TW366546B - Bump leveling apparatus and method thereof - Google Patents
Bump leveling apparatus and method thereofInfo
- Publication number
- TW366546B TW366546B TW086118224A TW86118224A TW366546B TW 366546 B TW366546 B TW 366546B TW 086118224 A TW086118224 A TW 086118224A TW 86118224 A TW86118224 A TW 86118224A TW 366546 B TW366546 B TW 366546B
- Authority
- TW
- Taiwan
- Prior art keywords
- bump
- level
- applied pressure
- pressure required
- leveling apparatus
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
- Length Measuring Devices By Optical Means (AREA)
- A Measuring Device Byusing Mechanical Method (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8324479A JPH10163215A (ja) | 1996-12-05 | 1996-12-05 | バンプレベリング装置及びその方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW366546B true TW366546B (en) | 1999-08-11 |
Family
ID=18166270
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086118224A TW366546B (en) | 1996-12-05 | 1997-12-04 | Bump leveling apparatus and method thereof |
Country Status (5)
Country | Link |
---|---|
US (1) | US5899140A (zh) |
JP (1) | JPH10163215A (zh) |
KR (1) | KR100516617B1 (zh) |
SG (1) | SG74033A1 (zh) |
TW (1) | TW366546B (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000133672A (ja) | 1998-10-28 | 2000-05-12 | Seiko Epson Corp | 半導体装置及びその製造方法、回路基板並びに電子機器 |
JP2000164630A (ja) * | 1998-11-26 | 2000-06-16 | Matsushita Electric Ind Co Ltd | 電子部品の実装方法及び電子部品実装基板 |
JP4371497B2 (ja) * | 1999-10-19 | 2009-11-25 | パナソニック株式会社 | バンプボンディング用加熱装置 |
US6590404B2 (en) | 2001-07-05 | 2003-07-08 | International Business Machines Corp. | Force and centrality measuring tool |
JP2005286166A (ja) * | 2004-03-30 | 2005-10-13 | Nec Electronics Corp | コイニング装置およびコイニング方法 |
JP4918351B2 (ja) * | 2006-12-28 | 2012-04-18 | 日本電産リード株式会社 | 基板処理装置 |
JP5735085B2 (ja) * | 2012-12-04 | 2015-06-17 | キヤノンマシナリー株式会社 | プレス装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4784058A (en) * | 1986-08-13 | 1988-11-15 | Kabushiki Kaisha Kobe Seiko Sho | Press control for maintaining a level position and a uniform pressure on a workpiece |
-
1996
- 1996-12-05 JP JP8324479A patent/JPH10163215A/ja active Pending
-
1997
- 1997-12-04 TW TW086118224A patent/TW366546B/zh active
- 1997-12-04 KR KR1019970065966A patent/KR100516617B1/ko not_active IP Right Cessation
- 1997-12-04 US US08/985,204 patent/US5899140A/en not_active Expired - Fee Related
- 1997-12-05 SG SG1997004335A patent/SG74033A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
KR19980063802A (ko) | 1998-10-07 |
JPH10163215A (ja) | 1998-06-19 |
US5899140A (en) | 1999-05-04 |
SG74033A1 (en) | 2000-07-18 |
KR100516617B1 (ko) | 2005-12-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW324847B (en) | The structure of composite bump | |
WO2003001889A3 (en) | Assay plates reader systems and methods for luminescence test measurements | |
EP0295388A3 (en) | Method of partitioning, testing and diagnosing a vlsi multichip package and associated structure | |
ATE234469T1 (de) | Verfahren zur erfassung des status eines organismus durch messung von peptiden | |
NO20045652L (no) | Bearbeiding av seismiske data | |
TW358997B (en) | Method and apparatus for performing operative testing on an IC | |
MY120159A (en) | Wafer polishing apparatus | |
CA2212676A1 (en) | Apparatus and method for measuring gravity | |
WO2002099373A3 (en) | Determining large deformations and stresses of layered and graded structures to include effects of body forces | |
ATE241932T1 (de) | Vorrichtung zum messen von physikalischen grössen,insbesondere zur druckmessung im auge | |
TW366546B (en) | Bump leveling apparatus and method thereof | |
MY112048A (en) | Apparatus and method for charging three-component mixed refrigerant | |
GB2301893A (en) | Integrity assessment of ground anchorages | |
IT8521474A0 (it) | Metodo per verificare la funzionalita' di valvole di ritegno. | |
HK1023743A1 (en) | Method and apparatus for preloading a skid plate for an early cutting concrete saw | |
TW350086B (en) | Method and apparatus for alignment and bonding | |
GB2327136A (en) | Coin testing apparatus and method | |
DK0475085T3 (da) | Målemetode til bestemmelse af brudforlængelsen af en trækprøve i computerstyrede trækforsøg | |
WO2003098397A3 (en) | Method and apparatus for determining layer thickness and composition using ellipsometric evaluation | |
FR2777654B1 (fr) | Dispositif de mesure de la pression d'une atmosphere | |
FR2493512B1 (fr) | Dispositif pour mesurer la planeite et la linearite de surfaces, en particulier de grandes surfaces | |
CA2251181A1 (en) | Method and device for checking the solidity of anchored standing masts | |
ATE147179T1 (de) | Kalibrieren von münzprüfern | |
EP0352026A3 (en) | A glass slide useful as a control of standard by having several areas of differing levels or types of analytes, and devices and methods for preparing the same | |
IT1313339B1 (it) | Metodo ed apparecchiatura per misurare il bilanciamneto di un'animametallica in uno strato di gomma o simili. |