CO4370140A1 - Conjunto de disipador de calor acoplado neumaticamente - Google Patents

Conjunto de disipador de calor acoplado neumaticamente

Info

Publication number
CO4370140A1
CO4370140A1 CO95042912A CO95042912A CO4370140A1 CO 4370140 A1 CO4370140 A1 CO 4370140A1 CO 95042912 A CO95042912 A CO 95042912A CO 95042912 A CO95042912 A CO 95042912A CO 4370140 A1 CO4370140 A1 CO 4370140A1
Authority
CO
Colombia
Prior art keywords
heat sink
assy
pneumatically coupled
pneumatic
coupled heat
Prior art date
Application number
CO95042912A
Other languages
English (en)
Inventor
Robert B Widmayer
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of CO4370140A1 publication Critical patent/CO4370140A1/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

UN CONJUNTO DE DISIPADOR DE CALOR (400) CARACTERI- ZADO POR ESTAR CONFORMADO POR: UNO O MAS DISIPADORES DE CALOR (100) CADA UNO DE ELLOS COMPRENDE: UNA SUPERFICIE CONVECTIVA; Y UNA PLURALIDAD DE SUPERFICIES RADIADORAS DE CALOR FORMADA SOBRE LA SUPERFICIE CONVECTIVA, EN DONDE AL MENOS TRES DE LAS SUPERFICIES RADIADORAS DE CA- LOR SE COORDINAN PARA FORMAR AL MENOS DOS TRAYEC- TOS NEUMATICOS NO PARALELOS (201), TAL QUE CUANDO UN PRIMER Y UN SEGUNDO DISIPADOR DE CALOR (401, 402) ESTAN YUXTAPUESTOS, LOS AL MENOS DOS TRAYEC- TOS NEUMATICOS DEL PRIMER DISIPADOR DE CALOR (401) ESTAN ACOPLADOS NEUMATICAMENTE A LOS AL MENOS DOS TRAYECTOS NEUMATICOS DEL SEGUNDO DISIPADOR DE CA- LOR (402). OPCIONALMENTE, UN MEDIO FORZADOR DE CIRCULACION DE AIRE QUE EMPUJA EL FLUJO DE AIRE POR DICHOS TRA- YECTOS NEUMATICOS. FIGURA 1 . . . . . . . . . . . . . . . . . . . . .
CO95042912A 1994-09-19 1995-09-19 Conjunto de disipador de calor acoplado neumaticamente CO4370140A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/308,316 US5582240A (en) 1994-09-19 1994-09-19 Pneumatically coupled heat sink assembly

Publications (1)

Publication Number Publication Date
CO4370140A1 true CO4370140A1 (es) 1996-10-07

Family

ID=23193489

Family Applications (1)

Application Number Title Priority Date Filing Date
CO95042912A CO4370140A1 (es) 1994-09-19 1995-09-19 Conjunto de disipador de calor acoplado neumaticamente

Country Status (10)

Country Link
US (1) US5582240A (es)
EP (1) EP0702405B1 (es)
KR (1) KR0182794B1 (es)
CN (1) CN1082724C (es)
BR (1) BR9504030A (es)
CO (1) CO4370140A1 (es)
DE (1) DE69530732T2 (es)
NZ (1) NZ280015A (es)
TW (1) TW307070B (es)
ZA (1) ZA957902B (es)

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US5927385A (en) * 1998-01-21 1999-07-27 Yeh; Ming Hsin Cooling device for the CPU of computer
EP0933878A1 (en) * 1998-01-27 1999-08-04 Lucent Technologies Inc. Cooling system for radio telecommunications equipment
US6176299B1 (en) 1999-02-22 2001-01-23 Agilent Technologies, Inc. Cooling apparatus for electronic devices
US6199624B1 (en) * 1999-04-30 2001-03-13 Molex Incorporated Folded fin heat sink and a heat exchanger employing the heat sink
US6360816B1 (en) 1999-12-23 2002-03-26 Agilent Technologies, Inc. Cooling apparatus for electronic devices
EP1202346A1 (en) * 2000-09-29 2002-05-02 Siemens Aktiengesellschaft Heat sink arrangement
US6418020B1 (en) * 2001-03-30 2002-07-09 Advanced Thermal Technologies Heat dissipation device with ribbed fin plates
WO2003015488A1 (en) 2001-08-09 2003-02-20 Celestica International Inc. Electronics cooling subassembly
US20030066626A1 (en) * 2001-10-04 2003-04-10 John Bird Cooling system having independent fan location
US8505063B2 (en) * 2002-02-22 2013-08-06 Qwest Communications International Inc. Systems and methods for providing redundant back-up to a video transmission system
US6972950B1 (en) * 2002-06-06 2005-12-06 Raytheon Company Method and apparatus for cooling a portable computer
US7046515B1 (en) 2002-06-06 2006-05-16 Raytheon Company Method and apparatus for cooling a circuit component
DE10234500A1 (de) * 2002-07-23 2004-02-19 Siemens Ag Verfahren zur Wärmeableitung in Mobilfunkgeräten und ein entsprechendes Mobilfunkgerät
US6735082B2 (en) * 2002-08-14 2004-05-11 Agilent Technologies, Inc. Heatsink with improved heat dissipation capability
US20040163795A1 (en) * 2003-02-25 2004-08-26 Yi-Yung Lin Heat sink
US7079390B2 (en) * 2003-06-05 2006-07-18 Hewlett-Packard Development, L.P. System and method for heat dissipation and air flow redirection in a chassis
US7198094B2 (en) * 2003-06-20 2007-04-03 Hewlett-Packard Development Company, L.P. Finned device for removing heat from an electronic component
GB2407375B (en) * 2003-10-22 2006-06-28 Motorola Inc Heat sinks
CN2672865Y (zh) * 2003-11-14 2005-01-19 鸿富锦精密工业（深圳）有限公司 散热器
US6958914B2 (en) * 2003-12-09 2005-10-25 Dell Products L.P. Interlocking heat sink
TWI251460B (en) * 2004-01-09 2006-03-11 Delta Electronics Inc Compound heat sink with multi-directional fins
US7779648B2 (en) * 2004-11-01 2010-08-24 Tecumseh Products Company Heat exchanger with enhanced air distribution
KR100719702B1 (ko) * 2005-05-25 2007-05-17 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
JP4480638B2 (ja) * 2005-07-04 2010-06-16 Ｎｅｃディスプレイソリューションズ株式会社 貫流型強制空冷ヒートシンクおよび投写型表示装置
US7532476B2 (en) * 2006-06-29 2009-05-12 Intel Corporation Flow solutions for microelectronic cooling
WO2008035452A1 (en) * 2006-09-19 2008-03-27 Mitsubishi Electric Corporation Cooling device for mobile body
US20130014921A1 (en) * 2011-07-14 2013-01-17 Chen Chih-Peng Air flow guiding structure
WO2015022032A1 (en) * 2013-08-16 2015-02-19 Huawei Technologies Co., Ltd. Enhanced structure for natural cooling heat sink
KR20150145084A (ko) * 2014-06-18 2015-12-29 주식회사 케이엠더블유 방열 장치
KR102536008B1 (ko) 2015-08-07 2023-05-23 비쉐이 데일 일렉트로닉스, 엘엘씨 고전압 애플리케이션을 위한 몰딩 바디 및 몰딩 바디를 구비한 전기 디바이스
US11067963B2 (en) * 2019-01-09 2021-07-20 Dell Products L.P. System and method for thermal management in a multicomponent system

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BE527420A (es) * 1953-03-20
US2965819A (en) * 1958-08-07 1960-12-20 Rosenbaum Jacob Heat dissipating electronic mounting apparatus
GB1054001A (es) * 1964-02-14
US3280907A (en) * 1964-09-01 1966-10-25 Hoffman Sidney Energy transfer device
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US3955122A (en) * 1974-02-26 1976-05-04 Armor Elevator Company, Inc. Heat sink mounting for controlled rectifiers
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US4682651A (en) * 1986-09-08 1987-07-28 Burroughs Corporation (Now Unisys Corporation) Segmented heat sink device
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US5077601A (en) * 1988-09-09 1991-12-31 Hitachi, Ltd. Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system
JPH03222350A (ja) * 1990-01-29 1991-10-01 Hitachi Ltd 樹脂封止形半導体装置及びその実装構造
JP2544497B2 (ja) * 1990-02-28 1996-10-16 株式会社日立製作所 コンピュ―タ冷却装置
JPH04192552A (ja) * 1990-11-27 1992-07-10 Nec Corp 半導体素子用パッケージ
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Also Published As

Publication number Publication date
DE69530732D1 (de) 2003-06-18
ZA957902B (en) 1996-04-29
NZ280015A (en) 1997-07-27
CN1082724C (zh) 2002-04-10
KR0182794B1 (ko) 1999-03-20
EP0702405B1 (en) 2003-05-14
BR9504030A (pt) 1996-09-24
KR960013151A (ko) 1996-04-20
CN1125319A (zh) 1996-06-26
TW307070B (es) 1997-06-01
DE69530732T2 (de) 2003-12-18
EP0702405A1 (en) 1996-03-20
US5582240A (en) 1996-12-10

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