TW307070B - - Google Patents

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Publication number
TW307070B
TW307070B TW084108017A TW84108017A TW307070B TW 307070 B TW307070 B TW 307070B TW 084108017 A TW084108017 A TW 084108017A TW 84108017 A TW84108017 A TW 84108017A TW 307070 B TW307070 B TW 307070B
Authority
TW
Taiwan
Prior art keywords
heat
remover
gas
heat removal
parallel
Prior art date
Application number
TW084108017A
Other languages
English (en)
Chinese (zh)
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Application granted granted Critical
Publication of TW307070B publication Critical patent/TW307070B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW084108017A 1994-09-19 1995-08-02 TW307070B (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/308,316 US5582240A (en) 1994-09-19 1994-09-19 Pneumatically coupled heat sink assembly

Publications (1)

Publication Number Publication Date
TW307070B true TW307070B (https=) 1997-06-01

Family

ID=23193489

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084108017A TW307070B (https=) 1994-09-19 1995-08-02

Country Status (10)

Country Link
US (1) US5582240A (https=)
EP (1) EP0702405B1 (https=)
KR (1) KR0182794B1 (https=)
CN (1) CN1082724C (https=)
BR (1) BR9504030A (https=)
CO (1) CO4370140A1 (https=)
DE (1) DE69530732T2 (https=)
NZ (1) NZ280015A (https=)
TW (1) TW307070B (https=)
ZA (1) ZA957902B (https=)

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US5785116A (en) * 1996-02-01 1998-07-28 Hewlett-Packard Company Fan assisted heat sink device
JPH11121667A (ja) * 1997-10-20 1999-04-30 Fujitsu Ltd ヒートパイプ式冷却装置
US5927385A (en) * 1998-01-21 1999-07-27 Yeh; Ming Hsin Cooling device for the CPU of computer
EP0933878A1 (en) * 1998-01-27 1999-08-04 Lucent Technologies Inc. Cooling system for radio telecommunications equipment
US6176299B1 (en) 1999-02-22 2001-01-23 Agilent Technologies, Inc. Cooling apparatus for electronic devices
US6199624B1 (en) * 1999-04-30 2001-03-13 Molex Incorporated Folded fin heat sink and a heat exchanger employing the heat sink
US6360816B1 (en) 1999-12-23 2002-03-26 Agilent Technologies, Inc. Cooling apparatus for electronic devices
EP1202346A1 (en) * 2000-09-29 2002-05-02 Siemens Aktiengesellschaft Heat sink arrangement
US6418020B1 (en) * 2001-03-30 2002-07-09 Advanced Thermal Technologies Heat dissipation device with ribbed fin plates
WO2003015488A1 (en) 2001-08-09 2003-02-20 Celestica International Inc. Electronics cooling subassembly
WO2003030608A1 (en) * 2001-10-04 2003-04-10 Celestica International Inc. Cooling system having independent fan location
US8505063B2 (en) * 2002-02-22 2013-08-06 Qwest Communications International Inc. Systems and methods for providing redundant back-up to a video transmission system
US7046515B1 (en) * 2002-06-06 2006-05-16 Raytheon Company Method and apparatus for cooling a circuit component
US6972950B1 (en) * 2002-06-06 2005-12-06 Raytheon Company Method and apparatus for cooling a portable computer
DE10234500A1 (de) * 2002-07-23 2004-02-19 Siemens Ag Verfahren zur Wärmeableitung in Mobilfunkgeräten und ein entsprechendes Mobilfunkgerät
US6735082B2 (en) * 2002-08-14 2004-05-11 Agilent Technologies, Inc. Heatsink with improved heat dissipation capability
US20040163795A1 (en) * 2003-02-25 2004-08-26 Yi-Yung Lin Heat sink
US7079390B2 (en) * 2003-06-05 2006-07-18 Hewlett-Packard Development, L.P. System and method for heat dissipation and air flow redirection in a chassis
US7198094B2 (en) * 2003-06-20 2007-04-03 Hewlett-Packard Development Company, L.P. Finned device for removing heat from an electronic component
GB2407375B (en) * 2003-10-22 2006-06-28 Motorola Inc Heat sinks
CN2672865Y (zh) * 2003-11-14 2005-01-19 鸿富锦精密工业（深圳）有限公司 散热器
US6958914B2 (en) * 2003-12-09 2005-10-25 Dell Products L.P. Interlocking heat sink
TWI251460B (en) * 2004-01-09 2006-03-11 Delta Electronics Inc Compound heat sink with multi-directional fins
US7779648B2 (en) * 2004-11-01 2010-08-24 Tecumseh Products Company Heat exchanger with enhanced air distribution
KR100719702B1 (ko) * 2005-05-25 2007-05-17 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
JP4480638B2 (ja) * 2005-07-04 2010-06-16 Ｎｅｃディスプレイソリューションズ株式会社 貫流型強制空冷ヒートシンクおよび投写型表示装置
US7532476B2 (en) * 2006-06-29 2009-05-12 Intel Corporation Flow solutions for microelectronic cooling
CN101516713A (zh) * 2006-09-19 2009-08-26 三菱电机株式会社 移动体用冷却装置
USD613258S1 (en) * 2009-05-15 2010-04-06 Koninklije Philips Electronics N.V. Heatsink
USD638376S1 (en) * 2010-08-06 2011-05-24 Cisco Technology, Inc. Passive cooling element
USD644615S1 (en) * 2010-08-31 2011-09-06 Canon U.S. Life Sciences, Inc. Two part heat spreader
US20130014921A1 (en) * 2011-07-14 2013-01-17 Chen Chih-Peng Air flow guiding structure
WO2015022032A1 (en) * 2013-08-16 2015-02-19 Huawei Technologies Co., Ltd. Enhanced structure for natural cooling heat sink
KR20150145084A (ko) * 2014-06-18 2015-12-29 주식회사 케이엠더블유 방열 장치
CN116314100A (zh) 2015-08-07 2023-06-23 韦沙戴尔电子有限公司 模制体和用于高电压应用的具有模制体的电气装置
US11067963B2 (en) * 2019-01-09 2021-07-20 Dell Products L.P. System and method for thermal management in a multicomponent system

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Publication number Priority date Publication date Assignee Title
BE527420A (https=) * 1953-03-20
US2965819A (en) * 1958-08-07 1960-12-20 Rosenbaum Jacob Heat dissipating electronic mounting apparatus
GB1054001A (https=) * 1964-02-14
US3280907A (en) * 1964-09-01 1966-10-25 Hoffman Sidney Energy transfer device
US3312277A (en) * 1965-03-22 1967-04-04 Astrodyne Inc Heat sink
US3592260A (en) * 1969-12-05 1971-07-13 Espey Mfg & Electronics Corp Heat exchanger with inner guide strip
US3955122A (en) * 1974-02-26 1976-05-04 Armor Elevator Company, Inc. Heat sink mounting for controlled rectifiers
US4823869A (en) * 1986-06-19 1989-04-25 International Business Machines Corporation Heat sink
US4753290A (en) * 1986-07-18 1988-06-28 Unisys Corporation Reduced-stress heat sink device
US4682651A (en) * 1986-09-08 1987-07-28 Burroughs Corporation (Now Unisys Corporation) Segmented heat sink device
US5019880A (en) * 1988-01-07 1991-05-28 Prime Computer, Inc. Heat sink apparatus
US5077601A (en) * 1988-09-09 1991-12-31 Hitachi, Ltd. Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system
JPH03222350A (ja) * 1990-01-29 1991-10-01 Hitachi Ltd 樹脂封止形半導体装置及びその実装構造
JP2544497B2 (ja) * 1990-02-28 1996-10-16 株式会社日立製作所 コンピュ―タ冷却装置
JPH04192552A (ja) * 1990-11-27 1992-07-10 Nec Corp 半導体素子用パッケージ
JPH0548282A (ja) * 1991-08-19 1993-02-26 Sansha Electric Mfg Co Ltd 冷却フイン構造
US5329436A (en) * 1993-10-04 1994-07-12 David Chiu Removable heat sink for xenon arc lamp packages
US5368094A (en) * 1993-11-02 1994-11-29 Hung; Chin-Ping Bipartite heat sink positioning device for computer chips

Also Published As

Publication number Publication date
EP0702405B1 (en) 2003-05-14
DE69530732D1 (de) 2003-06-18
ZA957902B (en) 1996-04-29
CN1082724C (zh) 2002-04-10
BR9504030A (pt) 1996-09-24
NZ280015A (en) 1997-07-27
KR0182794B1 (ko) 1999-03-20
CN1125319A (zh) 1996-06-26
KR960013151A (ko) 1996-04-20
CO4370140A1 (es) 1996-10-07
DE69530732T2 (de) 2003-12-18
EP0702405A1 (en) 1996-03-20
US5582240A (en) 1996-12-10

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