TW376353B - Methods and apparatus for chemical mechanical planarization using a microreplicated surface - Google Patents

Methods and apparatus for chemical mechanical planarization using a microreplicated surface

Info

Publication number
TW376353B
TW376353B TW087110322A TW87110322A TW376353B TW 376353 B TW376353 B TW 376353B TW 087110322 A TW087110322 A TW 087110322A TW 87110322 A TW87110322 A TW 87110322A TW 376353 B TW376353 B TW 376353B
Authority
TW
Taiwan
Prior art keywords
chemical mechanical
microreplicated surface
mechanical planarization
methods
increases
Prior art date
Application number
TW087110322A
Other languages
English (en)
Inventor
Stuart L Meyer
Original Assignee
Speedfam Ipec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Speedfam Ipec Corp filed Critical Speedfam Ipec Corp
Application granted granted Critical
Publication of TW376353B publication Critical patent/TW376353B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/70—Nanostructure
    • Y10S977/734—Fullerenes, i.e. graphene-based structures, such as nanohorns, nanococoons, nanoscrolls or fullerene-like structures, e.g. WS2 or MoS2 chalcogenide nanotubes, planar C3N4, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/70—Nanostructure
    • Y10S977/762—Nanowire or quantum wire, i.e. axially elongated structure having two dimensions of 100 nm or less
    • Y10S977/765—Nanowire or quantum wire, i.e. axially elongated structure having two dimensions of 100 nm or less with specified cross-sectional profile, e.g. belt-shaped
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/70—Nanostructure
    • Y10S977/773—Nanoparticle, i.e. structure having three dimensions of 100 nm or less
    • Y10S977/775—Nanosized powder or flake, e.g. nanosized catalyst
    • Y10S977/777—Metallic powder or flake
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/84—Manufacture, treatment, or detection of nanostructure
    • Y10S977/882—Assembling of separate components, e.g. by attaching
    • Y10S977/883—Fluidic self-assembly, FSA
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/84—Manufacture, treatment, or detection of nanostructure
    • Y10S977/888—Shaping or removal of materials, e.g. etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Crushing And Grinding (AREA)
TW087110322A 1997-06-26 1998-07-31 Methods and apparatus for chemical mechanical planarization using a microreplicated surface TW376353B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/883,404 US6224465B1 (en) 1997-06-26 1997-06-26 Methods and apparatus for chemical mechanical planarization using a microreplicated surface

Publications (1)

Publication Number Publication Date
TW376353B true TW376353B (en) 1999-12-11

Family

ID=25382510

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087110322A TW376353B (en) 1997-06-26 1998-07-31 Methods and apparatus for chemical mechanical planarization using a microreplicated surface

Country Status (4)

Country Link
US (2) US6224465B1 (zh)
JP (1) JP3078783B2 (zh)
DE (1) DE19828477A1 (zh)
TW (1) TW376353B (zh)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6224465B1 (en) * 1997-06-26 2001-05-01 Stuart L. Meyer Methods and apparatus for chemical mechanical planarization using a microreplicated surface
CN1345264A (zh) * 1999-03-30 2002-04-17 株式会社尼康 抛光盘、抛光机、抛光方法及制造半导体器件的方法
US6234875B1 (en) 1999-06-09 2001-05-22 3M Innovative Properties Company Method of modifying a surface
US6280288B1 (en) * 2000-02-04 2001-08-28 Norton Company Process for determining optimum grinding conditions
JP2002141315A (ja) * 2000-11-02 2002-05-17 Hitachi Chem Co Ltd 酸化セリウム研磨剤用ｃｍｐパッド及び基板の研磨方法
KR100892924B1 (ko) 2000-12-01 2009-04-09 도요 고무 고교 가부시키가이샤 연마 패드
US6612916B2 (en) 2001-01-08 2003-09-02 3M Innovative Properties Company Article suitable for chemical mechanical planarization processes
DE10131668B4 (de) * 2001-06-29 2006-05-18 Infineon Technologies Ag Verfahren zur abrasiven Bearbeitung von Oberflächen, auf Halbleiter-Wafern
US6593699B2 (en) 2001-11-07 2003-07-15 Axcelis Technologies, Inc. Method for molding a polymer surface that reduces particle generation and surface adhesion forces while maintaining a high heat transfer coefficient
US6939203B2 (en) * 2002-04-18 2005-09-06 Asm Nutool, Inc. Fluid bearing slide assembly for workpiece polishing
US6899612B2 (en) * 2003-02-25 2005-05-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad apparatus and methods
US20050060941A1 (en) * 2003-09-23 2005-03-24 3M Innovative Properties Company Abrasive article and methods of making the same
US7267700B2 (en) * 2003-09-23 2007-09-11 3M Innovative Properties Company Structured abrasive with parabolic sides
US20050060945A1 (en) * 2003-09-23 2005-03-24 3M Innovative Properties Company Method of making a coated abrasive
US7300479B2 (en) * 2003-09-23 2007-11-27 3M Innovative Properties Company Compositions for abrasive articles
US20050060944A1 (en) * 2003-09-23 2005-03-24 3M Innovative Properties Company Method of making a coated abrasive
US20050060942A1 (en) * 2003-09-23 2005-03-24 3M Innovative Properties Company Structured abrasive article
US20050064805A1 (en) * 2003-09-23 2005-03-24 3M Innovative Properties Company Structured abrasive article
US6997788B2 (en) * 2003-10-01 2006-02-14 Mosel Vitelic, Inc. Multi-tool, multi-slurry chemical mechanical polishing
JP4531661B2 (ja) * 2005-08-26 2010-08-25 東京エレクトロン株式会社 基板の処理方法及び基板の処理装置
JP2013049112A (ja) * 2011-08-31 2013-03-14 Kyushu Institute Of Technology ポリシングパッド及びその製造方法
JP6567420B2 (ja) * 2013-09-11 2019-08-28 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
KR102608901B1 (ko) * 2018-12-24 2023-12-01 삼성전자주식회사 웨이퍼 그라인딩 휠
US11331767B2 (en) 2019-02-01 2022-05-17 Micron Technology, Inc. Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods
CN111300161B (zh) * 2020-02-26 2022-02-01 上海东竞自动化系统有限公司 表面划痕修复的方法和设备

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4576850A (en) 1978-07-20 1986-03-18 Minnesota Mining And Manufacturing Company Shaped plastic articles having replicated microstructure surfaces
DE3644854A1 (de) 1985-07-31 1987-07-30 Speedfam Corp Werkstueckhalter
JPS6362673A (ja) 1986-09-01 1988-03-18 Speedfam Co Ltd 定寸機構付き平面研磨装置
DE68920365T2 (de) * 1988-06-28 1995-06-08 Mitsubishi Material Silicon Verfahren zur Polierung eines Halbleiter-Plättchens.
US5020283A (en) 1990-01-22 1991-06-04 Micron Technology, Inc. Polishing pad with uniform abrasion
US5107626A (en) 1991-02-06 1992-04-28 Minnesota Mining And Manufacturing Company Method of providing a patterned surface on a substrate
US5152917B1 (en) 1991-02-06 1998-01-13 Minnesota Mining & Mfg Structured abrasive article
US5378251A (en) 1991-02-06 1995-01-03 Minnesota Mining And Manufacturing Company Abrasive articles and methods of making and using same
DE69206685T2 (de) 1991-06-06 1996-07-04 Commissariat Energie Atomique Poliermaschine mit einem gespannten Feinschleifband und einem verbesserten Werkstückträgerkopf
US5329732A (en) 1992-06-15 1994-07-19 Speedfam Corporation Wafer polishing method and apparatus
US5498199A (en) 1992-06-15 1996-03-12 Speedfam Corporation Wafer polishing method and apparatus
US5366523A (en) 1992-07-23 1994-11-22 Minnesota Mining And Manufacturing Company Abrasive article containing shaped abrasive particles
MY114512A (en) 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US5549962A (en) 1993-06-30 1996-08-27 Minnesota Mining And Manufacturing Company Precisely shaped particles and method of making the same
KR100313263B1 (ko) * 1993-09-13 2001-12-28 스프레이그 로버트 월터 연마품,이의제조방법,이를사용한마무리방법및제작용금형
US5443415A (en) * 1993-09-24 1995-08-22 International Technology Partners, Inc. Burnishing apparatus for flexible magnetic disks and method therefor
US5453106A (en) 1993-10-27 1995-09-26 Roberts; Ellis E. Oriented particles in hard surfaces
US5453312A (en) 1993-10-29 1995-09-26 Minnesota Mining And Manufacturing Company Abrasive article, a process for its manufacture, and a method of using it to reduce a workpiece surface
US5454844A (en) * 1993-10-29 1995-10-03 Minnesota Mining And Manufacturing Company Abrasive article, a process of making same, and a method of using same to finish a workpiece surface
CA2134156A1 (en) * 1993-11-22 1995-05-23 Thomas P. Klun Coatable compositions, abrasive articles made therefrom, and methods of making and using same
US5441598A (en) 1993-12-16 1995-08-15 Motorola, Inc. Polishing pad for chemical-mechanical polishing of a semiconductor substrate
US5489233A (en) 1994-04-08 1996-02-06 Rodel, Inc. Polishing pads and methods for their use
US5536202A (en) 1994-07-27 1996-07-16 Texas Instruments Incorporated Semiconductor substrate conditioning head having a plurality of geometries formed in a surface thereof for pad conditioning during chemical-mechanical polish
US5958794A (en) 1995-09-22 1999-09-28 Minnesota Mining And Manufacturing Company Method of modifying an exposed surface of a semiconductor wafer
US5961372A (en) * 1995-12-05 1999-10-05 Applied Materials, Inc. Substrate belt polisher
US5664990A (en) * 1996-07-29 1997-09-09 Integrated Process Equipment Corp. Slurry recycling in CMP apparatus
US5692950A (en) 1996-08-08 1997-12-02 Minnesota Mining And Manufacturing Company Abrasive construction for semiconductor wafer modification
US5932486A (en) 1996-08-16 1999-08-03 Rodel, Inc. Apparatus and methods for recirculating chemical-mechanical polishing of semiconductor wafers
US5725417A (en) * 1996-11-05 1998-03-10 Micron Technology, Inc. Method and apparatus for conditioning polishing pads used in mechanical and chemical-mechanical planarization of substrates
US6224465B1 (en) * 1997-06-26 2001-05-01 Stuart L. Meyer Methods and apparatus for chemical mechanical planarization using a microreplicated surface

Also Published As

Publication number Publication date
US6224465B1 (en) 2001-05-01
DE19828477A1 (de) 1999-01-14
US6497613B1 (en) 2002-12-24
JPH1170462A (ja) 1999-03-16
JP3078783B2 (ja) 2000-08-21

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