TW345737B - Semiconductor integrated circuit - Google Patents

Semiconductor integrated circuit

Info

Publication number
TW345737B
TW345737B TW085110268A TW85110268A TW345737B TW 345737 B TW345737 B TW 345737B TW 085110268 A TW085110268 A TW 085110268A TW 85110268 A TW85110268 A TW 85110268A TW 345737 B TW345737 B TW 345737B
Authority
TW
Taiwan
Prior art keywords
circuit
ground line
semiconductor integrated
integrated circuit
input
Prior art date
Application number
TW085110268A
Other languages
English (en)
Inventor
Toshinori Hisada
Hiroyuki Koinuma
Original Assignee
Toshiba Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Co Ltd filed Critical Toshiba Co Ltd
Application granted granted Critical
Publication of TW345737B publication Critical patent/TW345737B/zh

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/02—Arrangements for writing information into, or reading information out from, a digital store with means for avoiding parasitic signals
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/10—Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
    • G11C7/1078—Data input circuits, e.g. write amplifiers, data input buffers, data input registers, data input level conversion circuits
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/14—Power supply arrangements, e.g. power down, chip selection or deselection, layout of wirings or power grids, or multiple supply levels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203—Particular design considerations for integrated circuits
    • H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
    • H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
    • H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
    • H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
    • H01L27/092—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors
    • H01L27/0928—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors comprising both N- and P- wells in the substrate, e.g. twin-tub
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/50—Peripheral circuit region structures

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dram (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Static Random-Access Memory (AREA)
TW085110268A 1995-09-01 1996-08-22 Semiconductor integrated circuit TW345737B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7225387A JPH0973780A (ja) 1995-09-01 1995-09-01 半導体集積回路

Publications (1)

Publication Number Publication Date
TW345737B true TW345737B (en) 1998-11-21

Family

ID=16828569

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085110268A TW345737B (en) 1995-09-01 1996-08-22 Semiconductor integrated circuit

Country Status (4)

Country Link
US (1) US5914505A (zh)
JP (1) JPH0973780A (zh)
KR (1) KR100224051B1 (zh)
TW (1) TW345737B (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3309898B2 (ja) * 1997-06-17 2002-07-29 日本電気株式会社 電源回路
IL121312A (en) * 1997-07-14 2001-09-13 Technion Res & Dev Foundation Microelectronic components, their manufacture and electronic networks containing them
IT1294271B1 (it) * 1997-07-23 1999-03-24 Sgs Thomson Microelectronics Interruttore elettronico integrato esente da dispersioni
US20030203394A1 (en) * 1998-05-04 2003-10-30 Yoav Eichen Detection of a target in a sample
IL126776A (en) 1998-10-27 2001-04-30 Technion Res & Dev Foundation A method of investing gold
US7364920B2 (en) * 1999-10-27 2008-04-29 Technion Research And Development Foundation Ltd. Method for gold deposition
US7936632B2 (en) * 2008-09-19 2011-05-03 Hynix Semiconductor Inc. Semiconductor device including an internal circuit receiving two different power supply sources
KR101635828B1 (ko) * 2010-08-19 2016-07-04 삼성전자주식회사 커패시터 장치 및 그 제조 방법
JP2013029963A (ja) * 2011-07-28 2013-02-07 New Japan Radio Co Ltd 定電圧出力回路
US11301740B2 (en) * 2019-12-12 2022-04-12 Au Optronics Corporation Integrated circuit, wireless communication card and wiring structure of identification mark

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3024774B2 (ja) * 1990-03-16 2000-03-21 沖電気工業株式会社 回路素子
US5111069A (en) * 1990-08-27 1992-05-05 Dallas Semiconductor Corporation Layout of integrated circuit with very large transistors
KR940003410B1 (ko) * 1991-08-01 1994-04-21 삼성전자 주식회사 망사 구조의 전원선을 가지는 반도체 메모리 장치
US5608594A (en) * 1992-04-14 1997-03-04 Oki Electric Industry Co., Ltd. Semiconductor integrated circuit with surge-protected output MISFET's
JP3137749B2 (ja) * 1992-06-30 2001-02-26 株式会社日立製作所 半導体集積回路装置

Also Published As

Publication number Publication date
KR100224051B1 (ko) 1999-10-15
JPH0973780A (ja) 1997-03-18
US5914505A (en) 1999-06-22
KR970017607A (ko) 1997-04-30

Similar Documents

Publication Publication Date Title
TW324122B (en) Noise isolated I/O buffer
TW326109B (en) Electric potential transfer semiconductor device
TW326622B (en) Semiconductor device, interposer for semiconductor device and method thereof
TW256013B (en) Installation board
EP0213037A3 (en) Semiconductor memory device having test pattern generating circuit
EP0893882A3 (en) High frequency switch device, front end unit and transceiver
TW278152B (en) A design method of clock generating circuit and pll circuit and semi-conductor device combined with clock generating circuit
GB2316814B (en) A radio telephone connector
KR900004252B1 (en) Semiconductor integrated circuit
MY125788A (en) Interconnection device and method
EP0481530A3 (en) Digital input circuit
EP0697732A3 (en) Driving circuit module
EP1158643A3 (en) Power distributor for vehicle
EP0592111A3 (en) Multichip module for integrated semiconductor components with a maximum of input and output options.
EP1198125A3 (en) Low light level photoreceptor
EP0337773A3 (en) Semiconductor integrated circuit device
KR960004744B1 (en) Signal output circuit in semiconductor integrated circuit
TW288117B (en) Semiconductor integrated circuit device
TW345737B (en) Semiconductor integrated circuit
TW431064B (en) Balun
TW368737B (en) Semiconductor integrated circuit device having high input/output connections
AU4460000A (en) Electrical terminal for an input-output module
TW366583B (en) Semiconductor device having an ESD protective circuitry
TW373312B (en) Semiconductor device, circuit board and combination of semiconductor device and circuit board
EP2348625A3 (en) Parallel power system and an electronic apparatus using the power system