TW351772B - Bracing structure for supporting mask holding frame - Google Patents

Bracing structure for supporting mask holding frame

Info

Publication number
TW351772B
TW351772B TW087107465A TW87107465A TW351772B TW 351772 B TW351772 B TW 351772B TW 087107465 A TW087107465 A TW 087107465A TW 87107465 A TW87107465 A TW 87107465A TW 351772 B TW351772 B TW 351772B
Authority
TW
Taiwan
Prior art keywords
holding frame
bracing structure
mask holding
mask
supporting mask
Prior art date
Application number
TW087107465A
Other languages
English (en)
Inventor
Takashi Kawahashi
Hiromi Kai
Original Assignee
Ushio Electric Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ushio Electric Inc filed Critical Ushio Electric Inc
Application granted granted Critical
Publication of TW351772B publication Critical patent/TW351772B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW087107465A 1997-05-29 1998-05-14 Bracing structure for supporting mask holding frame TW351772B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13985797A JP3322167B2 (ja) 1997-05-29 1997-05-29 マスク保持フレームの支持構造

Publications (1)

Publication Number Publication Date
TW351772B true TW351772B (en) 1999-02-01

Family

ID=15255161

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087107465A TW351772B (en) 1997-05-29 1998-05-14 Bracing structure for supporting mask holding frame

Country Status (5)

Country Link
US (1) US6003828A (zh)
EP (1) EP0881538B1 (zh)
JP (1) JP3322167B2 (zh)
DE (1) DE69839748D1 (zh)
TW (1) TW351772B (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1237045B1 (en) * 2001-03-01 2007-05-02 ASML Netherlands B.V. Method of taking over a lithographic mask
JP3960820B2 (ja) 2001-03-01 2007-08-15 エーエスエムエル ネザーランズ ビー．ブイ． マスク引継ぎ方法およびデバイス製造方法
US7173685B2 (en) * 2004-06-29 2007-02-06 Asml Netherlands B.V. Lithographic apparatus, a device manufacturing method, and a fastener for use in a lithographic apparatus
CN102866588A (zh) * 2011-06-10 2013-01-09 恩斯克科技有限公司 曝光装置
US9851643B2 (en) * 2012-03-27 2017-12-26 Kla-Tencor Corporation Apparatus and methods for reticle handling in an EUV reticle inspection tool
US9570309B2 (en) * 2012-12-13 2017-02-14 Varian Semiconductor Equipment Associates, Inc. Mask alignment system for semiconductor processing
US9333733B2 (en) * 2013-07-26 2016-05-10 Varian Semiconductor Equipment Associates, Inc. Multi-part mask for implanting workpieces
US9490153B2 (en) * 2013-07-26 2016-11-08 Varian Semiconductor Equipment Associates, Inc. Mechanical alignment of substrates to a mask
CN104658957B (zh) * 2013-11-18 2018-03-06 北京北方华创微电子装备有限公司 顶针机构及等离子体加工设备
KR102133922B1 (ko) * 2014-03-31 2020-07-15 주식회사 선익시스템 마스크 클램프 장치
CN104597723B (zh) * 2015-02-04 2017-02-22 合肥京东方光电科技有限公司 一种掩膜装置、曝光装置及曝光方法
CN105887010B (zh) * 2016-05-13 2018-10-26 京东方科技集团股份有限公司 掩膜集成框架及蒸镀设备
CN206610079U (zh) * 2017-04-12 2017-11-03 京东方科技集团股份有限公司 用于承载掩膜板的承载台、掩膜板、掩膜板固定组件
KR20240033734A (ko) * 2022-09-05 2024-03-13 삼성디스플레이 주식회사 마스크 스테이지 및 그것을 포함하는 마스크 제조 장치

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4185915A (en) * 1978-02-21 1980-01-29 Saul Fermaglich Method of producing multiple image formats
JPS6346466A (ja) * 1986-08-13 1988-02-27 Oak Seisakusho:Kk 両面露光用ワ−クアライメント装置
DE8800272U1 (de) * 1988-01-13 1988-02-25 Convac GmbH, 7135 Wiernsheim Träger für Fotomasken zur Herstellung von elektrischen intgegrierten Schaltungsbauelementen
JPH01139237U (zh) * 1988-03-15 1989-09-22
US5157438A (en) * 1992-02-04 1992-10-20 Dek Printing Machines Limited Workpiece support and clamping means
US5602622A (en) * 1993-02-26 1997-02-11 Ziegler; William R. Alignable negative stage for a photographic enlarger
JP2889126B2 (ja) * 1993-07-08 1999-05-10 ウシオ電機株式会社 ワークとマスクの間隙設定方法、及び間隙設定機構
KR100208739B1 (ko) * 1993-07-08 1999-07-15 다나카 아키히로 작업편과 마스크의 간극설정방법 및 간극설정기구
JP3244894B2 (ja) * 1993-11-30 2002-01-07 キヤノン株式会社 マスク保持方法、マスク及びマスクチャック、ならびにこれを用いた露光装置とデバイス製造方法

Also Published As

Publication number Publication date
EP0881538A3 (en) 2001-02-21
JPH10335204A (ja) 1998-12-18
EP0881538B1 (en) 2008-07-23
JP3322167B2 (ja) 2002-09-09
EP0881538A2 (en) 1998-12-02
US6003828A (en) 1999-12-21
DE69839748D1 (de) 2008-09-04

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees