope of patent application No. 26 further includes a vacuum loader plate, the vacuum loader plate includes an opening with a pattern equivalent to the hole pattern on the alignment plate, and is used to borrow the vacuum generated in each opening. To support a solder ball 'and position the solder ball above the opening of the alignment plate. 30. The device of claim 26, wherein the bottom edge of the perforation of the alignment plate is chamfered. 31. The device of claim 26, wherein the alignment plate has a thermal expansion coefficient similar to that of the substrate. 32. If the device in the scope of the patent application is No. 26, the device for heating the alignment plate and the substrate to a temperature sufficient to melt the solder balls is also included. 33 · —A device combining a solder ball to a substrate with a predetermined pattern defined on a substrate. This device includes: — a carrier for the substrate; and an alignment plate for twisting the carrier plate with a plurality of holes. A pattern is equivalent to a predetermined pattern on the substrate; and a device for generating a vacuum in the hole of the quasi-plate, and the vacuum is used to support a solder ball in each hole. The alignment plate is placed on the carrier with the substrate. The alignment of the plate holes and the pattern defined on the substrate is straight. 34. = A device for positioning a solder ball to a predetermined shape defined by the substrate on the substrate for use in combination with the substrate. The device includes an alignment sheet paper from the applicable Chinese National Standard (cns). 4wow (21mm deduction 7mm) (Please read the precautions on the back before dining and write this page) -33- Scope of patent application: The 13-perforations of the plate are equivalent to a predetermined pattern on the substrate. This alignment plate can be fixed on the substrate to align the holes of the alignment plate with the predetermined pattern on the substrate. 35 · —kind of substrate 'includes money and turns [connected to the surface of this substrate, in which the solder ball interconnectors have-the shape of the shape, including-roughly the material of the ball material · domains in the head area and the substrate The maximum diameter of the area between the surfaces is smaller than the maximum diameter of the head area, and the coplanarity of the solder ball interconnection is less than 10% of the average height of the solder ball interconnection. 36. For the substrate of the scope of application for item 35, wherein the coplanarity of the solder ball interconnection is less than 5 of the average height of the solder ball interconnection. / (^ 37. If the base of the 35th patent application scope, each solder ball is fixedly interconnected and placed on the base of the base. (Please read the precautions on the back before filling this page) -III ― ― Order I. II # 1 The paper size printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs applies to the Chinese National Standard (Cks) A4 (210X297 mm) -34-