TW298659B - - Google Patents

Description

V. Description of the invention (A7 B7) 15 f1% t [Industrial application field] The present invention relates to a semiconductor wafer and a semiconductor wafer using the packaging container, which are resistant to long-term storage while maintaining cleanliness. [ Description of conventional technology] Up to now, the semiconductor wafer wafer package and the polycarbonate cover constitute the acrylic half-wafer wafer carrier. This packaging container is used by Reduce the composition and reduce the organic on the surface of the wafer [Problem to solve the invention] However, when the semiconductivity is stored in this container, there will be contamination of the surface of the semiconductor wafer. This is because the crystallinity of the semiconductor after cleaning is high • As a result, it will become easy to absorb ion. The partial pressure of the hip in the container is low, so it is affected by the external source of disturbance. So • When a long time passes in the conventional packaging container, * foreign objects will be adsorbed on the wafer. Water repellent (contact angle with water The present invention was developed based on the above facts and a packaging container for contact angle with water under long-term storage and its manufacturing method and storage method, especially a kind of The packaging container for semiconductor wafers is made of polypropylene, and the inside of the box contains a method of contaminating volatiles from the material of the container. I want the wafer to pass the 10◦ day problem. The round surface is active. Reactive hybrids, etc., and the package is susceptible to organic contamination. When the clean wafers are stored, the surface will not increase the wafer). The purpose of the creator is to provide no crucibles. • Can be kept clear (please read the notes on the back before filling this page)

This paper wave scale is applicable to China National Standard (CNS) A4 specification (210X29 · mm) A7 B7 V. Invention description (2) Clarity semiconductor wafer packaging container. [Solution to the problem] It is K. The present invention reduces the vapor pressure of high-boiling-point organic components that tend to remain on the surface of semiconductor wafers by increasing the ratio of low-boiling-point components in sealed containers *. In addition, by covering low-boiling organic components with low-boiling organic components, contact with high-boiling organic components that are likely to remain can be suppressed, and it is possible to reduce the contamination of contaminants. Specifically, according to the present invention, the part directly in contact with the wafer of the sealed packaging container composed of the container and the lid is made of degassed resin, and at least the inner wall surface of the other parts is After treatment, it can actively produce low molecular weight organic gas hips. The packaging container for a semiconductor crystal garden according to the first invention of the present invention is composed of a container book and a lid body, and the semiconductor wafer is housed in a sealed state inside; the characteristic is that: the inner space of the packaging container * is enclosed There are aliphatic hydrocarbons with a carbon number of 6 to 8 or enzymes with a boiling point of 10 OCM. A packaging container for semiconductor wafers according to the second invention of the present invention is composed of a container body and a lid body. The inside thereof is a sealed device for storing a semi-conducting wafer; its special system is: at least the above-mentioned container Resin suspected of aliphatic hydrocarbons with a carbon number of 6 to 8 or alcohols with a boiling point of 100 ΌΜ. The base material of the above resins * It is better to use polypropylene, polyethylene, polycarbonate _ The paper size is applicable to China National Standard (CNS) Α4 specification (210X 297mm) (please read the precautions on the back before filling this page)

A7 B7 5. Description of the invention (3) The packaging container for semiconductor wafers according to the third invention of the present invention is composed of a container body and a lid body, and the inside thereof is a sealed semiconductor container; the characteristics are: The inner space of the packaging container for semiconductor crystal garden * is enclosed by resin impregnated with aliphatic hydrocarbons with a carbon number of 6 to 8 or enzymes with a boiling point of 1 OOCM, and can produce low-boiling boiling components with evaporation Source 〇 The fourth invention of the present invention is a method for manufacturing a packaging container for semiconducting wafers. The special method is as follows: This manufacturing method includes: a liquid phase method using n-hexane • Initiating cross-point reflection The process of polypropylene resin; M and a pellet formed from the above polypropylene resin, by forming the nine pellets to form a container body and a lid body, and a container in which the semiconductor wafer is housed in a sealed state Yucheng. The fifth invention of the present invention is the "Preparation Method of Packaging Containers for Crystal Garden; the special method is: The preparation method includes:-the process of forming a polypropylene resin by a cross-linking reaction initiated by a gas phase method; and -Forming nine pellets from the above-mentioned polypropylene resin, and molding the pellets to form a container consisting of a container body and a lid, and a container for holding semiconductor wafers in a sealed state inside. This paper scale is applicable to the Chinese National Standard (CNS) Α4 specification (210Χ 297 mm) (Please read the precautions on the back before filling in this I) Order A7 B7 V. Description of invention (☆) The sixth invention of the invention is The manufacturing method of the packaging container for semiconductor crystals; the special methods are as follows: This manufacturing method includes: a heat treatment process of removing volatile organic components from the raw material resin; and an aliphatic group with the number of carbons in the range of 10 to 16 added to the raw material resin Hydrocarbon, the process of forming pellets; and-Europium is formed by forming the above-mentioned pellets into a container body and a lid, and a container containing semiconducting wafers in a closed state inside M. The seventh invention of the present invention is a method for manufacturing a packaging container for semiconductor wafers; the special method is as follows: This method includes: a heat treatment process in which volatile organic components are removed from the pellets after the pellets are removed from the resin; -Forming these nine pieces to form a container body and a lid body, a container forming process for containing semiconductor wafers in a closed bark state; K and one at least the container body is immersed in the number of carbon containing 6 ~ The process of immersing the aliphatic hydrocarbons of 8 degrees or the solution of enzymes under boiling viscosity of 1 OOCK to the surface of the aliphatic hydrocarbons with the number of carbons of 6 to 8 or the enzymes with boiling points below 100 Ό. The eighth invention of the present invention is a method for manufacturing packaging containers for semi-wafer wafers; its special features are: This paper standard is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) (please read the back of Vi · (Please fill out this page again)

A7 B7 V. Description of the invention (r) The preparation method includes: a process of forming pellets from a raw material resin; a heat treatment process to remove volatile constituents from the pellets;-immersing the pellets in a carbon containing number of 6 The process of immersing the surface of aliphatic hydrocarbons with a boiling point of ~ 8 or a yeast with a boiling point of 1 OOtM to the surface of aliphatic hydrocarbons with a carbon number of 6 to 8 or with a boiling point of 1 ootcm; The forming process of the pellet is formed by the container body and the lid body, and the container containing the half-wafer wafers in a closed state inside M. The ninth invention of the present invention is a method for manufacturing a packaging container for semiconductor wafers; its special features are: This method includes: a resin material is molded to form a container body and a lid body, and the interior is sealed in a closed state The forming process of the container containing the semi-conducting medullary wafers; Μ and a solution containing at least 6-8 carbon aliphatic hydrocarbons or enzymes with a boiling point of 1 OOCK in the body, after being left for a certain period of time • The process of removing the solution from M. The 10th invention of the present invention is a semiconducting «wafer storage method; its motivation is in: This manufacturing method includes: —arrangement of semi-equal thick wafers in the container body; Conform to the cover «• and apply the paper size to the Chinese National Standard (CNS) Α4 specification (210X297 mm) (please read the precautions on the back before filling this page)

L order 398659 s ridge vector multiplication ¢ 11-¾¾U 肖 Λτ 乂 ^ Chatodo. Fifth, the description of the invention () 1 1 I The gas inside the device body 98 The exhaust process and 1 1 | in the above container Inside the body »The gas state is enclosed with a huge carbon number of 6 1 I. Aliphatic hydrocarbons with a degree of 1 I 8 or a boiling point of 1 0 0 V > λ for enzymes i Read the above container first 1 I read 1 Body and lid The closed passage between them is the function of 1 C] Note I Note 1 According to the above structure, by increasing the sub-items of low-boiling organic components in the container \ 1 then 1 I 懕 and the surface of the semiconductor wafer has a low boiling point It can be covered by the composition of ingredients 1-to reduce the amount of contaminated organic substances on the surface of the wafer 1 can be cleaned for a long time 1 1 net state The half-wafer wafer 0 1 1 here has a huge carbon number set to 6-W 8. The measurement result of the semiconductor wafer attachment 1 1 indicates that the residue on the surface of the semiconductor crystal painting is larger than C = 9 1 Aliphatic hydrocarbons below C 8 did not remain. The result is shown in Sleep 4 1 I. This result is the drawing of a silicon crystal of 8 i η ch in a closed container Μ 1 0 1 1 0 t: after heating for 1 hour Scrape off the foreign matter on its surface> λ GC will 1 1 its measurement result 0 From this result, it can be seen that the residue 1 r on the surface of the semi-conducting waist wafer is only the residue on C = 9 Μ and C = 5 > Residues under λ > 1 | There will be a problem of evaporation. 〇M > By using aliphatic hydrocarbons with C = 6 8 to pre-inject 1 1 into the space of the container $, it is easy to remain in the semiconducting « § 1 on the wafer surface 1 1 The vapor pressure suppression of high-boiling organic components and the high-boiling point that are likely to remain are 1 I component contact 1 Reduce the pollution caused by organic matter and suppress particles 〇1 1 1 and t By injecting enzymes with a boiling point of less than 100 0 in advance in the same way 1 1 P in the space in the container can be coated with half-grain crystals The absorption of the round surface f inhibits the contact with 1 1 high-boiling organic components that are easy to remain. The reduction is due to the presence of debris. 1 I-8-1 1 1 The paper scale is applicable to the Chinese National Sample Rate (CNS) Α4 (210X 297mm) A7 B7 t

P. Fifth, description of the invention (Ί) 1 1 I Pollution and particle suppression. The relationship between the temperature of these aliphatic hydrocarbons and the vapor pressure is shown in 1 1 1 in Figure 5. 0 The vertical axis represents the vapor pressure (at D) The axis represents the temperature (t :) X—V 1 I Please 1 1 0 From this result, we can know that by using aliphatic hydrocarbons with C = 6 8, the first reading 1 | the reading 1 general use temperature 2 〇t: degree The vapor pressure can be roughly formed into 1/1 on the back 1 1 〇0 > λ 0 Main | I also used in QB Garden 3 polypropylene resin containers that do not generate particles 1 I Re 1 1 Carbon contained The number of aliphatic hydrocarbons with a huge number of 6 8 or enzymes with a boiling point of less than 1 〇0. The Australian quantity is 5 0 0 PP m or more. 0 It can be seen that it is enclosed in a semiconductor crystal sheet 1 1 painting packaging container In order to produce aliphatic hydrocarbons with a potency of hundreds of carbon in the range of 6 1 1 8 or enzymes with a boiling point of less than 100 0 in the space, it is better to set 5 0 1 1 PP m > λ on 0 1 according to the first invention of the present invention. The inner space of the packaging container 1 for semiconductor wafers is filled with aliphatic hydrocarbons with a rja m number of about 6-8 or alcohols with boiling points of 1 1 1 0 0 or less. The contact of the components is suppressed, and the wafer surface can be maintained to be clean. 〇1 kT According to the second invention of the present invention, the system of the container is composed of aliphatic hydrocarbons with an I 1 carbon number of about 6 8 or a boiling point of 100 V or less. The yeast 1 1 is composed of resin, so the interior space is often sealed with hundreds of carbons, aliphatic hydrocarbons with a boiling point of 6 1 I 8 or a boiling point below 1 0 0 V. The yeasts with a boiling point of less than 100 V are Η. The contact of the organic components can be suppressed to maintain a clean 1 1 I clean wafer surface. 〇 1 1 It is expected that the use of polypropylene, polyethylene polycarbonate 1 1 etc. as the substrate chemical resistance and 9 -Easy to impregnate from this point of view and gather 1 1 1 1 This paper scale is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) A7 B7 ι $ k 5. Description of the invention (δ) 1 1 1 Carbonate is higher than the first two It is slightly inferior. 1 1 According to the third invention of the present invention, since the packaging for semiconductor wafers 1 I, please 1 I, the internal space of the container is filled with hundreds of carbon impregnated to the extent of 6 8 first reading 1 I reading 1 aliphatic hydrocarbon Or an alcohol resin with a boiling point of 1 0 0 Μ can produce a backside 1 I. Evaporation source of low-boiling organic components by which the internal space is often enclosed with notes 1 1 It means 1 aliphatic hydrocarbon with a carbon number of 6 8 or a yeast with a boiling point of 1 0 0 V Μ »Item 1 I 1 1 and as mentioned above, it is possible to suppress the contact with the susceptible residual components and maintain the book. The clean wafer surface 0 I > «—« · 1 I In addition, according to the fifth invention of the present invention, a cross-linking reaction is initiated by the gas phase method 1 1 The coupling reaction forms a polypropylene resin and the polypropylene resin is impregnated into nengjiu 1 1 Wash and use it as a raw material resin to form a packaging container box. The inside of the container 1 is set 1 [N-hexane is often enclosed in the space. As mentioned above, contact with organic components that are likely to remain is easy to obtain. The surface of the wafer is maintained and maintained. 0 1 1 According to the sixth invention of the present invention, after the raw material resin is removed by the treatment 1 1 After the volatilized component is volatilized, the amount of carbon added to the raw material resin is 1 1 0 1 6 aliphatic hydrocarbons are formed into nine pellets. The pellets are used to form a semi-conductor wafer packaging container. Therefore, the aliphatic hydrocarbons will be decomposed by thermal process. 1 1 »After forming, the container will become carbon-containing Those with a huge amount of lipid 1 1 group hydrocarbons with a degree of 6 8 are therefore often enclosed in the internal space with an aliphatic hydrocarbon with a huge carbon number of 6 ^ > w 8 Cheng 1 I degree and are connected to healthy components that are likely to remain as described above Λ〇9 Touch 1 1 1 Obtaining a wafer surface that can be suppressed to maintain cleanness 0 1 1 According to the seventh invention of the present invention, after the semiconductor crystal picture packaging container is shaped into 1 | shape, at least the container body is immersed in carbon containing hundreds of 6 8 Degree 1 I-10 • 1 1 1 This paper scale is applicable to the Chinese National Standard (CNS) A4 specifications (2 丨 0X29 * 7mm) A7 B7 £ t V. Description of the invention (aliphatic hydrocarbon or boiling point 1 〇〇 t: In the solution of fermented codfish on M, the number of carbon impregnated on its surface is 6 Aliphatic hydrocarbons with a degree of 8 or yeasts with a boiling point of 10 Ot, therefore, aliphatic hydrocarbons with a carbon number of 6 to 8 or boiling points with a boiling point of 100 ot: yeasts with a boiling point of 100 Kt are often enclosed in the internal space, as described above · Resistance to contact with americium components that are likely to remain can be suppressed. * The wafer surface can be cleaned and cleaned. Here * Because the carrier or holding member that directly contacts the wafer is the reason that the contaminants diffuse from the contact point, it is desirable to make it free of aliphatic hydrocarbons or boiling points 1 with a carbon immersion number of 6 to 8 〇〇 = The following enzymes, and only impregnate the container body and lid. According to the eighth invention of the present invention, nine grains are immersed in a solution of aliphatic hydrocarbons having a carbon number of 6 to 8 or enzyme solutions at a boiling point of 10 OtM, and the surface is impregnated with a carbon number of 6 to 8 Degree of aliphatic hydrocarbons or enzymes at a boiling point of 10 OC • Therefore, in the internal space of the container after molding • aliphatic hydrocarbons with a carbon number of 6 to 8 or enzymes at a boiling point of 100 ΌΜ are often enclosed, as described above The contact with the volatile components that are easy to remain is suppressed, and the clean wafer surface can be maintained. According to the ninth invention of the present invention * After forming the semiconductor wafer packaging container • At least the container body is built into an aliphatic hydrocarbon containing a carbon number of about 6 to 8 or a fermentation solution at a boiling point of 1 OOt: M , And remove it after leaving it for a certain period of time, so that the inner wall can be impregnated with aliphatic hydrocarbons with a carbon number of about 6 to 8 or enzymes with a boiling point of less than 100,000 · Ό. Aliphatic hydrocarbons with a carbon number of 6 to 8 or enzymes with a boiling point of 100 = the following, and as mentioned above, with the organic residues that are easy to remain, the Chinese standard (CNS) Α4 specification (210X 297 mm) (Please read the precautions on the back before filling in this tile) Order Α7 Β7 V. Description of the invention (Incorporated and fermented M is the number of copies, the carbon is removed, and some are allowed to be discharged and closed. The body is sealed. The surface of the air is usually between the surface and the surface. The body is easy to form a circle from the inside 1 to cover the inside and the round crystal, the point and the space, the crystal is clear, the net of the boiling body is empty, or the net is cleaned by the headquarters. ο The supernatant holding 1 in the body hydrocarbon container The content is as high as possible, it can be bright, the hydrocarbons, the hair production process, the suppression of the family's self-restraint can be controlled according to the crystals ~ Feng Qizhi's roots can be touched by the 6-state opening and lead Touch the outer half of the lid to cover the other side of the body. The number of other parts is to be carbonized to 6 parts into the general class (please read the precautions on the back and then fill in this page) [Example 〕 Secondly, here is a detailed description of the actual pickling example of the present invention, Zuo Mian noodles packaging container for semi-conducting hip crystal, as shown in Figure 1 • is: a container body 1 formed by a polypropylene produced A closed lid 2 formed as a body 1;-supporting a half-wafer wafer 6 with Μ 6 in the container body 1 made of degassed polypropylene 3; Μ and a matching carrier 3 are set to The semiconductor wafer 6 is composed of the special parts 4. Here, the container body 1 and the cover 2 are in close contact with the rubber pad 5. This packaging container; the inside of the container is filled with gas, even if it will not be affected, can Maintaining the clean surface bark state will not repel t. This liquid phase method can be used to hold the container and hold it in the carrier to fix it. Ming 0 Next water entering °, hereby using this semiconductor wafer manufacturing method of the packaging container, this paper will be explained -12- waves applied China National Standard Scale (CNS) Α4 Specification (2 Shu 0Χ 297 mm) A7 B7 Λ

I • β i? I Fifth, the description of the invention (ι!) 1 1 First of all, it is like filling the monomer in n-hex yaki> λ liquid phase method triggers the transfer reaction 1 1 1 polypropylene should be formed 0 at this time due to the system VX is burned Washing impurities or catalysts 1 I residues, it contains a large amount of positive and negative synthesis in the polypropylene resin (C = 6) 0 Please first 1 leap | Then add antioxidants to the polypropylene resin and then form the reading back I surface I For the pellets, use a mold to form 1 I t. 1 1 of the container body 1 \ lid 2 and other parts. Then perform 1 0 0 3 0 4 0 hours on the pellets. 1 I heat treatment will volatile organic After the components have been fully removed, the chess pieces are loaded to form the parts of the filling frame 3 and the holding member 4 0 Page 1 The semiconductor wafer packaging volume formed accordingly The carrier 3 of the device received 1 1 nano 2 5 silicon wafers of 8 in ch pre-sealed at room temperature after 3 1 | months after the container is opened, no matter which silicon wafer can be maintained 1 order clean The surface 〇Secondly, in order to determine the amount of these aliphatic hydrocarbons added and the degree of contamination on the surface of the wafer, the Kan is placed in a clean glass closed container. The non-contacted 1 1 is placed in the polymer that has not been decontaminated. Acrylic resin pellets and cleaned silicon 1 Was changed during storage and storage of the amount of positive Xin (C = 8) measurement of contamination 1 Stain degree 0 The results are shown in Figure 2 0 here is to cut the surface of the crystal garden Of * 1 1 in 5 9 0 nitrogen to make it heat away from the component that will be separated Μ GC 一 1 1 Μ S (gas chromatography) analysis and use decane burn to make the calibration line 1 I »to Μ conversion Into weight 0 This — determine the ft > λ surface divided as the adsorption per unit 1 1 I area. 0 The vertical axis is the amount of contaminated material on the wafer surface (η 1 1 S / C m 2) The horizontal axis is added / Saturation amount (4 0 V) ○ From this 1 | A result shows that the more the added amount / saturation amount is, the more sure it will be. 1 I-1 3-1 1 1 The table paper size is applicable to the Chinese National Standard (CNS) A4 Specification (210X 297mm)

9

A B 5. Invention description (Θ) Reduce the pollution of high boiling point components. In addition, in order to measure the state of the internal space at the time of sealing, four containers A to D are prepared, and the same silicon wafer is enclosed therein. These containers have the structure shown in the table below. Table 1 The material of the container used for the test shown in Figure 3 constitutes the container body holder holder A. Liquid phase method, PP with high boiling point components (200ppm) Liquid phase method, PP with high boiling point components Thermoplastic elasticity Polycarbonate B Liquid phase method, low boiling point liquid phase method, low boiling point heat-treated polycarbonate with many PP components PP PP (60ppm) C liquid phase method, low boiling point liquid method, low boiling point heat-treated PP with many polycarbonate components PP with many components PP (8ppm) D gas phase method, PP gas phase method, PP gas phase method, PP polycarbonate-14- (please read the precautions on the back before filling in this Page) This paper is applicable to the Chinese national standard (CNS> A4 specification (210X297mm) A 7 B7. V. Invention description (〇) (4ppm)-PP: Polypropylene, then install the adsorbent tube at the front end of the needle chuck. Open holes in the container body, insert the adsorption tube into the cavity • Aspirate 1 liter of internal vapor. Set the adsorption tube in the GC-MS, analyze the dedimensional gas, and measure the low-boiling volatile components in the container at that time Quantity. The result is shown in 圔 3. Here, the length is 10_1 ws / 1. At this time, AB does not generate particles. The wafer can be maintained well, but CD generates particles. From this fact, it can be seen that The more low-boiling point volatile components in the container * the less pollution, and the container body is also the one with more low-boiling point components, and the carrier or holder directly in contact with the crystal garden, the one with the lower K-boiling point is better. Secondly, as a second embodiment of the present invention, another example of the manufacturing method of a packaging container for semiconductor wafers will be described. First, the cross-linking reaction is initiated by the gas phase method to form polypropylene. Then, only the container body and The polypropylene used for the cover body is washed with n-hexane. At this time, the polypropylene resin contains a large amount of n-hexane (C = 6). The subsequent process is formed in exactly the same way as the first example above. In the same way, the polypropylene formed by the M vapor phase method is also combined. After cross-checking, wash it with n-hexane, and then K is the same way as the semiconductor wafer packaging container of polypropylene formed by the liquid phase method. At room temperature, -15- This paper standard applies to China Standard (CNS) Α4 specification (210Χ297 公 4) (Please read the precautions on the back before filling in this page) Order A7 _B7 5. Description of the Invention (Porphy) After 3 months, when opening the container, no chip is available The phenomenon of water repellency is generated, and the clean surface can be maintained. Secondly, as a third embodiment of the present invention, another example of the manufacturing method of a packaging container for half wafer wafers will be described. 1 00C, 30 ~ 40 hours of heat treatment, after the volatile organic compounds have been fully removed, add to the polypropylene an aliphatic hydrocarbon with a carbon number of about 10 ~ 16 to a level of 0.01%, and then mix Aliphatic hydrocarbons with a degree of about 10 to 16 are prepared, and then the pellets 1 are prepared, and then the parts of the container body 1 and the cover 2 are molded using a mold. On the other hand, the carrier and the holder are formed in the same manner as above except for the addition process K of the aliphatic hydrocarbon. The semiconductor wafer packaging container formed in this way is also the same. After 3 months at normal temperature, no matter which silicon crystal * is used to maintain a clean surface when the container is opened. Next, as a fourth W embodiment of the present invention, yet another example of the manufacturing method of the semiconductor wafer packaging container of the present invention will be described. First, use polypropylene as a raw material * to perform a heat treatment of 1 001 and 30 to 400 hours to fully remove volatile organic components, and then use a chess set to perform each of the container basic Zhao 1, the lid H2, the carrier 3, and the holding member 4 The forming of parts. Then, the container body and lid® were immersed in isopropyl fermentation solution for several days.

This paper scale is applicable to the Chinese National Standard (CNS) A4 specification (210X297mm) A7 B7 V. Description of the invention ((.〇1 1 I The semiconductor wafer packaging container formed in this way is also passed at room temperature 1 1 1 3 months later, when the container is opened, no matter any silicon 1 I, please 1 I wafer can maintain a clean surface. 0 Min 1 I, and then as the fifth tribute of the present invention. 1 1 I I will explain another example of the manufacturing method of the packaging container for crystal painting. Note 1 I meaning I first use polypropylene as the original family to form nine grains and then implement 1 0 0 Item 1 I again 1 |, 3 0 4 0 After heat treatment for 1 hour to fully remove volatile and volatile components, 1 use this 9 mold to carry out the container body 1 Ν lid 2 Λ carrier 3, holding 4 1 · Forming of various parts of «—> 1 〇1 1 and then placed in the container body and lid body for several days to impregnate aliphatic hydrocarbons with a carbon number of about 6 8 with a weight of 1 1 and a weight of 5 0 PP m or more Or boiling point 1, order the same part of the yeast that will not be needed> λ Wash and remove the low-boiling ingredients to fill 1 full container 0 1 1 According to this-the semiconductor wafer packaging container formed in this way is also at room temperature 1 | after 3 After a month, when opening the container, no matter how many silicon 1 Λ >-wafers can maintain a clean surface Ο W 1 and this fifth embodiment can also be formed in the container body and 1 1 cover Aliphatic hydrocarbons impregnated with hundreds of carbon in the degree of 6-8 can also be used as the first embodiment of the present invention. Invention of the semiconductor 1 1 Another example of the manufacturing method of a packaging container for wafers 0 1 1 First, polypropylene is used as a raw material to form pellets, and VX 1 0 0 v 1 I and 3 0 4 0 hours of bran treatment are used. The volatile organic components are adequately removed 1 1 1-17-1 1 1 The ft scale of this paper is applicable to the Chinese National Standard (CNS) A4 specification (210X297mm) 5. After the description of the invention (it) goes, hold the 4 In time, put the carbon shavings. In addition, the aliphatic hydrocarbon level of fat A7 B7 molds the various parts of the container body 1 using a mold. The resulting packaging container contains 6 to 8 aliphatic substances, and only the inner volume of the container, the lid 2, the carrier 3, and the semiconductor wafer are sealed with hydrocarbons or yeasts with the same boiling point, etc. The saturated steam filled with saturated steam will impregnate the carbon with a number of 6 ~ 8 into the container with a carbon number of 6 ~ 8. Examples. The carrier and the container body are like one 2 and the number of impregnated carbon is 6. Direct contact with the wafer is sufficient to remove volatile organic components. (Please read the precautions on the back before filling in this page) I% ί Ρ This is integrally formed, ~ 8 degree polypropylene of the body of the container [Based on the invention [圔 1 of the drawing] Solution perspective round drawing 2 Low boiling point of Figure 3 in The above-mentioned base of gaseous group hydrocarbons. Secondly, in the case of this packaging container, in the case of the six-paste pickling system, the material (not shown) can also be sealed in other implementations of the invention, as shown in 圔 6, Bottom * Only the holder 1 4 made of polypropylene of the cover 1 * is made of. 1 5 Series of aliphatic hydrocarbons in the sealing part 1 1 or the composition of the effect [Effect] The present invention can maintain a clean semiconductor wafer surface for a long time. Brief description] This is the first embodiment of the present invention. The packaging container for semiconductor crystals has the addition of volatile components to the pollution of the surface of the crystal garden. * The M-based container has a low boiling point volatile component -1 8 _ the amount of volatile materials For the paper size of the container volume and particle generation, the Chinese national standard (CNS) Α4 is present (210Χ 297 mm) it% V. Invention description (q) Figure 4 shows the surface of the wafer. Figure 5 shows The temperature of each aliphatic hydrocarbon is shown in Fig. 6 according to the present invention [SI MM 0 C description] 1 Container body 2 Cover 3 Carrier 4 Holder 5 Sealing member 1 1 Container body 1 2 Cover 1 4 Holder 1 5 An analysis diagram of the analysis results of the sealing parts A7 B7. Diagram of the relationship between temperature and vapor pressure. Examples of packaging containers for semiconductor wafers (please read the precautions on the back before filling in this f) The specifications of this paper apply to the Chinese National Standard (CNS) A4 specification (210X 297mm)

Claims (1)

ABCD, Ministry of Economic Affairs, Central Standards Bureau, Employee Consumer Cooperation Du Printing 6. Scope of patent application 1 'A packaging container for semi-conducting wafers, which is composed of a container body and a lid, and its interior is M sealed to accommodate semiconductor wafers; The special excitement is: In the internal space of the packaging container, aliphatic hydrocarbons with a carbon number of 6 to 8 or alcohols with a boiling point of 10 ουκ are enclosed. 2 · A kind of packaging container for semiconductor crystal painting, which is composed of the container body and the lid body, and the inside is a K sealing device to house the semiconductor wafer; its special excitation system is at least = the above container. The system consists of 6 ~ It is composed of 8-degree aliphatic hydrocarbon or yeast resin with boiling point of 10 OCM. 3 ·-A kind of packaging container for semiconductor crystal painting, which is constructed by the container body and the lid body, and the interior of which contains the semiconductor crystal painting in a sealed state; its special excitement is in: the internal space of the packaging container for semiconductor wafers , Encapsulated with resins impregnated with aliphatic hydrocarbons with a carbon number of 6 to 8 or yeasts with a boiling point of 100 tM, and can produce an evaporation source with a low boiling point and a low component. The manufacturing method of the packaging container for round use, the special method of which includes:-the process of forming a polypropylene resin by initiating the cross-pointing reaction by the liquid phase method using n-hexane; and a pellet formed from the polypropylene resin , By forming the nine grains, -1 ~ This paper scale is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) .................. ¥ .. .............. Order ......... i (Please read the notes on the back before filling in this page) ABCD Ministry of Economic Affairs Central Oak Standard Printed by the Bureau of Consumer Engineering Co., Ltd. 6. The scope of patent application is formed by the container body and the lid body The device forming process. 5. A kind of manufacturing method of packaging container for semiconductor wafer; the special method here includes: a process of forming a cross-linking reaction by a gas phase method to form a polypropylene resin; and a forming process of the above polypropylene resin Pellets are formed by forming the pellets * to form a container body and a lid body. A process of forming a container in which a semiconductor wafer is housed in a closed state. 6 _ —Preparation method of packaging container for semiconductor wafers; its special method includes: a heat treatment process to remove volatile organic components from raw material resin; a number of carbon added to the above raw material resin is about 1 0 ~ 16 Aliphatic hydrocarbons, the process of forming pellets; and a process of forming the above-mentioned pellets to form a container composed of the container body and the lid tilt, and the semiconductor wafer is received in a sealed state inside K. 7. A kind of manufacturing method for packaging containers for semiconductor wafers; the special illicit methods here include:-Pellet forming process by removing raw material resin to form pellets; -2- This paper scale is applicable to China National Standard (CNS) A4 Specifications (210 X 297 mm) ..................... f pack .......... Order (please (Read the precautions on the back first and then fill out this page) A8 Bg C8 D8 6. Scope of patent application 1. The heat treatment process of removing the volatile ingredients from the pellets; Once the pellets are formed, the container body and lid are formed The process of forming a container that contains semiconductor wafers in a sealed state inside;> and at least one of the above container bodies is immersed in aliphatic hydrocarbons containing a carbon number of 6 to 8 or a boiling point of 100 C or less In the alcohol solution, the surface is impregnated with aliphatic hydrocarbons with a carbon number of about 6 to 8 or alcohols with a boiling point of 1 OOtK. 8. A method for manufacturing a packaging container for semiconductor wafers; its special method includes: a process for forming pellets from raw resin;-a heat treatment process for removing volatile organic components from the pellets; The granules are immersed in a solution containing aliphatic hydrocarbons with a carbon number of 6 to 8 or enzymes with a boiling point of less than 1,000, and the surface is impregnated with aliphatic hydrocarbons with a number of 6 to 8 or a boiling point of 1OOCK The process of yeast; and printed by the Employee Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling in this page). Once the pellets are formed, they are formed by the container body and the lid. The forming process of a container that houses semiconductor wafers in a closed state. 9. A semi-conductor «Fabrication method for packaging containers for wafers; its special methods include: 1. Forming raw material resin to form a container body and a lid body -3- This paper size is applicable to Chinese national standards (CNS) A4 specification (210 X 297 male daughter) 6. The scope of the patent application is the forming process of the container in which the semiconductor wafers are housed in a sealed K state; and at least a fatty hydrocarbon containing a carbon number of 6 to 8 or an alcohol with a boiling point of 10 is contained in the body. The process of removing the solution after leaving it for a certain period of time. 1 ◦A method for storing semiconductor wafers; its special methods are: This method includes: a process of arranging semiconductor wafers in a container body; a placement of a lid corresponding to the container body on the container body, and the container body The exhaust process of the internal gas to be exhausted; K and a container with the number of carbons of 6 to 8 in the state of the above-mentioned container $ aliphatic hydrocarbons or alcohols with a boiling point of 100 C Μ, the above container A closed process between the body and the cover. (Please read the precautions on the back before filling out this page) Printed by the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs -4- This paper scale is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm)