TW358240B - Pedestal of semiconductor device fabrication apparatus - Google Patents

Pedestal of semiconductor device fabrication apparatus

Info

Publication number
TW358240B
TW358240B TW086104409A TW86104409A TW358240B TW 358240 B TW358240 B TW 358240B TW 086104409 A TW086104409 A TW 086104409A TW 86104409 A TW86104409 A TW 86104409A TW 358240 B TW358240 B TW 358240B
Authority
TW
Taiwan
Prior art keywords
pedestal
semiconductor device
device fabrication
fabrication apparatus
cooling gas
Prior art date
Application number
TW086104409A
Other languages
Chinese (zh)
Inventor
Kyue-Sang Choi
Hyung-Sik Hong
Jong-Hyun Kim
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Application granted granted Critical
Publication of TW358240B publication Critical patent/TW358240B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

A pedestal of a semiconductor device fabrication apparatus is disclosed, at whose center a cooling gas supply passage is formed and on whose top surface a plurality of cooling gas flow grooves are radially formed from the cooling gas supply passage, the pedestal being set in a chamber of a semiconductor device fabrication apparatus and mounting a wafer, wherein a cooling space is formed inside the pedestal and a cooling gas is supplied to the cooling space in order to cool the pedestal.
TW086104409A 1996-08-29 1997-04-08 Pedestal of semiconductor device fabrication apparatus TW358240B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960036586A KR19980016891A (en) 1996-08-29 1996-08-29 Pedestal of Semiconductor Manufacturing Equipment

Publications (1)

Publication Number Publication Date
TW358240B true TW358240B (en) 1999-05-11

Family

ID=19471528

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086104409A TW358240B (en) 1996-08-29 1997-04-08 Pedestal of semiconductor device fabrication apparatus

Country Status (3)

Country Link
JP (1) JP2837842B2 (en)
KR (1) KR19980016891A (en)
TW (1) TW358240B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101303005B1 (en) * 2012-03-22 2013-09-03 (재)한국나노기술원 Cooling apparatus for wafer and wafer cover using a gas

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0124928Y2 (en) * 1984-10-16 1989-07-27
JPH02135753A (en) * 1988-11-16 1990-05-24 Sumitomo Metal Ind Ltd Sample holding device

Also Published As

Publication number Publication date
JPH1092915A (en) 1998-04-10
KR19980016891A (en) 1998-06-05
JP2837842B2 (en) 1998-12-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees