TW369688B - Method of forming ball grid array contacts - Google Patents
Method of forming ball grid array contactsInfo
- Publication number
- TW369688B TW369688B TW086117816A TW86117816A TW369688B TW 369688 B TW369688 B TW 369688B TW 086117816 A TW086117816 A TW 086117816A TW 86117816 A TW86117816 A TW 86117816A TW 369688 B TW369688 B TW 369688B
- Authority
- TW
- Taiwan
- Prior art keywords
- solder
- preforms
- array
- ball grid
- grid array
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US3195896P | 1996-11-27 | 1996-11-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW369688B true TW369688B (en) | 1999-09-11 |
Family
ID=21862318
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086117816A TW369688B (en) | 1996-11-27 | 1997-11-27 | Method of forming ball grid array contacts |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPH10163374A (ko) |
KR (1) | KR19980042765A (ko) |
SG (1) | SG55421A1 (ko) |
TW (1) | TW369688B (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20030070342A (ko) * | 2002-02-25 | 2003-08-30 | 최록일 | 반도체 소자의 솔더볼 형성장치 및 그 탑재방법 |
CN100456635C (zh) * | 2004-12-24 | 2009-01-28 | 富士通媒体部品株式会社 | 电子器件及其制造方法 |
JP4456503B2 (ja) | 2004-12-24 | 2010-04-28 | 富士通メディアデバイス株式会社 | 電子部品の製造方法 |
-
1997
- 1997-11-21 SG SG1997004120A patent/SG55421A1/en unknown
- 1997-11-26 KR KR1019970062988A patent/KR19980042765A/ko not_active Application Discontinuation
- 1997-11-27 JP JP9326548A patent/JPH10163374A/ja active Pending
- 1997-11-27 TW TW086117816A patent/TW369688B/zh active
Also Published As
Publication number | Publication date |
---|---|
SG55421A1 (en) | 1998-12-21 |
KR19980042765A (ko) | 1998-08-17 |
JPH10163374A (ja) | 1998-06-19 |
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