AU6172698A - Method and apparatus for placing and attaching solder balls to substrates - Google Patents

Method and apparatus for placing and attaching solder balls to substrates

Info

Publication number
AU6172698A
AU6172698A AU61726/98A AU6172698A AU6172698A AU 6172698 A AU6172698 A AU 6172698A AU 61726/98 A AU61726/98 A AU 61726/98A AU 6172698 A AU6172698 A AU 6172698A AU 6172698 A AU6172698 A AU 6172698A
Authority
AU
Australia
Prior art keywords
substrates
placing
solder balls
attaching solder
attaching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU61726/98A
Inventor
Paul W. Barnes
Richard Ramos
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EDM Supplies Inc
Original Assignee
EDM Supplies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EDM Supplies Inc filed Critical EDM Supplies Inc
Publication of AU6172698A publication Critical patent/AU6172698A/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0557—Non-printed masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
AU61726/98A 1997-02-18 1998-02-18 Method and apparatus for placing and attaching solder balls to substrates Abandoned AU6172698A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US3809797P 1997-02-18 1997-02-18
US60038097 1997-02-18
US7175198P 1998-01-16 1998-01-16
US60071751 1998-01-16
PCT/US1998/003099 WO1998036451A1 (en) 1997-02-18 1998-02-18 Method and apparatus for placing and attaching solder balls to substrates

Publications (1)

Publication Number Publication Date
AU6172698A true AU6172698A (en) 1998-09-08

Family

ID=26714853

Family Applications (1)

Application Number Title Priority Date Filing Date
AU61726/98A Abandoned AU6172698A (en) 1997-02-18 1998-02-18 Method and apparatus for placing and attaching solder balls to substrates

Country Status (3)

Country Link
AU (1) AU6172698A (en)
TW (1) TW394716B (en)
WO (1) WO1998036451A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6641030B1 (en) 1997-02-06 2003-11-04 Speedline Technologies, Inc. Method and apparatus for placing solder balls on a substrate
JP3803556B2 (en) * 2001-03-26 2006-08-02 日本電気株式会社 Ball transfer device and ball alignment device
TW200414858A (en) * 2003-01-15 2004-08-01 Senju Metal Industry Co Apparatus and method for aligning and attaching solder columns to a substrate
KR20210101357A (en) * 2020-02-07 2021-08-19 삼성전자주식회사 Ball disposition system and method for ball disposition on substrate

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3719981A (en) * 1971-11-24 1973-03-13 Rca Corp Method of joining solder balls to solder bumps
US5279045A (en) * 1990-01-31 1994-01-18 Hitachi, Ltd. Minute particle loading method and apparatus
KR100245257B1 (en) * 1993-01-13 2000-02-15 윤종용 Manufacturing method for semiconductor package of wafer level
US5324569A (en) * 1993-02-26 1994-06-28 Hewlett-Packard Company Composite transversely plastic interconnect for microchip carrier
US5431332A (en) * 1994-02-07 1995-07-11 Motorola, Inc. Method and apparatus for solder sphere placement using an air knife
US5551627A (en) * 1994-09-29 1996-09-03 Motorola, Inc. Alloy solder connect assembly and method of connection
JP3079921B2 (en) * 1994-11-28 2000-08-21 松下電器産業株式会社 Solder ball mounting device and mounting method
US5685477A (en) * 1995-06-28 1997-11-11 Intel Corporation Method for attaching and handling conductive spheres to a substrate
US5735452A (en) * 1996-06-17 1998-04-07 International Business Machines Corporation Ball grid array by partitioned lamination process

Also Published As

Publication number Publication date
TW394716B (en) 2000-06-21
WO1998036451A1 (en) 1998-08-20

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