TW373237B - Apparatus for managing stripping photo-resist solvent - Google Patents

Apparatus for managing stripping photo-resist solvent

Info

Publication number
TW373237B
TW373237B TW087103143A TW87103143A TW373237B TW 373237 B TW373237 B TW 373237B TW 087103143 A TW087103143 A TW 087103143A TW 87103143 A TW87103143 A TW 87103143A TW 373237 B TW373237 B TW 373237B
Authority
TW
Taiwan
Prior art keywords
solvent
resist solvent
photo
stripping
stripping photo
Prior art date
Application number
TW087103143A
Other languages
English (en)
Chinese (zh)
Inventor
Toshimoto Nakagawa
Mitsumoto Nakagawa
Osamu Ogawa
Yoshitaka Nishijima
Takahiro Takarayama
Original Assignee
Hirama Lab Co Ltd
Nagase & Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hirama Lab Co Ltd, Nagase & Co Ltd filed Critical Hirama Lab Co Ltd
Application granted granted Critical
Publication of TW373237B publication Critical patent/TW373237B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW087103143A 1997-10-27 1998-03-04 Apparatus for managing stripping photo-resist solvent TW373237B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP09311403A JP3126690B2 (ja) 1997-10-27 1997-10-27 レジスト剥離液管理装置

Publications (1)

Publication Number Publication Date
TW373237B true TW373237B (en) 1999-11-01

Family

ID=18016786

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087103143A TW373237B (en) 1997-10-27 1998-03-04 Apparatus for managing stripping photo-resist solvent

Country Status (4)

Country Link
JP (1) JP3126690B2 (ko)
KR (1) KR100276561B1 (ko)
CN (1) CN1108541C (ko)
TW (1) TW373237B (ko)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3914722B2 (ja) 2001-06-25 2007-05-16 株式会社平間理化研究所 水系レジスト剥離液管理装置及び水系レジスト剥離液管理方法
JP3914721B2 (ja) * 2001-06-25 2007-05-16 株式会社平間理化研究所 非水系レジスト剥離液管理装置及び非水系レジスト剥離液管理方法
KR100481277B1 (ko) * 2002-05-10 2005-04-07 한국디엔에스 주식회사 반도체 제조 장치 및 방법
JP4365404B2 (ja) * 2006-12-28 2009-11-18 東京エレクトロン株式会社 レジスト液供給装置及び基板処理システム
CN101685273B (zh) * 2008-09-26 2014-06-04 安集微电子（上海）有限公司 一种去除光阻层残留物的清洗液
KR101958387B1 (ko) * 2011-07-28 2019-03-20 주식회사 동진쎄미켐 근적외선 분광기를 이용한 구리막 식각 공정 제어방법 및 구리막 식각액 조성물의 재생방법
JP6098790B2 (ja) * 2012-10-11 2017-03-22 パナソニックＩｐマネジメント株式会社 レジスト剥離液の調合方法および調合装置
CN103913959B (zh) * 2014-03-27 2017-09-26 京东方科技集团股份有限公司 一种光刻胶的剥离装置及剥离方法
JP6562789B2 (ja) * 2015-09-10 2019-08-21 キヤノン株式会社 除去対象物の除去方法
JP6681066B2 (ja) * 2016-03-14 2020-04-15 株式会社平間理化研究所 水系レジスト剥離液の調製装置および非水系レジスト剥離液の調製装置
CN108645959A (zh) * 2018-06-27 2018-10-12 深圳市华星光电技术有限公司 监控剥离液中胺类浓度变化的方法
CN116373457A (zh) * 2021-12-30 2023-07-04 细美事有限公司 基板处理液提供装置、基板处理系统及基板处理方法

Also Published As

Publication number Publication date
KR100276561B1 (ko) 2000-12-15
CN1215850A (zh) 1999-05-05
JP3126690B2 (ja) 2001-01-22
CN1108541C (zh) 2003-05-14
JPH11133630A (ja) 1999-05-21
KR19990036502A (ko) 1999-05-25

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees