TW353772B - Workpiece relaying apparatus - Google Patents

Workpiece relaying apparatus

Info

Publication number
TW353772B
TW353772B TW086112609A TW86112609A TW353772B TW 353772 B TW353772 B TW 353772B TW 086112609 A TW086112609 A TW 086112609A TW 86112609 A TW86112609 A TW 86112609A TW 353772 B TW353772 B TW 353772B
Authority
TW
Taiwan
Prior art keywords
wafers
workpiece
relaying apparatus
mounting plates
carrying arm
Prior art date
Application number
TW086112609A
Other languages
English (en)
Inventor
Yoji Iizuka
Teruo Asakawa
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Application granted granted Critical
Publication of TW353772B publication Critical patent/TW353772B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW086112609A 1996-09-09 1997-09-02 Workpiece relaying apparatus TW353772B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26034796 1996-09-09

Publications (1)

Publication Number Publication Date
TW353772B true TW353772B (en) 1999-03-01

Family

ID=17346715

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086112609A TW353772B (en) 1996-09-09 1997-09-02 Workpiece relaying apparatus

Country Status (3)

Country Link
US (1) US6013112A (zh)
KR (1) KR100338535B1 (zh)
TW (1) TW353772B (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6405101B1 (en) 1998-11-17 2002-06-11 Novellus Systems, Inc. Wafer centering system and method
KR100309919B1 (ko) * 1998-11-26 2002-10-25 삼성전자 주식회사 작업대상물의절단및분류자동화시스템과그제어방법
US6616394B1 (en) 1998-12-30 2003-09-09 Silicon Valley Group Apparatus for processing wafers
KR20010084796A (ko) * 2000-02-29 2001-09-06 박종섭 반도체 웨이퍼 제조장치
EP1189275A1 (en) * 2000-03-29 2002-03-20 Daikin Industries, Ltd. Substrate transfer device
TW562772B (en) * 2001-04-19 2003-11-21 Murata Machinery Ltd Automatic guided vehicle, automatic guided vehicle system and wafer carrying method
WO2003026002A1 (fr) * 2001-09-18 2003-03-27 Murata Kikai Kabushiki Kaisha Vehicule a guidage automatique
KR100977870B1 (ko) * 2006-03-14 2010-08-24 히라따기꼬오 가부시키가이샤 이동탑재 로봇
KR100781083B1 (ko) * 2006-03-31 2007-11-30 주식회사 뉴파워 프라즈마 기판 반송 장치 및 그것을 사용한 기판 처리 설비
US20080041716A1 (en) * 2006-08-18 2008-02-21 Schott Lithotec Usa Corporation Methods for producing photomask blanks, cluster tool apparatus for producing photomask blanks and the resulting photomask blanks from such methods and apparatus
JP7008573B2 (ja) * 2018-05-16 2022-01-25 東京エレクトロン株式会社 搬送方法および搬送装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4493606A (en) * 1982-05-24 1985-01-15 Proconics International, Inc. Wafer transfer apparatus
JPS636857A (ja) * 1986-06-26 1988-01-12 Fujitsu Ltd ウエ−ハ移し替え装置
US4952115A (en) * 1988-02-29 1990-08-28 Tel Sagami Limited Wafer support device
US5125784A (en) * 1988-03-11 1992-06-30 Tel Sagami Limited Wafers transfer device
JP2628335B2 (ja) * 1988-03-31 1997-07-09 テル・バリアン株式会社 マルチチャンバ型ｃｖｄ装置
US5054418A (en) * 1989-05-23 1991-10-08 Union Oil Company Of California Cage boat having removable slats
JPH03241853A (ja) * 1990-02-20 1991-10-29 Teru Barian Kk 処理装置
JP2984958B2 (ja) * 1991-07-26 1999-11-29 東京エレクトロン株式会社 基板の枚葉検出装置
US5516732A (en) * 1992-12-04 1996-05-14 Sony Corporation Wafer processing machine vacuum front end method and apparatus
TW275708B (zh) * 1993-12-28 1996-05-11 Tokyo Electron Co Ltd
US5664337A (en) * 1996-03-26 1997-09-09 Semitool, Inc. Automated semiconductor processing systems
US5452795A (en) * 1994-11-07 1995-09-26 Gallagher; Gary M. Actuated rotary retainer for silicone wafer box
US5613821A (en) * 1995-07-06 1997-03-25 Brooks Automation, Inc. Cluster tool batchloader of substrate carrier
US5609459A (en) * 1995-07-06 1997-03-11 Brooks Automation, Inc. Door drive mechanisms for substrate carrier and load lock

Also Published As

Publication number Publication date
US6013112A (en) 2000-01-11
KR19980024442A (ko) 1998-07-06
KR100338535B1 (ko) 2002-10-25

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees