TW332837B - The connection structure of embedded board - Google Patents

The connection structure of embedded board

Info

Publication number
TW332837B
TW332837B TW086112192A TW86112192A TW332837B TW 332837 B TW332837 B TW 332837B TW 086112192 A TW086112192 A TW 086112192A TW 86112192 A TW86112192 A TW 86112192A TW 332837 B TW332837 B TW 332837B
Authority
TW
Taiwan
Prior art keywords
connection structure
embedded board
frame
connected part
frame material
Prior art date
Application number
TW086112192A
Other languages
English (en)
Chinese (zh)
Inventor
Ryoo Matsumoto
Shirou Oohashi
Original Assignee
Nippon Karu Kinzoku Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Karu Kinzoku Kk filed Critical Nippon Karu Kinzoku Kk
Application granted granted Critical
Publication of TW332837B publication Critical patent/TW332837B/zh

Links

Landscapes

  • Joining Of Building Structures In Genera (AREA)
  • Building Environments (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
TW086112192A 1996-07-08 1997-08-25 The connection structure of embedded board TW332837B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17696596A JPH1018441A (ja) 1996-07-08 1996-07-08 パネルの連結構造

Publications (1)

Publication Number Publication Date
TW332837B true TW332837B (en) 1998-06-01

Family

ID=16022812

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086112192A TW332837B (en) 1996-07-08 1997-08-25 The connection structure of embedded board

Country Status (2)

Country Link
JP (1) JPH1018441A (ja)
TW (1) TW332837B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI492890B (zh) * 2012-06-29 2015-07-21 Sekisui Plastics Packaging materials and packaging

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BRPI0704162E2 (pt) * 2007-11-13 2009-10-06 Marco Antonio Vac aperfeiçoamento em suporte para piso elevado
JP5176203B2 (ja) * 2007-12-27 2013-04-03 コマニー株式会社 クリーンルームのパネル連結構造
JP5234977B2 (ja) * 2009-03-13 2013-07-10 株式会社熊谷組 電磁シールド構造
JP5213812B2 (ja) * 2009-08-06 2013-06-19 日軽パネルシステム株式会社 パネルの連結構造
JP7057251B2 (ja) * 2018-08-07 2022-04-19 日軽パネルシステム株式会社 積層パネル及び積層パネルの連結構造並びに積層パネルの製造方法
WO2021096416A1 (en) * 2019-11-15 2021-05-20 Sörmländska Invest Ab Prefabricated electromagnetically shielded construction element
CN112302208A (zh) * 2020-10-20 2021-02-02 惠州市鸿泰建筑工程有限公司 一种装配式建筑墙体及其施工方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI492890B (zh) * 2012-06-29 2015-07-21 Sekisui Plastics Packaging materials and packaging

Also Published As

Publication number Publication date
JPH1018441A (ja) 1998-01-20

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees