TW358067B - Method and an apparatus for generating test pattern - Google Patents

Method and an apparatus for generating test pattern

Info

Publication number
TW358067B
TW358067B TW087108316A TW87108316A TW358067B TW 358067 B TW358067 B TW 358067B TW 087108316 A TW087108316 A TW 087108316A TW 87108316 A TW87108316 A TW 87108316A TW 358067 B TW358067 B TW 358067B
Authority
TW
Taiwan
Prior art keywords
generating test
test pattern
screen
test patterns
printing process
Prior art date
Application number
TW087108316A
Other languages
English (en)
Inventor
Karl Schanz
Original Assignee
Ekra Eduard Kraft Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=7834364&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW358067(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Ekra Eduard Kraft Gmbh filed Critical Ekra Eduard Kraft Gmbh
Application granted granted Critical
Publication of TW358067B publication Critical patent/TW358067B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/12—Stencil printing; Silk-screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Screen Printers (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Methods (AREA)
TW087108316A 1997-07-02 1998-05-28 Method and an apparatus for generating test pattern TW358067B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19728144A DE19728144C2 (de) 1997-07-02 1997-07-02 Verfahren und Vorrichtung zum Erzeugen von Testmustern

Publications (1)

Publication Number Publication Date
TW358067B true TW358067B (en) 1999-05-11

Family

ID=7834364

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087108316A TW358067B (en) 1997-07-02 1998-05-28 Method and an apparatus for generating test pattern

Country Status (9)

Country Link
US (2) US6810138B1 (zh)
EP (1) EP1000529B1 (zh)
JP (1) JP2002508067A (zh)
CN (1) CN1194592C (zh)
AR (1) AR010922A1 (zh)
AU (1) AU7759498A (zh)
DE (2) DE19728144C2 (zh)
TW (1) TW358067B (zh)
WO (1) WO1999002021A1 (zh)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE60306389T2 (de) * 2002-08-19 2006-10-19 Matsushita Electric Industrial Co., Ltd., Kadoma Verfahren zur Bildung von Druckkontrolldaten
DE10311822A1 (de) * 2003-03-13 2004-10-07 Ekra Eduard Kraft Gmbh Maschinenfabrik Verfahren und Vorrichtung zur Kontrolle oder Beeinflussung des Druckprozesses beim Lotpastendruck
GB2403003B (en) 2003-06-19 2006-06-07 Dek Int Gmbh Inspection system for and method of inspecting deposits printed on workpieces
DE10335312A1 (de) * 2003-08-01 2005-02-24 Asys Automatisierungssysteme Gmbh Erstellen von Testmustern zur Nachkontrolle
US20070102477A1 (en) * 2005-11-10 2007-05-10 Speedline Technologies, Inc. Imaging system and method for a stencil printer
US20070102478A1 (en) * 2005-11-10 2007-05-10 Speedline Technologies, Inc. Optimal imaging system and method for a stencil printer
US7458318B2 (en) * 2006-02-01 2008-12-02 Speedline Technologies, Inc. Off-axis illumination assembly and method
US7549371B2 (en) * 2006-07-10 2009-06-23 Speedline Technologies, Inc. Method and apparatus for clamping a substrate
US7710611B2 (en) * 2007-02-16 2010-05-04 Illinois Tool Works, Inc. Single and multi-spectral illumination system and method
US7861650B2 (en) * 2007-04-13 2011-01-04 Illinois Tool Works, Inc. Method and apparatus for adjusting a substrate support
US11176635B2 (en) * 2013-01-25 2021-11-16 Cyberoptics Corporation Automatic programming of solder paste inspection system
WO2015125173A1 (ja) * 2014-02-19 2015-08-27 ヤマハ発動機株式会社 スクリーン印刷用検査データの作成ユニット、スクリーン印刷装置およびスクリーン印刷用検査データの作成方法
CN107344446B (zh) * 2016-05-05 2019-12-17 福耀集团（上海）汽车玻璃有限公司 基于图像处理法的玻璃印刷装置以及玻璃印刷方法
KR102106349B1 (ko) 2017-12-21 2020-05-04 주식회사 고영테크놀러지 인쇄 회로 기판 검사 장치, 솔더 페이스트 이상 감지 방법 및 컴퓨터 판독 가능한 기록 매체
US11947094B1 (en) * 2023-03-23 2024-04-02 Illinois Tool Works Inc. Dual camera prism assembly for stencil printer

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4924304A (en) * 1987-11-02 1990-05-08 Mpm Corporation Video probe aligning of object to be acted upon
JPH02276642A (ja) 1989-01-17 1990-11-13 Sanyo Electric Co Ltd スクリーン印刷方法及び印刷機
DE3928527A1 (de) * 1989-08-29 1991-03-14 Ind Siebdruck Systeme Neckarwe Flachbett-siebdruckmaschine zum bedrucken einer elektrischen leiterplatte
US5060063A (en) 1990-07-30 1991-10-22 Mpm Corporation Viewing and illuminating video probe with viewing means for simultaneously viewing object and device images along viewing axis and translating them along optical axis
DE4239995A1 (de) 1992-11-27 1994-06-01 Adalbert Fritsch Gerät und Verfahren zum Bedrucken eines Schaltungsträgers
JPH09189519A (ja) 1996-01-11 1997-07-22 Ushio Inc パターン検出方法およびマスクとワークの位置合わせ装置
US5912984A (en) * 1996-12-19 1999-06-15 Cognex Corporation Method and apparatus for in-line solder paste inspection

Also Published As

Publication number Publication date
WO1999002021A1 (de) 1999-01-14
DE59802650D1 (de) 2002-02-21
JP2002508067A (ja) 2002-03-12
US6810138B1 (en) 2004-10-26
EP1000529B1 (de) 2002-01-16
EP1000529A1 (de) 2000-05-17
AU7759498A (en) 1999-01-25
US20030113008A1 (en) 2003-06-19
DE19728144A1 (de) 1999-01-07
CN1194592C (zh) 2005-03-23
CN1262025A (zh) 2000-08-02
DE19728144C2 (de) 2001-02-01
AR010922A1 (es) 2000-07-12

Similar Documents

Publication Publication Date Title
TW358067B (en) Method and an apparatus for generating test pattern
ATE230201T1 (de) Tiefdruckverfahren, tiefdrucker, verfahren zur herstellung von höckern oder leitermustern, vorrichtung dafür, höckerelektrode und gedruckte leiterplatte
GB2025910B (en) Method for mounting chip type circuit elements on a printed circuit board and apparatus for performing the same
DE69507739T2 (de) Verfahren und Vorrichtung zum Siebdrucken
DE69020696D1 (de) Verfahren zum Montieren eines elektrischen Bauteils auf einer Leiterplatte.
EP0649699A3 (en) Method and apparatus for soldering electronic components on printed circuits and the assembly obtained.
DE69024594D1 (de) Verfahren zum Verbinden von Leiterplatten
DE69120887D1 (de) Verfahren zum Zusammenbau von gedruckten Leiterplatten mit hoher Abwechselung
DE59009928D1 (de) Verfahren zum Beloten von Leiterplatten.
DE59712869D1 (de) Vorrichtung und Verfahren zum Prüfen von Leiterplatten
EP0469788A3 (en) Method and apparatus for reflow-soldering of print circuit boards
DE69511613T2 (de) Verfahren zum Schwallöten von Bauteilen auf einer Leiterplatte in temperaturgesteuerter nicht-oxydiertender Atmosphäre
GB9003620D0 (en) An apparatus for,and a method of,printing a pattern on a container component
DE69616912D1 (de) Gerät zum Abkühlen von gedruckten Schaltungsplatten beim Wellenlöten
DE2962634D1 (en) Curable composition useful for screen-printing, a cured coating comprising said composition and process for soldering printed circuit boards using said composition
DE59712870D1 (de) Vorrichtung und Verfahren zum Prüfen von unbestückten Leiterplatten
MY123885A (en) Electronic unit manufacturing apparatus.
DE69801534D1 (de) Verfahren und Gerät für das Verbinden von Leiterplatten, Tintenstrahldruckkopf und Aufzeichnungsgerät
DE69703426T2 (de) Verfahren und Vorrichtung zum Siebdrucken und Löten von elektronischen Bauelementen auf eine gedruckte Leiterplatte
DE69013976D1 (de) Verfahren zum Montieren von elektronischen Bauteilen auf Leiterplatten.
GB2244815B (en) A method for inspecting printed circuit boards with through-holes
DE69020218T2 (de) Einrichtung zur Erzeugung eines Zeichenmusters hoher Qualität.
EP0410436A3 (en) Apparatus and method for testing printed circuit boards
GB9904255D0 (en) A method for tracking printed circuit boards on multi-board panels through a production process
DE68906982T2 (de) Adapterrahmen zum pruefen von gedruckten schaltungen hoher dichte.

Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent