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Application filed by Taiwan Semiconductor Mfg Co LtdfiledCriticalTaiwan Semiconductor Mfg Co Ltd
Priority to TW087112674ApriorityCriticalpatent/TW368702B/en
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Publication of TW368702BpublicationCriticalpatent/TW368702B/en
A kind of manufacturing method for semiconductor preventing the bonding pad staining whose steps are: providing a substrate on which forms the semiconductor components and a metal layer; forming a passivation layer to cover the metal layer, semiconductor components and substrate; etching the passivation layer to expose part of the metal layer as a metal bonding pad; then, applying fluoric plasma treatment to form a fluoric thin film on the surface of metal bonding pad to prevent the metal bonding pad from staining or discoloration caused by the contact of developer during the followed photolithography process.
TW087112674A1998-07-311998-07-31Manufacturing method for semiconductor preventing the bonding pad staining
TW368702B
(en)