TW346247U - Semiconductor manufacturing apparatus and its dry cleanning mechanism - Google Patents

Semiconductor manufacturing apparatus and its dry cleanning mechanism

Info

Publication number
TW346247U
TW346247U TW086216930U TW86216930U TW346247U TW 346247 U TW346247 U TW 346247U TW 086216930 U TW086216930 U TW 086216930U TW 86216930 U TW86216930 U TW 86216930U TW 346247 U TW346247 U TW 346247U
Authority
TW
Taiwan
Prior art keywords
cleanning
dry
manufacturing apparatus
semiconductor manufacturing
semiconductor
Prior art date
Application number
TW086216930U
Other languages
English (en)
Inventor
Masaaki Ogawa
Toshio Shimizu
Mitsutoshi Furuyama
Takeshi Kubota
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of TW346247U publication Critical patent/TW346247U/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
TW086216930U 1995-08-30 1996-09-04 Semiconductor manufacturing apparatus and its dry cleanning mechanism TW346247U (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7221818A JPH0964019A (ja) 1995-08-30 1995-08-30 半導体製造装置およびそのドライクリーニング方法

Publications (1)

Publication Number Publication Date
TW346247U true TW346247U (en) 1998-11-21

Family

ID=16772676

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086216930U TW346247U (en) 1995-08-30 1996-09-04 Semiconductor manufacturing apparatus and its dry cleanning mechanism

Country Status (3)

Country Link
JP (1) JPH0964019A (zh)
KR (1) KR100272143B1 (zh)
TW (1) TW346247U (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6322714B1 (en) * 1997-11-12 2001-11-27 Applied Materials Inc. Process for etching silicon-containing material on substrates
US6143084A (en) * 1998-03-19 2000-11-07 Applied Materials, Inc. Apparatus and method for generating plasma
JP3430036B2 (ja) * 1998-10-29 2003-07-28 松下電器産業株式会社 薄膜の形成方法及び半導体発光素子の製造方法
KR100481312B1 (ko) * 2002-10-16 2005-04-07 최대규 플라즈마 프로세스 챔버
KR100488348B1 (ko) * 2002-11-14 2005-05-10 최대규 플라즈마 프로세스 챔버 및 시스템

Also Published As

Publication number Publication date
KR970013077A (ko) 1997-03-29
KR100272143B1 (ko) 2000-12-01
JPH0964019A (ja) 1997-03-07

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