TW369688B - Method of forming ball grid array contacts - Google Patents

Method of forming ball grid array contacts

Info

Publication number
TW369688B
TW369688B TW086117816A TW86117816A TW369688B TW 369688 B TW369688 B TW 369688B TW 086117816 A TW086117816 A TW 086117816A TW 86117816 A TW86117816 A TW 86117816A TW 369688 B TW369688 B TW 369688B
Authority
TW
Taiwan
Prior art keywords
solder
preforms
array
ball grid
grid array
Prior art date
Application number
TW086117816A
Other languages
English (en)
Chinese (zh)
Inventor
Gonzalo Amador
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Application granted granted Critical
Publication of TW369688B publication Critical patent/TW369688B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
TW086117816A 1996-11-27 1997-11-27 Method of forming ball grid array contacts TW369688B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US3195896P 1996-11-27 1996-11-27

Publications (1)

Publication Number Publication Date
TW369688B true TW369688B (en) 1999-09-11

Family

ID=21862318

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086117816A TW369688B (en) 1996-11-27 1997-11-27 Method of forming ball grid array contacts

Country Status (4)

Country Link
JP (1) JPH10163374A (ko)
KR (1) KR19980042765A (ko)
SG (1) SG55421A1 (ko)
TW (1) TW369688B (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030070342A (ko) * 2002-02-25 2003-08-30 최록일 반도체 소자의 솔더볼 형성장치 및 그 탑재방법
CN100456635C (zh) * 2004-12-24 2009-01-28 富士通媒体部品株式会社 电子器件及其制造方法
JP4456503B2 (ja) 2004-12-24 2010-04-28 富士通メディアデバイス株式会社 電子部品の製造方法

Also Published As

Publication number Publication date
SG55421A1 (en) 1998-12-21
KR19980042765A (ko) 1998-08-17
JPH10163374A (ja) 1998-06-19

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