A7 ^05715 B7 五、發明説明（1 ) [發明所靨之技術領域] (請先閱讀背面之注意事項再填寫本頁) 本發明有關於半導體裝置之外部引線修整機及具備該外 部引線修整機之半導體裝置之外觀檢査裝置。 [習知之技術] 圖14之（1)和（2)是概略圖，分別用來表示習知之QFP( Quad Flat Package)半導體裝置之外部引線修整機之外部 引線之間距修整部及平坦度修整部之構造，圖中以模架為 開放之狀態表示。圖中之符號1和1A是第1修整部，2和2A 是第2修整部，3是模型保持器，4是模型板，5是衝床保持 器，6是衝床板，Ua和lib是間距修正衝床，12是引線推 下衝床，13是封裝接受模型，15和25是被修整半導體裝置 ，16和26是半導體裝置外部引線，18是上支點，22是引線 推上模型| 23是脫模裝置，28是脫模裝置安裝螺栓，24是 封裝推下衝床，30是壓縮彈簧，31是推壓彈簧。 經濟部中央標準局員工消費合作社印製 下面將說明其動作。依照該習知之外部引線修整機之外 部引線修整，如圖15之（1)〜（4)所示，其進行是Μ使用間距 修整部之2個工程和使用平坦度修整部之2個工程合計4個 工程來進行。首先，在圖14(1)之模架為開放之狀態，將 被修整半導體裝置15裝載在第1修整部1之封裝接受台13上 。其次，使衝床保持器5下降和使被固定在衝床板6之第1 間距修整衡床Ua下降，Μ可滑動狀態定位在間距修整衝 床11a内之上支點18亦同時下降。然後利用上支點18和封 裝接受模型13推壓被修整半導體裝置15之模型封裝，利用 彈簧31之作用力將其包夾和固定成不會動之方式。在此種 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） "** 4 ·~· 經濟部中央標準局員工消費合作社印製 A7 B7 五、發明説明（2 ) 狀態，當推下間距修整衝床11a時*被修整半導體裝置15 之外部引線16就如圖15(1)所示的沿著修整爪111(位於間 距修整衝床11a之下端）之形狀被左右掮大。 其次，將該擴大後之被修整半専體裝置15搬運和裝載到 第2修整部2之封裝接受模型113上。然後*在上述第1修整 部1被擴大之半導體裝置外部引線16，如圖15(2)所示，利 用與上述第1修整部1大致相同之動作，沿著間距修整衝床 lib之下端所具備之間距第二修整爪112被壓回，於是間距 修整即告完成。 其次*將完成間距修整之被修整半導體裝置15搬運和裝 載到圖14(2)所示之平坦度修整模架為開放狀態之第1修整 部1A之封裝接受模型13上。在此種狀態，當使衝床保持器 5下降時，如圖15(3)所示，被固定在衡床板6之引線推下 衝床12亦進行下降，利用推下衝床12之斜面部121用來將 被修整半導體裝置25之外部引線26推下到任意之位置。其 次，將該被推下之半導體裝置25搬運和裝載到第2平坦度 修整部2A之脫模裝置23上。其次，當使衡模保持器5下降 時，被固定在衝床板6之封裝推下衡床24a就進行下降，用 來將模型封裝表面27壓入。該被壓入之被修整半導體裝置 25在脫模裝置23上進行下降（這時，壓縮彈簧30被壓縮）， 如圖15(4)所示，該被修整半導體裝置25之外部引線26接 觸在引線推上模型22，因為被推上到任意位置（回到原來 位置）。利用這種方式，被修整半導體裝置15和25之外部 引線16和26之間距修整和平坦度修整就全部完成。 本纸張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） ~ m ϋ^ι im dn m —^ϋ ^ fK ^^^1 i iΛ^. 、\= 口 (請先閱讀背面之注意事項再填寫本頁) -5 - A7 B7 經濟部中央標準局員工消費合作社印製 五、發明説明 ( 3 ) 1 1 I明所欲解決之問題] Ί I 在 上 述 方 式 之 習 知 之 半 導 體 裝 置 之 外 部 引 線 修 整 機 中 9 1 | 於 外 部 引 線 之 間 距 修 整 時 需 要 使 用 2個之修整用爪用來 請 先 1 1 閱 | 進 行 2次之間距修整 所以會使裝置之體積變成很大 和 讀 背 | 面 I 使 修 整 作 業 之 工 程 變 成 複 雜 化 為 其 問 題 0 1 I 意 1 I 另 外 在 上 述 方 式 之 習 知 之 半 導 體 装 置 之 外 部 引 線 修 整 事 項 1 I 機 中 因 為 需 要 間 距 修 整 模 架 和 平 坦 度 修 整 模 架 之 2個模 填 寫 本 裝 架 所 壓 製 部 會 變 大 裝 置 全 體 亦 會 因 而 變 大 所 以 會 頁 1 I 造 成 製 作 成 本 變 高 之 間 題 〇 1 1 另 外 在 半 導 體 裝 置 外 部 引 線 平 坦 度 修 整 部 於 修 正 時 1 因 為 Μ 封 裝 之 4邊接受半導體裝置之模型封裝 所Μ在封 訂 裝 之 反 轉 扭 轉 之 模 型 封 裝 之 情 況 時 在 其 4邊内形成搖搌 Γ I 狀 態 修 整 後 之 半 導 體 裝 置 外 部 引 線 亦 形 成 搖 振 狀 態 會 1 1 I 造 成 平 坦 度 不 良 之 問 題 0 1 1 另 外 在 上 述 方 式 之 半 導 體 裝 置 外 部 引 線 平 坦 度 修 整 部 I 於 外 部 引 線 之 推 下 工 程 後 之 推 上 工 程 不 會 適 當 的 將 引 1 1 線 推 上 為 其 問 題 〇 » 1 I 另 外 在 具 備 有 習 知 之 半 導 體 裝 置 之 引 線 修 整 部 之 外 觀 1 I 檢 査 裝 置 中 半 導 體 裝 置 之 封 裝 之 形 狀 變 更 等 所 對 應 之 修 1 1 整 零 件 之 程 度 變 更 等 不 能 很 容 易 的 進 行 為 其 問 題 〇 1 1 本 發 明 用 來 解 決 上 述 之 問 題 其 巨 的 是 提 供 一 種 半 導 體 1 | 引 線 修 整 機 和 具 備 該 修 整 機 之 半 導 體 裝 置 之 外 觀 檢 査 裝 置 1 I 9 可 以 使 半 導 頒 裝 置 之 外 部 引 線 之 間 距 修 整 部 之 構 造 簡 化 1 1 1 用 來 使 其 工 程 簡 化 〇 另 外 本 發 明 之 巨 的 是 提 供 一 種 半 導 1 1 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） -6 - A7 B7 經濟部中央標準局員工消費合作社印製 五、發明説明 ( 4 ) 1 1 體 引 線 修 整 機 和 具 備 該 修 整 機 之 半 導 體 裝 置 外 觀 檢 査 装 置 1 I > 經 由 使 該 半 導 體 裝 置 外 部 引 線 修 整 機 由 2横架構造變成1 1 I 模 架 構 造 可 Μ 比 習 知 者 更 小 和 成 本 更 低 〇 另 外 本 發 明 請 先 關 1 1 I 之 巨 的 是 提 供 一 種 半 導 體 引 線 修 整 機 和 具 備 該 修 整 機 之 半 背 1 1 導 體 裝 置 外 觀 檢 查 裝 置 在 進 行 外 部 引 線 平 坦 度 修 整 用 之 TS7 之 注 1 I 意 1 I 封 裝 接 受 時 模 型 封 裝 之 反 轉 扭 轉 可 Μ 被 吸 收 藉 提 高 平 事 項 1 I m 度 Ο 另 外 本 發 明 之 巨 的 是 提 供 一 種 半 導 體 裝 置 外 部 引 寫 本 裝 線 修 整 機 和 具 備 該 修 整 機 之 半 導 體 裝 置 外 觀 檢 査 裝 置 在 頁 1 I 半 導 體 裝 置 外 部 引 線 平 坦 度 修 整 工 程 中 可 Μ 適 當 的 進 行 1 1 外 部 引 線 之 推 上 〇 另 外 本 發 明 之 百 的 是 提 供 一 種 半 導 體 I 裝 置 之 外 觀 檢 査 裝 置 可 >λ 很 容 易 的 進 行 半 導 體 裝 置 之 封 訂 裝 之 形 狀 變 更 等 所 對 應 之 修 整 零 件 之 程 序 變 更 〇 I [解決問題之手段] 1 1 1 在 用 以 解 決 上 述 問 題 之 依 照 本 發 明 之 半 導 體 裝 置 之 外 部 1 1 引 線 修 整 機 中 其 特 徵 是 具 備 有 第 1間距修整爪 將可 1 通 過 外 部 引 線 之 各 個 引 線 間 之 各 個 間 隙 之 爪 部 排 列 成 1 1 具 有 上 述 各 涸 間 隙 之 1個間距 和第2間 距 修 整 爪 將 可 以 1 I 通 過 外 部 引 線 之 各 個 引 線 間 之 各 個 間 隙 之 爪 部 排 列 成 對 I I 應 到 上 述 第 1間距修整爪之各個爪部所未對應之1 個 間 距 之 1 1 各 個 間 隙 上 述 之 第 1間距修整爪和上述之第2間 距 修 整 爪 1 1 被 配 置 成 對 半 導 體 裝 置 之 外 部 引 線 具 有 互 不 相 同 之 距 離 1 1 I 而 且 互 相 連 鑛 的 進 行 動 作 〇 1 I 另 外 在 本 發 明 中 最 好 在 一 個 模 架 具 備 有 上 述 之 第 1間 1 1 I 距 修 整 爪 和 上 述 之 第 2間距修整爪 ，和用來使該等第1 和 第 1 1 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 7 A7 B7 經濟部中央標準局員工消費合作社印製 五、發明説明 ( 5 ) 1 I 2間距修整爪進行連續動作之外部引線之平坦度修整部。 » * ! 1 另 外 * 在 本 發 明 中 最 好 在 一 個 模 架 具 備 有 :上 述之第 1 /S 1 I 間 距 修 整 爪 和 上 述 之 第 2間距修整爪 外部引線之平坦度 請 閱 1 1 I 修 整 用 之 引 線 推 下 部 被 配 置 成 用 來 使 該 等 第1和第2間 距 讀 背 1 1 修 整 爪 連 鑛 的 進 行 動 作 和 外 部 引 線 之 平 坦 度修 整用之 引 1 I 意 1 I 線 推 上 部 位 於 與 上 述 第 1和第2間 距 修 整 爪 分開 之位置 0 項 1 I m 1 V 另 外 在 本 發 明 中 最 好 更 具 備 有 移 動 機 構 ，在 上述之 第 導 本 裝 1和第2間 距 修 整 爪 通 \ Bt. 過 半 専 體 裝 置 之 外 部 引 線之 後，於 回 頁 、〆 1 1 復 移 動 到 原 來 位 置 之 過 程 中 上 述 之 第 1和第2間 距修整 爪 1 1 不 接 觸 在 外 部 引 線 依 此 方 式 使 上 述 之 第 1和第2間距修 整 1 爪 朝 向 離 開 外 部 引 線 之 方 向 移 動 0 訂 另 外 在 本 發 明 中 最 好 具 備 有 間 距 修 整 爪， 將可以 通 I 過 外 部 引 線 之 各 個 引 線 間 之 各 個 間 隙 之 爪 部 ，排 列成具 有 1 I 上 述 各 個 間 隙 之 1個間距 ;第1 間 距 修 整 部 使上 述之間 距 1 1 1 修 整 爪 通 過 上 述 之 各 個 引 線 間 之 各 個 間 隙 利用 該間距 修 1 整 爪 用 來 進 行 第 1間距修整 ;1間 距 移 位 部 在該 第1間距 1 1 修 整 終 了 後 使 上 述 之 間 距 修 整 爪 移 位 1個間距 促成對 1 I 臑 到 上 述 第 1間距修整時之上逑間距修整爪辛通過之1個 間 1 | 距 之 各 個 間 隙 和 第 2間距修整部 用來使該移位後之間 1 1 距 修 整 爪 通 過 上 述 各 個 引 線 間 之 各 個 間 隙 藉Μ 進行第 2 1 1 間 距 修 整 〇 1 1 另 外 在 本 發 明 中 最 好 在 用 Μ 接 受 半 導 體 裝置 之封裝 藉 1 I Μ 進 行 外 部 引 線 修 正 之 接 受 台 具 備 有 環 狀 之突 出部用 以 1 1 I 接 觸 在 封 裝 表 面 〇 1 1 ‘紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） A7 B7 經濟部中央標準局員工消費合作社印製 五、發明説明 (6 ) 1 | 另 外 t 在 本 發 明 中 最 好 使 外 部 引 線 之 平 坦度 修整 用 之 推 • _ 1 1 上 模 型 之 接 wn m 在 該 外 部 引 線 之 部 份 9 形 成 對引 線之 前 端 角 1 | 度 具 有 相 對 角 度 〇 請 先 閱 1 I 另 外 依 照 本 發 明 之 半 導 體 Uti· 裝 置 之 外 觀 檢査 裝置 之 特 徵 讀 背 1 1 面 I 是 將 上 述 之 半 導 體 裝 置 之 外 部 引 線 修 整 機 配置 在其 周 邊 部。 之 1 | 意 I [發明之實施形態] 事 項 1 I 再 在 依 照 本 發 明 之 半 導 體 裝 置 之 外 部 引 線 修整 機中 第 1 填 Η 本 装 間 距 修 整 爪 通 過 外 部 引 線 之 各 個 引 線 間 之 1個間距之各個 頁 1 I 間 隙 然 後 第 2間距修整爪Μ外部引線之上述第1 間 距 修 1 1 I 整 爪 不 能 通 過 之 1個間距通過各個間隙 Μ此方式進行外 1 部 引 線 之 間 距 修 整 〇 另 外 上 述 之 第 1間距修整爪和第2間 訂 距 修 整 爪 因 為 構 建 在 一 個 横 架 内 所 Μ 只 利用 一個 之 模 架 | 之 動 作 就 可 Μ 連 續 的 進 行 第 1間距修整爪之間距修整和第2 1 I 間 距 修 整 爪 之 間 距 修 整 因 此 可 以 使 間 距 修整 工程 簡 化 和 1 1 I 使 間 距 修 整 機 簡 化 及 低 成 本 化 〇 1 —"V 另 外 在 本 發 明 中 於 一 個 模 架 内 具 備 有： 上述 之 第 1 1 1 間 距 修 整 爪 和 上 述 之 第 2間距修整爪 ，和外部引線之平坦 1 | 度 修 整 部 用 來 使 該 等 第 1和第2間 距 修 整 爪埋 缅的 進 行 動 I 作 〇 因 此 半 導 體 裝 置 外 部 引 線 之 間 距 修 整和 平坦 度 修 整 1 1 可 以 在 同 一 模 架 内 連 績 的 進 行 可 Μ 使 外 部引 線修 整 工 程 1 1 簡 化 和 使 修 整 機 簡 化 及 低 成 本 化 〇 1 1 另 外 在 本 發 明 中 於 一 個 模 架 内 具 備 有： 上述 之 第 1 1 | 間 距 修 整 爪 和 上 述 之 第 2間距修整爪 :引線推下部 ，被配 1 I 置 成 與 該 等 第 1和第2間 距 修 整 爪 進 行 連 績 之動 作， 藉 Μ 進 1 1 ‘紙張尺度適用中國國家標準（CNS ) A4規格（210 X 297公釐） -9 - 五、發明説明（7 ) 行外部引線之平坦度修正；和引線推上部，被配置成與上 述之第1和第2間距修整爪分開的進行動作，藉Μ進行外部 引線之平坦度修整。因此，只需要利用同一模架之一個動 作就可Μ連鑛進行引線推下工程用來進行半導體裝置外部 引線之間距修整和平坦度修整，而且平坦度修整用之引線 推上工程亦可連績的進行。 另外，在本發明中，於使 上述第1和第2間距修整爪通 過半導體裝置之外部引線後回復移動到原來位置之過程中 ，因為利用移動機構使上述之第1和第2間距修整爪依離開 外部引線之方向移動，所Κ在上述之回復移動過程中可Μ 防止由於上述之第1和第2間距修整爪接觸在外部引線而造 成之外部引線之變形。 經濟部中央標準局員工消費合作社印製 (請先閱讀背面之注意事項再填寫本頁) 另外，在本發明中，首先是使間距修整爪通過上述各個 引線間之各個間隙藉Μ進行第1間距修整，然後，使上述 之間距修正爪移位1個間距（對應到該第1間逅修整時上述 間距修整爪不能通過之1個間距之各個間隙），其次，使該 移位後之間距修正爪通過上述各個引線間之各個間隙，經 由進行第2間距修整用來進行外部引線之間距修整。因此 ，用以進行外部引線之間距修正之間距修整爪可Μ小型化 和低成本化。 另外，在本發明中，當Κ接受台接受外部引線修正用之 半導體裝置之封裝時，因為在接受台具備有環狀之突出部 ，因為該環狀之突出部Μ環狀接觸在封裝表面，所以可以 獲得任意三點之接受，不會產生封裝之搖擺狀態，可Μ穩 本紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ 297公釐） -10 - A7 2C57J5 B7 五、發明説明（8 ) 定的接受封裝。 (請先閱讀背面之注意事項再填巧本頁) 另外，在本發明中，於半導體裝置之外部引線修整機之 情況，對於外部引線之平坦部修整用之推上模型，其接觸 在外部引線之部份對引線之前端角度形成有相對角度。利 用這種方式，在推上模型只有引線之前端部份接觸，因為 外部引線之彈回量為一定，所Μ可更高之精確度進行 平坦度修整。 另外，在依照本發明之半導體裝置之外觀檢査裝置中， 因為將上述之半導體裝置之外部引線修整機配置在其周邊 部，所Μ對應到半導體裝置之封裝之形狀變更等之修整機 之拆卸和安裝等之程序之變換變成很容易。 實施形態1 經濟部中央標隼局員工消費合作社印製 本紙張尺度適用中國國家標率（CNS ) Α4規格（210X 297公釐） 經濟部中央標準局員工消費合作社印製 A7 B7 五、發明説明（9 ) 數個）。另外，依外部引線1 6之排列方向之平行方向，將 間距修整爪11 2配置成使其面對各個外部引線1 6之間之各 個間隙之第偶數個（或第奇數個）。另外，間距修整爪111 和間距修整爪112依照對外部引線16之接近/離開方向（圖 中之垂直方向）被配置成上下二段。因為間距修整爪111和 間距修整爪112依此方式構成，所Μ當間距修整衝床11進 行下降移動時，如圖3所示，首先，間距修整爪111插入到 各個外部引線16之間之各個間隙之第奇數個（或第偶數個） 進行通過，其次，間距修整爪11 2插入到各個外部引線1 6 之間之各個間隙之第偶數個（或第奇數個）進行通過。利用 這種方式，習知之圖15(1)和（2)所示之需要2次之下降動 作才能進行之間距修整，在本實施例中只需要一次之下降 動作就可以連績的進行。 另外，在該第一修整部1中組合有利用1個動作（1個下降 動作）即可進行間距修整之間距修整部11和平坦度修整用 之引線推下衝床1 2。利用這種方式*只需要利用一組之横 架之第一修整部1就可Μ實施間距修整之全部工程，和平 坦度修整之前半工程（平坦度修整之後半工程以第二修整 部2實施）。因此，所提供之引線修整櫬可ΜΜ節省之空間 使控制簡化，可Μ進行引線之間距修整和平坦度修整等之 雙方修整。 下面將利用圖1〜圖4用來說明實施形態1之動作。圖2用 來詳细說明圖1之第一修正部1之動作，圖3是概略斜視圖 ，用來表示第一修整部，圖4是包含有壓製機之外部引線 本紙張尺度適用中國國家標準（CNS ) Α4規格（210'乂297公釐） i In m In im am t^n ^^^1 m- —^ϋτν f 灸- 、v>口 (請先閱讀背面之注意事項再填寫本頁) -12 - 經濟部中央標準局員工消費合作社印製 A7 B7 五、發明説明（10 ) 修整機之全體之概略斜視圖。 首先，將被修整半導體裝置15裝載在第一修整部1之封 裝接受台13。當利用空氣氣缸等之驅動源（參照圖4之符號 9)使衝床保持器5下降時，首先利用上支點18從上方推壓 被修整半導體裝置15之表面17，利用推壓彈簧31之力量推 壓（參照圖2 (1))。 其次，當連績的使衝床保持器5更進一步的下降時，第 一間距修整爪111就在1個引線間通過被修整半導體裝置15 之引線16之引線間之間隙（參照圖2(2))。這時，間距修整 爪111之前端為箭頭（或劈）之前端狀（參照圖2之（2)和（3)) ，被排列成對應到梳齒狀之半導體裝置引線1 6之間距，可 以順利的進入引線和引線i闇。然後當衝床保持器5進行下 降時，修整爪111通過引線之間，依横方向推壓引線使其 分開成對應到修整爪111之寬度。修整爪111之最大寬度尺 寸比引線間之尺寸稍大，該修整爪111之最大寬度尺寸之 決定是依照引線16之材質和厚度用來使修整能力成為最佳 化0 然後，當衡床保持器5下降時，這時第二間距修整爪112 通過第一修整爪111未通過之引線間，與第一修整爪時同 樣的，用來推壓引線16使其分開（參照圖2(3))。例如，使 第一間距修整爪111通過第奇數個之引線間•使第二間距 修整爪112通過第偶數個之引線間和最終端引線之外側（參 照圖3 )。 _然後當衝床保持器5進行下降時，引線推下衝床12之斜 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閱讀背面之注意事項再填寫本頁) -13 - A7 B7 五、發明説明（U ) 面部121就將引線16之前端推下到下方（參照圖2(4))。 當適當之推下過程完了時，於經過一定時間之後，驅動 源9進行反方向之動作，使衡床保持器5開始上升。上升行 程與下降行程相反，亦即與圖2之順序相反（圖2(4)~> (3) 4 (2)4(1))。另外，當間距修整爪111和112進行上升分 別通過對應之引線間時，可能會因為引線16和修整爪111 和112之間產生摩擦，因而產生將半導體裝置15提上之方 向之力量，對於此點，至少在間距修整爪111和112從下方 朝向上方完成通過引線間之前，因為利用上支點18持鑛將 半導體裝置15推到下方，所Μ不必擔心會將半導體裝置15 提上。 下面將說明第二修整部2之動作。在上述之第一修整部1 之衝床保持器5之上升完了時，就將被修整半導體裝置15 取出，使其移動到第二修整部2之脫模装置23上和進行裝 載。這時被裝載之被修整半導體裝置為圖1之符號25。另 外一方面，在變空之第一修整部1之封裝接受台13可以裝 載下一個之被修整半導體裝置15。 經濟部中央標準局員工消費合作社印製 (請先閲讀背面之注意事項再填寫本頁) 在第二修整部2，與第一修整部1同樣的，當利用空氣氣 缸等之驅動源9使衝床保持器5進行下降時，封裝推下衝床 24就下降，用來將被修整半導體裝置25之封裝表面27推下 。Μ比壓縮彈簧30之彈力大之下降力，將被壓縮彈簧30之 彈性支持之被裝載在脫模裝置23上之被修整半導體裝置25 推下。如此一來，被修整半導體裝置25之外部引線26就被 推壓到引線推上模型2 2，用來將引線2 6推上到上方。這時 本紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ297公釐) -14 - 五、發明説明（12 A7 B7 之行 當進 適24 最床 定衝 決下 來推 用裝 ’ 封 狀使 形後 、 之 質間 材時 之之 26定 線一 引過 照經 依在 量’ 之後 上然 推。 之量 成 完 告 即 程Η 部 全 之 整 修 線 引 是 2 於態 ， 形 升施 上實 態 形 施 實 明 說 來 施 實 本 態在 形 ， 施部 實整 在修 〇 之 Λνΐ 個二 有 合 I 0 架 模 3 之 用 a 5 組 圖 一 據在 根是 將例 面實 下之 示 中 2 態形 形施 態 實分 比架 部模 整之 修組 。二 部在 整之 修術 之技 個知 三 習 有與 備當 具是 架但 模 ， 之個 組 一 一 加 是增 實 與 時 較 比 造 構 之 部 整 修 個 四 1T 合 部 整 修 個二 有 備 具 別 造 構 之 間 空 省 節 且 而 單 簡 成 形Μ 可 的 樣 同 11 態 形 施 第 於 中 5 圖 在 部 整 修 (請先閱讀背面之注意事項再填寫本頁) 整 修 距 間 行 進 只 態 ， 形 件施 零實 之與 --- 11 用 1 整床 修衝 距整 間修 備距 具間 只 之 用 使 所 中 其 同 相 者 度 坦 平 之 線 引 置 裝 體 導 半 行 進 IX 部 整 修二 第 用 利 次 其 程Η 半 前 之 整 修 整 修 三 第 ， 用)> 利程 ，Η 後上 然推 。 線 \1/ U 弓 程 ί 工程 下工 推半 線後 引之 丨整 修 度 坦 平 施 實 2 是 於 部 線 經濟部中央標準局員工消費合作社印製 衝 動 驅 來 用 源 動 驅 個1 用 利 只 Μ 可 亦 〇 中 成 2 完態 告形 即施 程實 工本 整在 修 . 部 15整 置修 装三 體第 導向 半朝 整再 修 ， 被1' , 部 側整 床修 之態 置形 裝施 體實 導之 半述 個上 多在 行 ’ 進外 的另 績 二 連 第Μ 向藉 朝 ， L載 裝 行 進 的 序 順 部 整 修1 第 從 業 作 整 修 線 部 整 修二 第 用 利 是 造 構 之 中 用 部 整 部修 整二 修第 三 使 第 Μ 用可 利也 ’ 是 下但 推， 線上 -二· il二 弓 推 之線 正引 修之 度整 坦修 平度 行坦 進平 來行 用進 1 來 本紙張尺度適用中國國家標準（CNS ) A4規格（210 X 297公釐）A7 ^ 05715 B7 5. Description of the invention (1) [Technical field of the invention] (Please read the precautions on the back before filling in this page) The present invention relates to an external lead trimming machine for semiconductor devices and equipped with the external lead trimming machine Appearance inspection device for semiconductor devices. [Conventional Technology] FIGS. 14 (1) and (2) are schematic diagrams respectively showing the external lead spacing trimming portion and the flatness trimming portion of the external lead trimmer of the conventional QFP (Quad Flat Package) semiconductor device The structure is shown with the mold base open. The symbols 1 and 1A in the figure are the first trimming part, 2 and 2A are the second trimming part, 3 is the model holder, 4 is the model plate, 5 is the punch holder, 6 is the punch plate, Ua and lib are the spacing correction Punch, 12 is the lead-down punch, 13 is the package acceptance model, 15 and 25 are the trimmed semiconductor device, 16 and 26 are the external leads of the semiconductor device, 18 is the upper fulcrum, 22 is the lead-up model | 23 is the demoulding device , 28 is the mounting bolt of the demoulding device, 24 is the encapsulation push down punch, 30 is the compression spring, and 31 is the compression spring. Printed by the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs. The external lead trimming according to the conventional external lead trimming machine, as shown in (1) to (4) of FIG. 15, is performed by a total of 2 processes using the pitch trimming part and 2 processes using the flatness trimming part 4 projects. First, with the mold frame of Fig. 14 (1) open, the semiconductor device 15 to be trimmed is mounted on the package receiving table 13 of the first trimming unit 1. Next, the punch holder 5 is lowered and the first pitch trimming bed Ua fixed to the punching plate 6 is lowered, and the fulcrum 18 which is slidably positioned in the pitch trimming punch 11a is also lowered. Then, the upper fulcrum 18 and the package receiving model 13 are used to push the model package of the semiconductor device 15 to be trimmed, and the force of the spring 31 is used to clamp and fix it in a manner that does not move. In this paper scale, the Chinese National Standard (CNS) A4 specification (210X297 mm) is applied. &Quot; ** 4 · ~ · A7 B7 printed by the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs 5. The description of invention (2) status, when When the pitch trimming punch 11a is pushed down, the external leads 16 of the semiconductor device 15 to be trimmed are shaped as shown in FIG. 15 (1) along the shape of the trimming claw 111 (located at the lower end of the pitch trimming punch 11a). Next, the enlarged device 50 to be trimmed is transported and loaded onto the package receiving model 113 of the second trimming unit 2. Then, as shown in FIG. 15 (2), the external leads 16 of the semiconductor device in which the first trimming part 1 is enlarged, trimming the lower end of the punch lib along the pitch by the same operation as the first trimming part 1 The second trimming claw 112 is pressed back, and the trimming of the gap is completed. Next, * the semiconductor device 15 to be trimmed having completed the pitch trimming is transported and loaded onto the package receiving model 13 of the first trimming section 1A in which the flatness trimming mold base shown in FIG. 14 (2) is open. In this state, when the punch holder 5 is lowered, as shown in FIG. 15 (3), the lead fixed to the balance board 6 pushes down the punch 12 and also uses the inclined portion 121 of the push down punch 12 to The external lead 26 of the semiconductor device 25 to be trimmed is pushed down to an arbitrary position. Next, the pushed-down semiconductor device 25 is transported and loaded on the mold release device 23 of the second flatness finishing section 2A. Next, when the scale holder 5 is lowered, the package fixed to the punch plate 6 is pushed down and the scale 24a is lowered to press the mold package surface 27 in. The pressed semiconductor device 25 to be trimmed is lowered on the stripping device 23 (at this time, the compression spring 30 is compressed), as shown in FIG. 15 (4), the external lead 26 of the semiconductor device to be trimmed 25 is in contact with the lead Push up the model 22, because it is pushed to an arbitrary position (return to the original position). In this way, the trimming and flatness trimming between the outer leads 16 and 26 of the trimmed semiconductor devices 15 and 25 are all completed. This paper scale is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) ~ m ϋ ^ ι im dn m — ^ ϋ ^ fK ^^^ 1 i iΛ ^., \ = Port (please read the note on the back first Please fill out this page again) -5-A7 B7 Printed by the Employees ’Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs V. Invention Instructions (3) 1 1 I Identify the problem to be solved] Ί I outside the known semiconductor devices in the above manner 9 1 in the lead dressing machine | 2 dressing claws are used for dressing between the outer leads. Please use 1 1 reading first | Perform 2 dressings between the leads, so that the volume of the device becomes very large and the read back | Face I Complicating the repairing process becomes a problem. 0 1 I intention 1 I. In addition, the external lead trimming of the conventional semiconductor device in the above-mentioned manner. The two molds of the trimming mold frame are filled in. The pressing part of the mounting frame will become larger and the entire device will become larger. Therefore, the page 1 I will cause the manufacturing cost to increase. The part was modified at the time 1 because the 4 sides of the M package received the model package of the semiconductor device. In the case of the reversed and reversed model package of the binding, the 4 side formed a shaken Γ I state outside the trimmed semiconductor device. The lead also forms a shaking state. 1 1 I will cause the problem of poor flatness. 0 1 1 In addition, the external lead flatness trimming part I of the semiconductor device in the above manner will not be properly replaced after the external lead is pushed down. Lead 1 1 line to push it to the problem. 〇 1 1 I Appearance of the wire trimming part 1 I Corresponding to the modification of the shape of the semiconductor device package in the inspection device 1 1 The change in the degree of the whole part cannot be easily performed as a problem. 1 1 The present invention is used to solve the above problems. The great thing is to provide a semiconductor 1 | lead trimmer and appearance inspection device of semiconductor device equipped with the trimmer 1 I 9 can simplify the structure of the trimming part between the external leads of the semi-conducting device 1 1 1 used for its engineering Simplified. In addition, the hugeness of the present invention is to provide a semiconducting 1 1 paper standard applicable to the Chinese National Standard (CNS) A4 specification (210X 297 mm) -6-A7 B7 Printed by the Employee Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs. DESCRIPTION OF THE INVENTION (4) 1 1 Body lead trimmer and semiconductor device appearance inspection device equipped with the trimmer 1 I > The trimming machine is changed from 2 horizontal frame structure to 1 1 I. The mold frame structure can be smaller and cheaper than the conventional ones. In addition, the present invention should first close the 1 1 I. The big thing is to provide a semiconductor lead trimming machine and equipped with the trim The back of the machine 1 1 TS7 for external appearance flatness inspection of the conductor device 1 Note 1 I intention 1 I The reverse rotation of the model package when the package is accepted can be absorbed by raising the level 1 I m degree Ο In addition, the hugeness of the present invention is to provide a semiconductor device external lead wire assembly trimmer and a semiconductor device appearance inspection device equipped with the trimmer. In page 1 I, the semiconductor device external lead flatness trimming process can be appropriately performed 1 1 external The lead is pushed on. In addition, one hundred of the invention is to provide a semiconductor I device Appearance inspection device can be> λ It is easy to change the program of the trimmed parts corresponding to the shape change of the binding of the semiconductor device. [Means for solving the problem] 1 1 1 According to the present invention for solving the above problems The exterior of the semiconductor device of the 1 1 lead wire trimmer is characterized by a first pitch trimming claw that arranges the claws that can pass through the gaps between the leads of the external leads into 1 1 1 pitch with each of the above gaps And the second pitch trimming claws can be arranged in pairs with 1 I through the gaps between the individual leads of the external leads II should correspond to the 1st pitch of the 1st pitch trimming claws not corresponding to the above 1 1 each The gap between the above-mentioned first pitch trimming claw and the above-described second pitch trimming claw 1 1 are arranged to have different distances from the external leads of the semiconductor device 1 1 I and the operation of mutually connected mines. 1 I. In addition, in the present invention, it is preferable that a mold base is provided with the above-mentioned first space 1 1 I distance trimming claw and the above-mentioned second spacing trimming claw, and The first and the first 1 paper scales are in accordance with the Chinese National Standard (CNS) A4 (210X297 mm) 7 A7 B7 Printed by the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economy V. Invention Instructions (5) 1 I 2 Spacing The flatness trimming part of the external lead of the claw for continuous operation. »*! 1 In addition * In the present invention, it is better to have a mold base with: the first 1 / S 1 I pitch trimming claw mentioned above and the second pitch trimming claw above the flatness of the external leads, please refer to 1 1 I for trimming The lower part of the lead pusher is configured to make the first and second pitch read back 1 1 The operation of the trimming claw and the flatness of the external lead is used for trimming. The 1st and 2nd pitch trimming claws are separated from position 0 Item 1 I m 1 V In addition, in the present invention, it is better to have a moving mechanism, in the above-mentioned first guide device 1 and the 2nd pitch trimming claw pass \ Bt. After the external leads of the body device, the first and second pitch trimming claws 1 1 mentioned above do not touch the external leads during the process of returning to the original position and returning to the original position. 2 spacing trimming 1 The claw moves toward the direction away from the external lead. In addition, in the present invention, it is preferable to have a spacing trimming claw. The claws that can pass through each gap between each lead of the external lead are arranged to have 1 I above each gap. 1 pitch; the first pitch trimming section makes the above-mentioned gap 1 1 1 the trimming claw passes through the gaps between the above-mentioned respective leads to use the pitch trimming 1 trimming claw to perform the first pitch trimming; the 1 pitch shifting section is located in the first 1 Pitch 1 1 After finishing the trimming, shift the above-mentioned distance between the trimming claws by 1 pitch to promote the pair. 1 I Move to the above 1st pitch when trimming. The gap between the trimming claws passes. 1 | The 2 pitch trimming portion is used to make the shifted 1 1 pitch trimming claws carry out the second 2 1 1 pitch trimming through each gap between the above-mentioned lead wires. In addition, it is preferable to use M in the present invention. Accept the package of the semiconductor device with 1 I Μ for external lead correction. The receiving table is equipped with a ring-shaped protrusion for 1 1 I to contact the surface of the package. 1 1 'Paper size is applicable to China National Standard (CNS) A4 specification (210X297 ) A7 B7 Printed by the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economy V. Description of the invention (6) 1 | In addition t In the present invention, it is best to make the flatness of the external leads to be used for trimming push _ 1 1 m The portion 9 of the external lead forms a front end angle 1 | degrees with a relative angle. Please read 1 I. In addition, the characteristics of the appearance inspection device of the semiconductor Uti device according to the present invention. The external lead trimmer of the above-mentioned semiconductor device is arranged at its peripheral portion. Part 1 | Meaning I [Embodiment of the Invention] Item 1 I Then fill the first in the external lead wire trimmer of the semiconductor device according to the present invention. Page 1 I gap and then the second pitch trimming claw M. The above first pitch trimming of the external leads 1 1 I The gap between the outer 1 lead wires is trimmed through each gap M in one pitch where the claw cannot pass through. In addition, the above first pitch is trimmed. The distance between the trimming claw and the second distance trimming claw is built in a horizontal frame. Only one mold frame is used | The action can be performed continuously. The distance between the 1st trimming claw and the 2 1 I interval trimming The trimming between the claws can simplify the gap trimming process and 1 1 I simplify the gap trimming machine and lower the cost. 〇1 — " V Mingzhong is equipped with a mold base with: the above-mentioned first 1 1 pitch trimming claw and the above-mentioned second pitch trimming claw, and the flatness of the external leads 1 | degree trimming part is used to trim the first and second pitches The operation of the burial is done. Therefore, the trimming and flatness trimming of the external leads of the semiconductor device 1 1 can be performed continuously in the same mold frame. The external lead trimming process 1 1 is simplified and the trimming machine is simplified and low Cost reduction 〇1 1 In addition, in the present invention, in a mold frame is equipped with: the above-mentioned first 1 | spacing trimming claw and the above-mentioned second spacing trimming claw: the lead wire pushes the lower part, and is configured with 1 I 1 and the 2nd pitch trimming claws for consecutive performance, borrow Μ into 1 1 'paper size is applicable to China National Standard (CNS) A4 specifications (210 X 297 mm) -9-V. Description of invention (7) line external leads Flatness correction; and the lead pushes the upper part, which is configured to match the above The first and second pitch trimming claws are operated separately, and the flatness of the external leads is trimmed by M. Therefore, only one action of the same mold frame can be used to carry out the lead-down project of the M-Link, which is used to trim the gap between the external leads of the semiconductor device and the flatness, and the lead-up project for flatness repair can also be successful. Of. In addition, in the present invention, in the process of returning the first and second pitch trimming claws to the original position after passing through the external leads of the semiconductor device, the first and second pitch trimming claws are moved in accordance with the movement mechanism. Moving away from the direction of the external lead, the K can prevent the deformation of the external lead caused by the above-mentioned first and second pitch trimming claws contacting the external lead during the recovery movement described above. Printed by the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs (please read the precautions on the back before filling in this page). In addition, in the present invention, first, the pitch trimming claw is borrowed through the gaps between the above leads to carry out the first pitch Trim, and then shift the above-mentioned distance correction claws by 1 pitch (corresponding to each gap of the 1st pitch that the above-mentioned pitch trimming claws cannot pass through during the first intermediary trimming), and secondly, correct the gap after the shift The claw passes through each gap between the above-mentioned lead wires, and is used for trimming the outer lead wires by performing the second pitch trimming. Therefore, the distance trimming claw used for the distance correction between the external leads can be miniaturized and cost-reduced. In addition, in the present invention, when the K receiving stage receives the package of the semiconductor device for external lead correction, because the receiving stage is provided with a ring-shaped protrusion, because the ring-shaped protrusion M contacts the package surface in a ring shape, Therefore, it can be accepted at any three points, and there will be no swaying of the package. The paper standard can be applied to the Chinese National Standard (CNS) Α4 specification (210Χ 297 mm) -10-A7 2C57J5 B7 5. Description of the invention (8 ) Accept the package. (Please read the precautions on the back before filling out this page) In addition, in the present invention, in the case of an external lead trimmer of a semiconductor device, for the flattening of the flat part of the external lead, a push-up model is used, which is in contact with the external lead The part forms a relative angle to the front end angle of the lead. In this way, only the leading end of the lead is in contact when pushing up the model, because the amount of springback of the external lead is constant, so the flatness can be trimmed with higher accuracy. In addition, in the appearance inspection device of the semiconductor device according to the present invention, since the above-mentioned external lead trimmer of the semiconductor device is disposed at the peripheral portion thereof, the disassembly and repair of the trimmer corresponding to the change of the shape of the package of the semiconductor device, etc. It is easy to change the procedures such as installation. Implementation form 1 The paper standard printed by the Employee Consumer Cooperative of the Central Standard Falcon Bureau of the Ministry of Economic Affairs is applicable to China ’s National Standard Rate (CNS) Α4 specification (210X 297 mm). The A7 B7 is printed by the Employee Consumer Cooperative of the Central Standard Bureau of the Ministry of Economic Affairs. 9) Several). In addition, in accordance with the parallel direction of the arrangement direction of the external leads 16, the pitch trimming claws 11 2 are arranged so as to face the even number (or odd number) of the gaps between the respective external leads 16. In addition, the pitch trimming claws 111 and the pitch trimming claws 112 are arranged in two upper and lower stages according to the approach / exit direction to the external lead 16 (vertical direction in the figure). Since the spacing trimming claw 111 and the spacing trimming claw 112 are constructed in this manner, when the spacing trimming punch 11 moves downward, as shown in FIG. 3, first, the spacing trimming claw 111 is inserted into each gap between each external lead 16 The odd-numbered (or even-numbered) number is passed, and secondly, the even-numbered (or odd-numbered) number of the gap trimming claws 11 2 inserted into each gap between each external lead 16 is passed. In this way, the conventional adjustment shown in Figs. 15 (1) and (2) requires two lowering actions to perform the gap adjustment. In this embodiment, only one lowering action is required to perform consecutive results. In addition, the first trimming unit 1 is combined with one operation (one descent operation) to perform the gap trimming, the gap trimming unit 11 and the lead wire for flatness trimming to push down the punch 12. In this way, only the first trimming section 1 of a set of cross frames can be used to implement all the processes of pitch trimming, and the half process before flatness trimming (the half process after flatness trimming is implemented with the second trimming unit 2 ). Therefore, the provided lead trimming can save space and simplify the control, and can perform both trimming of the lead spacing and flatness trimming. The operation of Embodiment 1 will be described below using FIGS. 1 to 4. Fig. 2 is used to explain in detail the operation of the first correction part 1 of Fig. 1, Fig. 3 is a schematic perspective view showing the first trim part, and Fig. 4 is an external lead including a pressing machine. (CNS) Α4 specification (210 '297 mm) i In m In im am t ^ n ^^^ 1 m- — ^ ϋτν f moxibustion-, v > mouth (please read the precautions on the back before filling this page ) -12-A7 B7 printed by the employee consumer cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs 5. Description of the invention (10) A schematic oblique view of the entire trimmer. First, the semiconductor device 15 to be trimmed is mounted on the package receiving stage 13 of the first trimming section 1. When the press holder 5 is lowered by a driving source such as an air cylinder (refer to symbol 9 in FIG. 4), first, the surface 17 of the semiconductor device 15 to be trimmed is pushed from above by the upper fulcrum 18 and pushed by the force of the pushing spring 31 Pressure (refer to Figure 2 (1)). Secondly, when the punch holder 5 is further lowered, the first pitch trimming claw 111 passes through the gap between the leads of the lead 16 of the semiconductor device 15 to be trimmed between one lead (refer to FIG. 2 (2) ). At this time, the front end of the pitch trimming claw 111 is an arrow (or split) front end (refer to (2) and (3) of FIG. 2), and is arranged to correspond to the spacing between the comb-shaped semiconductor device leads 16, which can be smooth The entry leads and leads i are dark. Then, when the punch holder 5 is lowered, the trimming claw 111 passes between the leads, and the lead is pushed in the lateral direction to be separated to correspond to the width of the trimming claw 111. The maximum width dimension of the trimming claw 111 is slightly larger than the size between the leads. The maximum width dimension of the trimming claw 111 is determined according to the material and thickness of the lead 16 to optimize the trimming ability. 5 When descending, at this time, the second pitch trimming claw 112 passes between the lead wires that the first trimming claw 111 does not pass, and is used to push the lead wire 16 apart as in the first trimming claw (refer to FIG. 2 (3)). For example, the first pitch trimming claw 111 is passed between the odd-numbered leads • The second pitch trimming claw 112 is passed between the even-numbered leads and outside the terminal lead (refer to FIG. 3). _Then, when the punch holder 5 is lowered, the lead pushes down the slanted paper size of the punch 12. The Chinese National Standard (CNS) A4 specification (210X297mm) is applicable (please read the precautions on the back before filling this page) -13 -A7 B7 5. Description of the invention (U) The face 121 pushes the front end of the lead 16 down (refer to FIG. 2 (4)). When the proper push-down process is completed, after a certain period of time, the drive source 9 performs a reverse action to cause the scale holder 5 to start to rise. The ascending stroke is opposite to the descending stroke, that is, the sequence is reverse to that in Figure 2 (Figure 2 (4) ~> (3) 4 (2) 4 (1)). In addition, when the pitch trimming claws 111 and 112 rise through the corresponding leads, friction may occur between the leads 16 and the trimming claws 111 and 112, which may cause a force to lift the semiconductor device 15 in the direction. Point, at least until the pitch trimming claws 111 and 112 pass through between the leads from below to above, because the upper fulcrum 18 is used to hold the ore to push the semiconductor device 15 downward, so there is no need to worry about lifting the semiconductor device 15 up. The operation of the second dressing section 2 will be described below. After the above-mentioned raising of the punch holder 5 of the first dressing section 1 is completed, the semiconductor device 15 to be trimmed is taken out, moved to the mold release device 23 of the second dressing section 2 and loaded. The semiconductor device to be trimmed loaded at this time is symbol 25 in FIG. 1. On the other hand, the package receiving stage 13 of the first trimmed portion 1 that is empty can load the next trimmed semiconductor device 15. Printed by the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs (please read the precautions on the back before filling in this page) In the second trimming section 2, the same as the first trimming section 1, use the driving source 9 such as an air cylinder to make the punch When the holder 5 is lowered, the package push-down punch 24 is lowered to push down the package surface 27 of the semiconductor device 25 to be trimmed. The falling force greater than the elastic force of the compression spring 30 pushes the trimmed semiconductor device 25 loaded on the demolding device 23 elastically supported by the compression spring 30. As a result, the external lead 26 of the semiconductor device 25 to be trimmed is pushed to the lead-up model 22 to push the lead 26 up. At this time, the size of this paper is applicable to the Chinese National Standard (CNS) Α4 specification (210Χ297 mm) -14-V. Description of the invention (12 A7 B7 travel when the best bed 24 is determined to be determined and pushed to use the 'seal shape, after The intermediary material's 26 fixed line is quoted according to the quantity according to the sutra, and then pushed up. The amount is completed, and the complete line of the refurbishment line is 2 in the state, and the form is applied to the real form. Actually speaking, the actual state is in shape, and the shining part is under repair. The Λνl two-in-one I 0 frame 3 is used. A 5 group diagrams are based on the actual state of the 2-state shape. Shi state is divided into the repair group of the frame part. The second part of the repair technique is known and the three are available and prepared. The tool is the frame but the mold, and the one one plus one is augmented and compared with the time. Part of the structure is renovated. Four 1T parts are renovated. The two are equipped with unique structures. The space is simple and the shape is simple. The sample can be formed in the same shape as the 11 state. No. 5 in the picture. (Notes to fill out this page) Traveling only between the trimming distances, the zero-to-zero combination of the shape and shape --- 11 Use 1 whole bed to repair the punching distance, and only use the whole repairing distance between the fixtures, so that the line of the same phase is smooth and straight. The semi-advanced IX part of the refurbishment is the second, and the second is the second. The first half is the refurbishment, and the third is the use of. Line \ 1 / U Gongchengί The project was launched and the half-line was introduced. The refurbishment was smooth and practical. 2 The impulse drive was printed at the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs to use the source drive to drive 1 use. Only Μ can also 〇 中 成 2 The final state is reported, the actual process of the process is under repair. The 15 part is fixed and repaired, the third body is guided to the half direction, and then repaired, and it is repaired by 1 ', the side of the whole bed is repaired. The second half of the physical guide is more on the journey. The second performance is the second one. The second one is the borrowing of the second, the second is the order of the traveling. The first is the construction of the line. The second is the construction of the line. Use the whole part to trim the second trim third to make the Mth use Keli's down but push, the line-two · il two bow push the line is being introduced to the degree of straightening, straightening, flattening, flattening, flattening, and using 1 The paper size is applicable to China National Standard (CNS) A4 specification (210 X 297 mm)
5 1X A7 B7 經濟部中央標準局員工消費合作社印製 五、發明説明（13 和第三修整部互換，使平坦度修整之順序相反。 實施形態3 下面將根據圖6用來說明實施形態3。在本實施形態3中 ，將實施形態1或實施形態2所使用之間距修整部爪11構建 成依照下面所述之方式，可Μ依照對外部引線接近/離開 之方向進行開閉動作。 亦即，首先從圖6所牙、i狀態，使1¾製用氣缸基座以與實 施形態1同樣之動作，進行下降。如此一來，滑動球38就 被球推上軸39推上。如此一來，間距修整衝床11經由壓縮 彈簧36之推壓力使其間距修整爪側以爪軸40為中心朝向外 側開放（參照圖7 )。 其次，在此種狀態當間距修整衝床11進行上升時，如上 所述，因為間距修整衝床11之間距修整爪之前端依離開外 部引線之方向開放，所以上述之間距修整爪不會接觸在被 修整半導體裝置15之外部引線。因此，在本實施形態3之 構造中，可Μ不需要實施形態1和實胞形態2所使用之用Μ 防止被修整半導體裝置15之被提上之上支點18。 當間距修整衝床11之上升完了時，如圖6所示》球推下 軸37和滑動球38經由阻擋器35被推下，間距修整衝床11朝 向内側（朝向接近外部引線之方向）閉合。在此種狀態上升 動作終了，藉Μ完成下降動作之準備。經由重複該等動作 使間距修整衝床11之前端在下降行程進行閉合藉Κ進行間 距修正，在上升行程進行開放藉以遊免接觸在半導體裝置 15之外部引線。如上所述，在該實施形態6中，因為在上 t紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ297公釐） " --------!·裝；------1T- (請先閱讀背面之注意事項再填寫本頁) A7 B7 經濟部中央標準局員工消費合作社印製 五、發明説明 (14 ) I 升 工 程 使 間 距 修 整 爪 不 會 接 觸在被 修 正半導體 裝置 15之引 Ί 1 線 所 Μ 在 希 望 防 止 被 修 整 半導體 裝 置15之引 線由 於上述 1 | 之 上 升 工 程 而 造 成 變 形 之 情 況時， 此 種方式特 別有 效0 請 先 閱 1 I 實 施 形 態 4 讀 背 1 1 面 I 下 面 將 根 據 面 圖 8用來說明本發明之實腌形態4 。到 目前所 之 1 I 意 I 述 之 實 施 形 態 1〜3 中 所 使 用 之間距 修 正衝床11 是對 於被修 事 項 1 I 再 -«ft、 整 半 導 體 裝 置 之 各 個 引 線 間 之各個 間 隙使用對 應到 1個間 填 寫 本 裝 距 之 2個間距修整爪 將其配置成上下二段，互相偏移1個 頁 1 I 間 距 可 Μ 利 用 一 個 修 整 部 用來完 成 間距修整 ，但 是在本 1 1 I 實 施 形 態 中 則 是 使 用 被 配 置 成一段 之 間距修整 爪。 1 亦 即 在 實 施 形 態 4中 具備有間距修整衝床11之間距 訂- 修 整 爪 不 是 上 下 二 段 之 構 造 ，間距 修 整爪1 1 1只具備一段（ I 圖 8 ( 1 ) ) ，當間距修整衝床1 1進行下降時，間距修整爪111 1 I 就 通 過 如 同 第 奇 數 個 之 引 線 間之間 隙 (圖 8 (2)) 〇 1 1 I 然 後 當 間 距 修 整 衝 床 11 進行下 降 時，引線 推下 衝床12 乂 之 斜 面 部 1 2 1就接觸在引線之前端 用來進行引線平坦度 1 1 修 整 用 之 引 線 推 下 (圖8 (3)) 〇 1 I 其 次 進 入 上 升 工 程 用 來 使間距 修 整衡床11 進行 上升。 I 在 上 升 工 程 刖 之 途 中 > 使 間 距修整 衝 床11移位 1個間距之 1 1 部 份 (圖8 (4)) 〇 然 後 當 間 距 修整衝 床 1 1進行上 升時 ，上述 1 1 之 間 距 修 整 爪 11 1就通過在上述下降行程未通過之引線間 1 1 之 間 隙 例 如 第 偶 數 個 之 引 線間之 間 隙和取終 端引 線之外 1 I 側 (圖8 (5)) 〇 在 該 通 過 終 了 後，於 更 進一步上 升時 ，就使 1 I 上 述 之 間 距 修 整 衝 床 11 移 位 1個間距之部份，然後回到與 1 1 本紙張尺度適用中國國家標準（CNS ) A4規格（2]OX 297公釐） -17 - A7 B7 五、發明説明（15 ) 圖8(1)相同之狀態（圖8(6))。 如上所述，依照本賁施形態4時*因為間距修整爪111只 需要一段之構造即可，所Μ當與實施形態1〜3之二段構造 之情況比較時，間距修整爪之製作成本為一半即可為其優 點。 實施形態5 下面將參照圖9用來說明本發明之賁施形態5。本實施形 態5所提案之構造如下所述，在各個半導體裝置之引線修 整部具有接受被修整半導體裝置之構造*即使在封裝產生 反轉時亦可以穩定的接受被修整半導體裝置。 通常，半導體裝置之封裝依照在組合時或密封時之各種 條件，很少會發生反轉。當該封裝有反轉時，因為不能穩 定的接受該封裝，所以會妨礙引终之平坦度之修正。例如 ，在習知之封裝接受台中，如圖9(a)所示，在封裝接受台 13之周圍具有方形形狀之四邊形之接受部13a。在此種習 知之接受部13a中，當裝載反轉之封裝15時，如圖9(b)所 示，會造成搖搌之不能穩定為其問題。 經濟部中央標準局員工消費合作社印製 (請先閱讀背面之注意事項再填寫本頁) 用Μ解決此種問題之對策在習知技術中實施有各種方法 *在本實胞形態5中，如圖9(c)所示，在封裝接受台13設 置突出之環狀之接受部13b，以該環狀接受部13b接受封裝 15之背面或表面。 通常之物體於重力方向至少要以3點支持才能穩定的靜 止。物體之一之半導體裝置封裝15當被裝載在環狀接受部 13b時，即使半導體裝置封裝15反轉時，因為該半導體裝 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） —18 經濟部中央標準局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ 297公釐） A7 B7 五、發明説明（16) 置之封裝面中至少有3點進行接觸，所Μ可以靜止。換言 之，Μ自然之形狀求3點。在該自然之狀態實施引線之修 整時，可以獲得良好之引線之平坦度。 圖10之圖形用來說明依照本實施形態5之效果，（a)之圖 形表示使用習知之圖9U)所示之接受部進行平坦度修整之 情況時之半導體裝置之各邊（參照圖10(c))之外部引線之 被修整後之平坦度，（b)表示使用實施形態5之環狀接受部 13b進行平坦度修整之情況時之半導體裝置之各邊（參照圖 10(c))之外部引線之被修整後之平坦度。 實施形態6 下面將參照圖11〜12用來說明本發明之實施形態6。本 實施形態6之有關方法是在半導體裝置之外部引線之平坦 度修整部，於被修整半導體裝置之各邊（參照圖10(c))之 引線長度有差異之情況時，或是在引線前端角度有差異之 情況時，在半導體裝置之外部引線之推上模型之外部引線 之接觸部，設置對半導體裝置外部引線之前端角度具有5 度〜10度之相對角度，用來將引線推上。 通常在半導體裝置之外部引線之切斷和成形工程中，不 只限於一定要能夠平衡取得之半導體裝置，有時在各邊之 引線之長度具有差異，或在前端角度具有差異（參照圖 11(c))。當具有此種差異時，於進行引線之平坦度之修正 時會變成一種妨礙。 用Μ解決此種問題之對策，在習知技術中，如圖11(a) 所示，接觸在半導體裝置之外部引線之推上模型之引線之 -19 - (請先閱讀背面之注意事項再填寫本百〇 裝、 --訂 A7 B7 經濟部中央標準局員工消費合作社印製 五、發明説明 (17 ) » 1 1 表 面 形 狀 順 著 其 平 坦 度 修整 之引線之 前端角 度通 常 形成 1 I 0度~ -1 0度 ，與此相對的 在本實施形態6中， 如圖 11 (b) 1 1 所 示 對 其 平 坦 度 修 整 之 引線 之前端角 度形成 -5度 -10 請 龙 1 1 I 度 之 相 對 角 度 〇 利 用 這 種 方式 ，只有引 線之前 端部 份 接觸 背 1 1 在 推 下 模 型 4邊之半導體裝置外部引線之彈回量成為一 12/ 之 注 1 I 意 1 I 定 可 Μ 獲 得 良 好 之 平 坦 度。 举 項 1 I 圖 12之 圖 形 用 來 說 明 本 實施 形態6之效果，U)之 圖 形用 填 寫 本 裝 來 表 示 平 坦 度 修 整 前 之 平 坦度 之分布， (b )之圖形用來表 買 、-〆 1 | 示 習 知 之 推 上 模 型 角 度 為 0°時之修整後之平坦度之分布 1 1 > (C )之圖形用來表示依照本實施形態之推上模型角度為 1 -1 0。 之時之修整後之平坦度之分布。 訂 實 施 形 態 7 I 下 面 將 根 據 圖 13用 來 說 明本 發明之實 施形態 7。本實施 1 1 I 形 態 7是裝載有上述實施形態1 〜6之半導體裝置引線修整 1 1 機 之 半 導 體 裝 置 白 動 外 觀 檢査 裝置。圖 13之（1 )是概略流 1 程 圖 用 來 表 示 該 半 導 體 裝置 自動外觀 檢査装 置之 構 造和 1 動 作 圖 1 3 (2)用來表示該裝置之平面布置之- -實例t )在 1 I 本 實 施 形 態 7中 如圖1 3(1)， (2)所示 在半導體裝置自 1 I 動 外 觀 檢 査 裝 置 之 周 邊 部 配置 引線修整 部。利 用這 種 方式 I 1 可 以 很 容 易 的 進 行 對 應 到 半導 體裝置封 裝之形 狀變 更 之修 1 1 整 用 構 件 之 拆 卸 安 裝 等 之程 序變更。 另外， 在未 附 加有 1 I 引 線 修 整 機 之 現 有 之 外 觀 檢査 機中，可 Μ很容 易從 後 面附 1 I 加 引 線 修 整 機 〇 另 外 在 本實 施形態7之先前實例中 例 1 1 I 如 在 曰 本 專 利 案 特 開 平 6- 1 6 7 4 5 9號公報 所揭示 之實 例 中， 1 1 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -2 0 一 經濟部中央標準局員工消費合作社印製 Μ Β7 五、發明説明（IS ) 因為修理作業部被配置在半導體裝置自動外觀檢査裝置之 大致中央，所Μ對應到各種半導體裝置片理構件之程序 變換非常困難為其問題。 [發明之效果] 在依照本發明之半導體裝置之外部引線修整機中，第1 間距修整爪通過外部引線之各個引線間之1個間距之各個 間隙，然後連績的使第2間距修整爪通過外部引線之上述 第1間距修整爪未通過之1個間距之各個間隙，用來進行外 部引線之間距修整。亦即，上述之第1間距修整爪和第2間 距修整爪因為被構建在一個模架内，所Μ只利用一個模架 之動作就可Μ連續的進行第1間距修整爪之間距修整和第2 間距修整爪之間距修整。因《此，間距修整工程可Κ簡化。 另外，因為半導體裝置外部引線修整機可Μ從習知之2模 架構造變成1横架構造，所以可Μ使修整機之大小成為原 來之一半左右，衝床部之驅動源亦只需要1個即可，因此 製作成本亦可降低。另外，程序變換之時間亦可縮短。 另外，在本發明中，於一個模架内具備有上述之第1間 距修整爪和上述之第2間距修整爪，和用來使該等第1和第 2間距修整爪連鑛移動之外部引線之平坦度修整部。因此 ，可以在同一個模架内Μ —個模架之動作用來連鑛進行半 専體裝置外部引線之間距修整和平坦度修整。所Μ外部引 線之修整工程可Κ大幅的簡化。另外*因為半導體裝置外 部引線修整機可Μ從習知之2横架構造變成1模架構造，所 以可Μ使修整機之大小成為原來之一半左右，銜床部之驅 本紙張尺度適3中國國家標準（CNS ) Α4規格（210Χ297公釐） (請先閱讀背面之注意事項再填寫本頁)5 1X A7 B7 Printed by the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economy V. Invention description (13 and the third trimming unit are interchanged to reverse the order of flatness trimming. Embodiment 3 The following will describe Embodiment 3 based on FIG. 6. In the third embodiment, the interval trimming portion claw 11 used in the first embodiment or the second embodiment is constructed so that the opening and closing operations can be performed in accordance with the direction of approaching / leaving the external lead in the manner described below. First, from the state shown in FIG. 6, the cylinder base for 1¾ is moved down in the same manner as in Embodiment 1. In this way, the sliding ball 38 is pushed up by the ball on the shaft 39. In this way, The spacing trimming punch 11 opens the spacing trimming claw side toward the outside with the claw shaft 40 as the center via the urging force of the compression spring 36 (see FIG. 7). Secondly, when the spacing trimming punch 11 is raised in this state, as described above Because the gap between the trimming punch 11 and the front end of the trimming claw is opened in the direction away from the external lead, the gap between the trimming claw will not contact the external lead of the semiconductor device 15 being trimmed Therefore, in the structure of the present embodiment 3, the use of the embodiment 1 and the real cell form 2 may not be required to prevent the semiconductor device 15 being lifted from being lifted on the upper fulcrum 18. When the pitch trimming punch 11 rises When finished, as shown in Fig. 6> the ball push-down shaft 37 and the sliding ball 38 are pushed down through the stopper 35, and the gap trimming punch 11 is closed toward the inside (towards the direction of the external lead). In this state, the ascent action ends The preparation for the lowering operation is completed by M. By repeating these operations, the front end of the pitch trimming punch 11 is closed at the descending stroke to correct the pitch, and is opened at the upward stroke to avoid contact with the external leads of the semiconductor device 15. As described above In this Embodiment 6, because the paper standard on the upper t is applicable to the Chinese National Standard (CNS) Α4 specification (210Χ297 mm) " --------! · Installed; ----- 1T- (Please read the precautions on the back before filling out this page) A7 B7 Printed by the Employee Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs V. Invention Instructions (14) Correcting the lead 1 of the semiconductor device 15 This method is particularly effective when you want to prevent the lead of the semiconductor device 15 being trimmed from being deformed due to the above 1 | rise process. Please read 1 1 first. Back 1 1 Surface I The following will be used to illustrate the actual pickling form 4 of the present invention based on the surface FIG. 8. Up to now I 1 I meaning I used the embodiment 1 to 3 described in the interval correction punch 11 is for the repaired matter 1 I re- «ft, adjust the gaps between the leads of the semiconductor device, use the two spacing trimming claws corresponding to one to fill in this mounting distance, and configure it into two upper and lower segments, offset from each other by 1 page 1 I spacing A trimming part can be used to complete the trimming of the pitch, but in the present embodiment, the trimming claws configured to be spaced apart are used. 1 That is, in Embodiment 4, the distance between the trimming punches 11 is provided-the trimming claw is not a structure with two upper and lower stages, and the spacing trimming claw 1 1 1 has only one stage (I Figure 8 (1)). When the gap trimming punch 1 1 When the descent is performed, the pitch trimming claw 111 1 I passes through the gap between the odd-numbered leads (Figure 8 (2)) 〇1 1 I Then when the pitch trimming punch 11 descends, the lead pushes down the punch 12 The inclined surface 1 2 1 is in contact with the leading end of the lead for flatness of the lead. 1 1 The lead for trimming is pushed down (Figure 8 (3)). ○ 1 I The second step is to enter the ascending process to raise the pitch trimming weight 11. I On the way to ascending engineering> shift the gap trimming punch 11 by 1 part of the gap 1 (Fig. 8 (4)) ○ Then when the gap trimming punch 11 is raised, the gap between the above 1 1 trimming claws 11 1 passes through the gap between the lead wires that have not passed through the descending stroke, such as the gap between the even-numbered lead wires and the terminal wire 1 I side (Figure 8 (5)). After the passage is completed, the When it rises further, it shifts the distance between 1 I above the trimming punch 11 by 1 pitch, and then returns to the 1 1 paper size applicable to the Chinese National Standard (CNS) A4 specification (2) OX 297 mm) -17-A7 B7 5. Description of the invention (15) Figure 8 (1) is in the same state (Figure 8 (6)). As mentioned above, according to this Benshi form 4 * because the pitch trimming claw 111 only needs one stage structure, when compared with the case of the two-stage structure of the embodiments 1 to 3, the manufacturing cost of the pitch trimming claw is Half of it is its advantage. Embodiment 5 Next, referring to FIG. 9, the embodiment 5 of the present invention will be described. The structure proposed in this fifth embodiment is as follows. The lead trimming portion of each semiconductor device has a structure that accepts the semiconductor device to be trimmed * Even if the package is reversed, the semiconductor device to be trimmed can be received stably. In general, the packaging of semiconductor devices rarely changes depending on various conditions during assembly or sealing. When the package is reversed, since the package cannot be accepted stably, it will hinder the correction of the final flatness. For example, in the conventional package receiving table, as shown in FIG. 9 (a), there is a square-shaped quadrilateral receiving portion 13a around the package receiving table 13. In such a conventional receiving portion 13a, when the reverse package 15 is loaded, as shown in FIG. 9 (b), it may cause a problem of unstable shaking. Printed by the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs (please read the precautions on the back before filling out this page). The countermeasures for solving this problem with Μ are implemented in the conventional technology. There are various methods * in this real cell form 5, such as As shown in FIG. 9 (c), a protruding ring-shaped receiving portion 13b is provided on the package receiving table 13, and the back or surface of the package 15 is received by the ring-shaped receiving portion 13b. Normally, the object must be supported by at least 3 points in the direction of gravity to be stable. When the semiconductor device package 15 that is one of the objects is loaded on the ring-shaped receiving portion 13b, even when the semiconductor device package 15 is reversed, because the paper size of the semiconductor package is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) — 18 The size of the paper printed by the Staff Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs is applicable to the Chinese National Standard (CNS) Α4 specification (210Χ 297 mm). A7 B7 5. Description of the invention (16) At least 3 points should be in contact on the package surface. So M can be stationary. In other words, the shape of M natural seeks 3 points. When trimming the leads in this natural state, a good flatness of the leads can be obtained. The graph of FIG. 10 is used to explain the effect according to the fifth embodiment. The graph of (a) shows the sides of the semiconductor device when flattening is performed using the receiving portion shown in the conventional FIG. 9U) (see FIG. 10 ( c)) The flatness of the external leads after trimming, (b) shows the sides of the semiconductor device when the flatness trimming is performed using the ring-shaped receiving portion 13b of Embodiment 5 (see FIG. 10 (c)) The flatness of the external leads after being trimmed. Embodiment 6 The following will describe Embodiment 6 of the present invention with reference to FIGS. 11 to 12. The related method of the sixth embodiment is in the case where the flatness trimming portion of the external lead of the semiconductor device is different when the lead length of each side of the semiconductor device to be trimmed (see FIG. 10 (c)), or at the tip When there is a difference in angle, a contact angle of 5 degrees to 10 degrees to the front end angle of the external lead of the semiconductor device is provided at the contact portion of the external lead of the semiconductor device that pushes the external lead of the model to push the lead upward. Usually in the cutting and forming process of the external leads of the semiconductor device, it is not limited to the semiconductor device that must be balanced, and sometimes the length of the lead on each side is different, or the angle of the front end is different (see Figure 11 (c )). When there is such a difference, it becomes an obstacle when correcting the flatness of the lead. To solve this problem with Μ, in the conventional technology, as shown in FIG. 11 (a), contact with the external lead of the semiconductor device to push the lead of the model -19-(Please read the precautions on the back first Fill out this hundred packs,-order A7 B7 Printed by the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economy V. Invention Instructions (17) »1 1 The surface shape is trimmed along its flatness. The angle of the front end of the lead is usually formed 1 I 0 degrees ~ -1 0 degrees, in this embodiment 6, as shown in FIG. 11 (b) 1 1, the angle of the leading end of the lead wire whose flatness is trimmed is formed to -5 degrees -10, please check 1 1 I degrees Relative angle 〇In this way, only the front end of the lead contacts the back 1 1 The springback of the outer lead of the semiconductor device on the side where the model 4 is pushed down becomes a 12 / Note 1 I meaning 1 I can get a good Flatness. Item 1 I The figure in Figure 12 is used to illustrate the effect of the sixth embodiment, and the figure in U) is filled with Write a book to show the distribution of flatness before flatness trimming. (B) The graph is used to show the purchase, -〆1 | The conventional knowledge of the flatness distribution after trimming when the model angle is 0 ° 1 1 > The graph of (C) is used to indicate that the angle of the push-up model according to this embodiment is 1 -10. The distribution of flatness after trimming. Implementation Mode 7 I The following will explain the implementation mode 7 of the present invention based on FIG. 13. The present embodiment 1 1 I form 7 is a semiconductor device mounted white appearance inspection device equipped with the semiconductor device lead trimming 1 1 of the above embodiments 1 to 6. Fig. 13 (1) is a schematic flow chart. It is used to show the structure and operation of the automatic visual inspection device of the semiconductor device. FIG. 1 3 (2) is used to show the planar layout of the device--Example t) in 1 I In the seventh embodiment, as shown in FIGS. 13 (1) and (2), lead trimming portions are arranged on the peripheral portion of the semiconductor device from the I1 visual inspection device. In this way, I 1 can easily perform repairs that correspond to changes in the shape of the semiconductor device package. 1 1 Program changes such as disassembly, installation, and so on. In addition, in the existing visual inspection machine without a 1 I lead trimming machine, it is easy to attach a 1 I plus lead trimming machine from the back. In addition, in the previous example of the seventh embodiment, Example 1 1 I In the example disclosed in Japanese Patent Application Laid-Open No. 6- 1 6 7 4 5 9, 1 1 This paper size applies to the Chinese National Standard (CNS) A4 specification (210X297 mm) -2 0 An employee of the Central Standards Bureau of the Ministry of Economic Affairs Printed by consumer cooperatives Β7. Description of Invention (IS) Because the repair work part is arranged in the approximate center of the automatic visual inspection device for semiconductor devices, it is very difficult for the program conversion of various semiconductor device chip components to be a problem. [Effect of the Invention] In the external lead dressing machine of the semiconductor device according to the present invention, the first pitch dressing claw passes through each gap of one pitch between the leads of the external lead, and then successively passes the second pitch dressing claw Each gap of the first pitch trimming claw of the outer lead that does not pass is used for trimming the pitch between the outer leads. That is, since the above-mentioned first-pitch trimming claw and second-pitch trimming claw are built in one mold frame, the gap between the first pitch trimming claw and the first trimming claw can be continuously performed using only one mold frame. 2 The distance between the trimming claws is trimmed. Because of this, the spacing trimming project can be simplified. In addition, since the external lead trimming machine for semiconductor devices can be changed from the conventional two-die structure to a horizontal frame structure, the size of the trimming machine can be reduced to about one-half of the original size, and only one driving source for the punching part can be used. , So the production cost can also be reduced. In addition, the time for program change can also be shortened. In addition, in the present invention, the first pitch trimming claw and the second pitch trimming claw described above, and an external lead for moving the first and second pitch trimming claws together in one mold frame are provided. The flatness trimming department. Therefore, the action of M-framework in the same mold frame can be used for continuous trimming and flatness trimming of the external leads of the semiconductor device. The finishing work of the external leads can be greatly simplified. In addition * Because the external lead trimming machine for semiconductor devices can be changed from the conventional 2 horizontal frame structure to a 1 mold frame structure, the size of the trimming machine can be about one-half of the original size, and the driving paper size of the bed is suitable for 3 Chinese countries. Standard (CNS) Α4 specification (210Χ297mm) (Please read the precautions on the back before filling this page)
-21 - A7 B7 經濟部中央標準局員工消費合作社印製 五、發明説明 (19 ) ：1 I 動 源 亦 只 需 要 1個即可 因此製作成本亦可降低< 另外 Ί 1 程 序 變 換 之 時 間 亦 可 縮 短 0 1 I 另 外 在 本 發 明 中 因 為 在 一 個 模 架 内具 備 有 ： 上 述 之 請 閱 1 | 第 1間距修整爪和上述之第2間 距 修 整 爪 ;外 部 引 線 之 平 坦 背 1 1 面 I 度 修 整 用 之 引 線 推 下 部 被 配 置 成 用 來 使該 等 第 1和第2間 1 I I 距 修 整 爪 連 鑛 的 進 行 動 作 和 外 部 引 線 之平 坦 度 修 整 用 之 事 項 1 I 再 — 引 線 推 上 部 形 成 與 上 述 第 1和第2間 距 修整 爪 分 開 的 進 行 寫 本 裝 動 作 5 所 Μ 可 Κ 在 同 __» 個 模 架 内 以 個 模架 之 動 作 用 來 連 頁 1 I 鑛 進 行 半 導 體 裝 置 外 部 引 線 之 平 坦 度 修 整和 間 距 修 整 〇 因 1 1 I 此 因 為 半 導 體 裝 置 外 部 引 線 修 整 機 可 以從 習 知 之 2模架 1 構 造 變 成 1模架構造 所Μ可Μ使修整機之大小成為原來 訂 之 一 半 左 右 衝 床 部 之 驅 動 源 亦 只 需 要 1個即可 因此製 I 作 成 本 亦 可 降 低 〇 另 外 程 序 變 換 之 時 間亦 可 縮 短 〇 1 I 另 外 在 本 發 明 中 因 為 在 上 述 之 第 1和第2間 距 修 整 爪 1 1 1 通 過 半 導 體 裝 置 之 外 部 引 線 之 後 於 回 復移 動 到 原 來 位 置 1 -—V 之 過 程 中 利 用 移 動 機 構 使 上 述 之 第 1和第2 間 距 修 整 爪 朝 1 1 向 離 開 外 部 引 線 之 方 向 移 動 所 Μ 在 該 過程 中 可 Μ 防 止 上 I 述 之 第 1和第2間 距 修 整 爪 接 觸 在 外 部 引 線因 而 造 成 之 外 部 I 引 線 之 變 形 0 1 1 另 外 在 本 發 明 中 首 先 使 間 距 修 整 爪通 過 上 述 各 個 引 1 1 線 間 之 各 個 間 隙 藉 Μ 進 行 第 1間距修整 然後使上述之間 1 1 距 修 整 爪 移 位 1個間距 促成對懕到上述第1 間 距 修 整 時 之 1 | 上 述 間 距 修 整 爪 未 通 過 之 1個間距之各個間隙 •其次使該 1 I 移 位 後 之 間 距 修 整 爪 通 過 上 述 各 個 引 線 間之 各 個 間 隙 > 藉 1 1 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -22 - A7 B7 經濟部中央標準局員工消費合作社印製 五、發明説明 ( 2〇 ) j I >λ 進 行 第 2間距修整 以這種方式完成外部引線之間距修 Ί 1 整 〇 因 此 只 利 用 一 個 之 間 距 修 整 爪 即 可 進 行 外 部 引 線 之 ^ 1 I 間 距 修 整 所 可 使 外 部 引 線 修 整 機 小 型 化 和 低 成 本 化 〇 請 1 1 閱 I 另 外 在 本 發 明 中 於 接 受 台 具 備 有 環 狀 之 突 出 部 以 漬 背 I 面 I 接 受 台 接 受 半 導 體 裝 置 之 封 裝 藉 Μ 進 行 外 部 引 線 之 修 整 〇 冬 1 I 意 1 I 因 此 由 於 該 環 狀 之 突 出 部 Μ 環 狀 接 觸 在 封 裝 表 面 所 Μ 事 項 1 I 再 可 以 獲 得 任 意 三 點 之 接 受 不 會 產 生 封 裝 之 搖 擺 狀 態 可 裝 本 以 穩 定 的 接 受 封 裝 藉 Μ 獲 得 良 好 之 引 線 平 坦 度 〇 頁 、*- 1 | 另 外 在 本 發 明 中 外 部 引 線 之 平 坦 度 修 整 用 之 推 上 模 1 1 1 型 之 接 觸 在 該 外 部 引 線 之 部 份 形 成 對 引 線 之 前 端 角 度 具 1 有 相 對 角 度 〇 因 此 推 上 模 型 只 接 觸 外 部 引 線 之 刖 端 部 份 訂 9 所 Μ 外 部 引 線 之 彈 回 量 為 一 定 因 此 可 Μ 獲 得 良 好 之 引 | 線 平 坦 度 〇 1 I 另 外 在 依 照 本 發 明 之 半 導 體 裝 置 之 外 觀 檢 査 裝 置 中 > 1 1 I 因 為 將 上 述 之 半 導 體 裝 置 之 外 部 引 線 修 整 機 配 置 在 其 周 邊 —k 部 所 Μ 半 導 體 裝 置 之 封 裝 之 形 狀 變 更 等 所 對 應 之 修 整 機 1 1 之 拆 卸 和 安 裝 等 之 程 序 變 更 可 Μ 很 容 易 的 進 行 〇 1 I [附圖之簡單說明] 1 I ΓΒΐ 國 1是依照實腌形態1 之 半 導 體 引 線 修 整 機 之 概 略 構 造 圖。 1 1 圖 2用來說明實施形態1 之 第 一 修 整 部 之 動 作 0 1 1 圖 3是斜視圖 用來顯示實施形態1 之 第 一 修 整 部 0 1 1 圖 4是實施形態1 之 概 略 全 體 斜 視 圖 〇 1 I 圖 5是依照實施形態2之 半 導 體 引 線 修 整 機 之 概 略 構 造 圖。 1 I 圖 6是用來說明依照實施形態3之 半 導 體 引 線 修 整 機 之 動 1 1 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -23 - 經濟部中央標準局員工消費合作社印製 A7 B7 五、發明説明（2 1 ) 作。 圖7用來說明依照實施形態3之半専體引線修整機之動作。 圖8用來說明依照實施形態4之半導體引線修整機之動作。 圖9用來說明依照實施形態5之半導體引線修整機之封裝 接受台之改良部份。 圖10之圖形用來說明依照實施形態5之效果。 圖11用來說明依照實施形態6之半導體引線修整機。 圖12之圖形用來說明依照實施形態6之效果。 圖13(1)是概略流程画，用來說明依照本發明之實施形 態7之半導體裝置之外觀檢査裝置之構造和動作，（2)是概 略圖，用來表示該裝置之布置實例。 圖14用來表示習知之半導體引線修整機之構造。 _15用來技卟習知之半導體引線修整機之動作。 [符號之說明] 1,1/\....第1修整部， 2,2A....第 2修整部， 3.... 横型保持器， 4----模型板， 5----衝床保持器， 6____衝床板， 7----壓製機基座， 8——壓製機側板， 9.....空氣氣10....壓製機用氣缸基座， 11.,.. 間距修整衡床， 12.....引線推下衝床， 13——封裝 接受台， 13b——環狀接受部， 15, 25——被修整半導 體裝置， 16,26----外部引線， 17----模型封裝表面， 18____上支點， 2 2____引線推上模型， 2 3——脫模裝 置， 24.....封裝推下衝床， 27----模型封裝表面， 28____脫模裝置安裝螺栓， 30,36____壓縮彈簧， 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） - · - m I « 1^1 m ^^1· m ^ 士 In .^1^1 -i-1—J、 二 (請先閱讀背面之注意事項再填寫本頁) ^05715 五、發明説明（22 ) 簧’ n ay 彈球 壓動 推滑 器軸 擋上 阻推 :球 軸 下 推 球 爪 整 修 距 間1 第 ’ 爪 軸整 爪修 : 距 ..間 40二 第 部 面 斜 床 衝 下 推 線 引 (請先閱讀背面之注意事項再填寫本頁 裝-21-A7 B7 Printed by the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economy V. Description of invention (19): 1 I only need one source of motion, so the production cost can also be reduced. In addition, the time for Ί 1 program change It can be shortened by 0 1 I. In addition, in the present invention, because it is provided in a mold frame: Please refer to the above 1 | the first pitch trimming claw and the above second pitch trimming claw; the flat back of the external lead 1 1 surface I degree trimming The lower part of the lead pusher is configured to be used for the operation of the first and second 1 II distance trimming claws and the flatness of the external lead. 1 I again-the upper part of the lead pusher is formed as described above 1 and the second pitch trimming claws are separated to carry out the writing and loading operation. 5 MK can be used in the same __ »mold frame with a mold frame action to connect to the page 1 I mine for semiconductor devices The flatness trimming and spacing trimming of the internal leads are due to 1 1 I. This is because the external lead trimming machine of the semiconductor device can be changed from the conventional 2 mold frame 1 structure to the 1 mold frame structure. The size of the trimming machine has become half of the original order Only one drive source is needed for the left and right punch parts, so the manufacturing cost can also be reduced. In addition, the program conversion time can also be shortened. In addition, in the present invention, because the claws are trimmed at the first and second pitches described above 1 1 1 After passing through the external leads of the semiconductor device and returning to the original position 1--V, the moving mechanism moves the first and second pitch trimming claws 1 1 away from the external leads. During this process, it is possible to prevent the first and second pitch trimming claws described above from contacting the external leads and thus causing deformation of the external I leads. 0 1 1 In the Ming Dynasty, the gap trimming claws were first moved through the gaps between the above-mentioned lead lines 1 1 to carry out the first pitch trimming by M, and then the gaps between the above 1 1 trimming claws were shifted by 1 pitch to facilitate the adjustment to the above-mentioned first pitch trimming Part 1 | The gaps of the one gap of the above-mentioned spacing trimming claws • Secondly, the spacing between the trimming claws after the shift of the 1 I passes through the gaps of the above-mentioned lead wires > Borrow 1 1 This paper size is applicable to Chinese national standards ( CNS) A4 specification (210X297 mm) -22-A7 B7 Printed by the Employee Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs V. Description of the invention (2〇) j I > λ Perform the second pitch trimming in this way to complete the external leads Pitch trimming Ί 1 is adjusted. Therefore, only one gap trimming claw can be used for external leads ^ 1 I Pitch trimming can make the external lead trimming machine smaller and lower cost. Please 1 1 read I also in the present invention The receiving station is provided with a ring-shaped protrusion to stain the back surface I. The receiving station accepts the package of the semiconductor device to perform external lead trimming by M. Winter 1 I intention 1 I Therefore, due to the ring-shaped protrusion M Items on the surface of the package 1 Item 1 I can obtain any three points of acceptance without swaying of the package. It can be installed in a stable manner to accept the package to obtain a good lead flatness. Page 1, * -1 | Also in the present invention The flatness of the external lead is modified by the push-up mold 1 1 1 type contact. The part of the external lead is formed with a relative angle of 1 to the front end angle of the lead. Therefore, the push-up model only contacts the outer part of the external lead. 9 The amount of springback of the external lead is constant, so it can be obtained well Lead | Line flatness 〇1 I In addition, in the appearance inspection device of the semiconductor device according to the present invention > 1 1 I because the above-mentioned external lead trimming device of the semiconductor device is arranged on its periphery-the package of the semiconductor device Modification of the shaper, etc. corresponding to the dressing machine 1 1 Procedures such as disassembly and installation can be easily carried out. 1 I [Simple description of the drawings] 1 I ΓΒΐ country 1 is a semiconductor wire dressing according to the solid curing form 1 The schematic structure of the machine. 1 1 FIG. 2 is used to explain the operation of the first trimming unit of Embodiment 1. 0 1 1 FIG. 3 is a perspective view showing the first trimming unit of Embodiment 1. 0 1 1 FIG. 4 is a schematic overall perspective view of Embodiment 1. FIG. 〇1 I FIG. 5 is a schematic structural diagram of a semiconductor lead dresser according to the second embodiment. 1 I Figure 6 is used to explain the movement of the semiconductor lead trimming machine according to the embodiment 3 1 1 The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) -23-Printed by the Employees Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs System A7 B7 5. Description of invention (2 1). FIG. 7 is used to explain the operation of the half-body lead trimming machine according to the third embodiment. FIG. 8 is used to explain the operation of the semiconductor lead dresser according to the fourth embodiment. Fig. 9 is a diagram for explaining the improvement of the package receiving table of the semiconductor lead dresser according to the fifth embodiment. The graph of FIG. 10 is for explaining the effect according to the fifth embodiment. FIG. 11 is a diagram for explaining a semiconductor lead dresser according to the sixth embodiment. The graph of FIG. 12 is for explaining the effect according to the sixth embodiment. Fig. 13 (1) is a schematic flow diagram for explaining the structure and operation of the appearance inspection device of a semiconductor device according to Embodiment 7 of the present invention, and (2) is a schematic diagram for showing an arrangement example of the device. FIG. 14 is used to show the structure of a conventional semiconductor wire trimmer. _15 It is used for the operation of the semiconductor lead trimming machine that is known in the art. [Explanation of symbols] 1,1 / \ .... the first trimming part, 2,2A .... the second trimming part, 3 .... horizontal retainer, 4 ---- model board, 5- --- punch holder, 6____punch plate, 7 ---- pressing machine base, 8 ---- pressing machine side plate, 9 .... air gas 10 .... cylinder base for pressing machine, 11 .... Pitch trimming weighing bed, 12 ..... leads push down the punch, 13—package receiving table, 13b—ring receiving portion, 15, 25—semiconductor device being trimmed, 16,26-- --External leads, 17 ---- Model package surface, 18____upper fulcrum, 2 2____leads push up the model, 2 3——Release device, 24 .... Package push down punch, 27 --- -Model packaging surface, 28____molding device mounting bolts, 30,36 ____ compression spring, the paper size is applicable to China National Standard (CNS) A4 specification (210X 297mm)-·-m I «1 ^ 1 m ^^ 1 · m ^ Shi In. ^ 1 ^ 1 -i-1—J, 2 (please read the precautions on the back before filling in this page) ^ 05715 5. Description of the invention (22) Spring 'n ay pinball push push Slider shaft block upper resistance push: ball shaft push down ball claw trimming distance 1st claw shaft trim claw repair: .. 40 between two first surface portions inclined bed undershoot push wire lead (Read then fill the back surface of the page loaded Note
、3T 1 經濟部中央標準局貝工消費合作社印製 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 25、 3T 1 Printed by Beigong Consumer Cooperative of Central Bureau of Standards, Ministry of Economic Affairs. This paper scale is applicable to China National Standard (CNS) A4 (210X297mm) 25