TW358950B - Lead installation structure - Google Patents

Lead installation structure

Info

Publication number
TW358950B
TW358950B TW087101152A TW87101152A TW358950B TW 358950 B TW358950 B TW 358950B TW 087101152 A TW087101152 A TW 087101152A TW 87101152 A TW87101152 A TW 87101152A TW 358950 B TW358950 B TW 358950B
Authority
TW
Taiwan
Prior art keywords
lead
installation structure
leads
lead installation
sustainer
Prior art date
Application number
TW087101152A
Other languages
English (en)
Chinese (zh)
Inventor
Seiji Aizawa
Kazuhiko Sasaki
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Application granted granted Critical
Publication of TW358950B publication Critical patent/TW358950B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/01—Mounting; Supporting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308—Adaptations of leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adjustable Resistors (AREA)
  • Details Of Resistors (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
TW087101152A 1997-02-20 1998-01-26 Lead installation structure TW358950B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP03646597A JP3566483B2 (ja) 1997-02-20 1997-02-20 端子取付け構造

Publications (1)

Publication Number Publication Date
TW358950B true TW358950B (en) 1999-05-21

Family

ID=12470569

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087101152A TW358950B (en) 1997-02-20 1998-01-26 Lead installation structure

Country Status (4)

Country Link
JP (1) JP3566483B2 (ja)
KR (1) KR100255487B1 (ja)
CN (1) CN1096689C (ja)
TW (1) TW358950B (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104008835A (zh) * 2014-06-09 2014-08-27 常州市零伍壹玖电子有限公司 带接线触片保护套的电位器
CN104021902B (zh) * 2014-06-09 2017-05-17 常州市宏硕电子有限公司 触片碳膜电位器
JP7099703B2 (ja) * 2018-08-22 2022-07-12 北川工業株式会社 接触部材

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0304112B1 (en) * 1987-08-21 1993-10-06 Teikoku Tsushin Kogyo Co. Ltd. Molded resin casing of electronic part incorporating flexible board
EP0307977B1 (en) * 1987-09-07 1992-09-30 Teikoku Tsushin Kogyo Co. Ltd. Molded resin casing of electronic part with flat cable

Also Published As

Publication number Publication date
KR100255487B1 (ko) 2000-05-01
JP3566483B2 (ja) 2004-09-15
KR19980071501A (ko) 1998-10-26
CN1096689C (zh) 2002-12-18
JPH10261501A (ja) 1998-09-29
CN1191373A (zh) 1998-08-26

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Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent