TW387853B - Work transfer method and system - Google Patents

Work transfer method and system Download PDF

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Publication number
TW387853B
TW387853B TW088100872A TW88100872A TW387853B TW 387853 B TW387853 B TW 387853B TW 088100872 A TW088100872 A TW 088100872A TW 88100872 A TW88100872 A TW 88100872A TW 387853 B TW387853 B TW 387853B
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Taiwan
Prior art keywords
work piece
processing
work
processing unit
storage
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TW088100872A
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Chinese (zh)
Inventor
Kondo Hiroshi
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Nippon Electric Co
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773Conveying cassettes, containers or carriers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/22Devices influencing the relative position or the attitude of articles during transit by conveyors
    • B65G47/26Devices influencing the relative position or the attitude of articles during transit by conveyors arranging the articles, e.g. varying spacing between individual articles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02Articles
    • B65G2201/0297Wafer cassette
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2811/00Indexing codes relating to common features for more than one conveyor kind or type
    • B65G2811/06Devices controlling the relative position of articles
    • B65G2811/0621Devices controlling the relative position of articles by modifying the orientation or position of articles

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Control Of Conveyors (AREA)
  • Warehouses Or Storage Devices (AREA)

Abstract

In a work transfer method, the processing times of a plurality of processing units aligned in a line are set to be shorter as the processing units are apart from a stock shelf set on one end side of the processing units. The processing units process works under predetermined processing conditions different from each other. A plurality of works of the different processing conditions are stored in the stock shelf. A work using a processing unit arranged farthest from the stockshelf is selected from the works stored in the stock shelf, and transferred to the corresponding processing unit. Works using processing units arranged nearer to the stock shelf than a processing unit for a finally transferred work are sequentlially selected and transferred to the corresponding processing units. A work transfer system is also disclosed.

Description

五、發明說明(1) 【發明之背景】 發明之領域 本發明係關於一種工作件運送方法與工作件運 統,尤有關一種工作件運送方法與工作件運送系統,系 用以將包含複數半導體晶圓之複數晶舟盒運 1夂孩其能 的處理單元。 種不同 習用技術之描述 一般的晶圓處理技術包含各種不同的技術,諸如 植入、光刻以及蚀刻。現在’用以作為這些技術的 元,係實質上由機器人等所自動化。 早 明 一種習用之濕式蝕刻系統將參考囷3與圓4而詳細說 圖3顯示一種位於一般無塵室内的工作件運送系 如圖3所示’複數之處理單元群組3a(每—個處理單元。 3a在每個製程中係排列成一直線)係平行排列於無塵室、且 内《每個處理單元群組3a係由複數之處理單元3所組 例如,用以作光刻或濕式處理之一系列的處理單元3。 個執行預先決定的製程。於此條件下,假ί 二種製程條件A、β與C。 機6 軌署U ί裝設於無塵室之天花板。一可動的主運送 Γ盒12 ί if道7上一 9個用存包含半導艘晶圓之晶 單元群组33 ^的儲貨棚架2,係置於在軌道7側之每個處理 ΐίΠΙ 側。舉例:《言,,個包含光刻的半導趙晶 係被主運送機6運送·至一處理單元群組,V. Description of the Invention (1) [Background of the Invention] Field of the Invention The present invention relates to a work piece transportation method and work piece transportation system, and more particularly, to a work piece transportation method and work piece transportation system, and is used for incorporating a plurality of semiconductors. The wafer wafer box is shipped with 1 夂 processing unit. Description of Different Conventional Techniques General wafer processing techniques include various techniques such as implantation, photolithography, and etching. Now, as the element of these technologies, it is essentially automated by robots and the like. A conventional wet etching system will be described in detail with reference to 囷 3 and circle 4 in the early Ming Dynasty. Fig. 3 shows a work piece conveying system located in a general clean room as shown in Fig. 3 'a plurality of processing unit groups 3a (each- Processing units. 3a are arranged in a straight line in each process) are arranged in parallel in a clean room, and each processing unit group 3a is composed of a plurality of processing units 3, for example, for photolithography or wet The processing unit is a series of processing units 3. Each performs a predetermined process. Under this condition, two process conditions A, β and C are assumed. The 6 track unit U is installed on the ceiling of the clean room. A movable main transport box Γ 12 on the lane 7 is a storage rack 2 containing a crystal unit group 33 ^ containing semi-conductor wafers, which is placed on each process on the side of the rail 7 side. Example: "In a word, a semi-conducting Zhao Jing containing lithography was transported by a main conveyor 6 to a processing unit group.

五 '發明說明(2) 用以作漁式蚀刻並暫時儲存於儲貨棚架2。 圖4顯示圖3之處理單元群組3 &的習用配置。在圖4 中’與圓3相同的參考數字係表示相同的部分。 藉由主運送機6而儲存於儲貨棚架2的晶舟盒,係經由 一裝載機10而被運送至一搬運機U。搬運機丨丨從裝載的晶 舟盒取出一晶圓’並將其搬運至一晶舟以作為一抗蝕刻^ 器。由其中取出晶圓之晶舟盒會被一輸送機14移動至一搬 運機12。在晶舟上之晶圓會被一機器手臂4裝載至預先決 定的處理槽30、32、與34,快速給排水沖洗(qdR)槽31、 33與35,以及一旋轉乾燥槽36。在完成這些處理後,晶舟, 立即被運送至搬運機12。 ' 搬運機12從被運送的晶舟取出晶圓,並將其儲存於被 輸送機1 4所移動之晶舟盒中。包含晶圓的晶舟盒係經由一 卸載機13而裝設於一運送車5上,再運送至儲貨棚架2,並 儲存於儲貨棚架2中。如果需要的話,在儲貨棚架2中之晶 舟盒可被主運送機6運送,並裝載至一處理單元群組33用 以作下一步的處理。吾人應注意到輸送機1 4可雙向移動, 並在搬運機11與12之間輪送一個空的晶舟盒與晶舟。 習用濕式處理之晶舟盒運送程序將參考圖5Α至5G而說 明於下。在圖5A至5G中’與圖3相同的參考數字代表相同 的元件。為了便於說明起見,裝載機1 〇、却載機1 3等等之 圖示與說明將予以省略。 如圖5所示’被主運送機6(圖3)運送至儲貨棚架2之晶 舟盒1連續地裝設至儲貨棚架2上,並以裝載順序管理。舉5 'Description of the invention (2) It is used for fishing etching and temporarily stored in the storage rack 2. FIG. 4 shows a conventional configuration of the processing unit group 3 & In FIG. 4, the same reference numerals as those of circle 3 denote the same parts. The wafer box stored in the storage rack 2 by the main conveyor 6 is transported to a carrier U via a loader 10. The transporter takes out a wafer from the loaded boat box 'and transfers it to a boat as an anti-etcher. The wafer box from which wafers are taken out is moved by a conveyor 14 to a conveyor 12. The wafers on the wafer boat are loaded by a robot arm 4 into predetermined processing tanks 30, 32, and 34, rapid water supply and drainage (qdR) tanks 31, 33, and 35, and a rotary drying tank 36. After completing these processes, the wafer boat is immediately transported to the conveyor 12. 'The conveyor 12 takes out the wafer from the wafer boat being transported and stores it in the wafer box moved by the conveyor 14. The wafer box containing the wafer is mounted on a transport vehicle 5 via an unloader 13, and then transported to the storage rack 2 and stored in the storage rack 2. If necessary, the wafer box in the storage rack 2 can be transported by the main conveyor 6 and loaded into a processing unit group 33 for further processing. I should note that the conveyor 14 can move in both directions, and an empty wafer boat box and wafer boat are wheeled between the conveyors 11 and 12. The procedure for transporting a wafer box for conventional wet processing will be described below with reference to FIGS. 5A to 5G. In Figs. 5A to 5G, the same reference numerals as in Fig. 3 denote the same elements. For the convenience of explanation, the illustrations and descriptions of the loader 10, but the loader 13 and the like will be omitted. As shown in FIG. 5 ', the wafer box 1 transported to the storage rack 2 by the main conveyor 6 (FIG. 3) is continuously mounted on the storage rack 2 and managed in the loading order. Give

第6頁 五、發明說明(3) 例而言’在囷5A中’首先裝載屬於處理條件a之晶舟盒 其次裝載屬於處理條件B之晶舟盒^丨,再其次裝載屬 A1 於處理條件A之晶舟盒A2。同樣地,複數之晶舟盒ci B2、C2、A3、C3與C4相繼地儲存於館貨棚架2中。 儲存於儲貨棚架2之晶舟盒會被運送至各種不同的處 理^元3(處理單元A至〇,並受到各種不同的濕式處理。 在習用之系統中,如圖5B所示’晶舟盒係以至儲貨棚架2 的裝載順序而受到處理,而不管處理條件。亦即,第一個 裝載至儲貨棚架2之晶夯盒A1會第一個被機器手臂4卸載、 被裝載至處理單元A用以在處理條件a下作處理、以及持續 例如〗0分鐘作濕式處理。 如圓5C所示’經處理的晶舟盒A1,在快速給排水沖洗 (QDR)槽中清洗,於旋轉乾燥槽中乾燥,然後被運送車5運 送,並儲存於儲貨棚架2中。以相同的方式,晶舟盒B1會 被運送至相對應的處理單元B且被處理。 相同的處理係於圖51)至5(;執行,而處理過的晶舟盒 C4,係儲存於儲貨棚架2中(如圖5G所示),藉以完成一系列 的處理過程。 ^此處理過程中,為了簡化控制程序起見,複數之處 ,單元A至C通常是不能同時運作的。換言之,當使用處理 單τοΑ時’不會產生跳過處理單元a而使用隨後的處理單元 B與C的情況。 此乃因為如果複數之處理單元A至c同時完成處理時, 泡於姓刻液中之晶圓必須同時取出。然而一個處理單元Page 6 V. Description of the invention (3) For example, 'in 囷 5A' first load the wafer box belonging to processing condition a, then load the wafer box belonging to processing condition B ^ 丨, and then load A1 under processing conditions. A's Crystal Boat Box A2. Similarly, the plurality of crystal boat boxes ci B2, C2, A3, C3 and C4 are successively stored in the hall cargo shelf 2. The boat box stored in the storage rack 2 will be transported to various processing units 3 (processing units A to 0 and subjected to various wet processing. In the conventional system, as shown in Figure 5B ' The wafer box is processed in the order of loading of the storage rack 2 regardless of the processing conditions. That is, the first crystal compact box A1 loaded on the storage rack 2 is first unloaded by the robot arm 4, Is loaded into processing unit A for processing under processing condition a, and for example, wet processing for 0 minutes. As shown in circle 5C, the treated wafer boat box A1 is in a rapid water supply and drainage rinse (QDR) tank It is washed, dried in a rotary drying tank, and then transported by a transport cart 5 and stored in a storage rack 2. In the same manner, the wafer boat box B1 is transported to the corresponding processing unit B and processed. The same The processing is performed in Figures 51) to 5 (; and the processed wafer box C4 is stored in the storage rack 2 (as shown in Figure 5G) to complete a series of processing processes. ^ This processing In the process, in order to simplify the control procedure, the units A to C are usually not Simultaneous operation. In other words, when using the processing order τοΑ, 'the processing unit a will not be skipped and the subsequent processing units B and C will be used. This is because if plural processing units A to c complete the processing at the same time, The wafers in the engraving solution must be removed at the same time. However, a processing unit

五、發明說明(4) 群組通常包含只有一機器手臂4以壓低成本。 同時滿足處理單元A至。之要求。因此, 無法曰 圆取出時序錯誤會發生於處理單元AiCt。度蝕到的阳 如果晶舟盒是以一個接一個的儲存順庠 下的處理單元係為閒置的,這會阻滞& 處理,則剩 即,圈5B之處理單元B與C、Ϊ5會的增加。亦 處理單元B與C、圖5E之處理單元罐、以之 元A與B係為間置的。 之處理單 【發明之綜合說明】 本發明之一個目的係提供一種工作件 系統,其能盡可能藉由縮短對準處 ^方法及運送 現高產量。 姐對竿處理單疋之間置時間以實 為達成上述目的,本發明提供一 包含以下步驟:當虚疎置-由’、種作件運送方法, 儲貨棚架分開時,排成一直線 單兀末端之 會被設定成較短,而處理單::::二元的處理時間 處理條件下處理工作件;在儲之預先決定的 之複數工作件;藉由使用一個 不同處理條件 :件’並運送此工作件;作件中選擇-工 :架的處理單元,連1;;: ;:;2元更靠近儲, 對應的處理單元。 作件並運送此等工作件至相 【圓示之簡單說明】5. Description of the Invention (4) Groups usually include only one robot arm 4 to keep costs down. At the same time, the processing units A to are satisfied. Requirements. Therefore, it is impossible to say that the circular removal timing error occurs in the processing unit AiCt. If the wafer box is left idle with the processing units stored one by one, this will hinder the & processing, and the remaining is that the processing units B and C of circle 5B will increase. The processing units B and C, the processing unit tank of Fig. 5E, and the components A and B are interposed. Processing Sheet [Comprehensive Description of the Invention] An object of the present invention is to provide a work piece system which can achieve a high throughput by shortening the alignment method and transporting as much as possible. In order to achieve the above purpose, the time between the processing of the handles by the sisters is actually achieved. The present invention provides a method including the following steps: when the virtual handles are placed, and the method of transporting the pieces, the storage shelves are separated, and they are lined up in a single line. The end of the frame is set to be shorter, and the processing order :::: Binary processing time is used to process the work pieces; a predetermined number of work pieces are stored; by using a different processing condition: pieces' And transport this work piece; in the selection, the processing unit of -work: rack, even 1 ;;:;:; 2 yuan is closer to the storage, the corresponding processing unit. Make and ship these work pieces to the photo [Simplified description of the circle]

五、發明說明(5) 圖1顯示依本發明實施例之工作件運送系統之方塊 圖, 圖2A至2G顯示被圖1之工作件運送系統之運送程序之 圖示; 圖3顯示在無塵室之一種工作件運送系統之概要配置 的斜視圊; 圖4顯示在一種習用之工作件運送系統中之處理單元 群組的方塊圖;以及 圖5A至5G顯示圖4之工作件運送系統之運送程序之圖 示0 【符號之說明】 A、B、C〜處理槽 A1 、A2 、A3 、B1 、B2 、C1 、C2 ' C3 、 C4 ~ 晶舟盒 ΑΓ、A2’ 、A3’ 、B1’、B2’ 、C1’、C2’ 、C3’、C4’ ~ 處理過之晶舟盒 1 Ο 1 ~ 工作件(晶舟盒) 1 02 ~ 儲貨棚架 1 03〜處理單元 1 04 ~ 機器手臂 1 05〜運送車 1 06〜主運送機 1 1 0 ~ 裝載機 1 1 1、1 12〜搬運機 1 1 3 ~ 卸載機V. Description of the invention (5) FIG. 1 shows a block diagram of a work piece conveying system according to an embodiment of the present invention, and FIGS. 2A to 2G show diagrams of the conveying procedure of the work piece conveying system of FIG. 1; FIG. An oblique view of a general configuration of a work piece delivery system in a laboratory; Fig. 4 shows a block diagram of a processing unit group in a conventional work piece delivery system; and Figs. 5A to 5G show the delivery of the work piece delivery system of Fig. 4 Diagram of program 0 [Description of symbols] A, B, C ~ Processing tanks A1, A2, A3, B1, B2, C1, C2 'C3, C4 ~ Crystal boat boxes AΓ, A2', A3 ', B1', B2 ', C1', C2 ', C3', C4 '~ Treated crystal boat box 1 〇 1 ~ Work piece (crystal boat box) 1 02 ~ Storage rack 1 03 ~ Processing unit 1 04 ~ Robot arm 1 05 ~ Transporter 1 06 ~ Main Conveyor 1 1 0 ~ Loader 1 1 1, 1 12 ~ Conveyor 1 1 3 ~ Unloader

五、發明說明(6) 114 ~ 115 ~ 1 16〜 117〜 130 131 136 輸送機 供電控制器 記憶體 條件決定表 處理槽 - 快速給排水沖洗(QDR)槽 132 、 134 〜 133 ' 135 〜 旋轉乾燥槽 【較佳實施例之說明】 本發明將參考附圖而詳細說明於下。 圖1顯示使用於依本發明的一個實施例之工作件運送 系統的處理單元群組之配置。圊1顯示囷3之處理單元群組 3a。在圖1中’一個被主運送機106儲存於一儲貨棚架1〇2 的晶舟盒’係經由一裝載機110而被運送至一搬運機U1。 搬運機111從裝載的晶舟盒取出一個晶圓,並將其搬運至 一晶舟以作為一抗蝕刻容器。從其中取出晶圓的晶舟盒會 被一輸送機114移動至一搬運機112。 基於作為運送控制裝置之供電控制器115的控制,藉 由作為一運送裝置之機器手臂104,在晶舟上之晶圓會被 裝載至預先決定的處理槽130、132與134,快速給排水沖 洗(QDR)槽131、133與135,以及一旋轉乾燥槽136。在完 成這些處理之後,晶舟會立即被運送至搬運機112。 搬運機112從被運送的晶舟取出晶圓並將其儲存於被 輸送機1 1 4移動的晶舟盒。含有晶圓之晶舟盒,係經由一 卸載機113而被裝設至一運送車105上,然後再被運送至儲V. Description of the invention (6) 114 ~ 115 ~ 1 16 ~ 117 ~ 130 131 136 Conveyor power supply controller memory condition determination table processing tank-Quick water supply and drainage flushing (QDR) tank 132, 134 ~ 133 '135 ~ rotary drying tank [Description of Preferred Embodiments] The present invention will be described in detail below with reference to the drawings. Fig. 1 shows a configuration of a processing unit group used in a work piece transport system according to an embodiment of the present invention.圊 1 shows processing unit group 3a of 囷 3. In FIG. 1, 'a wafer box stored by a main conveyor 106 in a storage rack 102' is transported to a carrier U1 via a loader 110. The carrier 111 takes out a wafer from the loaded wafer boat box and transfers it to a wafer boat as an anti-etching container. The wafer box from which wafers are taken is moved by a conveyor 114 to a conveyor 112. Based on the control of the power supply controller 115 as the transport control device, with the robot arm 104 as a transport device, the wafers on the wafer boat will be loaded into predetermined processing tanks 130, 132, and 134 for rapid water supply and drainage flushing ( (QDR) tanks 131, 133, and 135, and a rotary drying tank 136. After completing these processes, the wafer boat is immediately transported to the conveyor 112. The conveyor 112 takes out the wafer from the wafer boat being transported and stores it in the wafer box moved by the conveyor 1 1 4. A wafer box containing wafers is mounted on a transport truck 105 via an unloader 113 and then transported to the storage

第10頁 五、發明說明(7) 貨棚架102,並儲存於儲貨棚架1〇2中。如果必要的話,在 儲貨棚架102中之晶舟盒可被主運送機106運送,並被裝載 至一個用以作下一步處理的處理單元群組。吾人應注意到 輸送機114可雙向移動,並在搬運機111與112之間輸送一 個空的晶舟盒與晶舟》 當處理槽與儲貨棚架102分開時,處理槽130、132與 134之處理時間會被設定成更短。最近的卸載之處理條件 係連續地被供電控制器1 1 5重寫至一記憶體1 1 6中。供電控 制器1 1 5使用從記憶體1 1 6讀出的處理條件而參考一條件決 定表117,用以連續地控制從與儲貨棚架1〇2隔開更遠之處 理槽134的晶舟盒裝載。這可避免處理槽13〇、132與134同 時完成處理過程。 舉例而言’處理槽130、132與134(以下稱為處理槽 A、B與C)係被排列成使處理槽c有5分鐘的處理時間、處理 槽B有10分鐘的處理時間、而處理槽△有15分鐘的處理時 間。基於記憶體116與條件決定表117,供電控制器115會 =從,理條件C、B、A的順序將在儲貨棚架丨〇2的晶舟盒運 送至處理jfA到C。因此’處理過程會以從處理條件C、B、 +之舟^士的順序完成,亦即,從處理槽C、B、A的順序完 j。=為處理槽C、B、Λ係以這樣的順序而與搬運機丨〗2靠 一加*以用以將一晶舟盒運送至搬運機112的時間,對於 :個J f件C的晶舟盒為最短,從處理條件B之晶舟盒次 之’而從處理條件A之晶舟盒更次之。 個處理條件c的晶舟盒並非一直儲存於儲貨棚架1〇2Page 10 V. Description of the invention (7) The cargo scaffold 102 is stored in the storage scaffold 102. If necessary, the wafer box in the storage rack 102 can be transported by the main conveyor 106 and loaded into a group of processing units for further processing. I should note that the conveyor 114 can move in both directions and convey an empty wafer boat box and wafer boat between the conveyors 111 and 112. When the processing tank is separated from the storage rack 102, the processing tanks 130, 132 and 134 The processing time will be set to shorter. The latest unloading processing conditions are continuously rewritten into a memory 1 1 6 by the power supply controller 1 1 5. The power supply controller 1 1 5 uses the processing conditions read from the memory 1 16 and refers to a condition determination table 117 to continuously control the crystals from the processing tank 134 spaced further from the storage rack 102. Boat box loading. This prevents the processing tanks 130, 132 and 134 from completing the processing at the same time. For example, the processing tanks 130, 132, and 134 (hereinafter referred to as processing tanks A, B, and C) are arranged so that processing tank c has a processing time of 5 minutes and processing tank B has a processing time of 10 minutes. Tank △ has a processing time of 15 minutes. Based on the memory 116 and the condition determination table 117, the power supply controller 115 will follow, and the order of the conditions C, B, and A will be transported to the wafer box on the storage shelf 〇 02 to process jfA to C. Therefore, the process is completed in the order of processing conditions C, B, and +, that is, the order of processing tanks C, B, and A is completed. = For processing tanks C, B, and Λ in this order with the conveyor 丨〗 2 by one plus * for the time to transport a wafer box to the conveyor 112, for: J fpiece C crystal The boat box is the shortest, second from the crystal boat box of processing condition B, and second from the crystal boat box of processing condition A. The wafer box of the processing condition c is not always stored in the storage rack 102

第11頁 五 發明說明(8) " ' " ----一· 中。如果沒有處理條件C的晶舟盒存在,晶舟盒會以 理條件B至A的優先順序而被尋找,而一個被找出 株 ,晶舟盒會被優先運送。如果存在相同的處2: 曰曰舟盒,則一個第一個裝載至儲貨棚架丨0 2 先被運送。 日日开盆會優 處理Zί表1係&用以決定一個卸載處理條件的晶舟盒之 處理條件表的一個例子。 表1 最後運送的 晶舟盒的條 件(記憶體 116) 第一候補 第二候補 第三候扁 條件A 待處理條利 1A的完成 3的完成 條件A @處理條件 條件C --一 條件B 條件A 等待處理條件 C的完成Page 11 V. Description of Invention (8) " '" ---- I. If a wafer box without processing condition C exists, the wafer box will be searched in the order of priority of conditions B to A, and one of the strains will be found, and the wafer box will be shipped first. If the same place 2: boat box exists, the first one is loaded to the storage shelf 丨 0 2 is transported first. An example of the processing condition table of the wafer box used to determine the processing conditions of an unloading processing system is to be used daily. Table 1 Conditions of the wafer boat last shipped (memory 116) First candidate Second candidate Third candidate condition A Completion of the pending item 1A 3 Completion condition A @Processing condition condition C-a condition B condition A waits for the completion of processing condition C

每當屬於處理條件Α至c其中一個的晶舟盒從儲貨棚架 102被卸載至一個對應至處理槽a至c的其中一個時,供電 控制器115會更新記憶體116。供電控制器會參考顯示於表 1之處理條件決定表117。如果儲存於記憶體116中的最後 (最近)運送條件為C,則供電控制器1 1 5會以從處理條件BWhenever a wafer box belonging to one of the processing conditions A to c is unloaded from the storage rack 102 to one of the processing tanks a to c, the power supply controller 115 updates the memory 116. The power supply controller will refer to the processing condition decision table 117 shown in Table 1. If the last (recent) shipping condition stored in memory 116 is C, the power supply controller 1 1 5

第12頁 五、發明說明(9) ' ' ----- 序的決Λ7 一個卸載條件的晶舟盒。如果沒有處理 =與A的明舟盒存在,則流程會等待在條件c下之處理 的义成,且一個處理條件C的晶舟盒會被卸載。 條株^樣^^如果儲存於記憶雜116中的最後(最近)運送 ::Γ理=電控制器115會決定下-個卸載條件的晶舟 如果沒有處理條件a之晶舟盒存在,則流 下之處理的完成,且-個處理條件B的晶 ίίΐί,載。如果儲存於記憶艘116中的最後(最近)運 加、件....,則流程會等待在條件Α下之處理的完成,且一 個處理條件A的晶舟盒會被卸載。 由顯不於圓1之處理單元群組所組成的工作件運送系 ,之運送程序,將參考圈以至2(;作詳細說明。雖然晶舟盒 疋以與圖5A相同的順序儲存於儲貨棚架1〇2中,但是為了 說明上的方便L個別條件的晶舟盒係被排成一直線。 如圊2A所示’複數之晶舟盒AI、A2、Α3、β1、B2、Page 12 V. Description of the invention (9) '' ----- Order Λ7 of a sequence A wafer box with unloading conditions. If there is no processing = there is a bright boat box of A, the process will wait for the processing under condition c, and a wafer boat box of processing condition C will be unloaded. Strains ^ sample ^^ If the last (recent) shipment stored in the memory 116 :: Γ = electric controller 115 will determine the wafer boat under the next unload condition. If no wafer box exists for processing condition a, then The completion of the processing of the shed, and a crystal of the processing condition B is contained. If the last (recent) shipment, piece, ... stored in the memory vessel 116, the process will wait for the completion of processing under condition A, and a wafer box for processing condition A will be unloaded. The work piece transportation system composed of processing unit groups that are not visible in circle 1. The transportation procedure is to refer to the reference circle to 2 (; for details. Although the crystal boat box 疋 is stored in the storage in the same order as in Figure 5A. In the scaffold 102, but for the sake of convenience of description, the wafer box systems of individual conditions are arranged in a straight line. As shown in 圊 2A, 'plural wafer boxes AI, A2, A3, β1, B2

Cjl、C2、C3與C4裝設於儲貨棚架1〇2的架上。如囷“所 示’供電控制器1 1 5會在處理條件c之晶舟盒c 1至c 4中,以 處理條件C、B、A的順序尋找第一個裝載至儲貨棚架1〇2的 晶舟盒C 1 ’並將晶舟盒C丨裝載至處理單元c。供電控制器 1 15會連續地將_晶舟盒B1與“分別卸載至處理單元B與A。 當處理單元A ' B與c被排列成使處理槽a有丨5分鐘的處 理時間、處理槽B有10分鐘的處理時間、而處理槽(:有5分 鐘的處理時間時,晶舟盒以、B1與^之處理係依至處理單 元A、B、C的裝載順序完成。這可避免在相同時序之處理Cjl, C2, C3, and C4 are installed on the shelf of the storage rack 102. As shown in the “shown”, the power supply controller 1 1 5 will find the first load to the storage rack 1 in the order of the processing conditions C, B, and A in the wafer box c 1 to c 4 of the processing condition c. 2 wafer boat box C 1 ′ and load the wafer boat box C 丨 to the processing unit c. The power supply controller 1 15 will continuously unload the wafer boat box B 1 and “to the processing units B and A, respectively. When processing units A'B and c are arranged so that processing tank a has a processing time of 5 minutes, processing tank B has a processing time of 10 minutes, and processing tank (: when there is a processing time of 5 minutes, the wafer box The processing of B1, B1, and ^ is completed according to the loading order of processing units A, B, and C. This can avoid processing at the same timing

第13頁 五、發明說明(10) 一 成。在每個處理過程中,被機器手臂104(圖^取 in 一晶舟 晶圓會被搬運至晶舟盒,而處理過ΐί 舟盒ΑΓ 、Β1,與以,係儲存於儲貨棚架1〇2中。過的晶 如圖2C所不,與圖2Β類似地,晶舟盒C2、Β2與Α2^ ,對應的處理單元A、Β與C裝栽與處理,然後儲存於破 :架;1〇2中。在圖2D、2£諸的程序亦同樣的被執行儲: 囷2E中,因為沒有處理條件B之晶舟盒存在’所以 ^ 會在裝栽晶舟盒C3之後裝載。在圖2F中,因為与曰右虚 、件A與B之晶舟盒存在,所以只有晶舟盒C3受^ j 因此’如圖2G所示,最後的晶舟盒C4’係餹六冰锉眢 2架102中,以完成全部的處理。於此方式中儲* =施例,可同時執行複數之處理以獲得一個 ^ 的生產能力。 匕%用系統高 雖時這個實施例是以運用濕式蝕刻來說明。,太 ,明並未受限於此,而且亦可應用至其他晶圓處二二術 工作件可以以代替晶舟盒之晶圓的單:理 時,斤述:月,當處理單元與储貨棚架分開 I! 處理單凡之處理時間或位置會被設定以縮短處理時 i理ΐ數之工作件會被裝載至一個與儲貨棚架分隔更遠的 已足夠從處理單元取出複數之工作件。 _機器手質 5可同時使用複數之處理單元’所以可縮翅它們的間 夏時間’以比習用系統具有較高產量的工作件處理。Page 13 V. Description of Invention (10) 10%. In each processing process, the robotic arm 104 (Figure ^ Take in a wafer boat wafer will be transported to the wafer boat box, and the processed boat boxes ΑΓ, β1, and 系 are stored in the storage rack 1 〇2. As shown in Figure 2C, the crystals are similar to Figure 2B, the wafer box C2, B2, and A2 ^, the corresponding processing units A, B, and C are mounted and processed, and then stored in a broken rack: 102. The procedures shown in Figures 2D and 2 are also executed in the same way: 囷 In 2E, since the wafer boat box of processing condition B does not exist, it will be loaded after the wafer boat box C3 is installed. In FIG. 2F, since the wafer box of the right and left, pieces A and B exist, only the wafer box C3 is subject to ^ j. Therefore, as shown in FIG. 2G, the final wafer box C4 is a six ice file. In the two racks 102, all the processing is completed. In this way, * = an example, and a plurality of processing can be performed at the same time to obtain a production capacity of ^. The system is high. Although this embodiment uses a wet type Etching to explain., Too, Ming is not limited to this, and can be applied to other wafers Order: time, description: month, when the processing unit is separated from the storage shelf I! The processing time or position of the processing order will be set to shorten the number of work pieces that are processed during the processing. The shelving of the cargo racks is far enough to take out multiple work pieces from the processing unit. _ Robot hand 5 can use multiple processing units at the same time 'so they can shrink their inter-day time' to work with higher yield than conventional systems Piece processing.

Claims (1)

六 驟 步 下 以 含 包 法 方 送 運 件 作 工 種 圍一 範一 利 11 請 與 元 單 理 處 當 (1 間 的(1 元 運 更 工. 以 存 由 儲 送 更 工 時 架理 棚處 貨的 -*日 儀 之 端 末 元 單 ?· S 處 於 定 設 個 3 ο 1X /|\ 元 單 理 處 數 複 之 線 直 一 成 tr 時 開 分 處件不 而作存 ,工忠 短理中 較處架 成下棚 定件貨 設條儲 被理在 會處 定 決一 先 預 之 異 ΠΤΤ 彳 此 彼 在 會 元 單 S 件 作 工 數 複 之 件 條 理 處 同 藉由使用一個配置於與儲貨棚架距離最遠的處理单 ,從儲存於儲貨棚架之複數工作件中選擇一工作件,並 送此工作件至相對應的處理單元;以及 藉由使用配置於比一個最後運送之工作件的處理單元 靠近儲貨棚架的處理單元,連續選擇工作件並運送此等 作件至相對應的處理單元。 2. 如申請專利範圍第1項之工作件運送方法,更包含 下步驟: 在使用一個配置於最靠近儲貨棚架的處理單元運送儲 於儲貨棚架之複數工作件中之其中一個工作件之後,藉 使用一個配置於與儲貨棚架距離最遠的處理單元,而從 存於儲貨棚架之剩下的工作件中選擇一個工作件,並運 此工作件至相對應的處理單元;以及 藉由使用配置於比一個最後運送的工作件的處理單元 靠近儲貨棚架的處理單元,連續選擇工作件並運送此等 作件至相對應的處理單元。 3. 如申請專利範圍第1項之工作件運送方法,更包含In six steps, use the package method to send the shipment as the type of work. Fan Yili 11 Please contact the Yuandanli office (1 room (1 yuan for transportation and repair. To save the storage and delivery time). -* Day instrument end-of-order yuan order? S is at a fixed set of 3 ο 1X / | \ yuan order processing number of complex lines straight to tr when open sub-parts will not be saved, short-term work in loyalty It is set up in the shed, and the order storage is settled at the meeting. A pre-difference is determined at the meeting. This is the same as the order processing of the S bill of materials in the meeting. For the processing order with the furthest distance from the storage rack, select a work piece from the plurality of work pieces stored in the storage rack, and send the work piece to the corresponding processing unit; The processing unit of the work piece is close to the processing unit of the storage shelf, and the work pieces are continuously selected and transported to the corresponding processing unit. 2. If the method of transporting the work piece in the scope of patent application No. 1 includes, Steps: Before using one The processing unit placed closest to the storage racks transports one of the plurality of work pieces stored in the storage racks, and then uses a processing unit arranged at the farthest distance from the storage racks. Select a work piece from the remaining work pieces of the storage rack, and transport this work piece to the corresponding processing unit; and by using a processing unit arranged closer to the storage rack than the last transported work piece, Processing unit, continuously selects the work piece and transports these pieces to the corresponding processing unit. 3. If the method for transporting work pieces in item 1 of the patent application scope, it further includes 第15頁 --—___________ 六、申請專利ϋ ~ 〜 -- 以下步驟: 單元個二置:比一個最後運送之工作件的處理 架:之工作件不存在於儲貨棚 - 由使用一個配置於更靠近儲貨棚靼的#理置 元。 工作件至相對應的處理單 4. 如申請專利範圍第1項之工祚杜、s 1 以下步驟: κ工作件運送方法,更包含 f成一個條件決定表’於其中,會設宏一细县从 :Ϊ與I —個所欲選擇的工作件:之ί; f ί運送 每當一個工作件被從儲貨棚 關係,以及 送的工作件,而連續選擇工作之专=乂會更新最後運 被更新的工作件,並參考條件決包含··藉由使用 所欲運送的工作件之步驟。 疋表(117)而決定下一個 5. 如申請專利範圍第1項之工你|吻 設^處理時間之該步驟包含配置具^ ^送方法,其中, ΐ Ξ:元之步㉟’用以在濕:式1 ϊ ϊ不同姓刻時間的 開時縮短蝕刻時間。 蚀刻單疋與儲貨棚架分 6. 如申請專利範圍第5珀夕 刀 選Ϊ二個工作件之該步驟包含:ίΐ二運送方法,其中, 且含有複數半導體晶圓的晶舟盒之:驟個儲存於儲貨棚架 複數之處理單元⑴〇、132統13G含排 複數之預先決定的處理條件下處理工^ 一直線,用以在 处工作件,當處理單元與Page 15 ---___________ VI. Apply for a patent ϋ ~ ~-The following steps: Set two units: a processing rack that is more than the last work piece to be transported: the work piece does not exist in the storage shed-by using one configuration in # 理 置 元 which is closer to Warehousing Shed. Work piece to the corresponding processing sheet 4. For example, the following steps of the application scope of the patent application scope, s 1 The following steps: κ work piece delivery method, including f into a condition decision table 'in which will be set in Hongyi County From: Ϊ and I-a desired work piece: of ί; f ί transport whenever a work piece is removed from the storage shed relationship, and the work piece sent, and continuous selection of the work == will update the last shipment The updated work piece and reference conditions must include the steps of using the work piece to be shipped. (117) and decide the next one. 5. If you apply for the first item in the scope of the patent application | Kissing ^ This step includes processing method of ^ ^ sending, where ΐ Ξ: 元 之 步 ㉟ 'is used to Shorten the etching time when wet: Equation 1 Etching sheet and storage shelf are divided into 6. According to the scope of the patent application No. 5 Percy knife selection of two work pieces, this step includes: two transportation methods, wherein, and a wafer boat box containing a plurality of semiconductor wafers: A plurality of processing units stored in the storage shelving unit, 132, 13G, and 13G, including a plurality of predetermined processing conditions, are processed under a predetermined processing condition. ^ A straight line is used to work on the place. When the processing unit and the 第16頁 六、申請專利範圍 _ 一儲貨棚架隔開時,該處理里_ 短; 70之處理時間會被設定成較 一儲貨棚架(102),設定 上,用以儲存不同處理條件\匕複數處理單元之末端 運送裝置U04),用/將之儲複/^工^作件(1〇1); 件運送至該處理單元;以及 存於該储貨棚架中之工作 運送控制裝置(1 1 5 ),用w^ 貨棚架較遠的處理單★,而•二用一個配置於距離該健 貨棚架中之複數工作件中選擇工=置=储存於該儲 送至相對應的處理單元。 ’並將工作件運 8. 如申請專利範圍第7項之工作件運谈主祕 * 一藉由使用一個配置於與該儲貨棚架最的慮、二罝 =,料送控制裝置首先會從儲存於該儲单 作件中選擇一個工作件,並將此工作 複數工 理單元丨以及 作仟運送至相對應的處 藉由使用配置於比一個最後運送的工 =近該儲貨棚架之處理單*,連續 作件至相對應的處理單元》 怍件並運送工 9. 如申請專利範圍第7項之工作件運读么^ 在儲存於該儲貨棚架中之複數工作件 用系統,其中, 該儲貨棚架最靠近的處理單元運送一工一個配置於與 J制裝置會使用一個配置於與該儲貨 Π捸3送 工作件,並運送此工作件至相對應的件中選擇-個 外枝·早兀,而且,藉Page 16 6. Scope of patent application _ When a storage scaffold is separated, the processing is short _; 70 processing time will be set to be longer than a storage scaffold (102), and set to store different processing Conditions \ Ultra-terminal transport unit (U04) for multiple processing units, used / stored / ^ worked as a piece (1101); the pieces were delivered to the processing unit; and the work was stored in the storage shelf The control device (1 1 5) uses w ^ to deal with the farthest fare of the cargo scaffold ★, and • Two uses one of a plurality of work pieces arranged in a distance from the healthy scaffold to select a job = set = stored in the storage and delivery To the corresponding processing unit. 'And transport the work piece 8. If the work piece of the scope of the patent application item 7 discusses the main secret * First, by using a configuration with the storage rack most concerns, two = =, the feed control device will first Select a work piece from the work stored in the storage order, and transport this work to a plurality of engineering units and the corresponding place by using a work piece configured near a last shipment = near the storage shelf The processing order *, continuous production to the corresponding processing unit "怍 documents and transport workers 9. If the work piece of the scope of patent application No. 7 is read? ^ Is it used for a plurality of work pieces stored in the storage rack? The system, wherein the processing unit closest to the storage shelf transports one job and one configured to the J-made device to use one configured to send a work piece with the storage Π 捸 3, and transports the work piece to the corresponding piece Choice-A Outer Branch · Early Wood, and, Borrow 六、申請專利範圍 由使用配置於 該儲貨棚架的 作件至相對應 10. 如申 中,當沒有僅 處理單元較靠 儲貨棚架時, 更靠近該儲貨 至相對應的處 11. 如申 更包含: 一條件決 工作件與下一 一記憶體 的工作件之資 新,該運送控 並參考該條件 12. 如 _ 中,該處理單 單元。 13. 如申 中,該工作件 比一個最後運送的工作件之處理單元 處理單元,會連續選擇工作件並 的處理單元。 疋此寻工 請專利範圍第7項之工作件運送系統,其 使用一個配置於比一個最後運送的工作件的 近該儲貨棚架的處理單元的工作件存在於該 該運送控制裝置會選擇一個使用一個配置於 棚架的處理單元之工作件,並運送此工作件 理單元》 請專利範圍第7項之工作件運送系統,其中 定表(117) ’於其中儲存有一個最後運送的 個所欲選擇的工作件間的關係;以及 (116) ’存有關於從該儲貨棚架最後被運送 訊’而且每當運送一個工作件後就會被更 制裝置會使用存於該記憶體之工作件資訊, 決定表’以決定下一個所欲運送的工作件。 請專利範圍第7項之工作件運送系統,其 70係為具有彼此相異的蝕刻時間之濕式蝕刻 請專利範圍第7項之工作件運送系統,其 係為包含複數半導體晶圓之晶舟盒。6. The scope of applying for a patent ranges from the use of the work piece configured on the storage scaffold to the corresponding 10. As in the application, when there is no only processing unit that is closer to the storage scaffold, it is closer to the storage to the corresponding location 11 If the application contains: a conditional work piece and the next piece of memory work piece information, the shipping control and refer to the condition 12. If _, the processing unit. 13. If applied, the work piece is processed more than the processing unit of the last delivered work piece. The processing unit of the work piece is selected continuously.寻 This job hunting system requires the work piece delivery system of item 7 of the patent scope, which uses a work piece disposed in a processing unit closer to the storage rack than a last work piece to be delivered. The work control device will select one Use a work piece disposed in the processing unit of the scaffold, and transport this work piece management unit. "The work piece delivery system in item 7 of the patent scope, where the table (117) is stored in the last one The relationship between the selected work pieces; and (116) 'There is a message about the last shipment from the storage shelf' and the work will be modified every time a work piece is shipped. The device will use the work stored in the memory. Information, decision table 'to determine the next work item to be shipped. The workpiece transport system according to item 7 of the patent, which is a wet etching with mutually different etching times. The workpiece transport system according to item 7 of the patent, which is a wafer boat containing a plurality of semiconductor wafers. box.
TW088100872A 1998-01-23 1999-01-20 Work transfer method and system TW387853B (en)

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Publication number Priority date Publication date Assignee Title
TWI766562B (en) * 2020-01-30 2022-06-01 台灣積體電路製造股份有限公司 Overhead transport vehicle and method of transporting an urgent lot

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Publication number Priority date Publication date Assignee Title
US10497594B2 (en) 2016-03-03 2019-12-03 Murata Machinery, Ltd. Conveyance system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI766562B (en) * 2020-01-30 2022-06-01 台灣積體電路製造股份有限公司 Overhead transport vehicle and method of transporting an urgent lot

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