KR0182794B1 - 공압적으로 연결된 히트 싱크 조립체 - Google Patents

공압적으로 연결된 히트 싱크 조립체 Download PDF

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Publication number
KR0182794B1
KR0182794B1 KR1019950030406A KR19950030406A KR0182794B1 KR 0182794 B1 KR0182794 B1 KR 0182794B1 KR 1019950030406 A KR1019950030406 A KR 1019950030406A KR 19950030406 A KR19950030406 A KR 19950030406A KR 0182794 B1 KR0182794 B1 KR 0182794B1
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KR
South Korea
Prior art keywords
air
heat sink
heat
face
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019950030406A
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English (en)
Korean (ko)
Other versions
KR960013151A (ko
Inventor
비. 위드메이어 로버트
Original Assignee
안토니 제이. 샬리; 제이알.
모토롤라 인크
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Filing date
Publication date
Application filed by 안토니 제이. 샬리; 제이알., 모토롤라 인크 filed Critical 안토니 제이. 샬리; 제이알.
Publication of KR960013151A publication Critical patent/KR960013151A/ko
Application granted granted Critical
Publication of KR0182794B1 publication Critical patent/KR0182794B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR1019950030406A 1994-09-19 1995-09-18 공압적으로 연결된 히트 싱크 조립체 Expired - Fee Related KR0182794B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/308,316 US5582240A (en) 1994-09-19 1994-09-19 Pneumatically coupled heat sink assembly
US08/308,316 1994-09-19
US8/308,316 1994-09-19

Publications (2)

Publication Number Publication Date
KR960013151A KR960013151A (ko) 1996-04-20
KR0182794B1 true KR0182794B1 (ko) 1999-03-20

Family

ID=23193489

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950030406A Expired - Fee Related KR0182794B1 (ko) 1994-09-19 1995-09-18 공압적으로 연결된 히트 싱크 조립체

Country Status (10)

Country Link
US (1) US5582240A (https=)
EP (1) EP0702405B1 (https=)
KR (1) KR0182794B1 (https=)
CN (1) CN1082724C (https=)
BR (1) BR9504030A (https=)
CO (1) CO4370140A1 (https=)
DE (1) DE69530732T2 (https=)
NZ (1) NZ280015A (https=)
TW (1) TW307070B (https=)
ZA (1) ZA957902B (https=)

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US5785116A (en) * 1996-02-01 1998-07-28 Hewlett-Packard Company Fan assisted heat sink device
JPH11121667A (ja) * 1997-10-20 1999-04-30 Fujitsu Ltd ヒートパイプ式冷却装置
US5927385A (en) * 1998-01-21 1999-07-27 Yeh; Ming Hsin Cooling device for the CPU of computer
EP0933878A1 (en) * 1998-01-27 1999-08-04 Lucent Technologies Inc. Cooling system for radio telecommunications equipment
US6176299B1 (en) 1999-02-22 2001-01-23 Agilent Technologies, Inc. Cooling apparatus for electronic devices
US6199624B1 (en) * 1999-04-30 2001-03-13 Molex Incorporated Folded fin heat sink and a heat exchanger employing the heat sink
US6360816B1 (en) 1999-12-23 2002-03-26 Agilent Technologies, Inc. Cooling apparatus for electronic devices
EP1202346A1 (en) * 2000-09-29 2002-05-02 Siemens Aktiengesellschaft Heat sink arrangement
US6418020B1 (en) * 2001-03-30 2002-07-09 Advanced Thermal Technologies Heat dissipation device with ribbed fin plates
WO2003015488A1 (en) 2001-08-09 2003-02-20 Celestica International Inc. Electronics cooling subassembly
WO2003030608A1 (en) * 2001-10-04 2003-04-10 Celestica International Inc. Cooling system having independent fan location
US8505063B2 (en) * 2002-02-22 2013-08-06 Qwest Communications International Inc. Systems and methods for providing redundant back-up to a video transmission system
US7046515B1 (en) * 2002-06-06 2006-05-16 Raytheon Company Method and apparatus for cooling a circuit component
US6972950B1 (en) * 2002-06-06 2005-12-06 Raytheon Company Method and apparatus for cooling a portable computer
DE10234500A1 (de) * 2002-07-23 2004-02-19 Siemens Ag Verfahren zur Wärmeableitung in Mobilfunkgeräten und ein entsprechendes Mobilfunkgerät
US6735082B2 (en) * 2002-08-14 2004-05-11 Agilent Technologies, Inc. Heatsink with improved heat dissipation capability
US20040163795A1 (en) * 2003-02-25 2004-08-26 Yi-Yung Lin Heat sink
US7079390B2 (en) * 2003-06-05 2006-07-18 Hewlett-Packard Development, L.P. System and method for heat dissipation and air flow redirection in a chassis
US7198094B2 (en) * 2003-06-20 2007-04-03 Hewlett-Packard Development Company, L.P. Finned device for removing heat from an electronic component
GB2407375B (en) * 2003-10-22 2006-06-28 Motorola Inc Heat sinks
CN2672865Y (zh) * 2003-11-14 2005-01-19 鸿富锦精密工业（深圳）有限公司 散热器
US6958914B2 (en) * 2003-12-09 2005-10-25 Dell Products L.P. Interlocking heat sink
TWI251460B (en) * 2004-01-09 2006-03-11 Delta Electronics Inc Compound heat sink with multi-directional fins
US7779648B2 (en) * 2004-11-01 2010-08-24 Tecumseh Products Company Heat exchanger with enhanced air distribution
KR100719702B1 (ko) * 2005-05-25 2007-05-17 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
JP4480638B2 (ja) * 2005-07-04 2010-06-16 Ｎｅｃディスプレイソリューションズ株式会社 貫流型強制空冷ヒートシンクおよび投写型表示装置
US7532476B2 (en) * 2006-06-29 2009-05-12 Intel Corporation Flow solutions for microelectronic cooling
CN101516713A (zh) * 2006-09-19 2009-08-26 三菱电机株式会社 移动体用冷却装置
USD613258S1 (en) * 2009-05-15 2010-04-06 Koninklije Philips Electronics N.V. Heatsink
USD638376S1 (en) * 2010-08-06 2011-05-24 Cisco Technology, Inc. Passive cooling element
USD644615S1 (en) * 2010-08-31 2011-09-06 Canon U.S. Life Sciences, Inc. Two part heat spreader
US20130014921A1 (en) * 2011-07-14 2013-01-17 Chen Chih-Peng Air flow guiding structure
WO2015022032A1 (en) * 2013-08-16 2015-02-19 Huawei Technologies Co., Ltd. Enhanced structure for natural cooling heat sink
KR20150145084A (ko) * 2014-06-18 2015-12-29 주식회사 케이엠더블유 방열 장치
CN116314100A (zh) 2015-08-07 2023-06-23 韦沙戴尔电子有限公司 模制体和用于高电压应用的具有模制体的电气装置
US11067963B2 (en) * 2019-01-09 2021-07-20 Dell Products L.P. System and method for thermal management in a multicomponent system

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BE527420A (https=) * 1953-03-20
US2965819A (en) * 1958-08-07 1960-12-20 Rosenbaum Jacob Heat dissipating electronic mounting apparatus
GB1054001A (https=) * 1964-02-14
US3280907A (en) * 1964-09-01 1966-10-25 Hoffman Sidney Energy transfer device
US3312277A (en) * 1965-03-22 1967-04-04 Astrodyne Inc Heat sink
US3592260A (en) * 1969-12-05 1971-07-13 Espey Mfg & Electronics Corp Heat exchanger with inner guide strip
US3955122A (en) * 1974-02-26 1976-05-04 Armor Elevator Company, Inc. Heat sink mounting for controlled rectifiers
US4823869A (en) * 1986-06-19 1989-04-25 International Business Machines Corporation Heat sink
US4753290A (en) * 1986-07-18 1988-06-28 Unisys Corporation Reduced-stress heat sink device
US4682651A (en) * 1986-09-08 1987-07-28 Burroughs Corporation (Now Unisys Corporation) Segmented heat sink device
US5019880A (en) * 1988-01-07 1991-05-28 Prime Computer, Inc. Heat sink apparatus
US5077601A (en) * 1988-09-09 1991-12-31 Hitachi, Ltd. Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system
JPH03222350A (ja) * 1990-01-29 1991-10-01 Hitachi Ltd 樹脂封止形半導体装置及びその実装構造
JP2544497B2 (ja) * 1990-02-28 1996-10-16 株式会社日立製作所 コンピュ―タ冷却装置
JPH04192552A (ja) * 1990-11-27 1992-07-10 Nec Corp 半導体素子用パッケージ
JPH0548282A (ja) * 1991-08-19 1993-02-26 Sansha Electric Mfg Co Ltd 冷却フイン構造
US5329436A (en) * 1993-10-04 1994-07-12 David Chiu Removable heat sink for xenon arc lamp packages
US5368094A (en) * 1993-11-02 1994-11-29 Hung; Chin-Ping Bipartite heat sink positioning device for computer chips

Also Published As

Publication number Publication date
EP0702405B1 (en) 2003-05-14
DE69530732D1 (de) 2003-06-18
ZA957902B (en) 1996-04-29
CN1082724C (zh) 2002-04-10
BR9504030A (pt) 1996-09-24
NZ280015A (en) 1997-07-27
CN1125319A (zh) 1996-06-26
KR960013151A (ko) 1996-04-20
CO4370140A1 (es) 1996-10-07
TW307070B (https=) 1997-06-01
DE69530732T2 (de) 2003-12-18
EP0702405A1 (en) 1996-03-20
US5582240A (en) 1996-12-10

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