TW377503B - Structure of multilevel interconnects in semiconductor components and the method of manufacturing the same - Google Patents

Structure of multilevel interconnects in semiconductor components and the method of manufacturing the same

Info

Publication number
TW377503B
TW377503B TW086114185A TW86114185A TW377503B TW 377503 B TW377503 B TW 377503B TW 086114185 A TW086114185 A TW 086114185A TW 86114185 A TW86114185 A TW 86114185A TW 377503 B TW377503 B TW 377503B
Authority
TW
Taiwan
Prior art keywords
layer
dielectric layer
semiconductor components
manufacturing
same
Prior art date
Application number
TW086114185A
Other languages
English (en)
Inventor
zhi-huang Lin
Original Assignee
United Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Microelectronics Corp filed Critical United Microelectronics Corp
Priority to TW086114185A priority Critical patent/TW377503B/zh
Application granted granted Critical
Publication of TW377503B publication Critical patent/TW377503B/zh

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
TW086114185A 1997-09-30 1997-09-30 Structure of multilevel interconnects in semiconductor components and the method of manufacturing the same TW377503B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW086114185A TW377503B (en) 1997-09-30 1997-09-30 Structure of multilevel interconnects in semiconductor components and the method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW086114185A TW377503B (en) 1997-09-30 1997-09-30 Structure of multilevel interconnects in semiconductor components and the method of manufacturing the same

Publications (1)

Publication Number Publication Date
TW377503B true TW377503B (en) 1999-12-21

Family

ID=57942090

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086114185A TW377503B (en) 1997-09-30 1997-09-30 Structure of multilevel interconnects in semiconductor components and the method of manufacturing the same

Country Status (1)

Country Link
TW (1) TW377503B (zh)

Similar Documents

Publication Publication Date Title
US5055426A (en) Method for forming a multilevel interconnect structure on a semiconductor wafer
EP0887849A3 (en) Method for fabricating capacitor for semiconductor device
EP0898308A3 (en) A method for forming a metal interconnection in a semiconductor device
TW359008B (en) Double metal embedding
SG125881A1 (en) Define via in dual damascene process
KR960004095B1 (en) Manufacturing method of metal plug in contact-hole
DE69623598D1 (de) Halbleiterverfahren zur herstellung eines elektrisch leitenden kontaktanschlusses
EP0177105A3 (en) Method for providing a semiconductor device with planarized contacts
EP0406025A3 (en) Method for fabricating a semiconductor device in which an insulating layer thereof has a uniform thickness
EP0717438A3 (en) Method for forming side contact of semiconductor device
TW343377B (en) Via structure and production process thereof
TW377503B (en) Structure of multilevel interconnects in semiconductor components and the method of manufacturing the same
TW353217B (en) Method of producing semiconductor device having a multi-layer wiring structure
TW337608B (en) Process for producing unlanded via
TW399298B (en) Manufacturing method of via hole
TW331018B (en) Method of fabricating semiconductor devices
KR970018396A (ko) 다층배선의 형성 방법
KR960008504B1 (en) Metal wire forming method of semiconductor device
TW340252B (en) Process of forming a via hole
EP0326956A3 (en) Method for connecting devices on an integrated circuit substrate to a metallization layer
TW288201B (en) Process of fabricating high-density memory integrated circuit
TW269053B (en) Process for disposable metal anti-reflection layer
TW280003B (en) Fabrication method of IC metal structure
KR970000705B1 (en) Multi-level metalizing method of semiconductor device
TW360939B (en) Method for forming capacitor in semiconductor device

Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent