TW318150B - - Google Patents
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- TW318150B TW318150B TW085106789A TW85106789A TW318150B TW 318150 B TW318150 B TW 318150B TW 085106789 A TW085106789 A TW 085106789A TW 85106789 A TW85106789 A TW 85106789A TW 318150 B TW318150 B TW 318150B
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
- C23C16/45568—Porous nozzles
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
- A61L27/00—Materials for grafts or prostheses or for coating grafts or prostheses
- A61L27/28—Materials for coating prostheses
- A61L27/30—Inorganic materials
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
- A61L27/00—Materials for grafts or prostheses or for coating grafts or prostheses
- A61L27/28—Materials for coating prostheses
- A61L27/30—Inorganic materials
- A61L27/303—Carbon
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
- A61L27/00—Materials for grafts or prostheses or for coating grafts or prostheses
- A61L27/28—Materials for coating prostheses
- A61L27/30—Inorganic materials
- A61L27/306—Other specific inorganic materials not covered by A61L27/303 - A61L27/32
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
- C04B41/5001—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials with carbon or carbonisable materials
- C04B41/5002—Diamond
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/85—Coating or impregnation with inorganic materials
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
- C23C14/0036—Reactive sputtering
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0605—Carbon
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/221—Ion beam deposition
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
- C23C16/4481—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by evaporation using carrier gas in contact with the source material
- C23C16/4483—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by evaporation using carrier gas in contact with the source material using a porous body
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
- C23C16/4485—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by evaporation without using carrier gas in contact with the source material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/503—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using dc or ac discharges
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F42—AMMUNITION; BLASTING
- F42B—EXPLOSIVE CHARGES, e.g. FOR BLASTING, FIREWORKS, AMMUNITION
- F42B12/00—Projectiles, missiles or mines characterised by the warhead, the intended effect, or the material
- F42B12/72—Projectiles, missiles or mines characterised by the warhead, the intended effect, or the material characterised by the material
- F42B12/76—Projectiles, missiles or mines characterised by the warhead, the intended effect, or the material characterised by the material of the casing
- F42B12/80—Coatings
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/14—Protective coatings, e.g. hard coatings
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
- G11B5/8408—Processes or apparatus specially adapted for manufacturing record carriers protecting the magnetic layer
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61F—FILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
- A61F2310/00—Prostheses classified in A61F2/28 or A61F2/30 - A61F2/44 being constructed from or coated with a particular material
- A61F2310/00389—The prosthesis being coated or covered with a particular material
- A61F2310/00574—Coating or prosthesis-covering structure made of carbon, e.g. of pyrocarbon
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T50/00—Aeronautics or air transport
- Y02T50/60—Efficient propulsion technologies, e.g. for aircraft
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/30—Self-sustaining carbon mass or layer with impregnant or other layer
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Medicinal Chemistry (AREA)
- Public Health (AREA)
- General Health & Medical Sciences (AREA)
- Dermatology (AREA)
- Animal Behavior & Ethology (AREA)
- Epidemiology (AREA)
- Veterinary Medicine (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Transplantation (AREA)
- General Physics & Mathematics (AREA)
- Structural Engineering (AREA)
- Nanotechnology (AREA)
- Plasma & Fusion (AREA)
- Optics & Photonics (AREA)
- Thermal Sciences (AREA)
- Combustion & Propulsion (AREA)
- General Engineering & Computer Science (AREA)
- Composite Materials (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
Description
318150 經濟部中央橾準局員工消費合作杜印装 A7 ------ B7五、發明説明(1 ) ~ " - 本發明背景本發明領域 本發明係使用似鑽石毫微複合物固態物作爲光學成分之 保濩塗層,尤爲如紅外感應窗等光學透射组件之塗層。 多種裝置使用紅外線感應器或窗以接受訊號作爲其遙端 控制。該感應器常與如飛機及導彈等高速移動裝置連接使 用。這些裝置及其他在高速下移動,使得紅外線感應器保 濩i曝露於相當大熱載及因顆粒衝擊之腐蝕。承受熱再加 上由顆粒撞擊窗所造成之傷害常超過窗承受限度。即使是 最小g氣灰塵顆粒亦會刮傷且長期言亦會相當腐蚀高速移 動物品上光學透射组件。 _ 當多種物質可用以克服如已上述溫度及腐蝕/磨蝕困難 時’選擇亦爲光學透射之合適物質爲受限的。在其上裝置 3 該等光學透射物以在高速移動時接收訊號之需要顯示了特 殊問題,其在該領域中仍未適當地討論解決。 例如製造紅外線透射窗之當今所用已知物質包括硫化鋅 (ZnS) '硒化鋅(ZnSe)、鍺(Ge)、矽(Si)、鑽石、砷化鎵— (GaAs)、磷化鎵(GaP)、熔氧化矽(31〇2)、氮氧化鋁 (A10N)、藍寶石(Al2〇3)、氧化鎂(Mg〇) '尖晶石 (Mg〇-Al2〇3)、立方結晶氧化锆(Ζγ〇2_9 4莫耳%γ2〇3) 乳化鑭接和之氧化乾(Υ2〇3_9% La2〇3) '氧化I乙 (0 3)、混合氟化物玻璃及其他。然而,該等作爲I R窗 之物質常因高速空氣摩擦造成之熱衝擊而損壞。在光學透 射窗因空氣動力加熱外表面而形成物質内溫度梯度,而造 _ -4- 本紙張尺度適用中國國家棣準(CNS ) A4規格(2丨〇X297公釐) ----:,---:----NI丨裝丨1 (請先閲讀背面之注意事項再填寫本頁)
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T 線 3i8j5〇 經濟部中央梯準局貝工消費合作社印装 A7 B7 五、發明説明(2 ) 成熱導致抗拉應力。例如在飛行迷度超過3馬赫之空對空 飛彈可得變化由約35CTC(在標高1〇公里、3馬赫時)至高於 约20〇〇°C(在海平面、6馬赫時)之停滯溫度。所述較高溫 度’因爲可能化學分解,不包括使用某些在8_12微米波長 範圍操作之物質,包括ZnS、ZnSe、GaP及GaAs。即使 具超卓光學、熱及機械性質之鑽石在高於650溫度之空 氣中仍會石墨化及氧化。 持夂多結晶光學物質氮氧化鋁(A1 ON)只在高至約4微米 之波常具高光學透射係數’其後透·射急速下降。同時, A1 Ο N因預見物質組合物(及由此之折射率)内週期性變化 故具有某些體積光學散射及波前扭曲。藍寶石爲具高強度 及低散射之光學物質。然而,在藍寶石之適合光學透射係 數,限制至波長至4微米。藍寶石之透射係數亦在高溫時 減少,且if加的發射降低了訊號對雜訊之比率(此在ΑΐαΝ 及尖晶石亦發生)。 雖然由氧化釔低於5微米之發射爲可忽略的,然而氧化把 具較差之機械及熱化學性質。在尖晶石、立方結晶氧化锆 、氧化釔、氧化鎂及氧化鑭掺和之氧化釔其可作業之光學 透射係數相似地限制在低於6微米。因此氧化物因而只能 用於約3至5微米之波長範圍,且受高溫性質限制。再者, 大部分物質之體積熱導率約爲7-50瓦/公尺-克氏溫度。 雖然鑽石具有高於其他物質一數量級之熱導率,使用鑽 石作爲IR窗物質可能有許多問題。當ZnS及ZnSe因其在 IR目標區域良好之光學透射係數,最常用作IR窗,這些物 ___ -5- 本紙張AA適用中關家標準(CNS ) ( 21qx_297公釐) ^ I^-- (請先閱讀背面之注意事項再填寫本頁)
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T A7 B7 經濟部中央榡準局員工消費合作杜印束 五、發明説明(3 ) 質爲”軟”的,故因此特別容易受高速顆粒衝擊之高溫腐蝕 惡劣環境之影響。 已嘗試施用以保護光學透射窗物質之保護塗層及膜以増 加窗物質之整體抗蚀性。似鑽石碳(DLC)膜已試實驗作爲 IR窗之保護塗層。參見米提(Mirtich)等氏科技期乱 〇_Vac· 年 11 月 / 12 月份 頁)。然而,DLC膜常需高溫及原子氫澱積,除非使用中介 層,否則此兩者皆會降解基片物質。介於基片及保護塗層 間之物質層(中介層)改善了塗層對基片之黏固性。然而不 幸地,$很難發現補助DLC物質之合適中介層。相反地, 该等中介層在咼溫時亦會剝離再複雜化該程序。 再者,中介層或甚至DLC塗層本身會妨礙常需要之高程 度的光學透射係數。爲有用計,任何用於光學透射窗之保 護塗層或中介層本身必須高度光學可透射。 、 又者,DLC膜典型具很高内應力。缺少足夠高内應力者 禁制了澱積如IR窗塗層常需要之厚、無孔膜。 發明概述 _ ί/依本發明揭示一種防牛光學透射基片腐蝕之方法,其包 括在該由交$所成之似鑽ϋ類製成Ϊ 塗層’該架構包含以氫穩定似鑽石嘆架構 架,及選用-之至少一由含週期表l-7b及8族元素之摻和化 A »/ ^ 1 . 一 s.. ... ..-·. ·.--------- 合物或竺:元製成.之架.楫。 在又一特徵,本發明係指一種由交穿架構所成之似鑽石 物質類製成之抗姓塗層,該物質由,該架構包括第一以氯
請 先 閲 讀 背 面 之 注 再 填 寫 本 頁 裝 1 丁 318150 ΚΙ Β7 發明説明 經濟部中央標準局員工消費合作社印裂 穩足似鑽石碳架構'第二以氧穩定之矽酮架構及随意地至 少一額外由含週期表^^及8族化合物或摻和元素之架構 〇 在本發明又另一特徵爲揭示由光學透射基片及抗蝕塗層 所製成之抗腐蝕物質,該塗層係由一種由交穿架構所成之 似鑽石物質類所製成,該架構包括第一以氫穩定似鑽石碳 架構、第二以氧穩定之矽架構及選用之至少一額外由含週 期表1-7 b-及8族元素之摻和化合物或摻和元素之架構。 圖面簡述. 圖1A-1C爲顯示二-網狀架構(a)、中介質(b)及三-網狀 架構(C)毫微複合物之主要微結構之示意圖。 圖2爲詳述製造複數〇匕仏主要方法之示意圖。 圖3爲詳,述使用反射光束流製造複數DLNs方法之示意圖 〇 圖4爲詳述殿積DLN塗層方法之再示意圖。 圖5 A - 5 F顯示系列圖形表示DLN塗佈及未塗佈樣本磨蝕 試驗之結果。 — 發明詳述 本發明係一種防止光學透射基片腐蝕之方法,其包括在 孩基片上塗用由交穿架構所成之似鑽石物質類製成之塗層 ,孩架構包含以氫穩定似鑽石碳架構、以氧穩定之矽架構 及選用t至少一由含週期表1-71)及8族元素之摻和化合物 或摻和元素製成之架構。 腐蝕意謂因與其他物品物理接觸在表面造成之物理傷害 :---^----^丨—-- (請先閱讀背面之注意事項再填寫本頁) 訂 Τ 線 良紙張尺度適用中國國家揉準(CNS ) A4規格(2ΐ〇χΐ97^5~ A7 B7 經濟部中央揉準局負工消费合作社印策 五、發明説明 。對如在武器或其他高速移動的遙端控制之物品地 /衝擊微塵粒可造成顯著可見傷害,其長期妨礙二 其塗層之表現及光學透射係數。 腐蚀對金屬及非金屬基片兩者士爲 令。為破壞力。例如,在固 定及移動兩情況下物品之塑膠及陷咨 及闹瓷表面必須常承受惡劣
環境影響,包括腐蚀。當基片曝霞分yt2 A a曝露於足以負面影響基片表 面之速度顆粒衝擊時,基片受到腐蚀㈣,如物理穿孔或 缺損。該腐姓可在曝料強風固定物上或本身高速移動物 σρ上發生。例如’因高速與如灰塵或麈粒顆粒衝擊,飛機 或飛彈窗户常顯示腐蝕現象。 除了抗腐蚀及高熱穩定外,本發明之抗#塗層不受生物 或化學衝擊且具高或抗物理顆粒衝擊。本發明塗層之抗蚀 性降低了如物理缺損之可能性。此造成基片之表面較不受 曝露於環境腐餘力之影響。塗層對基片具極佳黏固性且抗 熱衝擊及增溫和習知腐蝕習知.似鑽石塗層者。 已了解光學透射係數係指所欲幅射能或光線波長透過之 月&力。可用以製造I R透射窗之紅外線(丨R )透射基片透射波 長由约0.1微米至約20微米、較優1微米至约15微米及特優 由約2微米至約1 2微米之IR能量。若窗可娘大於約7 5 %之 IR透射發生時,即認爲其爲I r透射。 用以塗佈選用基片之較優抗腐蝕原子級似鑽石毫微複合 物(DLNs )的基本結構包含兩個或更多自身穩定隨意網狀架 構,每一以額外原子系化學穩定,同時兩網狀架構亦彼此 在結構上穩定。一個具該結構物質例爲似鑽石毫微複合物 -8 本紙張尺度適用中國國家標準(CNS ) A4规格(210X297公釐) (請先閲讀背面之注意事項再填寫本頁) 装· 訂 A7 B7 318150 五、發明説明( (DLN),其爲美國專利號5,352,493及1994年5月24日申請 之美國序號08/249,167之主要標的物。 在DLN中,主爲sp3”似鑽石”鏈結型之隨意碳網狀架構以 氫原子化學穩定,且似玻璃矽網狀架構爲以氧原子化學穩 定,故形成純非晶態結構。此處所謂"非晶態”係指隨意結 構或固態原子排列,而形成不再有大範圍規則排列,且缺 少結晶性或成粒性。該DLN物質具非晶態結構且不含大於 10埃之群-組。缺少此原子級群组爲本發明之DLN塗層之關 键特徵。群哼能破壞結構之非晶態性質、能當作降解之活 性中心且在光學成分情況下,能當作光散射中心。 因此,DLN(複數)不含群組或規則排列大於所定義配位 球半徑之三分之一。此結構已藉電子射影方法、掃描隧道 顯微術、原子力顯微術、掠視X光及電子繞射技術及高解 析度透射*子顯微術(TEM)。群組形成在來源、在主要臂 漿物、在反應槽空間、及在薄.膜生長時避免之。 經濟部中央梯準局員工消費合作社印製 本發明之似鑽石毫微複合物(DLN)類固態物之原子結構 示如圖1(A)。該物質可能有一或多個別非規則摻和體網狀-架構,如示於圖1(B)&1(C)。摻和體(Me)可爲任何週期 表l-7b及8族金屬及非金屬之一或組合,.且所有三型網狀 架構(C-H、Si-〇及若存在時,摻和體網狀架構:Me_Me) 主以弱化學鍵彼此連結。除了 C _ H網狀架構外之網狀架構 兀素可參照爲摻和元素。矽及氧原子亦可與其他元素及化 合物用於摻和網狀架構。可存在多於一個摻和網狀架構。 本發明之DLN塗層可含禹成分網狀架構·_似鑽石緩_氫架 -9 318150 A7 B7 經濟部中央橾隼局員工消費合作社印裂 五、發明説明(7 ) 構交穿以似玻璃矽-氧網狀架構。亦可用含矽-氧及碳-氫網 狀架構及一或多摻和網狀架構之三成分網狀架構,該摻和 體與前述兩交穿網狀架構交饰。在此情況下,在DLN内會 有三或多交穿網狀架構以形成所謂金屬-似鑽石毫微複合物 (M e - DLN)網狀架構。吾人了解亦可併合非金屬摻和網狀 架構當作選用摻和網狀架構,且與碳-氫及矽-氧網狀架構 交穿。 三網狀架構(碳-氫網狀架構、矽-氧網狀架構及摻和網狀 架構)間主以弱化學键彼此連結。即使在金屬濃度高至50% 時亦可防止碳化物之形成(以安格(Auger)電子光譜術、化 學分析電子光譜術(ESCA)、擴張X光吸收細構電子光譜術 (EXAFS)及傅立葉轉移紅外線光譜術(FTIR)證實)。再者 ,.這些物質之性質依摻和體及所設濃度和澱積技術及參數 而定,可i大範圍變化。如已述,這些複合物結構可調整 至原子級。因此可賦予DLN塗層獨一電子、光學及其他所 欲固態性質及所欲機械強度、硬度及抗化學性。 可用於Me-DLN網狀架構且用作抗腐蝕Me-DLN塗層之 掺和體特別有效之較優摻和元素爲硼、鋰、鈉、矽、鍺、 碲、氧、翻、鎢、纽、說、免、依、柏、訊、鐵、#、鎂 、鐘、鎳、鈥、錯·、絡、鍊、給、銅、銘、氣、銀及金, 其中鎮、路、錯、飲及給爲較優。可用作摻和體之較優化 合物包括氮化鈦、氮化硼、氮化鋁、氮化錯、氮化鉻,其 中氮化鈥、氮化銘及氮化絡爲最優。 似鑽石毫微複合物内碳含量大於DLN之約4 0原子%。雖 -10- .--^---_----^ 莽 (請先閲讀背面之注意事項再填寫本頁) Η 本紙張尺度適用中國國家標準(CNS ) A4规格(210 X 297公釐) A7 ----- B7 五、發明説明l8 ) ~~ — 〜-- 然DLN理論上可無任何氫製備,氫含量較優至少爲碳濃度 心約1原子%至高至約4〇原子%。碎、氧及摻和元素和含挣 和體化合物之和大於DLN之約2原子〇/c^在一較優實例中, 碳比石夕原子之比率爲由約2 : 1至約8 : i、氫比碳肩子之比 率爲由約0.01 : 1至約0.4 :丄、矽比氧原子之比率爲由約 0.5 : 1至約3 : 1而摻和體比碳原子之比率爲由約〇 :丄至約 1.5 : 1。因此,在dln網狀架構中,對每一部分碳言,就 會有由約P.01至約0.4部分氫、由約〇 125至約〇 5部分矽及 由約0.0375至約1.0部分氧。此設計下,若有第三摻和網狀 架構,依所欲賦予Me-DLN網狀架構特性而定,則對每一 4分碳s,就會有由約〇.〇1至約1.5部分之掺和體。 以氧穩足(似玻璃碎架構之存在作用爲防止在高溫時石 墨碳足生長、防止在含金屬三-網狀架構毫微複合物形成金 屬群組、降低在毫微複合物結構之内應力及增進對基片之 黏固。此顯見可導致本:發明<DLN(複數)直接極佳地黏固 至基片物。 如已述者,爲改善塗層之黏固,DLC塗層常需介於基片— 及DLC塗層間之中介層。經常地,若D L c塗層太厚,則會 成片剥離。令人驚訝地,以本發明之DLN·塗層之黏固性好 到不需中介層。其結果是,DLN塗層可直接施用至基片, 且再厚也不用冒由基片剝離之危險。施用較厚DLN塗層之 能力來自矽-氧網狀架構之低内應力,且咸信亦造成DLN塗 佈基片之極佳抗腐蚀性。 再者,免除中介層增加'設計保護塗層之可撓性,且保護 L___- 11 - 本纸張尺度適用中國國家揉準(CNS ) 格(2丨〇><297公釐) 318150 A7 B7 五、發明説明(9 經濟部中央標準局貝工消費合作社印裝 塗層保持光學清晰或例如對可見光及丨反幅射之光學透射。 雖然已知許多硬D L C -型塗層,本發明之Dln塗層爲自身 IR及可見光透射,故不會明顯破壞塗佈窗基片物質原透射 係數。 DLN之透射係數可藉選用用以解放碳、氫、矽及氧原子 組成成分之先質加以控制。一般言之,先質爲選用聚苯基 甲基矽氧烷族群中,因此元素之比率最適於在所欲光學波 長範圍内之所欲光學透射。例如,對長紅外線透射言,特 別是在由約8至約12微米之範圍内,.接近1〇微米之矽-氧吸 收光4必須極佳化。因此,所選先質具低矽-氧對碳-氫比 率。然而,矽-氧之存在提供了低應力及高黏固性,因此不 應芫全免除矽·氧網狀架構。 ^ 若需要時,本發明DLN塗層之特性可藉在層澱積第三網 狀组構時彳子細檢視併合入金屬之量預訂或"調整",而可用 以極小化殘跡,例如極小化偵測裝置檢測之風險。本發明 之DLN(複數)可澱積在多層及功能性級位置上,以調整光 學及電子性質以獲得所要某種表現要求。該”調整”爲逐漸 增加特定摻和體、摻和之濃度、及/或澱積條件,如偏向 電壓基片之電壓而完成。DLN(複數)當不.含摻和體時,其 性質亦可改變或”調整”。在兩網狀架構系統性質之該變化 可藉改變殿積條件,如偏向電壓基片之電壓而完成。 本發明之DLN(複數)具遠超過傳統似鑽石(dlC)物質之 溫度穩定性。例如,結晶鑽石至約11〇(rc穩定,其後發生 石墨化。石英具長期熱穩*定性至147〇°C及短期熱穩定性至 12 本紙張尺度適用中國國家標準(CNS ) A4規袼(2!〇χ297公釐 (請先閲讀背面之注意事項再填寫本頁) -裝- 、1Τ 線 A7 ----___ 五、發明説明(1〇) 1700°C。傳統上,非合金似鑽石(D L C )薄膜只穩定至約 600 C,其後發生石墨化。相反地,用以_提供本發明之抗 触塗層之DLN物質具長期熱穩定性至1250°C及短期熱穩定 性至2000Ό。因此DLN(複數)之熱穩淀性超過DLC者,但 保持非晶態、似鑽石及光學透射狀態。 再者,在由約600°C至約1000°C之範圍内,DLN物質之碳 網狀架構化學鍵結部分由Sp3變成Sp2。然而,毫微複合物 之一般結褲及其”似鑽石”性質仍保持。相反地,在相似情 況下,一般”似鑽石,,碳(DLC)爲石墨化且喪失其似鑽石性 質。對曝露於由約400。(:至500 Ό (較優430。(:)溫度範圍之 DLN(複數,可見相反轉型,因此Sp3對Sp2之比率增加 了。 經濟部中央樣準局員工消費合作社印製 碳-氫及矽-氧兩網狀架構DLN之密度介於由約1.8至約2.1 克/立方'公分。剩餘空間由隨意徑度由約0 28至約〇 35,毫 微米之t微孔網狀架構佔據。.毫微孔網狀架構不形成群組 或微孔。如已述者,兩網狀架構DLN之性質可藉加入掺和體 而訂製。該摻和體以隨意方式充滿毫微孔網狀架構,最後 在即使高至50原子%之濃度之某一摻和濃度形成額外無群 组或微晶粒網狀架構。在低於約丨〇原子。/q之濃度,摻和體 在似鑽石網狀架構内毫微孔中分佈成分離原子。在此擬隨 意結構内摻和原子間平均距離可以摻和濃度控制。當摻和 疋素或化合物之相對濃度達到約2 0 - 2 5原子。/〇時,如示於 圖1(C) ’掺和體在DLN結構中形成第三(Me_Me)網狀架構 ’造成具似鑽石機械及化學性質之物質。 ___ -13- ) A4*#. ( 210X297/av*7 '~--- A7 --- ------ B7 五、發明説明(11 ) " ~~~- 在中間^度範圍,當摻和濃度由約〗〇至約2 〇原子%,摻 和ea形成碎裂随意網狀架構而無眞正似網狀架構連灶。碎 裂摻和”網狀架構”之電子性質強烈地決定於外機械^載、 壓力及電磁場。具摻和濃度範圍在由約i至約2〇原子%之 M e DLN(複數)當作爲智慧物及感應器時爲理想的。”智慧 物咸知局不只感應到外在刺激且亦能反應而進行適當調整 以回應之物質。 本發明之D L N結構之電子性質在大範圍數量級中變化(至 v 1 8級),由純介電質至金屬態,但仍保留及改善〇 l匸態 足性質。轉移至無電阻之超導狀態對某些三-網狀架構毫微 複合物網狀架構内可在低溫獲得。 - 另本發明之DLN(複數)優點爲其相對硬度及持久悻。 PLN(複數),特別是金屬摻和〇1^(複數)具有高微硬度及 鬲彈性。’本發明之DLN(複數)之微硬度値由約6至约3〇十 億巴。 DLN(複數)可以相關元素離子、原子或作用基無群组束 共澱積製成,其中每一粒子系平均自由路徑超過介於其來― 源及成長顆粒膜表面間距離,且每—束含足供應用能量粒 經濟部中央梯準局貝工消費合作社印製 子。含碳顆粒束可以電漿槍移除電漿且以.眞空槽内偏向電 壓基片高壓場抽出帶電顆粒而製成。至少5〇%含碳顆粒具 動能高於約100電子伏特。在長成中基片之溫度應不超過 500Ό。 圖4顯示一用作〇1^塗佈澱積程序之塗佈槽之較優實例。 供眞i炎積槽1以塗佈墓片樣本。先質入口系統1 3包本 -14· 本紙張尺度適用中國國家揉準(〇^)八4^格(210父29*;公变) A7 _______B7 五、發明説明(12 ) ~~ ~~ — 金屬管及多孔陶瓷物3,較優爲局矽氧烷之液體先質經此 注入。圖面顯示先質入口系統13經槽基片丨〗併合入槽中。 熱陰極2含一阻抗加熱鍍鉦鎢絲4。欲塗佈DLN膜之基片5 連至基片固放器6。電源8爲用以偏向電壓基片(直流或高 頻)。在實務上系統爲使用正常眞空泵降程序,,泵降”。置於 蜂7 4閘閥(未顯關上,而系統再充以乾空氣、氮或氯直 至槽達大乳壓。而後打開槽門9,使用許多可能方法(線夹 、螺栓、如夹等)之任一將欲塗佈基片5連至基片固放器6 特殊形狀基片可能而要特殊固定器。基片固放器設計方 式爲其亦可固放筒狀樣品(未顯示),其中在操作時除了沿 中央轉柱10軸外亦沿其垂直於1〇之自身軸旋轉。在此方式 ,筒之轴必須垂直於軸1 〇。 當裝入基片時,關上槽門。而後槽抽眞空,打開閘閥以 將系統壓> 降至至少10-5至10-6托耳,其爲所欲系統基壓 範圍。當達到上述基壓時,氬氣由闕或量流控制器導入槽 中直至槽壓達到約5χ 1〇-5至lx 10-3牦耳,較優约卜3χ 經濟部中央標準局貝工消費合作社印裝 1〇-4托耳。在此時絲電流,絲偏向電壓及電磁力供應源打-開。絲電流爲流經熱陰極(亦稱作絲或陰極)之電流。絲偏 向電壓爲施用於絲上固定浮動電壓(相對於.接地爲約_15〇伏 特)。電漿電流爲衡量介於絲及基片或地面間之電流。此電 壓提供場,其將由絲釋出電子移至基片U。電磁力供應源 提供%流至電磁組,其產生磁場使得電予路徑變成螺狀, 增加電子路徑長度且改善電子及先質蒸發產生蒸氣分子間 碰撞機率。同時基片偏向淹壓電源亦打開。 _________ - 15- 本紙張尺度適用 ( CNS ) Α4ϋΓ( 210X297^* ) ^18150 A7 B7 經濟部中央標準局員工消費合作社印裝 五、發明説明( 打開這些電源造成氬電裝之生成,其麵積前用以清洗 基片。、在所要清洗時間達到後,打開先質供應。先質流以 針閥拴制’其產生乃因爲槽及外部大氣間壓力之不同。另 種導入先質之方法’如機械泵亦可應用。 當二流及在槽内蒸發已穩定時,關閉氬氣流。離子化 先質条氣形成穩定電漿,因基片偏向電壓,離子由其中加 速朝向基片固放器。因此,產生DLN膜之殿積。 掺和物質之共殿積如下進行。在基壓達到後,氬氣開始 流至磁極,且磁極8電源打開。間12用以防止基片在㈣ 清洗後澱積。、當清洗完成後,閥打開且㈣在所欲能量水 平上進行。依所需何種膜結構及组合物而定,此可在開始-DLN膜澱積開始前、進行中、進行後或交互間歇發生?使 用直流或高頻濺射,所有種類物質(金屬、陶瓷、合金等) 皆可用於#澱積。其他摻和體束來源可包括但不限於熱蒸 發、電子束蒸發或離子束。 參照圖4,毫微複合物膜成長條件爲如下。殿積槽1之壓 力應不超過10-3牦耳,且在電漿產生活化區2之壓力範圍-介於約\oxl0·3至約5.0xl〇-2乾耳。基片之溫度應不超. k 3 00 C,且在陰極絲之溫度範園由约.^ 1 〇〇至約 。陰極絲之電流爲由約40至约130安培,較優爲由约7〇至 約130安培,且經過絲之電壓爲由約5至约3〇伏特,較優爲 由約20至約30伏特。相對於接地之電壓爲由約7〇至約2⑽ 伏特,較優爲由約70至約13〇伏特,且電漿電流爲由約〇5 至約20.0安培。基片固放-器之電壓爲由约〇1至约5 〇千 -16- 本紙張尺度適用中國國家揉準(CNS )八4^格(210X297公着) 1—:--:---^--裝一I (請先閲讀背面之注意事項再填寫本頁)
、1T 線--:I. ------ 經濟部中央標準局員工消費合作社印裝 A7 ---- — __B7 五、發明説明(14 ) 特,且所有含碳及含矽系列具動能範園分別爲由約1〇〇至 約1200電子伏特及由約2 5至約3〇〇電子伏特。金屬原子/ 離子之動能不超過約25電子伏特。先質之流率爲由約〇5 至約5.0毫升/小時時,dlN之長成速率爲由約〇〖至約2 〇 微米/小時。 對大多數應用之較優操作範圍爲壓力約丨_ 3 χ丨〇 -4托耳 、電漿電流約1安培、絲之電流爲由約6 〇至約7 5安培、基 片之電壓-爲由約600至約1000伏特直流電,或射頻區約1〇〇 瓦特向前電能。射頻區較優頻率爲.由約9 〇至約450千赫茲 、更優爲由約9 0至約3 00千赫茲。較優磁極能量依dln塗 層所欲物質型態、組合物及結構而定。 在又另一較優實例中,較優澱積方法使用三極電漿槍釋 出電漿,如示意於圖4,且電漿能量密度高於約5千瓦小時 /碳·克原子。充電顆粒以眞空槽内高場吸出且導向基片。 較優基片固放器之能量電壓爲由約_〇 3至約+5 〇千伏特, 且特優爲1.0+ /-0.2千伏特,且其頻率變化範圍爲由約〇至 約2 5百萬赫兹直流電或高頻區由約9 〇至約3 〇〇千赫茲。在 電漿槍中釋出電子比碳先質流之比率爲由約〇 5至約15電 子/顆粒。 進行特殊努力以極小化澱積槽污染物之存在。這些污染 物可能包括非所欲金屬系、水、氧、氮或其.他元素或化合 物及其化合物或基,其吸收光譜位於所欲高光學透射所要 t波長。因此考量之施行步驟可包括在低壓操作、以惰性 企體如氬急沖、維持極度'乾淨槽、保證擴散及機械泵油爲 __ ___ . 17 - 本紙張纽ϋ财,〇χ29Ί/^) ------------裝------訂-----「線 ί ( (#先閱讀背面之注意事承再填寫本頁) A7 B7 五 經濟部中央標準局貝工消費合作社印装 '發明説明I:15 乾淨及其他此等對熟諳此項技藝者已明知極小化眞空槽内 亏染物之步驟。存在污染物量可以殘氣分析儀監視。 再者,基片電壓/偏向電壓對矽_氧對碳_氫比率有影響 。、爲極佳化此比率,特別是高紅外線透射言,I片電恩/ 偏向電壓範圍應介於由約1〇〇至約7〇〇伏特。 相似特殊注意及步驟必須採行以在其他光譜範圍獲得高 光學透射。爲調整塗層折射係數,掺和系及殿積條件(包括 基片偏向電壓)必須適當選擇。 有機矽化合物,如矽氧烷爲碳、氫、矽及氧之較優先質 板優有機矽化合物爲含五至“個矽原子之聚苯基甲基 矽虱烷。高沸點矽氧烷可經多孔陶瓷或金屬_陶瓷(圖2之/ 及圖3)直接導入活性電漿區’其以熱電極4幅射加熱。熱 電極之光子及電子釋出影#料表面先質分子蒸發、碎裂 及離子化,故其爲當作電漿產生器之離子源。另一注入矽 氧烷先質之方法爲使用擴散泵.直接注入。 含摻和體束之可藉下列方法任—或合用:”熱蒸發;2) 離子濺射;3)離子束。含摻和體束經眞空槽直接指向長成-膜表面以在澱積槽本身内去除粒子間碰撞。基片置於相連 槽内旋轉基片固放器(例如一鼓狀物),其保證雙旋轉動作 ,該相連槽以開π連至電漿產生槽以供原子或離子束釋出 ,如示意於圖3。另一方面,電漿產生可在含基片之槽(圖 4)内進行。直流或收音機頻率能量一般在澱積程序中施用 於基片。不而外部加熱基片。基片固放器可特設計以握住 對熟?f此項技藝者已明知之不同形狀(如筒狀)之零 - _ 1 - 1 〇 - 本紙張尺度適用中國國家裸準(CNS ) A4規格(2丨0X297公釐) 五、發明説明( 16 A7 B7 經濟部中央標準局貝工消費合作社印製 吾人亦應了解到對特定所欲應用言,含掺和體層可選擇 性地與非摻和DLN層殿積。再者,具變化量摻和體之摻和_ DLN層亦可如所欲的順序地系列地或選用地與非摻和dln 物質澱積。在上述方法之有用變化以澱積DLN膜包括使用 賤射碎及氧氣爲矽及氧之先質,及使用濺射碳及氫或羥氣 爲碳及氯之先質或其任何混合物。 爲殿積於如塑膠之非導電性基片言,如示意於圖3中之方 法,中性.基流由南壓目標反射且指向基片。此程序應用相 似於圖2所示之澱積,除了反射電極.8用以產生中性束。此 方法去除由充電及/或快速顆粒衝擊長成中基片所得基片 表面傷害。 - 較優澱積超薄介面DLN膜含離子撞擊(例如氬+或鉀+ ?其 能量在由約30至約150電子伏特之範圍)經眞空槽,其已以 矽氧烷蒸氣(約3 X 1 0 - 4托耳)回填。此形成毫微複合物膜 之自身穩疋成長,其最大厚度以釋出吸收基電荷最大隧道 距離而加以控制。 、極均勾及非彡孔超料電膜可依本發明澱積。澱積削 塗層之厚度/又有任何理論限制。現存技術及現有設備可讓 原子級複合物膜及塗層厚度典型範圍由約丨微米至約1〇微 未。依本發明,可澱積膜厚度範圍由約6至約8 優爽積膜厚度由約3至約5毫微米。 因此,只依所欲塗層基片應用而定,上述本發明之可撓 =塗層:澱積在選用基片厚度由數毫微米至數微米,較優 、.、勺20宅微米至12微米。澱積因此可預訂或”調整”以符特
尺度咖中關家標率(CNS -19 )A4現格(21 qX297公董) 请 先 閲 讀 背 $1 之 注 意 事 再 填 -I裝 頁 訂 線 經濟部中央標準局員工消費合作社印策 A7 ----------B7 五、發明説[(17 ) ~ '--- 定應用所需性質。随意交穿二-或三-網狀架構dln( . 保證在所有方向結構之均勻強度。結構即使在厚8〇埃時(8 笔微米)亦無微孔。DLN (複數)因此極穩定且具單—化學、 機械、電子及超導性質之組合。 子 下諸例只用作再説明本發明之各方面,且不能視爲 本發明。 例1 PLN塗層之避籍 兩微米厚DLN塗層澱積於硫化鋅紅外線窗。窗清洗且以 金屬夾置於澱積槽内基片固放器。爲清洗基片,關上槽栗 降至5x 1〇-5托耳。氬氣流導入槽中直至槽壓達到3 36χ-1 〇 _ 4托耳。打開絲電流且增至6 〇安培,而絲偏向電壓· i⑼ 伏特JL電磁電流爲250毫安培。基片之射頻偏向電能開至 頻率237千赫茲1〇〇瓦特向前電能。基片旋轉且保持速度在 7圈/分鐘。在電漿清洗5分鐘後,打開先質針閥至設定3 毫升/小時。在約5分鐘後,氬氣流停止。可得電衆電流 約1安培。基片負載功率爲約8 〇瓦。在澱積約3 〇分鐘後,-基片偏向前及負載功率降低約2 5 %。在約3小時後,先質. 閥關閉且關掉電源。讓槽及其中基片冷卻、槽而後回填氮 氣且DLN塗佈紅外線窗由基片固放器移除。 例2 DLN塗層之黏固性 ' 依如述於例1方式所製得且施用至基片之DLN塗層進行定 性測試以決定塗層對多種知質之黏固性。DLN塗層對下列 -20- 本纸張尺度適用中國國家標準(CNS ) A4规格(210X297公釐) (請先閱讀背面之注意事項再填寫本頁) -裝·
、1T 線 3 經濟部中央橾準局員工消费合作社印製 18150 A7 __ B7 "hq ~~ ~--------- 五'發明説明() 金屬基片:鐘、銘、欽、锆、铪、.鏡、运、絡、如'竭、 銖、鐵、鈷、鎳、銀、铜;對下列陶瓷:西托(sitall)、石 英及铭基陶资基片、氧化锆、金屬陶免等;及塑膠基片: 聚亞醯胺、鐵氟龍、高密度聚乙烯、聚脲酯、玻璃纖維_樹 脂複合物、壓克力、聚矽酮、環氧複合物等;具良至優黏 固性。表1顯示DLN及D L C塗層對多種基片間黏固性之主 要比較表。 黏固問题通常發生於D L C塗層,如剝落或碎裂,DLN塗 層因其高黏固性質則不會發生。塗層與基片物間之中介層 可藉調整澱積條件特別訂定以達高度黏固。 表 1 DLC及DLN塗層之黏固性 - 黏固性 最小中介層厚度(毫微米) 基片 DLC DLN DLC DLN 鋼 ++ +++ 20-40 2-3 鋁 ++ +++ .. 3-5 ++ +++ 一— 2-3 銅 — ++ 騎細 5 金 ~ ++ <25 5 姑 — +++ 5-10 鉻 — +++ 5-10 鉬 一 +++ 5-10 鎳 — +++ 一 5-10 -21 - 本紙張尺度適用中國國家榇準(CNS ) Μ規格(210X297公釐) A7 B7 五、發明説明( 19
(锖先Μ讀背面之注意事項再填寫本莧) -装· . 例3 务衡擊 鎢.摻和(W - DLN)熱阻器之性質在毫微秒久丄、古 <敢南溫南 於700 C之·2 X 1〇8熱脈衝後不具可衡量改變。' 取向溫高於 1200 C之107脈衝後,w-DLN無法衡量到任何改變。再者 ,1700°C之單脈衝後,W-DLN無法衡量到任何改變。相反 地,DLC塗層在由約400-50CTC之溫度轉移至似石墨結構 〇 例4 機械性質 鋁硬碟樣本以DLN塗層塗佈以跟D L C塗層比較機械性質 A.摩擦係數 DLN塗層及D L C塗層之摩擦係數使用硬碟塗層之I S Ο (世 界品質標準)測試方法決定。DLN塗層之摩擦係數兩倍小於 DLC(複數)。 -22 本紙張尺度適用中國國家標準(CNS ) A*规格(2ΐ〇χ297公釐) 訂 經濟部中央標準局貝工消費合作社印製 7 Β 五、發明説明(20 ) B.硬度及模度測試 硬度及模度衡量使用毫微測定器測試依例1所述製備樣本 。DLN(複數)顯示硬度爲7-2 1十億巴及模數爲80-200十億 巴。在曝露於由約400-500 °C之增溫後,數値只發現破壞約 10%。 例5 光學性質 · 二-網狀架構DLN之吸收邊緣重合於紫外線/可見光邊界( 波長約350毫微米)。光學密度在紫外線範圍爲高。透射在 可見光及近紅外線區域直至波長爲約6微米單調增加。此 透鏡反應決定於澱積程序且可能需要而不同。高透射性使 用FTIR分光術衡量可見高至約25 -40微米。含金屬DLN(複 數)膜(Me-DLNs)具高吸收性且增加導電性。 依膜成i之能量條件及先質系統而定,折射係數(在波長 630毫微米)在二-網狀架構DLN爲由1.7至2.5之範圍。某一 M e - DLN膜之折射係數範圍如列於下表2。DLN塗層之折射 係數及透射光譜之變化依塗層組合物而定。,χ -光之透射亦 爲可變的故亦可控制爲長成條件之函數。 (請先閱讀背面之注意事項再填寫本頁) 經濟部中央樣準局員工消费合作社印製 表2 鎢-DLN 铪-DLN 锆-DLN 鋁-DLN 矽-DLN 鈮-DLN 钽-DLN 最 浙射係數 2.25 2.15 2.51 3.27 2.20 2.30 2.50 最大折射係數 3.90 3.10 3.10 3.69 2.74 3.80 3.10 -23- 本紙張尺度適用中國國家標準(CNS ) Α4规格(210X297公釐) 經濟部中央標準局員工消費合作社印裂 5J8i5〇 Α7 ---__ Β7 五、發明説明(21 ) 勒理腐蚀測試
比較例A 叙樣本施以ASTM D968 A方法之落沙磨蝕測試。測試結 果如示於圖5 A。 例6
塗佈約3微米厚給_DLN塗層之鋁樣本施以ASTM D968 A 方法之落沙磨蝕測試。測試結果如示於圖5B。 - 例7 塗佈约3微米厚DLN塗層之鋁樣本施以ASTM D968 A方法 之落沙磨蝕測試。測試結果如示於圖5 C。
比較例B 不銹鋼樣本施以ASTM D968 A方法之落沙磨蝕測試。測 試結果如市於圖5 D。 ' 例8 塗佈約3微米厚給-DLN塗層之不銹鋼樣本施以ASTM D968 A方法之落沙磨蝕測試。測試結果如示於圖5 E。 例9 塗佈約3微米厚DLN塗層之不銹鋼樣本施以ASTM D968 A 方法之落沙磨蚀測試。測試結果'如示於圖5 F。 在所有例6 - 9之情況下及比較例a - B,圖5 A - 5 F之所示 拓.痕爲測試試樣(2吋見方)腐蝕區域之尺寸及形狀。列於圖 5 A - 5 F下之體積爲用作測試砂的體積。 例6-9及比較例A-B測試資料再顯示於表3。對塗佈試樣 言,測定磨穿3微米厚層所需砂量。”磨穿π之決定爲主觀 -24- 本紙張尺度逋用中國國家標準(CNS ) Α4規格(210X297公复) (請先閲讀背面之注意事項再填寫本頁) 裝· 、1Τ Α7 Β7 五、發明説明(22 ) ~ 裸視測試。對未塗佈試樣言,因無法衡量磨蚀區域深度, 以2升砂腐蝕區域總區域拿來當作腐蝕程度之數値衡量。 參見圖6A-6F。在測試後,相同砂量未塗佈鋁之腐蝕區域 約爲塗佈DLN鋁之三倍。相同砂量未塗佈不銹鋼之腐蝕區 域約爲塗佈DLN不錄鋼所見之六倍。腐蝕測試在每一樣本 之三個位置進行。 表3抗腐蝕性比較. (諳先閱讀背面之注意事項再填寫本頁} .裝_ 砂升數 腐蝕(μ、 例號 試樣 feiTl 範圍2 範圍3 範圍1 範圍2 範圍3 平均升/ 腐蝕 A 鋁 2.00 ——— 0.17 ... 0.17 6 鋁/绮-DLN 1.00 1.25 1.10 0.33 0.42 0.37 0.37 7 鋁/DLN 1.50 1.50 1.40 0.5 0.5 0.47 0.49 B 不銹鋼 -- 2.00 --- 0.20 0.20 8 不銹鋼/給-DLN 3.00 2.65 2.65 1.00 0.88 0.88 0.92 9 不銹鋼/DLN 1.75 2.00 1.65 0.58 0.67 ' 0.55 0.60 、βτ 經濟部中央標準局員工消费合作社印製 本發明之許多其他調整及改變對熟諳此技藝操作者言因 本發明説明即可了解到是可能的。因此了解者,本發明能 以此特述其他方式操作仍於本發明申請專利範圍之領域内 -25- 本紙張尺度適用中國國家標準(CNS ) Α4規格(210 X 297公釐)
Claims (1)
- 318J50 A8 B8 C8 D8 經濟部中央樣準局員工消費合作社印裂 、申請專利範圍 ~- 1·—種㈣光學透射基片腐蚀之方法,其包括在該 塗敷由互穿網狀結構所成之似鑽石#料種類所製成之塗 層,該網狀結構包括以氫安定化之似鑽石碳網狀社構、 以氧安定化切網狀結構及制之以—料切期表 弟l-7b&8族元素之掺雜劑元素或摻雜劑化合 之網狀結構。 2_根據申請專利範圍第i項之方法’其中碳m氧 係得自具有約丨至約10個矽原子之有機矽氧烷之分解。 3·根據申請專利範圍第2項之方法,其中有 苯基甲基矽氧烷。爲聚 4. 根據中請專利範圍第β之方法,其中碳料之重量比. 爲約2 : 1至約8 : 1。 5. 根據中請專利範圍第Μ之方法,丨中該塗層係沉積於 金屬基>4上。 6. ::申請專利範圍第丄項之方法…該塗層係沉積於 非金屬基片上。 7·根據中請專利範圍们項之方法,其中捧雜劑元素係選 自包括··硼、鋰、鈉、矽、鍺、碲 '氧、鉬、鎢 '鈕、 鈮、鈀、銥、鉑、釩、鐵、鈷、鎂 '錳..、鎳、鈦、锆、 鉻、錁、給、铜、鋁、氮、銀及金。 8.根據中請專利範圍第μ之方法,其中似罐石材料之碳 含量係大於塗層之約40原子%,氫含量至高爲碳之約4〇 原子。/。,且#、氧及摻雜劑—起之和係大於似绩石材料 之約2原子%。 ’ (请先閣讀背面之注意事項存填寫本貫) T 订 線 ........ -111 26- 本紙張^^適用中國國家標隼(CNS ) Α4規格(2似297公釐 1 I i申請專利範圍 A8 B8 C8 D8 鲤濟部中央榡準局員工消費合作社印裝 9·根據中請專利範圍第i項之方法, 射性。 、中孩塗層爲光學透 種由互穿網狀結構所形成之似雜石从』丨 抗触η、、… 罐材料種類所製成之 -蝕t層’ m網狀結構包括第—種 歿網狀結構、第二種以氧安定化之对:女疋化I似鑽石 至小—虱女弋化疋矽網狀結構及選用之 人^遇期表第卜713及8族元素之摻_元素或化 «物<另外網狀架構。 = 圍第1G項之塗層,其中竣、氫、碎及氧 12報:!1至約10個秒原子之有機秒氧垸之分解。 -很據申請專利範圍第L1項之塗 ^^ m 增其中有機矽氧烷爲聚 幕基曱基矽氧烷。/ 13. 根據申請專利範圍第〗項 .β 中碳含量爲約40 重量%至約9 8重量%。 14. 根據申請專利範圍第工〇項之 闲不iU貝;X層,其中碳含量爲約5、0 重量/ό至約98重量%。 15. 根據申請專利範圍第i 之塗層,其中碳對秒之重量比 爲約2 : 1至約8 : 1。 •根據申请專利範圍第1 0項之塗層 爲約0.5 : 1至約3 : 1。 17·根據申請專利範圍第1 0項之塗層 金屬基片上。 18_根據申請專利範圍第1 0項之塗層 非金屬基片上。 议根據申請專利範圍第! 〇’項之塗層,其中摻雜劑元素係選 其中矽對氧之重量 比 其中該塗層係沉積於 其中該塗層係沉積於 (請先閱讀背面之注意事項再填寫本頁) 装. 、tr 银_ 27- 表紙張尺石用T"5國家標準(CNS ) A4胁(210~^97公釐 318150 A8 B8 C8 D8 申請專利範圍 自包括 叙、飽 鉻、鍊 硼 叙 給 錢、鈉、碎、錯、碲、氧 銷、朝4、鐵、始、謨、鐘 銅、鋁、氮、銀及金。 4目、鎢 鋒、欽 锆 經濟部中央梯準局負工消費合作社印装 Μ =申請專利範圍第Μ項之塗層,其中該塗層爲光學透 21_ 一種1R窗,其係以根據申請專利範圍第1 0项之塗層塗 佈。 、 22. —種窗,其係以根據申請專利範圍第1〇項之塗層塗佈。 23. —種由光學透射基片及抗蝕塗層所製成之抗腐蝕材料, 該塗層d.種互穿網狀結構所成之似罐石材料種類所 料,1網狀結構包括第-種以氫安定化之似蹲石碳網 狀結構、第;種以氧安定作之梦網狀結構及選用之至少 :種含有週期表第"…族元素之掺雜劑元素或化合 物之另外網狀結構。 24. 根據中請專利範圍第23項之材料,其中碳、氫1及氧 爲得自含由約i至約10個矽原子之有機矽氧烷分解。 W艮^請專利範圍第24項之材料,其中有料氧燒爲聚 私基甲基碎氧燒。 艮據中請專利範圍第23項之材料,其中碳含量爲約4〇 重量%至約9 8重量%。 A根據中請專利範圍第㈣之材料,其Μ含量爲約5〇 重量%至約9 8重量%。 2Μ艮據中請專利侧第23項之材料,其切㈣之重量比 爲約2 : 1至約8 : 1。 -28- 本紙張尺度適用中國國家標準(CNS ) Α4規格(210父297公鼇 (請先閲讀背面之注意事項再填寫本頁) T •裝· 訂 t請專利範 圍 Αδ Β8 C8 D8 經濟部中夬揉準局貝工消費合作社印策 29·1 艮Γ請專利㈣第23項之材料,其切對氧之重量比 巧 4〇·5 : 1 至約 3 : 1。lei利範圍第23項之材料,其中該塗層係沉積於 31’根據申請專利範圍第23項之材料 非金屬基片上。 何科其中孩塗層係沉積於 32·才自艮=請專利範圍第23項之材料,其中掺雜劑元素係選叙 硼、鋰、納、矽、鍺、碲、氧、‘目、鎢、钽、 絡::' 鼓、舶、釩、鐵、餘、鎂、鐘、鎳、鈇、锆、 鍊'給~銅'铭'银及金。 33·才艮^請專利範圍第23項之材料,其中固態材料之碳含予=大於塗層之約40原子%,氫含量至高爲碳之約咐 〇/〇。〇,切、氧及摻雜劑一起之和係大於塗層之約2原子 34·根據申請專利範圍第2S項之材料 射性。 35.根據申請專利範圍第23項之材料 36·根據申請專利範圍第3 5項之材料 乜卞, 六丫孩W馬由選自自 =下列族群之光學透射基片所製成:魏鋅、則匕辞、 叙、發、翁石、坤化鎵、嶙化鎵、 叙、藍寶石、氧化鎂、尖晶石、立乳氣化鑭摻雜之氧化釔、氧化釔、破璃 乳化合物。 .喁晶合鼠化玻璃或其混 37·根據申請專利範圍第35-項之材料,其中該窗爲以窗。 其中該塗層爲光學透 其中該基片爲窗。. 其中該窗爲由選自包(請先閲讀背面之注意事項再填寫本頁) -裝· 、βτ 線
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TW (1) | TW318150B (zh) |
WO (1) | WO1996040446A1 (zh) |
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-
1995
- 1995-06-07 US US08/476,660 patent/US5718976A/en not_active Expired - Lifetime
-
1996
- 1996-06-05 WO PCT/US1996/008814 patent/WO1996040446A1/en active Application Filing
- 1996-06-05 AU AU61513/96A patent/AU6151396A/en not_active Abandoned
- 1996-06-06 TW TW085106789A patent/TW318150B/zh active
Also Published As
Publication number | Publication date |
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AU6151396A (en) | 1996-12-30 |
WO1996040446A1 (en) | 1996-12-19 |
US5718976A (en) | 1998-02-17 |
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