TW332837B - The connection structure of embedded board - Google Patents
The connection structure of embedded boardInfo
- Publication number
- TW332837B TW332837B TW086112192A TW86112192A TW332837B TW 332837 B TW332837 B TW 332837B TW 086112192 A TW086112192 A TW 086112192A TW 86112192 A TW86112192 A TW 86112192A TW 332837 B TW332837 B TW 332837B
- Authority
- TW
- Taiwan
- Prior art keywords
- connection structure
- embedded board
- frame
- connected part
- frame material
- Prior art date
Links
Landscapes
- Joining Of Building Structures In Genera (AREA)
- Building Environments (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17696596A JPH1018441A (ja) | 1996-07-08 | 1996-07-08 | パネルの連結構造 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW332837B true TW332837B (en) | 1998-06-01 |
Family
ID=16022812
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086112192A TW332837B (en) | 1996-07-08 | 1997-08-25 | The connection structure of embedded board |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPH1018441A (ja) |
TW (1) | TW332837B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI492890B (zh) * | 2012-06-29 | 2015-07-21 | Sekisui Plastics | Packaging materials and packaging |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BRPI0704162E2 (pt) * | 2007-11-13 | 2009-10-06 | Marco Antonio Vac | aperfeiçoamento em suporte para piso elevado |
JP5176203B2 (ja) * | 2007-12-27 | 2013-04-03 | コマニー株式会社 | クリーンルームのパネル連結構造 |
JP5234977B2 (ja) * | 2009-03-13 | 2013-07-10 | 株式会社熊谷組 | 電磁シールド構造 |
JP5213812B2 (ja) * | 2009-08-06 | 2013-06-19 | 日軽パネルシステム株式会社 | パネルの連結構造 |
JP7057251B2 (ja) * | 2018-08-07 | 2022-04-19 | 日軽パネルシステム株式会社 | 積層パネル及び積層パネルの連結構造並びに積層パネルの製造方法 |
WO2021096416A1 (en) * | 2019-11-15 | 2021-05-20 | Sörmländska Invest Ab | Prefabricated electromagnetically shielded construction element |
CN112302208A (zh) * | 2020-10-20 | 2021-02-02 | 惠州市鸿泰建筑工程有限公司 | 一种装配式建筑墙体及其施工方法 |
-
1996
- 1996-07-08 JP JP17696596A patent/JPH1018441A/ja active Pending
-
1997
- 1997-08-25 TW TW086112192A patent/TW332837B/zh not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI492890B (zh) * | 2012-06-29 | 2015-07-21 | Sekisui Plastics | Packaging materials and packaging |
Also Published As
Publication number | Publication date |
---|---|
JPH1018441A (ja) | 1998-01-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |