JP2002299813A - Printed wiring board, method and device for mounting electronic component on printed wiring board, and electronic component feeder - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a new method of mounting an electronic component on a printed wiring board which is inexpensive and mass-produced. SOLUTION: This electronic component mounting method comprises a first process of preparing a printed wiring board where a through-hole in which an electronic component can be inserted and two land patterns which are isolated from each other, connected to the electrodes of an electronic component, and formed in or around the through-hole are provided, a second process of inserting an electronic component into the through-hole bored in the printed wiring board, receiving the part from below the printed wiring board, and holding it at the prescribed position inside the through-hole, and a third process of connecting electrodes provided to the end faces of the electronic component inserted into the through-hole to the land patterns formed on the printed wiring board with conductive members respectively.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board, a method and an apparatus for mounting electronic components, and an electronic component supply device. And a mounting apparatus for mounting the electronic component at a predetermined position on a printed wiring board.

[0002]

2. Description of the Related Art An extremely large number of electronic components are mounted on a printed wiring board. At this time, an electronic component automatic mounting machine (automatic electronic component mounter) is used for surface mounting (mounting) electronic components on a printed wiring board. Conventionally, most electronic components are surface-mounted on a printed wiring board. In recent years, demands for high-density mounting have been increasing, and high-density mounting of electronic components has been achieved while reducing the size of electronic components and the pitch between lead terminals. However, there is an increasing demand for higher density mounting beyond the surface area limit of the printed wiring board. Therefore, techniques for embedding electronic components in a printed wiring board to form a three-dimensional circuit have been researched and developed by various methods. The technology for embedding electronic components in a printed wiring board can be roughly divided into a method of embedding electronic components in the process of manufacturing a printed wiring board, and a method of embedding discrete electronic components in a completed printed wiring board as before. There is a way. In addition, the latter method includes
There is known a method in which a recess is provided in a printed wiring board, a small through hole is provided at the bottom of the recess so that components do not fall down, and solder is inserted through the hole and soldered. However, these techniques have not yet reached the stage of practical use because the technology for forming a recess in a printed wiring board and the automatic mounting machine that supplies electronic components to the recesses in the printed wiring board have not been completed.

[0003]

As described above, one of the methods for embedding electronic components in a printed wiring board is to provide a recess in the printed wiring board in which electronic components can be accommodated in a vertical direction, and the component is spilled at the bottom. There is a method in which a small through hole that does not fall off but allows soldering is provided, and the electrode of the component and the circuit of the printed wiring board are connected through the hole. In this case, a large number of dents are formed on the printed wiring board with high accuracy,
In addition, low cost manufacturing technology is required. However, judging from the fact that such a technique has not yet been put to practical use, it is considered that a technique for forming a depression has not been established, or the cost is extremely high, and it is not suitable for mass production.

[0004] Therefore, the present inventors, instead of the depression,
The inventor has found that if a straight through hole is formed to embed an electronic component in a printed wiring board, the printed wiring board can be manufactured at low cost and can be mass-produced.
However, in this case, a technique for preventing the electronic component from spilling out of the through hole is necessary, and such a technique must be devised. In addition, a technique must be devised to connect the electrodes of the electronic component inserted into the through holes of the printed wiring board in the vertical direction and the land patterns on both surfaces of the printed wiring board. Furthermore, the method of removing air that may be trapped in the middle of the through hole, the process of bonding failure caused by the difference in the coefficient of thermal expansion between the printed wiring board and the embedded electronic component, etc. There are many issues. Furthermore, when the above mounting method is established, a high-speed automatic mounting machine (electronic component mounting device) that inserts electronic components into through holes of a printed wiring board at high speed is required.

Further, when an electronic component is embedded in a printed wiring board in a horizontal direction, it is necessary to provide a long hole for accommodating the electronic component in the printed wiring board. However, it is necessary to devise a method for forming a long hole that eliminates conduction between land patterns provided on the left and right of the long hole. Furthermore, it is necessary to devise a printed wiring board that can be mass-produced while maintaining the cost with such a long hole.
Further, it is necessary to devise a mounting method capable of connecting (joining) an electrode of the electronic component and a land pattern by inserting the electronic component into the elongated hole of the printed wiring board from the lateral direction.

Accordingly, an object of the present invention is to provide a novel electronic component mounting method capable of mounting electronic components on a printed wiring board which can be mass-produced at low cost. Another object of the present invention is to provide an electronic component mounting apparatus capable of mounting an electronic component in the through hole at a high speed when the electronic component is mounted in the through hole of the printed wiring board. Another object of the present invention is to provide a printed wiring board suitable for mounting electronic components using such an electronic component mounting apparatus. It is another object of the present invention to provide an electronic component supply device applicable to such an electronic component mounting method.

[0007]

According to a first aspect of the present invention, there is provided a method of mounting an electronic component on a printed circuit board, wherein a part or all of the electronic component is inserted. Preparing a printed circuit board on which a through-hole capable of being formed is formed and two land patterns which are connected to the electrodes of the electronic component and are not electrically connected to each other are formed around the through-hole or the through-hole; An insertion and holding step of inserting a part or the whole of the electronic component into the through hole of the printed wiring board and receiving the electronic component from below the printed wiring board and holding the electronic component at a predetermined position of the through hole; and electrodes at both ends of the electronic component inserted into the through hole And a connection step of connecting the land pattern of the printed wiring board with a conductive member, respectively.

In the first aspect of the present invention, preferably, the inserting and holding step includes vertically inserting the electronic component into the through hole of the printed wiring board and holding the electronic component by receiving means. A first application step of applying a first conductive member connecting the first electrode on the upper side of the electronic component and the first land pattern of the printed wiring board from the upper side surface of the printed wiring board; Inverting the printed circuit board while holding the electronic component, and removing the receiving means in the inverted state to hold the electronic component from below with the first conductive member; A first connecting step of heating the member to connect the first electrode and the first land pattern; and, after the first connecting step, the second electrode on the upper side of the electronic component and the print from the upper surface of the printed wiring board. A second application step of applying a second conductive member connecting the second land pattern of the wiring board; and heating the second conductive member applied in the second application step to heat the second electrode and the second land pattern. And a second connection step of connecting

In the first invention, preferably, the inserting and holding step includes applying a first conductive member to a part or all of the through hole from the upper surface of the printed wiring board onto the first land pattern of the printed wiring board. A first coating step of closing the printed circuit board, a step of inverting the printed wiring board, and a step of vertically inserting the electronic component into the through hole and holding the electronic component at a predetermined position of the through hole with the first conductive member. The connecting step includes a first connecting step of heating the first conductive member to connect the first electrode and the first land pattern, and after the first connecting step, an upper side of the printed wiring board and an upper side of the electronic component. A second application step of applying a second conductive member connecting the second electrode of the second wiring pattern and the second land pattern of the printed wiring board; and heating the second conductive member applied in the second application step to form a second conductive member. Connect the electrode and the second land pattern That it has a second connecting step.

In the first invention, preferably, the inserting and holding step includes vertically inserting the electronic component into the through-hole of the printed wiring board, and the first electrode on at least the upper side of the electronic component is located above the surface of the printed wiring board. The electronic component is held by the receiving means so as to be in a recessed state, and the connecting step includes:
A ball-shaped solder is used as the first conductive member. In the first invention, preferably, the inserting and holding step includes a step of vertically inserting the electronic component into the through-hole from above by the insertion means, and a step of inserting the electronic component into the through-hole in synchronization with the operation of the electronic component. Applying a first conductive member for connecting the first electrode of the electronic component and the first land pattern of the printed wiring board with a dispenser from below, and thereby holding the electronic component, A first connection step of heating the first conductive member applied in the first coating step to connect the first electrode and the first land pattern, and thereafter, the electronic component is held by the first conductive member. A second application step of applying a second conductive member connecting the second electrode of the electronic component and the second land pattern of the printed wiring board from the upper side surface of the printed wiring board in the state, and applying the second application step in the second application step; Second conductivity A second connecting step of connecting the second electrode and the second land pattern by heating the timber, the.

In the first invention, preferably, the air confined in the through hole when the electrodes of the electronic component and the land pattern of the printed wiring board are connected by the first and second conductive members, respectively. Forming a vent hole to be released to the air.

According to a second aspect of the present invention, there is provided a method of mounting an electronic component on a printed wiring board, wherein an elongated through-hole through which the electronic component can be inserted is formed, and the through-hole or the through-hole is formed. And two land patterns that are connected to the electrodes of the electronic component and are not electrically connected to each other are formed in the periphery of the through hole. Further, the inner walls at the left and right ends of the through hole are covered with a conductive material that conducts with the land patterns on both surfaces. And a step of preparing a printed wiring board in which the wall portions other than the inner walls at the left and right ends of the through hole are non-conductive, and inserting the electronic component into the through hole of the printed wiring board in a lateral direction to print the printed wiring board. An insertion and holding step of holding the receiving part at a predetermined position of the receiving through hole by a receiving means from below, and inserting the electronic component laterally into the through hole of the printed wiring board and inserting both of the inserted electronic component. A connecting step of connecting each of the electrodes and the printed wiring land patterns of the substrate with a conductive member,
It is characterized by having.

In the second invention, preferably, the connecting step includes, after the insertion and holding step, the first electrode and the second electrode of the electronic component and the first land pattern and the first electrode of the printed wiring board from the upper surface of the printed wiring board. An application step of applying a first conductive member and a second conductive member to be connected to the two land patterns, and a printed circuit board being inverted with the electronic component held by the receiving means, and the receiving means being removed in the inverted state Thus, a step of holding the electronic component from below with the first conductive member and the second conductive member, and heating the first conductive member and the second conductive member applied in the coating step to form the first electrode and the first electrode. Connecting the two electrodes to the first land pattern and the second land pattern, respectively.

In the first or second invention, preferably, the thermal expansion coefficient of the printed wiring board is the same as or very close to the thermal expansion coefficient of the material of the electronic component. Preferably, the first or second invention further comprises a step of connecting at least between the electrode and the material of the electronic component or between the electrode of the electronic component and the first and second conductive members. And a step of providing a conductive buffer material for absorbing a force generated by a difference between a coefficient of thermal expansion of the electronic component and a coefficient of thermal expansion of the printed wiring board.

In a printed wiring board according to a third aspect of the present invention, an elongated through hole through which an electronic component can be inserted in a lateral direction is formed, and the through hole or the periphery of the through hole is connected to an electrode of the electronic component. And two land patterns that are not electrically connected to each other are formed. Further, the inner walls at the left and right ends of the through hole are covered with a conductive material that is energized with the land patterns on both surfaces, and the inner walls at the left and right ends of the through hole are formed. The other wall portions are non-conductive.

According to a fourth aspect of the present invention, there is provided a mounting apparatus for mounting an electronic component in a through-hole of a printed wiring board having a through-hole through which an electronic component can be penetrated, wherein the electronic component is mounted in a component transport passage. A component supply unit that supplies the electronic component from the component supply unit and inserts the component into a through-hole of the printed wiring board; A component receiving unit that receives the electronic components supplied from the unit separately, and a component insertion unit that inserts the electronic component received by the component receiving unit into a through hole of the printed wiring board. Features.

In the fourth invention, preferably, the component receiving portion of the component insertion means includes a vertically rotating disk, a concave portion provided on an outer peripheral side of the disk for storing one electronic component, Component introducing means for introducing the electronic components into the recesses while separating them one by one. In the fourth aspect, preferably, the component introduction means includes an openable and closable shutter mechanism for enhancing the sealing between the concave portion of the disk and the component transport passage, and a negative pressure air when the shutter mechanism is in a closed state. Suction means for sucking the electronic components in the component transport passage into the concave portion of the circular body, and holding the second and subsequent electronic components in the component transport passage for separating the first electronic component from the second electronic component. Holding means. In the fourth invention, preferably, the component insertion part of the component insertion means has a rotation mechanism for rotating the disk to change the attitude of the electronic component in the recess from the horizontal direction to the vertical direction, and in this vertical direction, The converted electronic component is vertically inserted into the through hole of the printed wiring board.

In the fourth invention, preferably, a plurality of concave portions of the disk are provided, and the electronic component insertion means further performs an operation of receiving the electronic components from the component conveying path to these concave portions and a process of receiving the electronic components. Means for simultaneously taking out the electronic component from the recess into the component insertion portion is provided. 4th
In the invention, preferably, the component insertion part of the component insertion means has a rotation mechanism for rotating the disk to change the attitude of the electronic component in the concave portion from the horizontal direction to the horizontal direction opposite by 180 degrees from the horizontal direction. The electronic component converted in the horizontal direction on the opposite side by 180 degrees is inserted horizontally into the through hole of the printed wiring board arranged in the vertical direction. In the fourth invention, preferably, the component insertion portion of the component insertion means includes: a component passage for taking out the electronic component from the concave portion of the disk and moving the component in the insertion direction;
A swingable alignment plate for stopping the electronic component at a predetermined position in the component passage, and an electronic component stopped by pushing the electronic component stopped in the component passage in the insertion direction to swing the alignment plate in a direction of expanding the electronic component. And pusher means for positioning.

In the fourth invention, preferably, the component insertion portion of the component insertion means takes out the electronic component from the concave portion of the disk by the suction force, moves the electronic component in the insertion direction, and inserts the electronic component into the through hole of the printed wiring board. Having. In the fourth invention, preferably, the component insertion section of the component insertion means, when the electronic component is caught at the entrance of the through hole of the printed wiring board, slightly moves the component insertion section or the printed wiring board to catch the electronic component. Has means for canceling. The fourth invention preferably further comprises means for inserting a ball-shaped conductive member into a recess formed on an electrode of the electronic component after the component insertion means inserts the electronic component into the through hole of the printed wiring board. Means for heating the inserted conductive member to connect the electronic component to the land pattern of the printed wiring board.

In the fourth invention, preferably, the component supply means comprises a plurality of fixed electronic component supply devices, and the component insertion means is movable at least along these electronic component supply devices, Printed wiring board is X
It is movable in the −Y direction, and a predetermined through hole can be positioned at the component insertion position by the component insertion means. In the fourth invention, preferably, the component supply means includes a plurality of electronic component supply devices movable in a predetermined direction,
The component insertion means is fixedly arranged, and can receive an electronic component from the electronic component supply device by positioning a plurality of electronic component supply devices at predetermined positions. It is movable in the X-Y direction, and a predetermined through hole can be positioned at the component insertion position by the component insertion means. In the fourth invention, preferably, the component supply means comprises a plurality of fixed electronic component supply devices, the printed wiring board is fixedly arranged, and the component insertion means has at least a direction along the electronic component supply device. The component can be moved in a direction orthogonal to this direction, and the position of component insertion into a predetermined through hole by the component insertion means can be determined.

According to a fifth aspect of the present invention, there is provided an electronic component supply device for supplying an electronic component to a mounting device for mounting the electronic component in a through hole of a printed wiring board having a through hole through which the electronic component can pass. Means for aligning the electronic components in a bulk state in a row, a component transport path for transporting the electronic components aligned in a row horizontally and supplying the mounted electronic components to a mounting apparatus, and a leading part of the component transport path. Separating means for separating the electronic component from the second electronic component, wherein the aligning means aligns the electronic components in a line so that the largest surface of the electronic component is vertical in the component transport path. Features. A sixth invention of the present invention is an electronic component supply device for supplying an electronic component to a mounting device for mounting the electronic component in a through hole of a printed wiring board having a through hole through which the electronic component can pass, Alignment means for arranging the electronic components in a stacked state in a row, a component transport path for horizontally transporting the electronic components aligned in a row, and a leading electronic component in the component transport path from the second electronic component. It is characterized by having separating means for separating, and component reversing means for reversing the electronic component such that the minimum surface of the separated electronic component faces upward.

[0022]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of a method and an apparatus for mounting an electronic component, a printed wiring board and an electronic component supply device according to the present invention will be described with reference to the accompanying drawings. First, an example of an electronic component mounted on a printed wiring board will be described with reference to FIGS. The electronic component 1 shown in FIG. 1 is a chip capacitor, FIG. 1A is a perspective view of the electronic component (chip capacitor) 1, and FIG. It is B sectional drawing. The electronic component (chip capacitor) 1 includes electrodes 2 formed at both ends in the vertical direction, and a main body 4 as a capacitor. The electronic component 1 shown in FIG. 2 is a chip resistor, FIG. 2A is a perspective view of the electronic component (chip resistor) 1, and FIG. FIG. 2C is a sectional view taken along the line DD. Similarly, this electronic component (chip resistor) 1 also includes electrodes 2 formed at both ends in the vertical direction, and a main body 4 as a resistor. In the following description of each embodiment, a chip capacitor is mainly used as a representative example of the electronic component 1 for convenience.

Next, a first embodiment of a method for mounting an electronic component according to the present invention will be described with reference to FIG. In the first embodiment, the printed wiring board 6 on which the electronic component 1 is mounted is formed to have a thickness shorter than the length of the electronic component 1 in the vertical direction. In addition, the printed wiring board 6 includes
At a predetermined position where the electronic component 1 is mounted, a through hole 8 of a predetermined size through which the electronic component 1 can penetrate in the vertical direction is formed. A conductive land pattern 10 is printed around the through hole 8 of the printed wiring board 6. In particular,
The land pattern 10 is formed on the surface of the printed wiring board 6 and a part of the inner wall of the through hole 8 as shown in FIG. Further, the land pattern 10 may be formed only on the surface of the printed wiring board 6. However, it is necessary that there is no conduction between the land patterns 10 on the front and back of the printed wiring board 6.

The printed wiring board 6 configured as described above
FIG. 3 shows each step of mounting the electronic component 1 in the through hole 8 of FIG.
(A) to (f). First, FIG.
As shown in FIG. 1, the receiving jig 1 serving as a receiving means for holding the electronic component 1 below the through hole 8 of the printed wiring board 6.
2 is arranged. In this state, the electronic component 1 is inserted into the through hole 8. At this time, the electronic component 1 is held from below by the receiving jig 12 at a position where the electrodes 2 slightly protrude from the surface of the printed wiring board 6. Next, as shown in FIG. 3B, cream solder 14 is printed on the land pattern 10 so as to cover the electrodes 2 of the electronic component 1 in this state. In this case, the solder 14 may be dispensed instead of printing, or another conductive member may be used instead of the solder 14. In this specification, the term “apply” is used as a concept including both the case where the solder 14 is printed and the case where the solder 14 is dispensed.

Next, as shown in FIG. 3C, the receiving jig 12 is turned upside down by 180 degrees while the receiving jig 12 is attached in this state, and then the receiving jig 12 is separated from the printed wiring board 6. Next, as shown in FIG. 3D, while the electronic component 1 is held from below by the solder 14, heat is applied by a reflow furnace or the like to melt the creamy solder 14, and the land pattern is formed via the solder 14. 10 and the electrode 2 of the electronic component 1 are joined. Thus, one electrode 2 of electronic component 1 is connected to land pattern 10 by soldering.

Next, as shown in FIG. 3E, in order to solder the other electrode 2 of the electronic component 1 and the other land pattern 10, the electrode of the electronic component 1 is placed on the opposite land pattern 10. The cream-like solder 14 is again applied (printed or dispensed) so as to cover 2. Finally, FIG.
In this state, heat is applied again by a reflow oven or the like to melt the creamy solder 14, and
Land pattern 1 on both sides of printed wiring board 6
0 and the electrodes 2 of the electronic component 1 are connected (joined). Thus, the mounting of the electronic component 1 in the through hole 8 of the printed wiring board 6 is completed.

Next, a second embodiment of a method for mounting an electronic component according to the present invention will be described with reference to FIG. In the second embodiment, the steps shown in FIGS. 4C and 4D are only different from the steps shown in FIGS. 3C and 3D of the second embodiment. This is the same as the first embodiment shown in FIG. In the second embodiment, the state shown in FIG.
That is, after applying (printing or dispensing) cream-like solder 14 so as to cover the electrode 2 of the electronic component 1 on the land pattern 10, as shown in FIG. Is attached, heat is applied by a reflow oven or the like to melt the creamy solder 14 and join the land pattern 10 and the electrode 2 of the electronic component 1. Thereafter, as shown in FIG. 4D, the receiving jig 12 is detached and inverted. Thereafter, as shown in FIG. 4E, a creamy solder 14 is printed again on the land pattern 10 on the opposite side so as to cover the electrodes 2 of the electronic component 1, and as shown in FIG. In this state, heat is applied again by a reflow furnace or the like to melt the creamy solder 14, and the printed wiring board 6
Are connected (joined) to both electrodes 2 of the land pattern 10 on both sides of the electronic component 1 and the printed wiring board 6 of the electronic component 1.
Is completed in the through hole 8. In the second embodiment, in the step of FIG. 4C, heat is applied by a reflow furnace or the like with the receiving jig 12 attached, so that the receiving jig 12 needs to be heat-resistant. . The solder 14
May be irradiated with a laser beam or the like to heat the substrate. In this case, the receiving jig 12 does not need to be heat-resistant.

Next, a third embodiment of the method for mounting an electronic component according to the present invention will be described with reference to FIG. In the third embodiment, the printed wiring board 6 used is the first printed wiring board.
The thickness of the printed wiring board 6 is shorter than the length of the electronic component 1 in the vertical direction, and the through hole 8 is formed at a predetermined position. A conductive land pattern 10 is printed around the through hole 8.

According to the third embodiment, the printed wiring board 6
FIG. 5 shows each step of mounting the electronic component 1 in the through hole 8 of FIG.
(A) to (f). First, FIG.
As shown in the figure, on the upper surface of the printed wiring board 6,
A cream solder 14 is applied (printed or dispensed) so as to cover the land pattern 10 and the through hole 8. In this case, the entire through-hole 8 may be covered, or a part of the through-hole 8 may be covered if the electronic component 1 is received when the electronic component 1 is inverted. Further, as the solder 14, another conductive member may be used instead of the cream-like solder 14. Next, as shown in FIG. 5B, the printed wiring board 6 is turned upside down.

Next, as shown in FIG. 5C, the electronic component 1 is inserted into the through hole 8 by using an insertion head 16 of a mounting device described later, and the electrodes 2 of the electronic component 1 are connected to the printed wiring board. 6 so as to protrude from the lower surface.
In this case, the applied cream-like solder 14 is pressed by the electronic component 1, but since it is cream-like, it is viscous and does not peel off from the land pattern 10. In the third embodiment, as shown in FIG.
Function as receiving means instead of the receiving jig 12. Next, the respective steps of (d), (e) and (f) of FIG. 5 are the same as the respective step diagrams of (d), (e) and (f) of FIG. Then, the mounting of the electronic component 1 in the through hole 8 of the printed wiring board 6 is completed.

Next, a fourth embodiment of the method for mounting an electronic component according to the present invention will be described with reference to FIG. In the fourth embodiment, the step shown in FIG. 6 is different from the step shown in FIG.
Only the difference is that the other steps are the same as the third embodiment shown in FIG. In the fourth embodiment, the process shown in FIG. 5A is first performed on a plurality of predetermined electronic components 1, and then the process shown in FIG. 5B is performed. Thereafter, the printed wiring board 6 is moved by the head 16 of the mounting apparatus.
The plurality of electronic components 1 are sequentially inserted into the respective through holes 8. At this time, the electrodes 2 of the electronic component 1 are pushed so as not to protrude from the lower surface of the printed wiring board 6. This is to prevent the printed cream-like solder 14 from peeling off from the land pattern 10 due to the impact of insertion or the inertia of the electronic component 1 when inserting the electronic component 1 at a high speed.
After all the electronic components 1 are inserted, as shown in FIG. 6, all the electronic components 1 are simultaneously pushed in and the jig 18 slowly moves the electrodes 2 of the electronic components 1 from the lower surface of the printed wiring board 6. Push so that it becomes. Since it is pushed in slowly, even if the creamy solder 14 having no viscosity is used, it does not peel off. Thereafter, for each of the electronic components 1, the processes corresponding to (d), (e), and (f) of FIG. 5 are executed, and through these processes, the through-hole of the printed wiring board 6 of the electronic component 1 is formed. 8 is finished.

Next, a fifth embodiment of the method for mounting an electronic component according to the present invention will be described with reference to FIGS. In the fifth embodiment, the thickness of the printed wiring board 6 is
The electronic component 1 is formed to be longer by a predetermined length (see FIG. 7) or substantially the same length as the longitudinal length of the electronic component 1 (see FIG. 8). FIG. 7 corresponds to FIG. 3A of the fifth embodiment (first embodiment) in which the thickness of the printed wiring board 6 is formed to be longer than the vertical length of the electronic component 1 by a predetermined length. FIG. In the process shown in FIG. 7, a receiving jig 12 as a receiving means for holding the electronic component 1 is disposed below the through hole 8 of the printed wiring board 6. In this state, the electronic component 1 is inserted into the through hole 8, and the electronic component 1 is held at a predetermined position in the through hole 8.

FIG. 8 is similar to FIG. 3C (first embodiment) of the fifth embodiment in which the thickness of the printed wiring board 6 is formed to be substantially the same as the length of the electronic component 1 in the vertical direction. The corresponding steps are shown. In the process shown in FIG. 8, the receiving jig 12 is separated from the printed wiring board 6.
In the fifth embodiment, the respective steps in the first to fourth embodiments described above can be applied.

Next, a sixth embodiment of the method for mounting an electronic component according to the present invention will be described with reference to FIG. In the sixth embodiment, the thickness of the printed wiring board 6 is formed to be longer than the vertical length of the electronic component 1 by a predetermined length. This sixth embodiment is similar to the second embodiment shown in FIG. 4, and the steps of (b) and (c) of FIG. 9 correspond to (b) and (c) of FIG. 4 of the second embodiment. The other steps in the sixth embodiment correspond to the second steps shown in FIG.
This is the same as the embodiment.

In the sixth embodiment, the receiving means for receiving the electronic component 1 inserted into the through hole 8 from below the printed wiring board 6 is the receiving jig 12, but the electrodes 2 at both ends of the electronic component 1 are not used. The printed wiring board 6 is recessed from the surface. Then, as shown in FIG. 9B, after the electronic component 1 is inserted into the through hole 8 of the printed wiring board 6, the spherical solder ball 20 is inserted into the recess of the board 6. Thereafter, as shown in FIG. 9C, a laser beam or the like is applied to the solder ball 20, and the solder ball 20 is melted to join the land pattern 10 and the electrode 2 of the electronic component 1. After that, the same steps as those of (d), (e) and (f) in FIG. In the sixth embodiment, the connection between the electrode 2 of the electronic component 1 on the opposite surface and the land pattern 10 is performed by irradiating the solder ball 20 with laser light or the like using the solder ball 20 as described above. The land pattern 10 and the electrode 2 of the electronic component 1 may be joined by melting.

Next, a seventh embodiment of the method for mounting an electronic component according to the present invention will be described with reference to FIG. First, FIG.
As shown in (a), the insertion head 16 of the mounting machine is lowered to insert the electronic component 1 into the through hole 8 of the printed wiring board 6 from above, and at the same time as the pushing operation of the insertion head 16 of the insertion machine is synchronized. Then, the dispensing needle 22 of the cream solder dispenser ascends from under the printed wiring board 6 from under the through hole 8 to dispense the cream solder 14. In the seventh embodiment, the cream-like solder 14 dispensed from the dispensing needle 22 functions as a receiving unit that receives the electronic component 1 from below. Next, as shown in FIG. 10B, the dispensing needle 22 is lowered and the insertion head 16 of the mounting machine is raised. In this state, FIG.
As shown in FIG. 1C, the printed wiring board 6 is heated in a reflow furnace or the like to melt the creamy solder 14, and the land pattern 10 and the electrode 2 of the electronic component 1 are joined.

Next, as shown in FIG. 10D, in order to solder the other electrode 2 of the electronic component 1 and the other land pattern 10, the opposite (upper) land pattern 10 is formed.
A cream-like solder 1 is formed so as to cover the electrodes 2 of the electronic component 1.
4 is applied (printed or dispensed) again. Next, as shown in FIG. 10E, the printed wiring board 6 is heated again in a reflow furnace or the like, so that the creamy solder 14 is melted.
The land patterns 10 on both sides of the printed wiring board 6 and both electrodes 2 of the electronic component 1 are joined. Thus, the mounting of the electronic component 1 in the through hole 8 of the printed wiring board 6 is completed.

Next, an eighth embodiment of a method for mounting an electronic component according to the present invention will be described with reference to FIGS. By vertically inserting the electronic component 1 into the through hole 8 of the printed wiring board 6 and joining the electrodes 2 on both sides and the land pattern 10, air is confined in the middle of the through hole 8, and the confined air is released. It may expand due to heat and cause poor bonding. The eighth embodiment is to solve this. FIG. 11 is a plan view of the printed wiring board 6 as viewed from above. As shown in FIG. 11, a solder resist 24 is applied to a part of the land pattern 10 in advance, and then the electrode 2 of the electronic component 1 and the land pattern 10 are soldered in this state as shown in FIG. To join. In this case, since the solder 14 does not rise on the solder resist 24, that portion is
Is formed, and the air trapped in the through hole 8 is discharged to the outside through the air vent hole 26, so that the above problem can be solved. The eighth embodiment is applicable to the first to seventh embodiments of the above-described method for mounting an electronic component and ninth and tenth embodiments described below.

Next, a ninth embodiment of the electronic component mounting method according to the present invention will be described with reference to FIG.
Embodiment 0 will be described. In connection with these ninth and tenth embodiments, the printed wiring board normally uses a material having a small coefficient of thermal expansion in the lateral direction. However, in the method of mounting an electronic component according to the embodiment of the present invention described above, the thermal expansion coefficient in the thickness direction of the printed wiring board 6 and the thermal expansion coefficient of the main body (material) 3 of the inserted electronic component 1 are different. If there is a large difference, a stress is generated due to the difference in the coefficient of thermal expansion, and this stress may cause a problem that bonding to the electronic component 1 or the land pattern 10 of the printed wiring board 6 becomes defective. Therefore, when a ceramic core is used as a material of the printed wiring board 6 or a ceramic filler is mixed, the coefficient of thermal expansion of the board 6 is reduced.
The coefficient of thermal expansion of the ceramic, which is the main body (material) 3 of the electronic component 1, may be set as close as possible.

In the ninth embodiment, as shown in FIG. 13, in order to reduce the stress caused by the difference between the coefficient of thermal expansion of the printed wiring board 6 and the coefficient of thermal expansion of the electronic component 1, the main body of the electronic component 1 is reduced. A conductive buffer material 28 is provided between the part (material) 3 and the electrode 2, and solder plating is further performed on the conductive buffer material 28 to relieve stress and reduce bonding defects.

Further, in the tenth embodiment, FIG.
As shown in FIG. 4, in order to reduce the stress caused by the difference between the coefficient of thermal expansion of the printed wiring board 6 and the coefficient of thermal expansion of the electronic component 1, the electrode 7 of the electronic component 1 and the land pattern 1
By providing the conductive buffer material 30 between zero, stress is relieved, and joint failure is reduced. Also in this embodiment, solder may be further added on the conductive buffer material 30 to obtain the bonding strength.

The ninth embodiment and the tenth embodiment include an eleventh embodiment (see FIGS. 19 and 20), a twelfth embodiment (see FIGS. 21 and 22), and a method for mounting an electronic component, which will be described later. The thirteenth embodiment (see FIGS. 23 and 24), the fourteenth embodiment (see FIGS. 29 and 30), the first
This is applicable to the fifth embodiment (see FIGS. 31 and 32) and the sixteenth embodiment (see FIGS. 33 and 34).

Next, an eleventh embodiment of the electronic component mounting method according to the present invention is shown in FIGS. 19 and 20, a twelfth embodiment is shown in FIGS. 21 and 22, and a thirteenth embodiment is shown in FIG.
3 and FIG. 24, these embodiments
All the mounting methods are such that the electronic component 1 is inserted laterally into the through hole of the printed wiring board.

Before describing the eleventh to thirteenth embodiments, a first embodiment of a printed wiring board according to the present invention used in these embodiments will be described with reference to FIGS.

First, as shown in FIG. 15, the left and right independent through holes 4 are formed in the printed wiring board 40 at predetermined intervals.
2 is provided. Next, a semicircular land pattern 44 is provided outside each of the through holes 42. These land patterns 44 are provided so as not to cover a central through hole 46 described later. In this state, as shown in FIG. 16, a conductive member 48 such as copper plating is provided so as to cover a part of the inner wall of the through hole 44 of the printed wiring board 40. The land patterns 44 on the front and back (upper and lower surfaces) of the substrate 40 are connected.

Next, as shown in FIG. 17, a through-hole 46 having a diameter such that a part of the through-hole 42 partially overlaps the through-hole 42 which is left and right independent is drilled. In this state, as shown in FIG. 18, the inner wall of the central through-hole 46 remains the non-conductive member 50, and the left and right land patterns 44 do not conduct with each other. These three through holes 4 of the printed wiring board 40
The electronic component 1 can be inserted laterally into the final through hole 52 formed by the components 2 and 46. Here, the central through hole 46 is not limited to a drill, but may be opened by a laser, or may be punched by a punch die.

Next, an eleventh embodiment of the electronic component mounting method according to the present invention will be described with reference to FIGS. In the eleventh embodiment, the printed wiring board 40 on which the electronic component 1 is mounted has the same thickness as the electronic component 1 in the lateral direction. The printed wiring board 40
The electronic component 1 is located at a predetermined position where the electronic component 1 is mounted.
Is formed with a through hole 52 of a predetermined size that can penetrate in the lateral direction. The electronic component 1 to be mounted is a chip capacitor (see FIG. 1) having a square component cross section.

Next, each step of mounting the electronic component 1 in the through hole 52 of the printed wiring board 40 according to the eleventh embodiment will be described with reference to FIGS. First, as shown in FIG.
The electronic component 1 is inserted laterally into the through hole 52 of FIG. FIG.
0 is a plan view showing the step of FIG. At this time, the electronic component 1 is received by a receiving jig 54 as receiving means provided below the through hole 52. The receiving jig 54 is arranged so as to position the electronic component 1 so that the electrode 2 of the electronic component 1 and the surface of the printed wiring board 40 are at the same height.

Next, as shown in FIG. 19B, cream solder 56 is applied (printed or dispensed) on the land pattern 44 so as to cover the electrodes 2 of the electronic component 1 in this state. Next, as shown in FIG. 19C, in this state, the receiving jig 54 is turned upside down by 180 degrees with the receiving jig 54 attached, and then the receiving jig 54 is separated from the printed wiring board 40. Next, as shown in FIG. 19D, while the electronic component 1 is held from below by the solder 56, heat is applied by a reflow furnace or the like to melt the cream-like solder 56, and the respective solders 14 are passed through the solder 14. The electrodes 2 of both the land pattern 56 and the electronic component 1 are connected (joined).

Thus, the mounting of the electronic component 1 in the through hole 52 of the printed wiring board 40 is completed. At this time, the land patterns 44 provided on the front and back (upper and lower surfaces) of the printed wiring board 40 are electrically connected through the conductive member 48 provided on the inner wall of the through hole 52. Further, the left and right land patterns 44 are not conductive. In this embodiment, the thickness of the printed wiring board 40 is the same as that of the electronic component 1, but may be larger or smaller than the electronic component 1. Further, instead of the solder 56, another conductive member may be used.

In the eleventh embodiment, similarly to the second embodiment (see FIG. 4), the solder 56 is heated by irradiating a laser beam or the like in the state of FIG. 44 (electrode 2) and electrode 2 of electronic component 1 are connected (joined)
You may do it. Further, the heat-resistant receiving jig 54
19 (c), the solder 56 may be heated by a reflow furnace or the like to connect (join) the land pattern 44 and the electrode 2 of the electronic component 1.

Next, a twelfth embodiment of the electronic component mounting method according to the present invention will be described with reference to FIGS. In the twelfth embodiment, the printed wiring board 40 on which the electronic component 1 is mounted has a thickness smaller than the thickness of the electronic component 1 in the lateral direction. In the printed wiring board 40, a through hole 52 having a predetermined size through which the electronic component 1 can penetrate in the lateral direction is formed at a predetermined position where the electronic component 1 is mounted. The electronic component 1 to be mounted is a chip resistor having a rectangular component cross section (see FIG. 2).
Is inserted into the through-hole 52 with its maximum surface being vertical. FIG. 21 and FIG. 22 correspond to FIG.
(B) and FIG. 20 respectively. Each step in the mounting method in the twelfth embodiment is basically the same as in FIGS. 19A to 19D of the eleventh embodiment.

Next, a thirteenth embodiment of the electronic component mounting method according to the present invention will be described with reference to FIGS. In the thirteenth embodiment, the printed wiring board 40 on which the electronic component 1 is mounted has a thickness larger than the thickness of the electronic component 1 in the lateral direction. In the printed wiring board 40, a through hole 52 having a predetermined size through which the electronic component 1 can penetrate in the lateral direction is formed at a predetermined position where the electronic component 1 is mounted. The electronic component 1 to be mounted is a chip resistor having a rectangular component cross section (see FIG. 2).
Is inserted into the through hole 52 in a posture where its largest surface is horizontal. FIG. 23 and FIG. 24 correspond to FIG. 19 of the eleventh embodiment.
(B) and FIG. 20 respectively. Each step in the mounting method in the thirteenth embodiment is basically the same as in FIGS. 19A to 19D of the eleventh embodiment.

Next, a second embodiment of the printed wiring board according to the present invention will be described with reference to FIGS. FIG.
5 is a plan view of the printed wiring board of the second embodiment, and FIG. 26 is a cross-sectional view taken along line EE of FIG.
The second embodiment of the printed wiring board is different from the first embodiment shown in FIGS. 15 to 18 in that the printed wiring board 56 is configured as a multilayer board, and that the land pattern 60 is an inner layer land disposed between the multilayer boards. It is assumed that the land pattern 60 may not appear on the front and back (upper and lower surfaces) of the printed wiring board 56, and the conductive member 62 that covers the inner wall of the through hole 52 is not the entire inner wall. It differs in that it is configured to cover a part of the inner wall, and the other configuration is the same as that of the first embodiment shown in FIGS.

Next, a third embodiment of the printed wiring board according to the present invention will be described with reference to FIGS. 27 and 28. FIG.
7 is a plan view showing a third embodiment of the printed wiring board of the present invention, and FIG. 28 is a sectional view of FIG. This third
In the embodiment, as shown in FIGS. 27 and 28,
First, the land patterns 44 are provided on the printed wiring board 64 on both the front surface and the back surface of the substrate 64 in consideration of the positions of the through holes 52 described later. Next, a rectangular through hole 52 into which the electronic component 1 can be inserted in the lateral direction is formed in the substrate 64 by pressing, razor processing, or the like. This allows
The land pattern 44 is left on both the front and back surfaces of the substrate 64 at both ends of the through hole 52. In addition,
In this case, first, a rectangular through-hole 52 into which the electronic component 1 can be inserted in the lateral direction is opened in the printed wiring board 64 by pressing or laser processing, and then the surface of the substrate 64 at both ends of the through-hole 52 is formed. Alternatively, land patterns 44 may be provided on both surfaces of the back surface. In addition, this land pattern 4
4 may be provided on only one of the front surface and the back surface of the substrate 64. In this embodiment, unlike the printed wiring board 40 of the first embodiment shown in FIGS. 17 and 18, the inner wall surface of the through hole 52 is not covered with a conductive member. Thus, in the printed wiring board 64 according to the third embodiment, the electronic component 1 can be inserted in the through hole 52 in the lateral direction.

Next, a fourteenth embodiment (see FIGS. 29 and 30) and a fifteenth embodiment (see FIGS. 31 and 32) of a method of mounting an electronic component using the printed wiring board 64 shown in FIGS. 27 and 28 will be described. 33) and the sixteenth embodiment (FIG. 33).
And FIG. 34).

A fourteenth embodiment of the electronic component mounting method according to the present invention will be described with reference to FIGS. 29 and 30. As shown in FIGS. 29 and 30, in the fourteenth embodiment,
The thickness of the printed wiring board 64 on which the electronic component 1 is mounted is the same as the thickness of the electronic component 1 in the lateral direction. Further, the land pattern 44 is provided on the printed circuit board 64 by the substrate 6.
4 are provided on both front and rear surfaces. The steps shown in FIGS. 29A to 29D in the fourteenth embodiment are basically the same as those shown in FIGS. 19A to 19D in the eleventh embodiment.
Are the same as those shown in FIG. However, in the eleventh embodiment, the inner wall surface of the through hole 52 of the printed wiring board 40 is covered with the conductive member 48, but in the fourteenth embodiment, the inner wall surface of the through hole 52 is Since the printed wiring board 64 that is not covered with 48 is used, the electrode 2 of the electronic component 1 is directly connected (joined) to the land pattern 44. The printed wiring board 64
When only the land pattern 44 provided on any one of the front surface and the back surface of the electronic component 1 is connected to the electrode 2 of the electronic component 1, the mounting method of the mounting method is performed in the steps shown in FIGS. The process ends.

Further, when connecting both land patterns 44 provided on the front surface and the back surface of the printed wiring board 64 to the electrodes 2 of the electronic component 1, FIGS.
The steps shown in FIGS. 29 (e) and 29 (f) are performed following the step of FIG. That is, as shown in FIG. 29 (d), the electrode 2 of the electronic component 1 is
After the pattern and the land pattern 44 are connected by the solder 56a, as shown in FIG. 29 (e), the printed wiring board 64 is held by the receiving jig 66 of the board 64, and the other surface of the printed wiring board 64 (FIG. 29E). In FIG. 29E, the cream-like solder 56b is applied (printed or dispensed) on the land pattern 44 so as to cover the electrode 2 of the electronic component 1. Thereafter, as shown in FIG. 29 (f), the receiving jig 66 is removed, and heat is applied by a reflow furnace or the like in a state where the electronic component 1 is held from below by the solder 56a to melt the claim-shaped solder 56b. The electrode 2 of the electronic component 1 and the land pattern 44 are connected on the other surface of the printed wiring board 64 via the solder 56b.

Next, a fifteenth embodiment of the electronic component mounting method according to the present invention will be described with reference to FIGS. In the fifteenth embodiment, the thickness of the printed wiring board 64 on which the electronic component 1 is mounted is smaller than the thickness of the electronic component 1 in the lateral direction. In the printed wiring board 64, a through hole 52 of a predetermined size is formed at a predetermined position where the electronic component 1 is mounted, through which the electronic component 1 can penetrate in the lateral direction. The electronic component 1 to be mounted is a chip resistor having a rectangular component cross section (see FIG. 2).
Is inserted into the through-hole 52 with its maximum surface being vertical. The fifteenth embodiment is basically the same as the twelfth embodiment shown in FIGS. However, in the twelfth embodiment, the printed wiring board 40
Although the inner wall surface of the through hole 52 is covered with the conductive member 48, the fifteenth embodiment uses a printed wiring board 64 in which the inner wall surface of the through hole 52 is not covered with the conductive member 48. Therefore, the electrode 2 of the electronic component 1 is directly connected (joined) to the land pattern 44.

Next, a sixteenth embodiment of the electronic component mounting method according to the present invention will be described with reference to FIGS. In the sixteenth embodiment, the thickness of the printed wiring board 64 on which the electronic component 1 is mounted is larger than the thickness of the electronic component 1 in the lateral direction. In the printed wiring board 64, a through hole 52 of a predetermined size is formed at a predetermined position where the electronic component 1 is mounted, through which the electronic component 1 can penetrate in the lateral direction. The electronic component 1 to be mounted is a chip resistor having a rectangular component cross section (see FIG. 2).
Is inserted into the through hole 52 in a posture where its largest surface is horizontal. The sixteenth embodiment is basically the same as the thirteenth embodiment shown in FIGS. However, in the thirteenth embodiment, the printed wiring board 40
Although the inner wall surface of the through hole 52 is covered with the conductive member 48, in the sixteenth embodiment, a printed wiring board 64 in which the inner wall surface of the through hole 52 is not covered with the conductive member 48 is used. Therefore, the electrode 2 of the electronic component 1 is directly connected (joined) to the land pattern 44.

Next, a first embodiment of the electronic component mounting apparatus of the present invention will be described with reference to FIGS. The first embodiment is applicable to the above-described first to tenth embodiments of the electronic component mounting method, and is used when an electronic component is vertically inserted into a through hole of a printed wiring board. Is done. First, the overall configuration of the electronic component mounting apparatus 70 will be described with reference to FIGS. FIG.
FIG. 36 is a plan view illustrating the electronic component mounting apparatus according to the first embodiment, and FIG. 36 is a side view illustrating the electronic component mounting apparatus viewed from the Q direction illustrated in FIG. 35.

As shown in FIGS. 35 and 36, the mounting apparatus 70 includes a component supply section 72 for supplying the electronic component 1, an insertion head 74 for inserting the electronic component into the through hole 8 of the printed wiring board 6, and a print head 74. A positioning device 76 for positioning the wiring board 6 is provided. The component supply unit 72 includes a plurality of electronic component supply devices 80 fixed to a mounting base 78, and the electronic component supply devices 80 use the electronic component supply devices 80 to align the electronic components 1 in a bulk state in a line, thereby forming the insertion head 74. Transport in the direction. The insertion head 74 is
The electronic components 1 are received one by one from the electronic component supply device 80 and inserted into the insertion holes 8 of the printed wiring board 6. Further, the insertion head 74 moves in a straight line in parallel with the line of the electronic component delivery port 82 of the electronic component supply device 80, and sequentially receives the electronic components from the different electronic component supply devices 80 while sequentially receiving the electronic components. It can be inserted into the insertion hole 8. The printed wiring board 6 is fixed to the positioning device 76, so that the printed wiring board 6
It freely moves with respect to the axis and the Y axis and is positioned.

According to the mounting apparatus 70 of the first embodiment, the floor occupied area can be reduced and the component supply section 72 is fixed, so that electronic components can be supplied even while the mounting apparatus 70 is operating. Therefore, the impact on the electronic component can be suppressed without the electronic component being shaken.

Next, as shown in FIGS. 37 to 39, the electronic components 1 are individually received from the component supply device 80 of the component supply section 72 of the electronic component mounting device 70 while being separated from each other, and are passed through the printed wiring board 6 in a predetermined manner. A mechanism (the electronic component supply device 80 and the insertion head 74) to be inserted into the hole (insertion hole) 8 will be described. FIG. 37 is an overall enlarged side view showing the component supply device 80 and the insertion head 74. FIGS. 38 and 39 show the electronic component 1 in which the insertion head 74 is supplied from the component supply device 80.
FIG. 7 is a partially enlarged side view showing a component supply device 80 and an insertion head 74 for illustrating an operation of receiving the component.

As shown in FIG. 37, the insertion head 74
It has a rotating disk 84, and the rotating disk 84 is provided with a recess 86 that can accommodate one electronic component 1. A vacuum suction port 88 is provided at the back of the recess 86, and the vacuum suction force of the vacuum suction port 88 causes the leading electronic components 1 aligned in a line in the transfer passage 90 of the electronic component supply device 80 to be recessed. At the same time as the electronic components are drawn into the interior 86, the entire electronic components arranged in a line in the transport passage 90 of the electronic component supply device 80 can be sucked and moved in the direction of the recess 86. At this time, a shutter mechanism 92 is provided in the concave portion 86 of the rotating disk 84 to prevent air leakage between the concave portion 86 of the rotating disk 84 and the transport passage 90 of the electronic component supply device 80. The shutter mechanism 92 is activated at the time of sucking the electronic component, and operates in the transport path 90
To seal the space between the concave portion 86 of the rotating disk 84 and the transport passage 90 of the component supply device 80. Further, a component stopper 94 is built in the concave portion 86 of the rotating disk 84, and a gap is provided between the concave portion 86 and the component stopper 94. Negative pressure air flows through the gap, and the negative pressure The electronic component 1 can be guided into the recess 86 by the flow of air.

Next, as shown in FIG. 38, after the shutter mechanism 92 is closed, negative pressure air acts on the electronic component 1 through the vacuum suction port 88, and the leading electronic component 1 moves to the position of the component stopper 94. I do. The second electronic component 1 from the top stops without protruding from the front end of the transport path 90. At this time, since the vacuum suction port 88 is closed by the leading electronic component 1, the second electronic component is not sucked. Then, as shown in FIG.
The component stopper 94 moves to the back of the concave portion 86 while sucking the leading electronic component 1, and the shutter mechanism 92 opens to perform vacuum breakage. As a result, the second electronic component 1 from the top does not move because the space between the concave portion 86 and the transport passage 90 is broken in vacuum. Further, in the recess 86,
The electronic component guide 96 is fixedly arranged so that the shutter mechanism 92 does not work even if it moves.

On the other hand, as shown in FIGS. 38 and 39, in order to hold the second electronic component 1 from the top, the magnet 98 arranged near the front end of the transport path 90 is moved to the second electronic component 1 from the top. By lowering the electronic component 1 to a position where the component 1 can be held and approaching the electronic component 1, the first electronic component 1 and the second electronic component 1 from the top may be reliably separated. In this case, when the shutter mechanism 92 is open, the magnet 98 is lowered to prevent the electronic component 1 from jumping out of the transport path 90. Further, the sensor light 100 communicates with the exit of the leading end of the transport passage 90,
When the second electronic component 1 from the top protrudes from the leading end exit of the transport passage 80, the sensor light 100 is blocked,
It can be confirmed that the separation of the electronic components is not working well. After confirming that the sensor light 100 is not blocked and that the separation mechanism is working well, the rotating disk 84 is rotated.
Is moved to the position of another electronic component supply device 80.

As shown in FIG. 37, around the rotating disk 84 of the insertion head 74, a plurality (four in the example of FIG. 37)
Are provided at the position where the electronic component 1 is received in the horizontal direction, and the position where the electronic component 1 is vertically transferred to the insertion jig 102 at the position where the concave portion 86 is rotated in the vertical direction. And a recess 86 is provided.
As described above, the insertion head 74 is mounted on the electronic component 1 in the horizontal direction.
In the vertical direction, and an operation of receiving the electronic component 1 by the concave portion 86 and an operation of transferring the electronic component 1 from the concave portion 86 to the insertion jig 102 through the component passage 104 at the same time.

Next, a modification of the first embodiment of the electronic component mounting apparatus will be described with reference to FIG. The modification of the first embodiment includes an insertion head 106 that moves the electronic component 1 in the horizontal direction and inserts the electronic component 1 into the through hole 8 of the printed wiring board 6 from the horizontal direction. In the insertion head 106, the direction in which the electronic component 1 is received by the concave portion 86 and the direction in which the electronic component 1 is transferred from the concave portion 86 to the insertion jig 102 are opposite by 180 degrees with respect to the horizontal direction. In the mounting device configured as described above, since the electronic component 1 does not move in the direction of gravity, when the electronic component 1 is inserted at a high speed, the applied cream-like solder 14 functioning as the receiving means of the electronic component 1 is used. The effect of preventing the solder cream 14 from being broken by inertia or being pushed from the land pattern 10 by the electronic component 1 can be prevented.

Next, the mechanism of the insertion jig 102 will be described with reference to FIGS. The insertion jig 102 is fixedly arranged without rotating, and when the concave portion 86 comes to the component delivery position, the electronic component 1 moves from the concave portion 86 to the component passage 104.
It is designed to fall freely inside. At this time,
The electronic component 1 may be dropped to the centering position with the assistance of negative pressure air.

As shown in FIG. 41, an insertion passage 108 is provided below the component passage 104, and passage walls 110 (110a, 110a) are provided on both sides of the insertion passage 108.
b) is formed. One side 1 of this passage wall 110
10a (the right side in FIG. 41) includes a centering swing plate 11
2, the centering rocking plate 112 can enter the insertion passage 108 through a slit (not shown) provided in the passage wall 110a. The other side 110b of the passage wall 110 (the left side in FIG. 41)
Is provided with a pusher 114, and this pusher 11
4 can similarly enter the insertion passage 108 through a slit (not shown) provided in the passage wall 110b. As shown in the figure, in the lower part of the insertion passage 108, the centering swing plate 112 is pushed clockwise from above to enter the insertion passage 104, and presses the electronic component 1 against the left passage wall 110b. By
The electronic component 1 is positioned in one direction. In addition,
The passage wall 110a may be omitted, and the left side surface of the centering swing plate 112 may function as the passage wall 110a. In addition, a suction port (not shown) is provided on the back surface of the electronic component 1 at the position shown in FIG. 41, so that the electronic component 1 can be sucked and positioned in the orthogonal direction. . In this way, the inserted electronic component 1 is positioned. The centering rocking plate 112 is moved by a stopper 116.
Movement is regulated.

Thereafter, as shown in FIG. 42, a pusher 114 disposed on the opposite side of the centering
Moves far into the insertion passage 108, and in this state, pushes the electronic component 1 downward by the pusher 114. At this time, the centering swing plate 112 is pushed rightward by the electronic component 1 by the size of the electronic component 1, but the electronic component 1 is still inserted into the passage wall 11 on the left side of the insertion passage 108.
0b. As a result, even when the electronic component 1 is pushed downward by the pusher 114,
It is positioned by being pressed against the passage wall 110b by the centering swing plate 112. In this manner, the electronic component 1 can be inserted while being accurately positioned by the passage wall 110b on the left side of the insertion passage 108, the centering swing plate 112, and the suction port. In addition, although not shown, a means for moving the electronic component 1 in the insertion direction by positive pressure or negative pressure air without using the pusher 114 may be adopted.

Next, referring to FIG. 43, a description will be given of a case where the insertion error is released when the electronic component 1 is hooked at the entrance of the through hole 8 of the printed wiring board 6 and an insertion error occurs. When an insertion error of the electronic component 1 occurs, the pusher 114
The electronic component 1 is caught at the entrance of the through hole 8 of the printed wiring board 6 and stops at a position higher than a normal pushing position. A spring or the like (not shown) pushes the pusher 114 so that a force greater than a predetermined value does not act on the pusher 114.
Is a mechanism that does not apply excessive force to the electronic component 1.
The force acting on the pusher 114 is detected by a sensor or the like. If the force exceeds a predetermined value, an insertion error has occurred, so that the pushing operation of the pusher 114 is stopped and the pusher 114 is pushed to a position where no pressure acts on the electronic component 1. Is lifted upward, and in this state, the insertion jig 102 or the printed wiring board 6 is slightly moved in the front, rear, left, and right directions.
As a result, the catch of the electronic component 1 at the entrance of the through hole 8 of the printed wiring board 6 is released, and it is confirmed that the electronic component 1 has been correctly inserted. Then, the pusher 114 is moved downward again, and the electronic component 1 is moved downward. The insertion operation of 1 is ended.

Next, a second embodiment of the electronic component mounting apparatus of the present invention will be described with reference to FIG. This second embodiment is a sixth embodiment of the above-described electronic component mounting method (FIG. 9).
Reference mounting). That is, the mounting device 118 according to this embodiment includes the insertion head 120,
The insertion head 120 inserts the electronic component 1 into the through hole 8 of the printed wiring board 6 so that the electrode 2 is recessed from the surface of the printed wiring board 6, and the spherical solder ball 20 is inserted into the recess. Then, the inserted solder balls 2
0 are individually melted, and the electrodes 2 of the inserted electronic component 1 are joined to the land patterns 10 of the printed wiring board 6 so that the electronic component can be inserted and joined with one mounting apparatus. It has become.

More specifically, as shown in FIG. 44, a solder ball passage 124 for supplying the solder ball 20 is provided in the insertion path 108 of the insertion jig 122 of the insertion head 120 via a gate 128. I have. When the electronic component 1 is inserted into the through hole 8 of the printed wiring board 6, the gate 128 is closed, and the electronic component 1 can be inserted into the through hole 8 of the printed wiring board 6. At this time, the electronic component 1 is received in the through hole 8 such that the receiving jig 12 as the receiving means is in a state where the electrodes 2 of the electronic component 1 are recessed from the surface (upper surface) of the printed wiring board 6. After all or a predetermined number of electronic components 1 are inserted into the through holes 8 of the printed wiring board 6, the gate 128 is opened, and the solder balls 20 are inserted into the recesses of the through holes 8. 20
To irradiate the solder ball 20 and melt the electronic component 1
And the land pattern 10 of the printed wiring board 6 are joined.

In the mounting device 118 of the second embodiment,
As described above, since the electronic component 1 and the solder ball 20 can be inserted by one insertion jig 122, the mechanism of the insertion jig is simplified, and the cost is also reduced. In addition, since soldering is performed at the same time as the insertion of the solder ball 20, it is not necessary to apply (print or dispense) creamy solder in a separate process and then perform soldering in a separate process. Cost reduction can also be achieved. In this embodiment, after all or a predetermined number of electronic components 1 are inserted, the solder balls 20 are inserted and soldered.
For each individual electronic component 1, the solder ball 20 may be inserted immediately after the electronic component 1 is inserted and soldered.
Further, the jig for inserting the solder ball 20 may be separated from the jig for inserting the electronic component 1 so as to have another mechanism.

Next, a third embodiment of the electronic component mounting apparatus according to the present invention will be described with reference to FIG. FIG. 45 is a plan view showing the overall structure of the mounting apparatus 140 according to the third embodiment. In the mounting device 140, the component supply unit 72 including a plurality of electronic component supply devices 80 is movable,
The insertion head 74 is fixedly arranged. The electronic component supply device 80 transfers the electronic components 1 one by one to the insertion head 74 while moving sequentially, and the insertion head 74 inserts the electronic component into the through hole 8 of the printed wiring board 6. The printed wiring board 6 is moved by the positioning device 76.
The insertion hole 8 can be freely moved in two directions of the X-axis and the Y-axis, and the insertion hole 8 can be moved to the insertion position of the insertion head 74. The electronic component mounting apparatus 140 according to the third embodiment configured as described above requires high accuracy, has a complicated structure, and has a fixed arrangement of the insertion head 74 required for high-speed operation. , High-precision insertion head 7
4 can be mounted.

Next, a fourth embodiment of the electronic component mounting apparatus according to the present invention will be described with reference to FIG. FIG. 46 is a plan view showing the overall structure of the mounting device 142 of the fourth embodiment. In the mounting device 142, the component supply unit 72
Is provided with a plurality of electronic component supply devices 80, and is fixedly arranged. The insertion head 74 is movable and receives one or a plurality of electronic components 1 at a time from the electronic component supply device 80. The printed wiring board 6 is fixedly placed, and the insertion head 74 is mounted on the printed wiring board 6.
Is moved to a predetermined position of the through hole 8.

In the mounting apparatus 142 of the fourth embodiment configured as described above, since the printed wiring board 6 does not move, the surface-mounted electronic component 1 does not slip on the printed wiring board 6, so that high-precision mounting is performed. Becomes possible. Also,
Since the floor occupation area can be reduced and the component supply unit 72 is fixedly disposed, components can be supplied even while the mounting apparatus 142 is operating, and the impact on the electronic components can be suppressed because the electronic components are not shaken. I can do it. Furthermore, since a plurality of components can be received at one time from the electronic component supply device 80, the number of times the insertion head 74 moves between the electronic component supply device 80 and the predetermined insertion hole 8 is reduced, and high-speed insertion can be realized. .

Next, a first embodiment of the electronic component supply device of the present invention will be described with reference to FIGS. 47 and 48. The electronic component supply device according to the first embodiment includes a twelfth embodiment of the electronic component mounting method illustrated in FIGS. 21 and 22 and FIG.
32 is applicable to the electronic component mounting method shown in FIG.

Before describing the first embodiment, an eleventh embodiment (see FIG. 19) and a thirteenth embodiment of a mounting method in which the electronic component 1 is inserted horizontally into the through hole 52 of the printed wiring board 40. Form (FIGS. 23 and 24), a fourteenth embodiment (FIGS. 29 and 30), and a sixteenth embodiment (FIG. 3).
3 and FIG. 34) will be described. In this case, there is no need to develop a special mounting device, and an automatic mounting machine (mounting device) that is currently widely used can be used. That is, the automatic mounting machine originally mounts electronic components on the surface of the printed wiring board.
The electronic component 1 may be inserted laterally into the through hole 52. However, when a component whose cross section is rectangular, such as a chip resistor (see FIG. 2) shown in FIG. 48, has its maximum surface N coincident with the insertion direction, an existing automatic mounting machine is used. (Mounting device) cannot be used. Therefore, in such a case, the electronic component supply device 150 of the embodiment of the present invention shown in FIG. 47 may be used.

Hereinafter, the electronic component supply device 150 of this embodiment will be described in detail with reference to FIGS. 47 and 48. The electronic component supply device 150 includes a mechanism 154 for aligning the electronic components 1 that are in a state of being stacked in the component storage unit 152 in a row, and a transport for transporting and supplying the electronic components 1 that are aligned in a row in the horizontal direction. The passage 156 and the transport passage 15
6 has a separating mechanism (not shown) for separating the first electronic component 1 from the second electronic component 1. Here, the mechanism 154 for aligning the electronic components 1 in a line is configured such that the maximum surface N of the supplied electronic component 1 is perpendicular (side surface) to the transport direction X in the transport path 156. I have. In this way, the electronic component 1 is supplied such that its maximum surface N is perpendicular (side surface) to the transport direction X, and further, in a state where the electronic component 1 is separated, the component pickup of the existing mounting apparatus The nozzle 158 sucks the electronic component 1 while keeping the posture, and forms the through hole 52 of the printed wiring board 58.
Then, the electronic component 1 is inserted in a state where the maximum surface N coincides with the insertion direction.

As described above, when the electronic component supply device 150 of this embodiment shown in FIG. 40 is used, the electronic component 1 is set in the horizontal direction in a direction in which the cross section is rectangular and the maximum surface N is vertical. Thus, it can be inserted into the through hole 52 of the printed wiring board 40 by an existing mounting device.

The component supply device shown in FIG.
The present invention is based on the structure of a chip component supply device described in Japanese Patent Application No. 9-204255 of the present applicant (the content of the specification of this application is also included in the present specification).
The chip component supply device of this application is configured such that a maximum surface of an electronic component to be supplied is horizontal in a transport direction in a component transport path. Therefore, the mechanism (the second component storage chamber 8, the alignment plate 16, the first and second alignment portions 18, 20 and the like) for aligning the electronic components in a bulk state in this application in one row is changed by 90 degrees, thereby achieving the above-described operation. Thus, the mechanism 154 for aligning the electronic components 1 in the stacked state according to the present embodiment in a line can be obtained.

Next, a second embodiment of the electronic component supply device of the present invention will be described with reference to FIGS. 49 and 50. The second embodiment of the electronic component supply device is a first embodiment (see FIG. 3) of a method of mounting an electronic component in which an electronic component is vertically inserted into a through hole of a printed wiring board. Embodiment (see FIG. 4), third embodiment (see FIG. 5), fourth embodiment (see FIG. 6), fifth embodiment (see FIGS. 7 and 8), sixth embodiment (see FIG. 9), Seventh embodiment (FIG. 1)
0), the eighth embodiment (see FIGS. 11 and 12), the ninth embodiment (see FIG. 13), and the tenth embodiment (see FIG. 14).

Hereinafter, the electronic component supply device 160 of this embodiment will be specifically described with reference to FIGS. 49 and 48. This electronic component supply device 160 is disclosed in Japanese Patent Application No.
No. 04255 (the content of the specification of this application is also included in the present specification) based on the structure of the chip component supply device. Electronic component supply device 160
Is a component storage unit 1 for storing electronic components 1 in a bulk state.
52, a mechanism 154 for arranging the electronic components 1 in a bulk state in a line, and a component transport path 162. In the component transport path 162, the supplied electronic component 1 has a maximum surface N (see FIG. 50). Are configured to be horizontal with respect to the transport direction.

The electronic component supply device 160 further includes a component reversing mechanism 164 that also serves as a component separating means, at the tip side (downstream side) of the component transport path 162. The component reversing mechanism 164 has the same structure as the rotating disk 84 of the electronic component mounting apparatus shown in FIGS. 37 to 39 described above. That is, the component reversing mechanism 164 has a concave portion 166 capable of storing one electronic component 1, sucks and moves the leading electronic component 1 of the component transport path 162 into the concave portion 166, and then rotates the component 90 degrees counterclockwise. , The electronic component at the tip is separated from the second electronic component, and the minimum surface S (see FIG. 50) of the electronic component 1 is directed upward.

The component pick-up nozzle 158 of the electronic component mounting apparatus picks up the electronic component 1 having the minimum surface S facing upward by the component reversing mechanism 164 in the state where the electronic component 1 is kept in the upright position. Then, the electronic component 1 is inserted with the minimum surface S facing upward. As described above, when the electronic component supply device 160 of the present embodiment shown in FIG. 49 is used, the minimum surface S of the electronic component 1 is directed upward, and the electronic component 1 is vertically moved using the existing mounting device. After being picked up, it can be inserted into the through hole 8 of the printed wiring board 6 in that state.

[0089]

As described above, according to the electronic component mounting method of the present invention, an electronic component can be mounted on a printed wiring board which can be mass-produced at low cost. Further, according to the electronic component mounting apparatus of the present invention, when mounting the electronic component in the through hole of the printed wiring board, the electronic component can be mounted in the through hole at high speed. Further, according to the present invention, it is possible to provide a printed wiring board suitable for mounting an electronic component using such an electronic component mounting apparatus. Further, according to the present invention, it is possible to provide an electronic component supply device applicable to a mounting method of an electronic component.

[Brief description of the drawings]

FIG. 1 is a perspective view and a sectional view showing a chip capacitor as an example of an electronic component mounted on a printed wiring board.

FIGS. 2A and 2B are a perspective view and a cross-sectional view illustrating a chip resistor as an example of an electronic component mounted on a printed wiring board. FIGS.

FIG. 3 is a diagram showing each step of the electronic component mounting method according to the first embodiment of the present invention.

FIG. 4 is a view showing each step of a method for mounting an electronic component according to a second embodiment of the present invention.

FIG. 5 is a view showing each step of a method for mounting an electronic component according to a third embodiment of the present invention.

FIG. 6 is a view showing a process according to a fourth embodiment of the mounting method of an electronic component of the present invention.

FIG. 7 is a view showing one process according to a fifth embodiment of the electronic component mounting method of the present invention.

FIG. 8 is a view showing another process according to the fifth embodiment of the electronic component mounting method of the present invention.

FIG. 9 is a view showing each step of a method for mounting an electronic component according to a sixth embodiment of the present invention.

FIG. 10 is a view showing each step of a method for mounting an electronic component according to a seventh embodiment of the present invention.

FIG. 11 is a view showing one step in an electronic component mounting method according to an eighth embodiment of the present invention.

FIG. 12 is a view showing another step of the electronic component mounting method according to the eighth embodiment of the present invention.

FIG. 13 is a view showing a step in the ninth embodiment of the electronic component mounting method of the present invention.

FIG. 14 is a view showing a process according to the tenth embodiment of the electronic component mounting method of the present invention.

FIG. 15 is a plan view showing one step in manufacturing the first embodiment of the printed wiring board of the present invention.

FIG. 16 is a sectional view of FIG.

FIG. 17 is a plan view showing another step in manufacturing the first embodiment of the printed wiring board of the present invention.

FIG. 18 is a sectional view of FIG. 17;

FIG. 19 is a view showing steps of an electronic component mounting method according to an eleventh embodiment of the present invention.

FIG. 20 is a plan view showing one step of FIG. 19;

FIG. 21 is a view showing a process according to the twelfth embodiment of the electronic component mounting method of the present invention.

FIG. 22 is a plan view showing the step of FIG. 20.

FIG. 23 is a view showing a process according to the thirteenth embodiment of the electronic component mounting method of the present invention.

FIG. 24 is a plan view showing the step of FIG. 22.

FIG. 25 is a plan view showing a step in manufacturing the second embodiment of the printed wiring board of the present invention.

FIG. 26 is a sectional view of FIG. 25;

FIG. 27 is a plan view showing a third embodiment of the printed wiring board of the present invention.

FIG. 28 is a sectional view of FIG. 27;

FIG. 29 is a diagram showing each step of the electronic component mounting method according to the fourteenth embodiment of the present invention.

FIG. 30 is a plan view showing one step of FIG. 29.

FIG. 31 is a diagram showing a step in the electronic component mounting method according to the fifteenth embodiment of the present invention.

FIG. 32 is a plan view showing the step of FIG. 31;

FIG. 33 is a view showing a step in the sixteenth embodiment of the electronic component mounting method of the present invention.

FIG. 34 is a plan view showing the step of FIG. 33.

FIG. 35 is an overall plan view showing a first embodiment of an electronic component mounting apparatus according to the present invention.

FIG. 36 is an overall side view of FIG. 35 viewed from the Q direction.

FIG. 37 is a side view showing the electronic component supply device and the insertion head according to the first embodiment of the electronic component mounting device of the present invention.

FIG. 38 is a partially enlarged view of FIG. 37. .

FIG. 39 is a partially enlarged view of FIG. 37;

FIG. 40 is a side view of an insertion head showing a modification of the first embodiment of the electronic component mounting apparatus of the present invention.

FIG. 41 is a partially enlarged side view showing the insertion jig of the electronic component mounting apparatus according to the first embodiment of the present invention.

FIG. 42 is a partially enlarged side view showing an insertion jig of the electronic component mounting apparatus according to the first embodiment of the present invention.

FIG. 43 is a partially enlarged side view showing the insertion jig of the electronic component mounting apparatus according to the first embodiment of the present invention.

FIG. 44 is a partially enlarged side view showing an insertion jig of the electronic component mounting apparatus according to the second embodiment of the present invention.

FIG. 45 is an overall plan view showing a third embodiment of the electronic component mounting apparatus of the present invention.

FIG. 46 is an overall plan view showing a fourth embodiment of the electronic component mounting apparatus of the present invention.

FIG. 47 is a schematic side view showing a first embodiment of the electronic component supply device of the present invention.

FIG. 48 is a perspective view showing an electronic component conveyed by the embodiment of FIG. 47.

FIG. 49 is a schematic side view showing a second embodiment of the electronic component supply device of the present invention.

50 is a perspective view showing an electronic component conveyed by the embodiment of FIG. 49.

[Description of Signs] 1 Electronic component 2 Electrode 4 Main body 6, 40, 58, 64 Printed wiring board 8, 42, 52 Through hole 10, 44, 60 Land pattern 12, 54 Receiving jig 14, 56 Solder 16 Mounting machine Insertion head 18 Push-in jig 20 Solder ball 22 Dispenser needle 24 Solder resist 26 Air vent hole 28, 30 Conductive buffer material 46 Drill hole 48 Conductive member 50 Non-conductive member 62 Conductive member 70, 118, 140, 142 Mounting device 72 Component supply unit 74, 120 Insertion head 76 Positioning device 78 Mounting stand 80, 152 Electronic component supply device 82 Electronic component delivery port 84 Rotating disk 86 Depression 88 Vacuum suction port 90 Transport path 92 Shutter mechanism 94 Component stopper 96 Electronic parts guide 98 Magnet 100 Sensor light 02 insertion jig 104 component passage 106 insertion head 108 insertion passage 110 passage wall 112 centering swing plate 114 pusher 116 stopper 122 insertion jig 124 solder ball passage 128 gate 130 laser light source 132 laser light 150, 160 electronic component supply device 154 alignment Mechanism 156, 162 Conveyance path 158 Parts pick-up nozzle 164 Rotating disk 166 Recess

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5E313 AA03 AA11 DD07 DD10 DD17 DD41 5E319 AA09 AB06 AC01 AC11 AC20 BB04 BB05 CC33 CC46 CD27 CD29 GG15 5E336 AA07 BB02 BC02 BC16 CC32 CC52 CC53 EE03 GG30

Claims (28)

[Claims] 1. A method for mounting an electronic component on a printed wiring board, comprising: forming a through-hole into which a part or all of the electronic component can be inserted; and surrounding the through-hole or the through-hole. Preparing a printed wiring board on which two land patterns connected to the electrodes and not electrically connected to each other are formed, and a part or all of the electronic components are inserted into the through holes of the printed wiring board, and An insertion holding step of holding the receiving through hole at a predetermined position from below, and a connecting step of connecting electrodes at both ends of the electronic component inserted into the through hole and the land pattern of the printed wiring board with a conductive member, respectively. A mounting method of an electronic component, comprising: 2. The method according to claim 1, wherein the inserting and holding step includes vertically inserting the electronic component into the through hole of the printed wiring board, and holding the electronic component by receiving means. A first applying step of applying a first conductive member for connecting a first electrode on the upper side of the electronic component and a first land pattern of the printed wiring board from the upper surface of the wiring board, and a state in which the electronic component is held by the receiving means A step of holding the electronic component from below with a first conductive member by removing the receiving means in the inverted state of the printed wiring board, and heating the first conductive member applied in the first coating step. A first connecting step of connecting the first electrode and the first land pattern by the first connecting step; A second coating step of coating a second conductive member connecting the de pattern,
2. The electronic component mounting method according to claim 1, further comprising: a second connection step of heating the second conductive member applied in the second application step to connect the second electrode and the second land pattern. 3. The inserting and holding step includes a first coating step of coating a part or all of the through hole from a top surface of the printed wiring board onto the first land pattern of the printed wiring board by applying a first conductive member. Reversing the printed wiring board, inserting the electronic component into the through hole in the vertical direction, and holding the electronic component at a predetermined position of the through hole with the first conductive member;
The connection step comprises: a first connection step of heating the first conductive member to connect the first electrode to the first land pattern; A second application step of applying a second conductive member that connects the second electrode on the upper side of the component and the second land pattern of the printed wiring board; and heating the second conductive member applied in the second application step. To connect the second electrode and the second land pattern
2. The method for mounting an electronic component according to claim 1, further comprising a connecting step. 4. The step of inserting and holding an electronic component in a through-hole of a printed wiring board in a vertical direction and at least an upper first electrode of the electronic component is recessed from the surface of the printed wiring board. 3. The electronic component mounting method according to claim 2, wherein the electronic component is held by receiving means, and the connecting step uses a ball-shaped solder as the first conductive member. 5. The inserting and holding step includes a step of vertically inserting the electronic component into the through hole by the insertion means, and a step of moving the electronic component from below in synchronization with the operation of inserting the electronic component into the through hole. A first application step of applying a first conductive member for connecting the first electrode of the electronic component and the first land pattern of the printed wiring board with a dispenser, thereby holding the electronic component; A first connection step of heating the first conductive member applied in the first application step to connect the first electrode and the first land pattern, and thereafter printing the electronic component while holding the electronic component with the first conductive member; A second application step of applying a second conductive member connecting the second electrode of the electronic component and the second land pattern of the printed wiring board from the upper surface of the wiring board, and a second conductive step applied in the second application step Heating the sexual components The method for mounting an electronic component according to claim 1, further comprising: a second connection step of connecting the second electrode and the second land pattern. 6. An air vent hole for releasing air trapped in the through hole when connecting the electrode of the electronic component and the land pattern of the printed wiring board with the first and second conductive members, respectively. The electronic component mounting method according to claim 1, further comprising a step. 7. A method of mounting an electronic component on a printed wiring board, comprising: forming an elongated through hole into which the electronic component can be inserted in a lateral direction; and forming an electrode of the electronic component around the through hole or the through hole. Preparing a printed wiring board on which two land patterns that are connected to each other and are not electrically connected to each other are formed; and an electronic component is laterally inserted into a through hole of the printed wiring board, and from below the printed wiring board. An insertion and holding step of holding a receiving through hole in a predetermined position by a receiving means; inserting an electronic component laterally into the through hole of the printed wiring board; A method for mounting an electronic component, comprising: a connecting step of connecting a pattern with a conductive member. 8. The printed wiring board prepared in the step of preparing the printed wiring board, wherein inner walls at both left and right ends of the through hole are covered with a conductive material that is energized with land patterns on both surfaces, and the through hole is formed. 8. The method for mounting an electronic component according to claim 7, wherein a wall portion other than the inner walls at the left and right ends of the hole is non-conductive. 9. The connecting step includes connecting the first electrode and the second electrode of the electronic component to the first land pattern and the second land pattern of the printed wiring board from the upper surface of the printed wiring board after the inserting and holding step. A coating step of applying the first conductive member and the second conductive member, respectively, and a first step in which the printed circuit board is inverted while the electronic component is held by the receiving means, and the receiving means is removed in the inverted state. Holding the electronic component from below with the conductive member and the second conductive member, and heating the first and second conductive members applied in the applying step to heat the first and second electrodes and the second electrode; The method for mounting an electronic component according to claim 7, further comprising a connecting step of connecting the first land pattern and the second land pattern. 10. The thermal expansion coefficient of the printed wiring board is:
The electronic component mounting method according to claim 1, wherein the thermal expansion coefficient of the electronic component material is the same as or very close to that of the electronic component material. 11. An electron generated in the connecting step at least between the electrode and the material of the electronic component or between the electrode of the electronic component and the first and second conductive members. The electronic component mounting method according to any one of claims 1 to 10, further comprising a step of providing a conductive buffer material for absorbing a force generated by a difference between a thermal expansion coefficient of the component and a thermal expansion coefficient of the printed wiring board. 12. A land pattern in which an elongated hole through which an electronic component can be inserted in a lateral direction is formed, and two land patterns which are connected to electrodes of the electronic component and are not electrically connected to each other around the through hole or the through hole. A printed wiring board, wherein a printed wiring board is formed. 13. An inner wall at both left and right ends of the through hole is covered with a conductive material that is energized with the land patterns on both surfaces, and a wall portion other than the inner walls at both left and right ends of the through hole is non-conductive. 13. The printed wiring board according to claim 12, wherein 14. A mounting apparatus for mounting an electronic component in a through-hole of a printed wiring board having a through-hole through which an electronic component can pass. And a component insertion unit for receiving an electronic component from the component supply unit and inserting the electronic component into a through hole of a printed wiring board. The component insertion unit includes an electronic component supplied from the component supply unit. An electronic component comprising: a component receiving unit that receives components separately from each other; and a component insertion unit that inserts the electronic component received by the component receiving unit into a through hole of a printed wiring board. Mounting device. 15. A component receiving portion of the component insertion means includes a vertically rotating disk, a recess provided on an outer peripheral side of the disk for storing one electronic component, and one electronic component. The electronic component mounting apparatus according to claim 14, further comprising: a component introduction unit configured to introduce the component into the recess while separating the component. 16. The component introduction means includes an openable and closable shutter mechanism for enhancing the sealing between the concave portion of the disc and the component transport passage, and the component is supplied by negative pressure air when the shutter mechanism is closed. Suction means for sucking the electronic components in the transport passage into the concave portion of the circular body, and holding the second and subsequent electronic components in the component transport passage to separate the first electronic component from the second electronic component. The electronic component mounting apparatus according to claim 15, further comprising a holding unit. 17. The component insertion section of the component insertion means has a rotation mechanism for rotating a disk to change the attitude of the electronic component in the concave portion from a horizontal direction to a vertical direction, and the rotation is performed in the vertical direction. 17. The electronic component mounting apparatus according to claim 14, wherein the electronic component is vertically inserted into a through hole of the printed wiring board. 18. The disk has a plurality of recesses provided therein, and the electronic component insertion means further includes an operation of receiving an electronic component into the recesses from a component transport path and inserting components from the recesses. The electronic component mounting apparatus according to any one of claims 15 to 17, further comprising means for simultaneously performing an operation of taking out the electronic component to the unit. 19. The component insertion part of the component insertion means has a rotation mechanism for rotating the disk to change the attitude of the electronic component in the concave portion from the horizontal direction to the horizontal direction opposite to 180 degrees from the horizontal direction,
16. The electronic component mounting apparatus according to claim 15, wherein the electronic component converted in the horizontal direction on the opposite side by 180 degrees is horizontally inserted into a through hole of the printed wiring board arranged in the vertical direction. 20. A component insertion portion of the component insertion means, wherein a component passage for taking out an electronic component from a concave portion of the disc and moving the component in an insertion direction, and a swingable stopper for stopping the electronic component at a predetermined position in the component passage. The electronic device according to claim 15, further comprising: an alignment plate; and pusher means for positioning the electronic component by pushing the electronic component stopped in the component passage in an insertion direction to swing the alignment plate in a direction of expanding the electronic component. Component mounting equipment. 21. The component insertion part of the component insertion means has suction means for removing an electronic component from a concave portion of the disk by an attractive force, moving the electronic component in an insertion direction, and inserting the electronic component into a through hole of the printed wiring board. 16. An electronic component mounting apparatus according to claim 15. 22. The component insertion part of the component insertion means, when the electronic component is caught at the entrance of the through hole of the printed wiring board, slightly moves the component insertion part or the printed wiring board to prevent the electronic component from being caught. 15. The electronic component mounting apparatus according to claim 14, further comprising a releasing unit. 23. A means for inserting a ball-shaped conductive member into a recess formed on an electrode of an electronic component after the component insertion means inserts the electronic component into a through hole of a printed wiring board, and the insertion. 15. The electronic component mounting apparatus according to claim 14, further comprising means for heating the conductive member to connect the electronic component to a land pattern of the printed wiring board. 24. The component supply means comprises a plurality of fixed electronic component supply devices, and the component insertion means comprises:
The printed wiring board can be moved at least along these electronic component supply devices, the printed wiring board can be moved in the X-Y direction, and a predetermined through hole can be positioned at a component insertion position by the component insertion means. An electronic component mounting apparatus according to claim 14. 25. The component supply means comprises a plurality of electronic component supply devices movable in a predetermined direction, the component insertion means is fixedly disposed, and the plurality of electronic component supply devices are located at predetermined positions. The printed circuit board can be moved in the X-Y direction by being positioned in the electronic component supply device, and a predetermined through hole is formed by the component insertion means. 15. The electronic component mounting apparatus according to claim 14, wherein the device can be positioned at a component insertion position. 26. The component supply means comprises a plurality of fixed electronic component supply devices, wherein the printed wiring board is fixedly arranged, and the component insertion means includes at least a direction along the electronic component supply device and The component can be moved in a direction perpendicular to the direction, and a component insertion position into a predetermined through hole by the component insertion means can be positioned.
4. An electronic component mounting apparatus according to claim 4. 27. An electronic component supply device for supplying an electronic component to a mounting device that mounts the electronic component in a through hole of a printed wiring board having a through hole through which the electronic component can pass, wherein the electronic component in a bulk state is provided. Alignment means for arranging the components in a row, a component transport path for horizontally transporting the electronic components aligned in the row and supplying the mounted components to the mounting apparatus, Separating means for separating the electronic components from the electronic components, wherein the aligning means aligns the electronic components in a line so that a maximum surface of the electronic components is in a vertical direction in the component transport path. Feeding device. 28. An electronic component supply device for supplying an electronic component to a mounting device that mounts the electronic component in a through hole of a printed wiring board having a through hole through which the electronic component can pass, wherein the electronic component is in a bulk state. Alignment means for arranging the components in a row, component transport path for horizontally transporting the electronic components aligned in the row, and separation means for separating the first electronic component in the component transport path from the second electronic component And a component reversing means for reversing the electronic component so that the minimum surface of the separated electronic component faces upward.