TW328937B - A charger assembly for a wafer carrying apparatus - Google Patents
A charger assembly for a wafer carrying apparatusInfo
- Publication number
- TW328937B TW328937B TW085114639A TW85114639A TW328937B TW 328937 B TW328937 B TW 328937B TW 085114639 A TW085114639 A TW 085114639A TW 85114639 A TW85114639 A TW 85114639A TW 328937 B TW328937 B TW 328937B
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer
- guider
- charger
- carrying apparatus
- grooves
- Prior art date
Links
- 230000008878 coupling Effects 0.000 abstract 1
- 238000010168 coupling process Methods 0.000 abstract 1
- 238000005859 coupling reaction Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
- Y10S414/138—Wafers positioned vertically within cassette
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950067538A KR100248864B1 (ko) | 1995-12-29 | 1995-12-29 | 웨이퍼 이송장치를 위한 챠저 어셈블리 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW328937B true TW328937B (en) | 1998-04-01 |
Family
ID=19447778
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW085114639A TW328937B (en) | 1995-12-29 | 1996-11-27 | A charger assembly for a wafer carrying apparatus |
Country Status (4)
Country | Link |
---|---|
US (1) | US5803697A (zh) |
JP (1) | JP3690893B2 (zh) |
KR (1) | KR100248864B1 (zh) |
TW (1) | TW328937B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19637875C2 (de) * | 1996-04-17 | 1999-07-22 | Steag Micro Tech Gmbh | Anlage zur Naßbehandlung von Substraten |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3209923A (en) * | 1963-03-27 | 1965-10-05 | Holstein & Kappert Maschf | Bottles and the like |
US3805943A (en) * | 1971-03-24 | 1974-04-23 | W Warren | Swivel-lift vacuum article loader |
JPS63122234A (ja) * | 1986-11-12 | 1988-05-26 | Mitsubishi Electric Corp | ウエハ移し替え装置 |
US5125784A (en) * | 1988-03-11 | 1992-06-30 | Tel Sagami Limited | Wafers transfer device |
KR0129405B1 (ko) * | 1988-04-25 | 1998-04-07 | 하자마 겐쥬 | 배열된 판형상체의 상호 피치간격을 변환하는 피치변환장치 및 피치변환방법 |
US4957406A (en) * | 1989-05-08 | 1990-09-18 | Intelmatec Corporation | Apparatus for transferring disks from one cassette to another with different pitch |
US5188499A (en) * | 1990-12-14 | 1993-02-23 | Mactronix | Method and apparatus for varying wafer spacing |
JP2756734B2 (ja) * | 1991-03-22 | 1998-05-25 | 大日本スクリーン製造株式会社 | 表面処理装置のウエハ移替装置 |
US5299901A (en) * | 1992-04-16 | 1994-04-05 | Texas Instruments Incorporated | Wafer transfer machine |
JP2812642B2 (ja) * | 1993-07-01 | 1998-10-22 | 三菱電機株式会社 | ウエハ整列機 |
US5562387A (en) * | 1993-10-04 | 1996-10-08 | Tokyo Electron Limited | Device for transferring plate-like objects |
US5632080A (en) * | 1994-07-26 | 1997-05-27 | Burr Oak Tool & Gauge Company, Inc. | Tube cutter/bender to lacer transfer station |
-
1995
- 1995-12-29 KR KR1019950067538A patent/KR100248864B1/ko not_active IP Right Cessation
-
1996
- 1996-11-27 TW TW085114639A patent/TW328937B/zh not_active IP Right Cessation
- 1996-12-27 JP JP35126596A patent/JP3690893B2/ja not_active Expired - Fee Related
- 1996-12-27 US US08/774,274 patent/US5803697A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR100248864B1 (ko) | 2000-03-15 |
US5803697A (en) | 1998-09-08 |
JP3690893B2 (ja) | 2005-08-31 |
JPH09191045A (ja) | 1997-07-22 |
KR970052017A (ko) | 1997-07-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |