A7五、發明説明（f ) B7 經濟部中央標準局員工消費合作杜印製 本發明係爲一種便於去除灌膠通道膠體之積體電路封 裝方法及結構，乃爲一種可解決在基板上預留金屬區域做 爲剝膠使用所衍生之繞線空間不足、線路密度降低、作業 成本增加等問題之無需透過形成金屬區域即可如期地去除 灌膠通道位置之膠體者。 —般 B G A ( BALL GRID ARRAY )(球陣式）封裝 基板在設計時，爲使封膠作業能飽J1利進行，均需在對應 於灌膠通道位置預留一適當的區域，而此區域必須爲可便 於後續剝離位在該區域之膠體，爲達此目的，如美國專利 第 5635671 號「MOLD RUNNER REMOVAL FROM A SUBSTRATE-BASED PACKAGED ELECTRONIC DEVICE」案中，主要爲在封裝基板的相應位置設置一金 屬區域，而藉由金屬與膠體間的結合力遠小於金屬與基板 間結合力的特性下，故能夠輕易地將封裝基板灌膠通道上 的殘膠剝離，而不致傷害封裝基板，以下即以應用於B G A封裝基板說明之，爲如第四圖所示，爲在封裝基板（5 〇 )中央形成晶片黏著區（5 2 )、設置在外圍位置之以 極複雜的繞線所形成之繞線區（51)以及在封膠本體區 域（5 4 )覆蓋保護膠與在外圍形成供裁切成單顆之裁切 線（5 5 )之外，更在其一側之對應於灌膠模具之灌膠通 道位置形成一供便於剝離膠體之金屬區域（5 3 )者，雖 上述設計可解決封裝基板灌膠通道之膠體剝離的問題，然 實際應用上，則衍生若干的缺失，茲分析如下。 A ·金屬區域佔用基板表面積，造成線路高密度之限 ,____3_ 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閣讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 A7 B7 五、發明説明（> ) 制與線路設計不便：該金屬區域佔用部份基板面積之故， 不僅增加表面繞線的困難度，亦造成該區域線路過於密集 ，衍生產品良率降低以及線路雜訊干擾增加之不良現象。 B·導致封裝基板成本增加：封裝基板上所預設的金 屬區域，由於整個基板表面的金屬面積增加，致使後續鍍 金作業所耗費的材料量增加，造成製造成本昇高的問題。 C·封裝基板上所形成之相應的金屬區域亦必須隨著 、模具設計而不斷地更動：此舉，造成基板設計必須經常變 化，造成設計成本方面的浪費與不盡經濟的缺點。 故基於以上理由，爲在封裝基板上形成供便於剝離膠 體之金屬區域（5 3 )之設計，造成基板表面可使用面積 縮小、線路設計較爲不便、製造成本增加以及無法適用於 各式灌膠模具之缺陷下，確應尋求其他解決方案。 故本發明人鑒於前述習知技術之缺陷，乃經悉心地試 驗與硏究，終硏製出一種便於去除灌膠通道膠體之積體電 路封裝方法及結構，此方法爲一種無需形成金屬區域之下 ，亦可達到便於剝離膠體的效果者，據以解決習知技術之 各項問題者。 本發明之主要目的在於提供一種便於去除灌膠通道膠 體之積體電路封裝方法及結構，主要爲將封裝基板灌膠通 道區域的性質予以適當地改變，亦即爲僅將區域與膠體之 間的黏著性適度地降低，據此，達到可在不損及基板的情 況下，達到如期地剝離該區域所形成之殘膠者，此項設計 ，使得基板的表面均可做爲繞線使用，無習知技術之佔用 4 本紙張尺度適用中國國家標隼（CNS ) A4規格（210X297公釐） ί ΙΊΙ n . I - -i I- tn -- - I ) - - : In— —1 -- i - (請先閱讀背面之注意事項再填寫本頁) 經濟部中央標隼局員工消費合作社印製 A7 B7__五、發明説明（}) 繞線區域、鍍金處理之材料耗用量增加與衍生的缺失者。 本發明之次一目的在於提供一種便於去除灌膠通道膠 體之積體電路封裝方法及結構，主要爲透過對基板之灌膠 通道區域進行表面處理後，可令覆蓋在基板該區域之止焊 劑（SOLDER MASK) (S/Μ)的性質改變爲與灌入的膠體僅有 低的結合力，而基板的封膠本體部份所覆蓋的止焊劑爲與 膠體之間有著較強的結合力，而達到便於剝離基板之灌膠 通道'區域之膠體，而基板封膠本體部位的膠體爲保持與基 板良好的結合力，以確保封裝品質。 本發明之另一目的在於提供一種便於去除灌膠通道膠 體之積體電路封裝方法及結構，可在對基板進行止焊劑塗 佈之前，對基板底材及線路作適當的前處理，如噴砂、機 械刷磨、化學微蝕、紫外光照射、紅外光照射及熱處理等 方式，以增加基板與止焊劑之間的結合力，使得在剝膠時 ，止焊劑不致與基板底材或線路分離。 本發明之又一目的在於提供一種便於去除灌膠通道膠 體之積體電路封裝方法及結構，可在對基板進行止焊劑塗 佈製程期間，針對基板之灌膠通道區域作特別處理，以遮 板或光阻劑（P R ) ( PHOTO RESIST)覆蓋於其他區域 之後’針對該灌膠通道區域施以紫外線照射、紅外光照射 、機械刷磨、化學微蝕、噴砂、電漿處理、紫外光臭氧處 理或熱處理等方式’藉以改變該灌膠通道區域之止焊劑之 表面特性，使其不易與膠體黏著，故能於剝膠時輕易地剝 離，.亦不致損及止焊劑或基板，而封膠本體區域則令膠體 5 -I I- - - -. - --! I I :| - :1 1 !1 . ml In VeJ (請先閱讀背面之注意事項再填寫本育) 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 經濟部中央標準局員工消費合作社印製 A7 B7___ 五、發明説明（屮） 與止焊劑之間保持良好的結合力，以確保封膠品質者。 爲使貴審查委員能夠進一步瞭解本發明之方法、特 徵及其他目的，茲附以圖式詳細說明后。 (一）圖式部份： 第一圖：係本發明之封裝基板之平面示意圖。 第二圖：係本發明之基板上覆蓋遮板或光阻劑之平面圖。 第三圖：係B GA封裝製法示意圖。 第四圖：係習知形成金屬區域之封裝基板的平面示意圖。 (二、圖號部份： (10) ( 5 0 )封裝基板 （11) ( 5 1 )繞線區 (13) (54)封膠本體區域（14) (55)裁切線 (12) (52)晶片黏著區（20)遮板或光阻劑 (30)灌膠通道區域 本發明爲形成一種無需耗用基板面積之便於剝離灌膠 通道區域殘膠之封裝基板製法及封裝基板結構，而本發明 之封裝基板的表面型態爲如第一圖所示，與前述第四圖之 習知封裝基板相互比較，當可淸楚發現，本發明之封裝基 板（1 0 )上僅形成位在中央位置之晶片黏著區（1 2 ) 以及在外圍完全塡滿有複雜線路圖案之繞線區（11)、 封膠本體區域（1 3 )與裁切線（1 4 )者，爲完全無需 預留任何額外的結構，亦即，本發明之封裝基板（1 〇 ) 爲一種無任何灌膠通道保留區之型態，如此，即無習知預 留金屬區域所造成之佔用問題、電鍍作業過度損耗之成本 增加問題以及金屬區域設計方面的問題，而本發明爲可在 _6_ 本紙¥尺度適用V國國家標準（CNS ) A4規格（210X297公釐) 一 ------------象------訂 (請先閱讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 A7 B7五、發明説明（ir ) 無需預留保留區之情況下’仍可達到輕易地剝離位在灌膠 通道之殘膠，且不致損及封裝基板者。 而本發明之可如期地達到便於剝離封裝基板之灌膠區 域之殘膠的方法上，主要即爲改變封裝基板之相對於膠體 之間的結合力予以達成者，以下即以一GA積體電路 封裝之製程說明之，如第三圖所示之本發明之B GA封裝 基板的製法觀之，首先爲對基板上施以形成線路之步驟， 然後對基板之底板及銅面進行前處理，再透過對銅面進行 塗佈止焊劑，並進行影像蟓移.（曝光、顯影··等），而 使劑僅覆蓋在欲保護之位置，之後，對止焊劑不覆蓋 的區域實施電鍍表面金屬之步驟（供後續焊接或連接晶片 接點之用），而后，爲實施一道改變止焊劑表面性質之步 驟，此步驟爲透過電漿淸洗機或紫外線臭氧改質機處理， 供淸潔基板表面沾附之有機介面，更藉以改變止焊劑表面 特性，以使膠體與止焊劑之間有良好的結合力，以確保品 質’然後，則爲依序進行晶片黏著與完成與基板間之電氣 連接（打線或單點焊接）、注膠灌模、去除灌膠通道之殘 膠、烘烤以使灌膠主體充分聚合、錫球焊連接至基板以及 將條狀基板切割成單顆，而完成整個積體電路之封裝作業 者。 而本發明爲在該止焊劑塗佈之前或止焊劑製程期間， 加入一適當的處理步驟，以達到改變止焊劑與封裝基板之 間的結合力或是改變位在基板灌膠通道部份之止焊劑的性 質’亦即爲改變該特定部位之止焊劑與膠體之間的結合力 — 7 (請先阶讀背面之注意事^再填寫本頁)A7 V. Explanation of the invention (f) B7 Printed by the staff of the Central Bureau of Standards of the Ministry of Economic Affairs. The present invention is an integrated circuit packaging method and structure that facilitates the removal of the glue channel gel. It is a solution that can solve the problem of reserve on the substrate. The metal area is used for problems such as insufficient winding space, reduced circuit density, and increased operating costs, which are caused by the use of glue stripping, and can remove the gel at the location of the glue channel as expected without forming a metal area. —Generally, in the design of BGA (BALL GRID ARRAY) (ball array) package substrate, in order to make the sealing operation can be carried out satisfactorily, it is necessary to reserve an appropriate area corresponding to the position of the filling channel, and this area must be In order to facilitate the subsequent stripping of the gel located in this area, for this purpose, for example, in the case of US Patent No. 5,536,671 "MOLD RUNNER REMOVAL FROM A SUBSTRATE-BASED PACKAGED ELECTRONIC DEVICE", a metal is mainly provided at the corresponding position of the packaging substrate. Area, and because the bonding force between the metal and the colloid is much smaller than the bonding force between the metal and the substrate, it can easily peel off the residue on the packaging substrate filling channel without damaging the packaging substrate. The following applies The description of the BGA package substrate is as shown in the fourth figure, which is a winding area formed by forming a wafer adhesion area (5 2) in the center of the package substrate (50) and a very complicated winding set at a peripheral position. (51) In addition to covering the sealant body area (5 4) with a protective glue and a cutting line (5 5) formed on the periphery for cutting into a single piece, the one on one side corresponds to the filling mold Glue passage location is formed by a for the convenience of metal region peeling colloid of (53), although the above design solves the problem of colloidal package substrate Glue passage of peeling, the natural practice, deletions plurality is derived, hereby follows. A · The metal area occupies the surface area of the substrate, which limits the high density of the circuit. ____3_ This paper size applies to the Chinese National Standard (CNS) A4 specification (210X297 mm) (please read the precautions on the back before filling this page) Printed by the Consumer Bureau of Standards Bureau A7 B7 V. Description of the invention (>) Inconvenient system and circuit design: The metal area occupies part of the substrate area, which not only increases the difficulty of surface winding, but also causes the area to be too dense. , The decline in the yield of derivative products and the increase of line noise interference. B. Resulting in increased packaging substrate costs: Preset metal areas on the packaging substrate, due to the increase in the metal area of the entire substrate surface, caused an increase in the amount of materials consumed in subsequent gold plating operations, causing a problem of increased manufacturing costs. C. The corresponding metal area formed on the package substrate must also be continuously changed with the design of the mold: this will cause the substrate design to change frequently, causing waste in design costs and uneconomical shortcomings. Therefore, based on the above reasons, in order to form a metal region (53) on the packaging substrate for easy peeling of the colloid, the surface area of the substrate can be reduced, the circuit design is inconvenient, the manufacturing cost is increased, and it cannot be applied to various types of glue. Under the defects of the mold, other solutions should be sought. Therefore, in view of the defects of the foregoing conventional technology, the inventor has carefully tested and researched, and finally produced an integrated circuit packaging method and structure that facilitates the removal of the glue channel colloid. This method is a method that does not require the formation of metal regions. In addition, those who can achieve the effect of peeling the colloid easily can solve the problems of the conventional technology. The main purpose of the present invention is to provide an integrated circuit packaging method and structure that facilitates the removal of the glue channel colloid, mainly for appropriately changing the properties of the package substrate glue channel region, that is, only between the region and the colloid. Adhesiveness is moderately reduced. Based on this, it can reach those who can peel off the residual glue formed in this area without damaging the substrate. This design allows the surface of the substrate to be used as a winding. Occupation of conventional technology 4 The paper size is applicable to Chinese National Standard (CNS) A4 (210X297 mm) ί ΙΊΙ n. I--i I- tn--I)--: In— —1-i -(Please read the precautions on the back before filling out this page) A7 B7 printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs __V. Description of the invention (}) Increase in the consumption of winding area and gold-plated materials and derived Missing. A secondary object of the present invention is to provide an integrated circuit packaging method and structure that facilitates the removal of colloids in the glue channel. The method is mainly to perform surface treatment on the glue channel area of the substrate, so that a solder stopper covering the area of the substrate ( The properties of SOLDER MASK) (S / M) are changed to have a low bonding force with the injected colloid, and the soldering flux covered by the sealing body of the substrate has a strong bonding force with the colloid, and The gel in the region of the glue channel of the substrate is easily peeled off, and the gel in the body of the substrate sealing body maintains a good bonding force with the substrate to ensure the packaging quality. Another object of the present invention is to provide an integrated circuit packaging method and structure that facilitates the removal of the glue channel colloid. The substrate substrate and wiring can be properly pre-treated, such as sandblasting, Mechanical brushing, chemical micro-etching, ultraviolet light irradiation, infrared light irradiation, and heat treatment, etc., to increase the bonding force between the substrate and the solder stopper, so that the solder stopper will not be separated from the substrate or circuit of the substrate when peeling. Another object of the present invention is to provide an integrated circuit packaging method and structure that facilitates the removal of colloids from the glue channel. During the process of coating the substrate with a flux, a special treatment is performed for the glue channel area of the substrate to shield the plate. Or photoresist (PR) (Photo RESIST) after covering other areas' UV irradiation, infrared light irradiation, mechanical brushing, chemical micro-etching, sand blasting, plasma treatment, ultraviolet light ozone treatment for the glue channel area Or heat treatment, etc. 'to change the surface characteristics of the solder stopper in the glue channel area, making it difficult to adhere to the colloid, so it can be easily peeled off when peeling off the adhesive, and it will not damage the solder stopper or the substrate, and seal the body. For regions, make colloids 5 -I I----.--! II: |-: 1 1! 1. Ml In VeJ (Please read the notes on the back before filling in this education) The paper size applies to Chinese national standards (CNS) A4 specification (210X297 mm) Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A7 B7___ V. Description of the invention (屮) Maintain a good bonding force with the solder stopper to ensure the quality of the sealant . In order to allow your reviewers to further understand the methods, features, and other purposes of the present invention, detailed descriptions are attached with drawings. (I) Schematic part: The first figure is a schematic plan view of the package substrate of the present invention. The second figure is a plan view of a cover or photoresist on the substrate of the present invention. The third picture is a schematic diagram of the B GA packaging method. FIG. 4 is a schematic plan view of a conventional package substrate forming a metal region. (II) Part number: (10) (50) Package substrate (11) (51) Winding area (13) (54) Sealing body area (14) (55) Cutting line (12) (52) ) Wafer adhesion area (20) shield or photoresist (30) glue channel area The present invention is to form a package substrate manufacturing method and a package substrate structure for easily peeling off the residual glue in the glue channel area without consuming the substrate area. The surface profile of the packaging substrate of the invention is as shown in the first figure, and compared with the conventional packaging substrate of the fourth figure, when it can be clearly found that the packaging substrate (10) of the present invention is formed only in the center. The wafer adhesive area (1 2) at the position and the winding area (11), the sealing body area (1 3) and the cutting line (1 4) completely filled with complex circuit patterns on the periphery, no need to reserve any The additional structure, that is, the package substrate (10) of the present invention is a type without any glue channel reserved area, so that there is no occupation problem caused by the reserved metal area and excessive loss of plating operations. The problem of cost increase and the design of metal area, and the present invention is _ This paper ¥ scale applies to National Standard V (CNS) A4 specifications (210X297 mm) I ------------ Like -------- Order (please read the precautions on the back before filling (This page) Printed A7 B7 by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs. 5. Description of the Invention (ir) Without the need to reserve a reserved area, it can still easily strip the residual glue located in the glue channel without damage. For packaging substrates, the method of the present invention that can achieve the easy removal of the adhesive residue in the encapsulation area of the packaging substrate is to achieve the change of the bonding force between the packaging substrate and the colloid, as follows: The manufacturing process of the GA integrated circuit package is explained. As shown in the third figure, the manufacturing method of the B GA package substrate of the present invention is as follows. First, the step of forming a circuit is performed on the substrate, and then the bottom plate and the copper surface of the substrate are performed. Pre-treatment, and then apply flux to the copper surface and perform image migration (exposure, development, etc.), so that the flux is only covered at the position to be protected, and then the area not covered by the flux is applied Steps of plating the surface metal (for subsequent To connect or connect the chip contacts), and then, in order to implement a step to change the surface properties of the flux, this step is processed by a plasma cleaning machine or an ultraviolet ozone reformer, for the organic interface attached to the surface of the clean substrate In addition, the surface characteristics of the flux stopper are changed to ensure a good bonding force between the colloid and the flux stopper to ensure the quality. Then, the wafer adhesion and the electrical connection with the substrate are completed in order (wire or single-point soldering). ), Glue injection mold, remove the residual glue of the glue channel, bake to fully polymerize the glue body, solder the ball to the substrate and cut the strip substrate into a single piece, and complete the packaging of the entire integrated circuit By. In the present invention, an appropriate processing step is added before the application of the flux stopper or during the flux stopper process, so as to change the bonding force between the flux stopper and the package substrate or change the position of the substrate in the channel for filling the substrate. The nature of the flux 'is to change the binding force between the solder stopper and the colloid in this specific part — 7 (Please read the precautions on the back first before filling this page)
本紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ297公釐） 經濟部中央標準局貝工消費合作社印製 A7 _B7__ 五、發明説明（,（） ，而·逢到便於剝離位在封裝基板之灌膠通道位置之殘膠者 ，而本發明之處理方式可由如下不同的實施例完成。 本發明之第一實施例爲：可在對基板進行止焊劑塗佈 之前，對基板底材及線路作適當的前處理，如噴@、機械 刷磨、化學微蝕、紫外光照射、紅外光照射及熱處理等方 式，以增加基板與止焊劑之間的結合力，使得在第三圖之 去除灌膠通道之殘膠的剝膠步驟時，由於改變止焊劑的性 質爲與基板之間的結合力爲大於膠體與止焊劑之間的結合 力之故，故在該剝離灌膠通道位置之殘膠時，不致使得止 焊劑與基板底材或線路分離，如此，即可達到便於剝除殘 膠的'效果。 本發明之另一實施例爲：可在止焊劑製程期間，針對 基板之灌膠通道區域作特別處理，如第二圖之以遮板或光 阻劑（2 0)覆蓋於封裝基板（1 0)灌膠通道區域（3 0 )以外的大面積之區域，針對該灌膠通道區域（3 0 ) .、施以紫外線照射、紅外光照射、機械刷磨、化學微蝕、噴 砂、電漿處理、紫外光臭氧處理f熱處理等方式，藉以改 變該灌膠通道區域之止焊劑之表面特性，使其不易與膠體 黏著，故能於剝離覆蓋在該灌膠通道區域（3 0 )之殘膠 時，可輕易地剝離，而不致損及止焊劑或基板，而其他區 域之膠體與止焊劑之間則由於未受上述處理的影響，故仍 能保持良好的結合力，亦提供確實的封膠保護效果。 本發明之第三實施例爲：可在在止焊劑製程中，針對 止焊劑表面施以適當之處理，如以紫外線照射、紅外光照 __8_ 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公H ~ ^!t. - - - 1 - 1 - i n^i In· I nn —^ϋ f]^— —^ϋ a^m 一eJ (請先閲讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 A7 B7五、發明説明（；？） 射、機械刷磨、化學微蝕、噴砂、電漿處理、紫外光臭氧 處理;或熱處理等方式，藉以改變止焊劑之表面特性，使其 在潅膠完成後，殘膠剝離時，由於止焊劑與膠體間之結合 力不佳，而能輕易地剝離又不致傷害止焊劑或底板，而其 餘的區域則在烘烤之充分聚合之後，則令止焊劑與膠體間 恢復良好的結合狀態者。 本發明之第四實施例爲：亦可在灌膠製程之前，爲將 基板之灌膠通道區域以遮板覆蓋住，然後透過對基板施以 電漿淸洗機或紫外線臭氧改質機處理，而使得僅令欲灌膠 之位置的止焊劑與膠體有著良好結合力，而該經由遮板覆 蓋之灌膠通道區域，由於未經處理，故處於較低結合力的 狀態'故可輕易地令位在灌膠通道位置之殘膠分離，而不 致損及止焊劑或底材者。 故以前述本發明之各項實施例的說明可知，本發明爲 形成一種無需在基板上預留金屬區域即可如期地剝離灌膠 通道殘膠的方法，確可解決於基板上形成剝膠之金屬區域 所衍生之各項缺點，確爲一符合新穎性、進步性之設計， 應符專利申請要件，爰依法提出申請。 1- ϋ·—· i nn· - --ii In I ml nn ml n m 一ffJ (請先閲讀背面之注意事項再填寫本頁) 9 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐）This paper size is applicable to China National Standard (CNS) A4 specification (210 × 297 mm). Printed by the Central Standards Bureau of the Ministry of Economic Affairs, Shelley Consumer Cooperatives. A7 _B7__ V. Description of the invention (, (), and when it is easy to peel off, it is located on the packaging substrate. Residual glue at the location of the glue channel, and the processing method of the present invention can be completed by the following different embodiments. The first embodiment of the present invention is: before the substrate is subjected to solder resist coating, the substrate substrate and the circuit can be processed. Appropriate pre-treatment, such as spraying, mechanical brush grinding, chemical micro-etching, ultraviolet light irradiation, infrared light irradiation, and heat treatment, etc., to increase the bonding force between the substrate and the flux, so that the glue is removed in the third picture In the stripping step of the residual glue of the channel, because the property of the solder flux is changed so that the bonding force between the substrate and the substrate is greater than the bonding force between the gel and the solder flux, when the adhesive residue at the position of the glue channel is peeled off, So as not to separate the flux stopper from the substrate material or the circuit, so that the effect of peeling off the adhesive residue can be achieved. Another embodiment of the present invention is: during the process of the flux stopper, The glue channel area of the substrate is specially treated. For example, the second figure covers a large area outside the glue channel area (30) of the package substrate (1 0) with a mask or photoresist (20). The glue channel area (30). The method of applying ultraviolet radiation, infrared light, mechanical brushing, chemical micro-etching, sandblasting, plasma treatment, ultraviolet light ozone treatment, and heat treatment is applied to change the glue channel area. The surface characteristics of the solder stopper make it difficult to adhere to the colloid, so it can be easily peeled off when the residual adhesive covering the glue channel area (30) is peeled off without damaging the solder stopper or the substrate, and other Because the area between the colloid and the flux is not affected by the above treatment, it can still maintain a good bonding force, and also provide a reliable sealant protection effect. The third embodiment of the present invention is: In order to apply proper treatment to the surface of the flux, such as ultraviolet light and infrared light __8_ This paper size is applicable to China National Standard (CNS) A4 specification (210X297 male H ~ ^! T.---1-1-in ^ i In · I nn — ^ ϋ f] ^ — — ^ ϋ a ^ m a eJ (Please read the notes on the back before filling this page) Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs A7 B7 V. Invention Description (;?) Brush grinding, chemical micro-etching, sand blasting, plasma treatment, UV-ozone treatment; or heat treatment, etc., to change the surface characteristics of the flux stopper, so that after the adhesive is peeled off, the residue is peeled off due to the gap between the flux stopper and colloid. Those with poor bonding force, which can be easily peeled off without causing damage to the flux stopper or the bottom plate, and the rest of the area, after fully polymerizing the baking, will restore a good bonding state between the flux stopper and the colloid. The fourth embodiment is as follows: before the potting process, the area of the potting channel of the substrate is covered with a shield, and then the substrate is treated with a plasma washer or an ultraviolet ozone reformer, so that only the The soldering flux at the position to be glued has a good bonding force, and the glue channel area covered by the shutter is in a state of lower binding force because it is not treated, so it can be easily placed in the glue. aisle Home of adhesive residue separation, and without loss caused by the substrate or the solder stop. Therefore, according to the foregoing description of the embodiments of the present invention, it can be known that the present invention is to form a method for stripping the glue residue of the glue channel on time without the need to reserve a metal area on the substrate, which can really solve the problem of forming the glue on the substrate. The various disadvantages derived from the metal area are indeed a design that is in line with novelty and progress. It should meet the requirements for patent application and apply according to law. 1- ϋ · — · i nn ·---ii In I ml nn ml nm ffJ (Please read the precautions on the back before filling out this page) 9 This paper size applies to China National Standard (CNS) A4 (210X297) %)