TW357405B - Method for pre-shaping a semiconductor substrate for polishing and structure - Google Patents
Method for pre-shaping a semiconductor substrate for polishing and structureInfo
- Publication number
- TW357405B TW357405B TW085102917A TW85102917A TW357405B TW 357405 B TW357405 B TW 357405B TW 085102917 A TW085102917 A TW 085102917A TW 85102917 A TW85102917 A TW 85102917A TW 357405 B TW357405 B TW 357405B
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor substrate
- polishing
- shaping
- primary surface
- provision
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 5
- 239000000758 substrate Substances 0.000 title abstract 5
- 238000005498 polishing Methods 0.000 title abstract 3
- 238000000034 method Methods 0.000 title abstract 2
- 238000007493 shaping process Methods 0.000 title abstract 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02024—Mirror polishing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/974—Substrate surface preparation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Weting (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US49451095A | 1995-06-26 | 1995-06-26 | |
US08/512,050 US5968849A (en) | 1995-06-26 | 1995-08-07 | Method for pre-shaping a semiconductor substrate for polishing and structure |
Publications (1)
Publication Number | Publication Date |
---|---|
TW357405B true TW357405B (en) | 1999-05-01 |
Family
ID=27051436
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW085102917A TW357405B (en) | 1995-06-26 | 1996-03-11 | Method for pre-shaping a semiconductor substrate for polishing and structure |
Country Status (5)
Country | Link |
---|---|
US (1) | US5968849A (zh) |
EP (1) | EP0750967A3 (zh) |
JP (1) | JPH0917757A (zh) |
KR (1) | KR970003587A (zh) |
TW (1) | TW357405B (zh) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11302878A (ja) * | 1998-04-21 | 1999-11-02 | Speedfam-Ipec Co Ltd | ウエハ平坦化方法,ウエハ平坦化システム及びウエハ |
DE19841473A1 (de) * | 1998-09-10 | 2000-03-23 | Wacker Siltronic Halbleitermat | Verfahren zur Herstellung einer hochebenen Halbleiterscheibe |
JP2000124235A (ja) * | 1998-10-16 | 2000-04-28 | Oki Electric Ind Co Ltd | 樹脂封止半導体装置 |
US6162702A (en) * | 1999-06-17 | 2000-12-19 | Intersil Corporation | Self-supported ultra thin silicon wafer process |
DE102005043657B4 (de) * | 2005-09-13 | 2011-12-15 | Infineon Technologies Ag | Chipmodul, Verfahren zur Verkapselung eines Chips und Verwendung eines Verkapselungsmaterials |
DE102009037281B4 (de) | 2009-08-12 | 2013-05-08 | Siltronic Ag | Verfahren zur Herstellung einer polierten Halbleiterscheibe |
US8602482B2 (en) * | 2011-03-30 | 2013-12-10 | GM Global Technology Operations LLC | Closure assembly and method of manufacturing same |
RU2536328C2 (ru) * | 2013-04-01 | 2014-12-20 | Российская Федерация, От Имени Которой Выступает Министерство Промышленности И Торговли Российской Федерации | Способ утоньшения фоточувствительного слоя матричного фотоприемника |
BR112016025058A2 (pt) | 2014-05-27 | 2017-08-15 | Scania Cv Ab | caixa de câmbio para veículos e veículos compreendendo tal caixa de câmbio |
SE539659C2 (sv) | 2014-05-27 | 2017-10-24 | Scania Cv Ab | Växellåda för fordon samt fordon, som innefattar en sådan växellåda |
CN110962039A (zh) * | 2018-09-29 | 2020-04-07 | 康宁股份有限公司 | 载体晶片和形成载体晶片的方法 |
CN110010458B (zh) * | 2019-04-01 | 2021-08-27 | 徐州鑫晶半导体科技有限公司 | 控制半导体晶圆片表面形貌的方法和半导体晶片 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2865125A (en) * | 1954-11-22 | 1958-12-23 | Turco Products Inc | Apparatus for selectively contouring a metal part by etching |
DE1621510A1 (de) * | 1967-03-23 | 1971-04-29 | Siemens Ag | Loesungsmittelgemisch mit Salpetersaeure und Flusssaeure zum nasschemischen AEtzen von Silizium |
JPS4936792B1 (zh) * | 1970-10-15 | 1974-10-03 | ||
US3914846A (en) * | 1972-06-15 | 1975-10-28 | Us Navy | High density InSb PV IR detectors |
US3964957A (en) * | 1973-12-19 | 1976-06-22 | Monsanto Company | Apparatus for processing semiconductor wafers |
US3977926A (en) * | 1974-12-20 | 1976-08-31 | Western Electric Company, Inc. | Methods for treating articles |
US4251317A (en) * | 1979-04-30 | 1981-02-17 | Fairchild Camera And Instrument Corporation | Method of preventing etch masking during wafer etching |
JPS6056868A (ja) * | 1983-09-08 | 1985-04-02 | Nec Corp | 研摩装置 |
US4579760A (en) * | 1985-01-08 | 1986-04-01 | International Business Machines Corporation | Wafer shape and method of making same |
JPS6239173A (ja) * | 1985-08-14 | 1987-02-20 | Nec Corp | ウエハ研摩装置 |
FR2625190A1 (fr) * | 1987-12-23 | 1989-06-30 | Trt Telecom Radio Electr | Procede de metallisation d'un substrat en silice, quartz, verre, ou en saphir et substrat obtenu par ce procede |
US4940507A (en) * | 1989-10-05 | 1990-07-10 | Motorola Inc. | Lapping means and method |
EP0579298B1 (en) * | 1992-06-15 | 1997-09-03 | Koninklijke Philips Electronics N.V. | Method of manufacturing a plate having a plane main surface, method of manufacturing a plate having parallel main surfaces, and device suitable for implementing said methods |
DE4224395A1 (de) * | 1992-07-23 | 1994-01-27 | Wacker Chemitronic | Halbleiterscheiben mit definiert geschliffener Verformung und Verfahren zu ihrer Herstellung |
JP2910507B2 (ja) * | 1993-06-08 | 1999-06-23 | 信越半導体株式会社 | 半導体ウエーハの製造方法 |
JPH08274050A (ja) * | 1995-03-29 | 1996-10-18 | Komatsu Electron Metals Co Ltd | 半導体ウェハの製造方法 |
-
1995
- 1995-08-07 US US08/512,050 patent/US5968849A/en not_active Expired - Lifetime
-
1996
- 1996-03-11 TW TW085102917A patent/TW357405B/zh not_active IP Right Cessation
- 1996-04-30 KR KR1019960013586A patent/KR970003587A/ko not_active Application Discontinuation
- 1996-06-04 JP JP8165246A patent/JPH0917757A/ja active Pending
- 1996-06-20 EP EP96109962A patent/EP0750967A3/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
KR970003587A (ko) | 1997-01-28 |
EP0750967A2 (en) | 1997-01-02 |
US5968849A (en) | 1999-10-19 |
EP0750967A3 (en) | 1998-05-13 |
JPH0917757A (ja) | 1997-01-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK4A | Expiration of patent term of an invention patent |