TW364019B - Copper based alloy featuring precipitation hardening and solid-solution hardening - Google Patents

Copper based alloy featuring precipitation hardening and solid-solution hardening

Info

Publication number
TW364019B
TW364019B TW087114229A TW87114229A TW364019B TW 364019 B TW364019 B TW 364019B TW 087114229 A TW087114229 A TW 087114229A TW 87114229 A TW87114229 A TW 87114229A TW 364019 B TW364019 B TW 364019B
Authority
TW
Taiwan
Prior art keywords
hardening
solid
based alloy
copper based
solution
Prior art date
Application number
TW087114229A
Other languages
English (en)
Chinese (zh)
Inventor
David H Mandle
Daniel D Farquharson
Original Assignee
Miller Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Miller Co filed Critical Miller Co
Application granted granted Critical
Publication of TW364019B publication Critical patent/TW364019B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Laminated Bodies (AREA)
TW087114229A 1997-09-05 1998-08-27 Copper based alloy featuring precipitation hardening and solid-solution hardening TW364019B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US5777997P 1997-09-05 1997-09-05

Publications (1)

Publication Number Publication Date
TW364019B true TW364019B (en) 1999-07-11

Family

ID=22012718

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087114229A TW364019B (en) 1997-09-05 1998-08-27 Copper based alloy featuring precipitation hardening and solid-solution hardening

Country Status (12)

Country Link
EP (1) EP1021575B1 (fr)
JP (1) JP2001515960A (fr)
KR (1) KR20010023699A (fr)
CN (1) CN1097095C (fr)
AR (1) AR017044A1 (fr)
AT (1) ATE240413T1 (fr)
AU (1) AU9108398A (fr)
BR (1) BR9811448A (fr)
CA (1) CA2303164A1 (fr)
DE (1) DE69814657T2 (fr)
TW (1) TW364019B (fr)
WO (1) WO1999013117A1 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7163753B2 (en) 2002-04-15 2007-01-16 Sumitomo Wiring Systems, Ltd. Arc-resistant terminal, arc-resistant terminal couple and connector or the like for automobile
JP4100629B2 (ja) * 2004-04-16 2008-06-11 日鉱金属株式会社 高強度高導電性銅合金
WO2007138956A1 (fr) 2006-05-26 2007-12-06 Kabushiki Kaisha Kobe Seiko Sho Alliage de cuivre trÈs rÉsistant prÉsentant une conductivitÉ Électrique ÉlevÉe et une excellente mallÉabilitÉ en flexion
WO2009098810A1 (fr) * 2008-02-08 2009-08-13 Mitsui Mining & Smelting Co., Ltd. Procédé de production d'une bande d'alliage de cuivre durcie par précipitation
EP2322676A4 (fr) * 2008-09-10 2012-06-13 Taiho Kogyo Co Ltd ÉLÉMENT COULISSANT CONSTITUÉ D'UN MATÉRIAU FRITTÉ EXEMPT DE Pb DE TYPE Cu-Bi
CN106435250A (zh) * 2009-04-08 2017-02-22 瑞士金属-Ums瑞士金属加工有限公司 可机加工的铜基合金和生产它的方法
WO2020160682A1 (fr) * 2019-02-07 2020-08-13 Equispheres Inc. Alliages ayant une faible densité de précipités destinés à être utilisés dans des applications qui comprennent des procédés de refusion, et procédé de préparation associé
KR102107585B1 (ko) * 2019-11-22 2020-05-07 주식회사 풍산 내마모성이 우수한 동합금재 및 이의 제조방법
CN110923505B (zh) * 2019-12-31 2021-11-02 内蒙古工业大学 Cu-Ni-Mn合金及其制备方法和应用
CN113249612A (zh) * 2021-04-21 2021-08-13 铁岭富兴铜业有限公司 新型触点铜合金及其制备方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU219368A1 (fr) * 1966-07-16 1968-05-30 Припой Пайки Меди
JPS5727051A (en) * 1980-07-25 1982-02-13 Nippon Telegr & Teleph Corp <Ntt> Copper nickel tin alloy for integrated circuit conductor and its manufacture
JPS61143564A (ja) * 1984-12-13 1986-07-01 Nippon Mining Co Ltd 高力高導電性銅基合金の製造方法
JPH02122039A (ja) * 1988-10-31 1990-05-09 Nippon Mining Co Ltd 酸化膜密着性に優れた高力高導電銅合金
JPH02197543A (ja) * 1989-01-26 1990-08-06 Furukawa Electric Co Ltd:The 接続機器用銅合金
JPH0776397B2 (ja) * 1989-07-25 1995-08-16 三菱伸銅株式会社 Ｃｕ合金製電気機器用コネクタ
JP2780584B2 (ja) * 1992-11-13 1998-07-30 三菱伸銅株式会社 熱間加工性および打抜き加工性に優れた電気電子部品用Ｃｕ合金

Also Published As

Publication number Publication date
DE69814657D1 (de) 2003-06-18
WO1999013117A1 (fr) 1999-03-18
CA2303164A1 (fr) 1999-03-18
JP2001515960A (ja) 2001-09-25
BR9811448A (pt) 2000-08-22
AR017044A1 (es) 2001-08-22
DE69814657T2 (de) 2004-03-25
EP1021575A1 (fr) 2000-07-26
KR20010023699A (ko) 2001-03-26
CN1097095C (zh) 2002-12-25
ATE240413T1 (de) 2003-05-15
CN1275171A (zh) 2000-11-29
AU9108398A (en) 1999-03-29
EP1021575B1 (fr) 2003-05-14

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