CN1180241A - External lead wire corrector and visual examinator for semiconductor device - Google Patents
External lead wire corrector and visual examinator for semiconductor device Download PDFInfo
- Publication number
- CN1180241A CN1180241A CN96100698A CN96100698A CN1180241A CN 1180241 A CN1180241 A CN 1180241A CN 96100698 A CN96100698 A CN 96100698A CN 96100698 A CN96100698 A CN 96100698A CN 1180241 A CN1180241 A CN 1180241A
- Authority
- CN
- China
- Prior art keywords
- spacing
- correction
- lead
- semiconductor device
- outside lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention is a semiconductor external lead straightener and an appearance inspection device which can realize the miniaturization and the cost degradation of the structure than before. The invention is equipped with a first space modified claw which arranges claw parts that can penetrate through every gap of every lead of external leads every one space of every gap and a second space modified claw which arranges the claw parts every one space of every gap that can penetrate through every gap of every lead of external leads and are not corresponding to the claw parts of the first space modified claw. The first space modified claw and the second space modified claw are arranged like that the mutual distances to the external leads of a semiconductor device are different.
Description
The present invention relates to the outside lead straightener and appearance inspection device of semiconductor device with semiconductor device of this straightener.
Figure 14 (1) and (2) are respectively the skeleton diagrams of the structure of the spacing correction portion of outside lead of outside lead straightener of existing QFP (quad flat package) semiconductor device and flatness correction portion, and the state of opening with mould bases illustrates.Among the figure, 1 and 1A be the 1st correction portion, 2 and 2A be the 2nd correction portion, the 3rd, punch die base, the 4th, die shoe, the 5th, the perforator base, the 6th, perforator backing plate, 11a and 11b are spacing correction perforators, the 12nd, and lead-in wire presses down perforator, the 13rd, the encapsulation platform, 15 and 25 is to be corrected semiconductor device, and 16 and 26 is semiconductor device outside leads, the 18th, and the top fulcrum, the 22nd, press punch die on the lead-in wire, the 23rd, the punch die liftout attachment, the 28th, punch die liftout attachment construction bolt, 24a are that encapsulation presses down perforator, the 30th, the compression spring, the 31st, by pressing spring.
Below, its action is described.Utilize outside lead correction that this outside lead straightener that has earlier carries out shown in Figure 15 (1)～(4), amount to 4 operations by 2 operations of 2 operations of spacing correction portion and flatness correction portion and carry out.At first, beginning will be corrected under the state that the mould bases of Figure 14 (1) is opened on the encapsulation platform 13 that semiconductor device 15 places the 1st correction portion 1.Then, when perforator base 5 was descended, the 1st spacing correction perforator 11a that is fixed on the perforator backing plate 6 just descended, and the top fulcrum 18 that navigates in the spacing correction perforator 11a with the state that can slide also descends simultaneously.And, at first push the die package box that is corrected semiconductor device 15 by top fulcrum 18 and encapsulation platform 13, under the effect of spring 31, it is gripped with motionless power.Under this state, when pressing down spacing correction perforator 11a, shown in Figure 15 (1), the outside lead 16 that is corrected semiconductor device 15 just along the shape of the correction pawl 111 of the lower end that is located at spacing correction perforator 11a by expansion ground extruding to the left and right.
Then, the semiconductor device 15 of being corrected that this is pushed with being expanded transmits and places on the encapsulation platform 13 of the 2nd correction portion 2.And, shown in Figure 15 (2), the semiconductor device outside lead 16 that push by above-mentioned the 1st correction portion 1 expansion ground with the roughly the same action of above-mentioned the 1st correction portion 1, revise pawl 112 by to time pushing along the spacing the 2nd of the lower end that is located at spacing correction perforator 11b, thereby finish the spacing correction.
Then, the semiconductor device 15 of being corrected of finishing the spacing correction is transmitted and places on the encapsulation platform 13 of the 1st correction portion 1A of the flatness correction mould bases open mode shown in Figure 14 (2).Under this state, when perforator base 5 is descended, shown in Figure 15 (3), just the lead-in wire that is fixed on the perforator backing plate 6 presses down perforator 12 declines, the outside lead 26 that will be corrected semiconductor device 25 by the inclined plane part 121 that presses down perforator 12 is expressed to position arbitrarily downwards.Then, this semiconductor device that was pushed downwards 25 is transmitted and place on the punch die liftout attachment 23 of the 2nd flatness correction portion 2A.Then, when perforator base 5 is descended, be fixed on encapsulation on the perforator backing plate 6 and press down perforator 24a and just descend, be pressed in the die package box surface 27.(at this moment this bulged-in semiconductor device 25 that is corrected descends on punch die liftout attachment 23, compression spring 30 compresses), shown in Figure 15 (4), this outside lead 26 that is corrected semiconductor device 25 is gone up with lead-in wire and is pressed punch die 22 to contact, and upwards is expressed to position (getting back to original position) arbitrarily.Like this, being corrected the outside lead 16 of semiconductor device 15 and 25 and 26 spacing correction and flatness correction just all finishes.
In the outside lead straightener of the above-mentioned the sort of semiconductor device that has earlier, when the spacing correction of carrying out outside lead, must use 2 correction pawls to carry out 2 spacing corrections, so not only device maximizes, and the operation of correction operation is also complicated.
In addition, in the outside lead straightener of the above-mentioned the sort of semiconductor device that has earlier, owing to must be the structure of spacing correction mould bases and these 2 mould bases of flatness correction mould bases, so, the press section volume is big, thereby not only whole device volume is big, and manufacturing cost is also high.
In addition, in semiconductor device outside lead flatness correction portion, when revising, owing to be to receive when receiving the die package box of semiconductor device at four edge joints of enclosure, so, when the die package box has reverse twist, in this four limit, just become the seesaw state, revised semiconductor device outside lead also becomes the seesaw state, thereby flatness degenerates.
In addition, in above-mentioned the sort of semiconductor device outside lead flatness correction portion, externally the going up after the operation that press down of lead-in wire pressed in the operation, upwards swaged lead that can not be just right.
In addition, in the appearance inspection device of lead-in wire correction portion with the semiconductor device that has earlier, can not be according to alteration of form of the enclosure of semiconductor device etc. and change correcting part at an easy rate.
The present invention makes in order to address the above problem, and can make semiconductor leads straightener that operation simplifies and the appearance inspection device with semiconductor device of this straightener thereby purpose aims to provide a kind of designs simplification of spacing correction portion of the outside lead that makes semiconductor device.In addition, the present invention also is by making semiconductor device outside lead straightener become 1 mould bases structure from 2 mould bases structures, provides and to have the semiconductor device appearance inspection device of this straightener than the semiconductor leads straightener of miniaturization in the past, cost degradation.In addition, thus another object of the present invention is to provide the reverse twist that can absorb the die package box when encapsulating in order to carry out the correction of outside lead flatness can improve the semiconductor leads straightener of flatness and has the semiconductor device appearance inspection device of this straightener.In addition, the present invention also aims to be provided at semiconductor device outside lead straightener that outside lead upwards can be expressed to just right position in the semiconductor device outside lead flatness correction operation and semiconductor device appearance inspection device with this straightener.In addition, purpose of the present invention also aims to provide the appearance inspection device that can change the semiconductor device of correcting part according to alteration of form of the enclosure of semiconductor device etc. at an easy rate.
In order to address the above problem, the outside lead straightener of semiconductor device of the present invention is characterised in that: the 2nd spacing correction pawl that the claw with each gap between each lead-in wire that can pass outside lead is arranged accordingly every not corresponding each gap every 1 spacing of the 1st spacing correction pawl of 1 spacing arrangement in above-mentioned each gap and the claw that can pass each gap between each lead-in wire of outside lead and each claw of above-mentioned the 1st spacing correction pawl, above-mentioned the 1st spacing correction pawl and above-mentioned the 2nd correction pawl are configured to different with respect to the phase mutual edge distance of the outside lead of semiconductor device, action continuously mutually.
In addition, in the present invention, in a mould bases, preferably have above-mentioned the 1st spacing correction pawl and above-mentioned the 2nd spacing correction pawl and move continuously with the 1st and the 2nd spacing correction pawl and the flatness correction portion of the outside lead that is provided with.
In addition, in the present invention, in a mould bases, preferably have above-mentioned the 1st spacing correction pawl and above-mentioned the 2nd spacing correction pawl and move continuously with the 1st and the 2nd spacing correction pawl and the lead-in wire pressing down section of the flatness correction that is used for outside lead that is provided with and with the above-mentioned the 1st and the 2nd spacing correction pawl splenium on the lead-in wire of single movement and the flatness correction that is used for outside lead that is provided with respectively.
In addition, in the present invention, preferably have after making the above-mentioned the 1st and the 2nd spacing correction pawl pass the outside lead of semiconductor device and in the process that original location restore moves, make the above-mentioned the 1st and the 2nd spacing correction pawl, so that the above-mentioned the 1st does not contact with outside lead with the 2nd spacing correction pawl to the travel mechanism that the direction away from outside lead moves.
In addition, in the present invention, preferably have the spacing correction pawl of the claw in each gap between each lead-in wire that can pass outside lead every 1 spacing arrangement in above-mentioned each gap, thereby each gap that above-mentioned spacing correction pawl is passed between above-mentioned each lead-in wire makes this spacing correction pawl carry out the 1st spacing correction portion of the 1st spacing correction, thereby 1 spacing moving part of 1 spacing is moved in each gap that makes 1 spacing that above-mentioned spacing correction pawl and above-mentioned spacing correction pawl when carrying out above-mentioned the 1st spacing correction do not pass after the 1st spacing correction finishes accordingly and make above-mentioned spacing correction pawl pass the 2nd spacing correction portion that above-mentioned each each gap between going between makes this spacing correction pawl that moved carry out the 2nd spacing correction.
In addition, in the present invention, in order to carry out the outside lead correction, the protuberance that preferably has the ring-type that contacts with enclosure on the table top of the enclosure that receives semiconductor device is so that contact with ring-type with respect to the enclosure surface.
In addition, in the present invention, the relative angle of toe angle that the upper holder that uses for the flatness correction of carrying out outside lead and the part of this outside lead contact are preferably formed as and go between.
In addition, the appearance inspection device of semiconductor device of the present invention is characterised in that: the outside lead straightener of above-mentioned semiconductor device is configured in its periphery.
Fig. 1 is the brief configuration figure of the semiconductor leads straightener of embodiment 1.
Fig. 2 is the schematic diagram of action that is used to illustrate the 1st correction portion of embodiment 1.
Fig. 3 is the oblique view of the 1st correction portion of embodiment 1.
Fig. 4 is the overall concise and to the point oblique view of embodiment 1.
Fig. 5 is the brief configuration figure of the semiconductor leads straightener of embodiment 2.
Fig. 6 is the schematic diagram of action that is used to illustrate the semiconductor leads straightener of embodiment 3.
Fig. 7 is the schematic diagram of action that is used to illustrate the semiconductor leads straightener of embodiment 3.
Fig. 8 is the schematic diagram of action that is used to illustrate the semiconductor leads straightener of embodiment 4.
Fig. 9 is the schematic diagram of improvement part of encapsulation platform that is used to illustrate the semiconductor leads straightener of embodiment 5.
Figure 10 is the curve chart that is used to illustrate the effect of embodiment 5.
Figure 11 is the schematic diagram that is used to illustrate the semiconductor leads straightener of embodiment 6.
Figure 12 is the curve chart that is used to illustrate the effect of embodiment 6.
Figure 13 (1) is used to illustrate the structure of appearance inspection device of semiconductor device of the embodiment of the invention 7 and the outline flowchart of action, and Figure 13 (2) is sketch of its device configuration example.
Figure 14 is the structure chart of the semiconductor leads straightener that has earlier.
Figure 15 is the schematic diagram that is used to illustrate the action of the semiconductor leads straightener that has earlier.
In the accompanying drawing:
1,1A... the 1st correction portion
2,2A... the 2nd correction portion
3... punch die base
4... die shoe
5... perforator base
6... perforator backing plate
7... stamping machine base
8... stamping machine side plate
9... air cylinder
10... stamping machine cylinder base
11... spacing correction perforator
12... lead-in wire presses down perforator
13... encapsulation platform
13b... ring-type acceptance division
15,25... is corrected semiconductor device
16, the 26... outside lead
17... die package box surface
18... top fulcrum
22... press punch die on the lead-in wire
23... punch die liftout attachment
24... encapsulation presses down perforator
27... die package box surface
28... punch die liftout attachment construction bolt
30,36... compresses spring
31... press pressing spring
35... brake
37... last item under the ball
38... sliding ball
39... ball upper pressure axial
40... pawl axle
111... the 1st spacing correction pawl
112... the 2nd spacing correction pawl
121... lead-in wire presses down the perforator inclined plane part
In the outside lead straightener of semiconductor device of the present invention, by making the 1st spacing Revise between each lead-in wire that pawl passes outside lead every each gap of 1 spacing, make then the 2 spacing correction pawls pass that above-mentioned the 1st spacing correction pawl of outside lead do not pass every 1 The spacing correction of outside lead is carried out in each gap of spacing. And, above-mentioned the 1st spacing correction Pawl and the 2nd spacing correction pawl are formed in 1 mould bases, so, can in a mould bases Utilize continuously the spacing correction of the 1st spacing correction pawl and utilize the 2nd spacing correction The spacing correction of pawl, thus spacing correction operation is simplified and the simplification of spacing straightener And cost degradation.
In addition, in the present invention, in a mould bases, have above-mentioned the 1st spacing correction pawl and Above-mentioned the 2nd spacing correction pawl and move continuously with the 1st and the 2nd spacing correction pawl And the lead-in wire pressing down section of the flatness correction that is used for outside lead of configuration and with the above-mentioned the 1st And the 2nd spacing correction pawl move independently respectively and arrange be used for the smooth of outside lead Splenium on the lead-in wire that degree is revised. Therefore, utilize an action of same mould bases both can connect Carry out for the spacing correction of semiconductor device outside lead and drawing of flatness correction continuously Line presses down operation, can carry out again simultaneously pressing operation on the lead-in wire for the flatness correction.
In addition, in the present invention, in that being passed partly, the above-mentioned the 1st and the 2nd spacing correction pawl leads In the process that the backward original location restore of the outside lead of body device moves, move owing to utilize Actuation mechanism makes the above-mentioned the 1st and the 2nd spacing correction pawl move to the direction away from outside lead, So, can prevent the above-mentioned the 1st and the 2nd spacing correction pawl in above-mentioned recovery moving process Contact with outside lead and to cause outside lead distortion etc.
In addition, in the present invention, at first, make spacing correction pawl pass above-mentioned respectively each between lead-in wire The 1st spacing correction is carried out in the gap. Then, above-mentioned spacing correction pawl is moved and carry out the 1st Each gap every 1 spacing that above-mentioned spacing correction pawl does not pass during the spacing correction is corresponding Each gap that 1 spacing, above-mentioned spacing correction pawl are passed between above-mentioned each lead-in wire was moved this Spacing correction pawl carries out the 2nd spacing correction, carries out the spacing correction of outside lead with this. Cause This, the spacing correction pawl that can be used in the spacing correction of outside lead is realized miniaturization and low Cost.
In addition, in the present invention, in order to carry out the outside lead correction, receiving half with plummer The protuberance that has ring-type on the plummer during encapsulation box of conductor means, the protuberance of this ring-type Contact with ring-type with encapsulation box surface, so, arbitrarily 3 carryings can be obtained, the encapsulation box The seesaw state can be do not become, thereby the encapsulation box can be stably received.
In addition, in the present invention, in the outside lead straightener of semiconductor device, in order to advance The flatness correction of row outside lead and the upper pressure punch die that uses contacts with this outside lead Part forms the angle relative with the toe angle of lead-in wire. Like this, only sharp in upper pressure punch die Fore-end with lead-in wire contacts, because the elastic recovery amount of outside lead is certain, and institute With, can carry out the flatness correction with higher precision.
In addition, in the appearance inspection device of semiconductor device of the present invention, because with above-mentioned The outside lead straightener of semiconductor device is configured in its periphery, so, can be easy to Ground carries out the dismounting of the straightener corresponding with the change in shape of the encapsulation box of semiconductor device etc. And install to wait and change operation.
Embodiment 1:
Below, with reference to Fig. 1～Fig. 4 embodiments of the invention 1 are described.In Fig. 1,1 is the 1st correction portion, and 2 is the 2nd correction portions.The 3rd, the punch die base, the 4th, die shoe, the 5th, the perforator base, the 6th, the perforator backing plate, the 1st correction portion 1 and the 2nd correction portion 2 are mounted thereto.
In the 1st correction portion 1, the 11st, spacing correction perforator, 111 is the 1st spacing correction pawls, 112 is the 2nd spacing correction pawls.In addition, the 12nd, lead-in wire presses down perforator, and the 121st, with the downward inclined plane part that pushes of the front end of outside lead 16.In addition, the mounting encapsulation platform 13 that is corrected semiconductor device 15 is installed on the die shoe 4.
In the 1st correction portion 1, shown in Fig. 3 institute oblique view, spacing correction pawl 111 relatively is configured in the direction parallel with the orientation of outside lead 16 with each odd number (or even number) gap of 16 of each outside leads.In addition, spacing correction pawl 112 relatively is configured in the direction parallel with the orientation of outside lead 16 with each even number (or odd number) gap of 16 of each outside leads.And, spacing correction pawl 111 and spacing correction pawl 112 with respect to outside lead 16 mutually near and away from direction (vertical direction among the figure) on be configured in two ends up and down.Because spacing correction pawl 111 and spacing correction pawl 112 are to constitute like this, so, when 111 declines of spacing correction pawl are mobile, as shown in Figure 3, at first spacing correction pawl 111 is inserted through each odd number (or even number) gap of 16 of each outside leads, then, spacing correction pawl 112 is inserted through each even number (or odd number) gap of 16 of each outside leads.Like this, in the past as Figure 15 (1) and (2) just shown in the spacing correction of 2 down maneuvers of needs carry out serially by a down maneuver.
In addition, in the 1st correction portion 1, also combination only has with 1 action (1 down maneuver) and just can carry out the spacing correction portion 11 of spacing correction and lead-in wire that the flatness correction is used presses down perforator 12.Like this, only just can implement whole operations of spacing correction and preceding half operation of flatness correction (the later half operation of flatness correction is implemented by the 2nd correction portion 2) with the 1st correction portion 1 of 1 assembly mould frame.Therefore, can carry can be for saving the space, simplifying control and the spacing correction that goes between simultaneously and the lead-in wire straightener of these two kinds of corrections of flatness correction.
Below, the action of embodiment 1 is described with reference to Fig. 1～Fig. 4.Fig. 2 is the schematic diagram of action that is used for describing in detail the 1st correction portion 1 of Fig. 1, and Fig. 3 is the simple oblique view of the 1st correction portion 1, and Fig. 4 is the overall simple oblique view that comprises the outside lead straightener of stamping machine.
At first, will be corrected on the encapsulation platform 13 that semiconductor device 15 places the 1st correction portion 1.Utilize drive sources such as pneumatic cylinder (referring to the symbol 9 of Fig. 4) that perforator base 5 is descended, press the surface 17 that is corrected semiconductor device 15 from the top with top fulcrum 18 earlier, utilize active force to push (referring to Fig. 2 (1)) by pressing spring 31.
Then, when perforator base 5 was descended, the 1st spacing correction pawl 111 was every 1 gap (referring to Fig. 2 (2)) that goes between between the lead-in wire that passes the lead-in wire 16 that is corrected semiconductor device 15 at interval.At this moment, the front end of spacing correction pawl 111 (referring to Fig. 2 (2) and (3)) is arranged in comb form accordingly with the spacing of semiconductor device lead-in wire 16, is inserted into smoothly between lead-in wire and the lead-in wire.When perforator base 5 further descended, correction pawl 111 just passed between lead-in wire and with the width of revising pawl 111 and will go between to horizontal extruding accordingly.The greatest width dimension of revising pawl 111 is more some greatly than the size between lead-in wire, and still, the greatest width dimension of this correction pawl 111 is determined according to the material and the thickness of lead-in wire 16, so that capability for correcting can reach best effect.
When perforator base 5 was descended, at this moment the 2nd spacing correction pawl 112 just passed the 1st and revises between the lead-in wire that pawl 111 do not pass and the same as horizontal swaged lead 16 (referring to Fig. 2 (3)) with the 1st correction pawl.For example, the 1st spacing correction pawl 111 passes between each odd number lead-in wire, and the 2nd spacing correction pawl 112 passes between each even number lead-in wire and the outside (referring to Fig. 3) of ragged edge lead-in wire.
When perforator base 5 was descended, just will go between 16 front end of the inclined plane part 121 that lead-in wire presses down perforator 12 pushed (referring to Fig. 2 (4)) downwards.
Just right when pressing down stroke when finishing, then, through after the regular hour, drive source 9 is just to effect in the other direction, and perforator base 5 just begins to rise.Upward stroke is the reverse drive of descending stroke, along reverse the carrying out (Fig. 2 (4) → (3) → (2) → (1)) of Fig. 2 order.At this moment, when passing between each self-corresponding lead-in wire apart from correction pawl 111 and 112, rubs between lead-in wire 16 and the correction pawl 111 and 112 rise time, might produce the active force that semiconductor device 15 is upwards promoted, to this, at least when spacing correction pawl 111 and 112 passes between lead-in wire from bottom to top since top fulcrum 18 continue semiconductor device 15 is pushed downwards, so, needn't worry that semiconductor device 15 upwards promotes.
Below, the action of the 2nd correction portion 2 is described.In above-mentioned the 1st correction portion 1, when finishing the rising of perforator base 5, just take out and be corrected semiconductor device 15, move and place on the punch die liftout attachment 23 of the 2nd correction portion 2.Place the semiconductor device that is corrected at this place to represent with symbol 25 at Fig. 1.On the other hand, also the next one can be corrected on the encapsulation platform 13 that semiconductor device 15 places the 1st correction portion 1 that is available.
In the 2nd correction portion 2, with the same in the 1st correction portion 1, when utilizing drive source 9 such as pneumatic cylinder that perforator base 5 is descended, encapsulation presses down perforator 24 and just descends, pushes the enclosure surface 27 that is corrected semiconductor device 25 downwards.Place by the semiconductor device 25 that is corrected on the punch die liftout attachment 23 of elasticity support of compression spring 30 and push downwards by decline power greater than the elastic force of compression spring 30.So the outside lead 26 that is corrected semiconductor device 25 just is extruded to lead-in wire and goes up on the pressure punch die 22, lead-in wire 26 is pushed upward.At this moment upwards amount of compression is determined best amount according to the material and the shape of lead-in wire 26.Then, through behind the certain hour, encapsulation presses down perforator 24 rises, and finishes whole operations that lead-in wire is revised.Embodiment 2:
Below, with reference to Fig. 5 embodiment 2 is described.In embodiment 1, show 2 correction portions are focused on example in 1 assembly mould frame, in embodiment 2, adopt the structure that in 1 assembly mould frame, has 3 correction portions.Increase by 1 correction portion than embodiment 1, compare with the structure that has 4 correction portions altogether that has 2 correction portions in 2 assembly mould frames of prior art respectively, the same with embodiment 1, can realize structure simple and the saving space.
In Fig. 5, in the 1st correction portion 1, only have the parts that the spacing correction is used, only carry out the spacing correction.Spacing correction perforator 11 used herein and embodiment's 1 is identical.
Secondly, carry out preceding half operation (lead-in wire presses down operation) of the flatness correction of semiconductor device lead-in wire by the 2nd correction portion 1 '.Then, by the later half operation (pressing operation on the lead-in wire) of the 3rd correction portion 2 enforcement flatness corrections, finishing lead-in wire and revising operation.
In present embodiment 2, also be the drive source that drives perforator one side have 1 just passable, place on the 2nd correction portion 1 ' and the 3rd correction portion 2 from the 1st correction portion 1 by being corrected semiconductor device 15,25 orders, just carry out the lead-in wire correction operation of a plurality of semiconductor devices serially.
In the foregoing description 2, the lead-in wire that employing is carried out the flatness correction by the 2nd correction portion 1 ' presses down, and carries out the structure of pressing on the lead-in wire of flatness correction by the 3rd correction portion 2, still, also the 2nd correction portion and the 3rd correction portion can be exchanged, the reversed order of flatness correction is come.Embodiment 3:
Below, with reference to Fig. 6 embodiment 3 is described.In embodiment 3, as described below such of the spacing correction pawl that will in embodiment 1 or embodiment 2, use 111 adopt with respect to outside lead near and away from direction can carry out the structure of on-off action.
That is, at first utilize with embodiment 1 identical action make stamping machine with the cylinder base from state decline shown in Figure 6.So sliding ball 38 is just by upwards extruding of ball upper pressure axial 39.It is that (referring to Fig. 7) opened at the center laterally with pawl axle 40 that spacing correction perforator 11 utilizes the extruding force of compression spring 36 to make its spacing correction pawl one side.
Secondly, under this state, when spacing correction perforator 11 rises, as previously mentioned, spacing correction perforator 11 since the front end of its spacing correction pawl from outside lead to away from direction open, so above-mentioned spacing correction pawl can not contact with the outside lead that is corrected semiconductor device 15.Therefore, in the structure of present embodiment 3, that need not use in embodiment 1 and embodiment 2 is used to prevent to be corrected the top fulcrum 18 that semiconductor device 15 is moving upward.
When finishing the rising of spacing correction perforator 11, as shown in Figure 6, last item 37 and sliding ball 38 are braked device 35 and push downwards under the ball, thus spacing correction perforator 11 to the inside (to direction) near outside lead close.Under this state, vertical motion finishes, and has just finished the preparation of down maneuver.By carrying out these actions repeatedly, the front end of spacing correction perforator 11 is closed in descending stroke, carries out the spacing correction, opens in upward stroke, can avoid contacting with the outside lead of semiconductor device 15.As mentioned above, in present embodiment 3, because spacing correction pawl is not contacted with the lead-in wire that is corrected semiconductor device 15, so particularly situation about deforming in above-mentioned rising operation for the lead-in wire of wanting to prevent to be corrected semiconductor device 15 is effective.Embodiment 4:
Below, with reference to Fig. 8 embodiments of the invention 4 are described.The spacing correction perforator 11 that in previously described embodiment 1～3, uses by will with respect to each gap between each lead-in wire that is corrected semiconductor device with every corresponding 2 the spacing correction pawls uses of 1 spacing at the two sections spacing correction pawl that 1 spacing disposes that staggers, just can finish the spacing correction by 1 correction portion, but, in the present embodiment, use the spacing correction pawl of one section configuration.
That is, in embodiment 4, the spacing correction pawl that has in spacing correction perforator 11 is not the structure of two sections, but only has 111 1 sections of spacing correction pawls (Fig. 8 (1)).And when spacing correction perforator 11 descended, for example spacing correction pawl 111 passed the odd number gap (Fig. 8 (2)) between lead-in wire.
In addition, when spacing correction perforator 11 descended, lead-in wire pressed down the preceding end in contact of inclined plane part 121 with the lead-in wire of perforator 12, the extruding downwards that will go between, and the flatness correction is used to go between.
Secondly, enter the rising operation that spacing correction perforator 11 is risen.Before the rising operation or in the way of rising, make spacing correction perforator 11 move 1 spacing (Fig. 8 (4)).And then, when spacing correction perforator 11 is risen, the gap that above-mentioned spacing correction pawl 111 just is passed between the lead-in wire that does not pass in the above-mentioned descending stroke, for example outside (Fig. 8 (5)) that goes between by even number gap between lead-in wire and ragged edge.When after passing, further rising, just make above-mentioned spacing correction perforator 11 move 1 spacing, get back to the state identical (Fig. 8 (6)) with Fig. 8 (1).
As mentioned above, according to present embodiment 4,111 usefulness one segment structures of spacing correction pawl get final product, so, compare with the situation of the two-stage structure of embodiment 1～3, have the advantage that the manufacturing cost of spacing correction pawl approximately can reduce by half.Embodiment 5:
Below, with reference to Fig. 9 embodiments of the invention 5 are described.As described below, present embodiment 5 adopts carrying to be corrected the structure of semiconductor device in the lead-in wire correction portion of each semiconductor device, and the phenomenon even this enclosure is distorted etc. also can stably be carried and is corrected semiconductor device.
Usually, the enclosure of many semiconductor devices is because during assembling or various conditions during encapsulation and can being distorted knifeedge.When this enclosure has distortion, owing to can not stably carry enclosure, the obstacle in the time of will becoming the flatness correction that goes between.For example, on the encapsulation platform that formerly has, shown in Fig. 9 (a), around encapsulation platform 13, the supporting part 13a with foursquare four limits is set.When the enclosure 15 that will have a distortion places this supporting part 13a that has earlier to go up, shown in Fig. 9 (b), will shake and unstable.
As the countermeasure that addresses this problem, implemented the whole bag of tricks in the past, still, in present embodiment 5, shown in Fig. 9 (c), be the supporting part 13b that outstanding ring-type is set on encapsulation platform 13, by the reverse side or the surface of this ring-type supporting part 13b carrying enclosure 15.
Usually, object uses 3 supports just can be stably static at gravity direction at least.In the time of will placing ring-type supporting part 13b to go up as the semiconductor device packages box 15 of one of object, even semiconductor device packages box 15 has distortion, at least 3 contacts on the encapsulating face of this semiconductor device, thus can be static.In other words, look for 3 points with the form of nature.During the correction that under this natural state, goes between, just can obtain the flatness of good lead-in wire.
Figure 10 is the curve chart that is used to illustrate the effect of present embodiment 5, the curve of the corrected flatness of outside lead on each limit of semiconductor device (referring to Figure 10 (c)) when (a) being to use the supporting part shown in the Fig. 9 (a) that has earlier to carry out the flatness correction, the curve of the corrected flatness of outside lead on each limit (referring to Figure 10 (c)) of the semiconductor device when (b) being to use the ring-type supporting part 13b of embodiment 5 to carry out the flatness correction.Embodiment 6:
Below, with reference to Figure 11～12 explanation embodiments of the invention 6.Present embodiment 6 is in the flatness correction portion of the outside lead of semiconductor device, on the outside lead of semiconductor device, press the contact site setting angle (5 degree～10 degree) relative of the outside lead of punch die, so that when the wire length of each limit that is corrected semiconductor device (referring to Figure 10 (c)) has difference or the lead-in wire toe angle method that will go between and make progress and push when difference is arranged with the toe angle of semiconductor device outside lead.
Usually, in the cut-out and forming process of the outside lead of semiconductor device, differing forms the semiconductor device of balance surely, and the length of the lead-in wire on each limit has difference sometimes, and perhaps toe angle has difference (referring to Figure 11 (c)).When this difference, the obstacle in the time of will becoming the flatness correction that goes between.
As the countermeasure that addresses this problem, in the past, shown in Figure 11 (a), be that the surface configuration of the lead-in wire contact of pressing punch die with going up of the outside lead of semiconductor device adopts the angle consistent with the toe angle of the lead-in wire that carries out this flatness correction (being generally 0 degree～10 degree).In contrast, in present embodiment 6, shown in Figure 11 (b), then form the angle relative (5 degree～-10 degree) with the toe angle of the lead-in wire that carries out this flatness correction.Like this, just only leaded fore-end contacts with pressing down punch die, and it is certain that the elastic recovery amount of the semiconductor device outside lead on 4 limits keeps, thereby can obtain good flatness.
Figure 12 is the curve chart that is used to illustrate the effect of present embodiment 6, (a) be the distribution curve of the flatness before the flatness correction, (b) being the distribution curve of getting corrected flatness when pressing the punch die angle to be 0 ° that has earlier, (c) is the distribution curve of getting of present embodiment corrected flatness when pressing the punch die angle to be-10 °.Embodiment 7:
Below, with reference to Figure 13 embodiments of the invention 7 are described.Present embodiment 7 is the semiconductor device automatic shape inspection apparatus that assembling the semiconductor device lead-in wire straightener of foregoing embodiment 1～6.Figure 13 (1) is the structure of this semiconductor device automatic shape inspection apparatus and the outline flowchart of action, and Figure 13 (2) is an example of the planar configuration of this device.In present embodiment 7, shown in Figure 13 (1) and (2), the lead-in wire correction portion is configured in the periphery of semiconductor device automatic shape inspection apparatus.Like this, just, can carry out the corresponding correction of alteration of form with the semiconductor device packages box at an easy rate and change operation with the dismounting of parts and installation etc.In addition, for the appearance inspection machine of having established of additional lead straightener not, additional lead straightener at an easy rate later on.As present embodiment 7 example arranged earlier, for example there is the spy to open flat 6-167459 communique etc., in the disclosed example of the document, because reconditioning work portion is configured in the substantial middle of semiconductor device automatic shape inspection apparatus, so, be difficult to carry out the replacing operation of the repairing parts corresponding with various semiconductor device packages boxes.
In the outside lead straightener of semiconductor device of the present invention, the 1st spacing correction pawl passes respectively each gap every 1 spacing between lead-in wire of outside lead, above-mentioned the 1st spacing correction pawl that makes the 2nd spacing correction pawl pass outside lead then continuously do not pass every each gap of 1 spacing, carry out the spacing correction of outside lead with this.That is, because in 1 mould bases that above-mentioned the 1st spacing correction pawl and the 2nd spacing correction pawl constitute, so, only just carry out the spacing correction of the 1st spacing correction pawl and the spacing correction of the 2nd spacing correction pawl serially with the action of 1 mould bases.Therefore, spacing correction operation is simplified.In addition, owing to can make before 2 the mould bases structures that have of semiconductor device outside lead straightener become 1 mould bases, so, can make the size of straightener approximately reduce half, the drive source of perforated portion uses 1 just, thereby can reduce manufacturing cost.In addition, can also shorten the replacing activity duration.
In addition, in the present invention, in 1 mould bases, have above-mentioned the 1st spacing correction pawl and above-mentioned the 2nd spacing correction pawl and the flatness correction portion of the outside lead that is provided with in order to move continuously with the 1st and the 2nd spacing correction pawl.Therefore, in same mould bases, utilize the action of 1 mould bases just to carry out the spacing correction and the flatness correction of semiconductor device outside lead serially.So, the correction operation of outside lead is simplified significantly.In addition, owing to make before 2 the mould bases structures that have of semiconductor device outside lead straightener become 1 mould bases structure, so, can make the size of straightener approximately reduce half, the drive source of perforated portion uses 1 just, thereby can reduce manufacturing cost.In addition, can also shorten the replacing activity duration.
In addition, in the present invention, owing in 1 mould bases, having above-mentioned the 1st spacing correction pawl and above-mentioned the 2nd spacing correction pawl and in order to move the lead-in wire pressing down section of the flatness correction that is used for outside lead be provided with continuously with the 1st and the 2nd spacing correction pawl and in order to move splenium on the lead-in wire of the flatness correction that is used for outside lead that is provided with respectively independently with the above-mentioned the 1st and the 2nd spacing correction pawl, so, in same mould bases, utilize the action of 1 mould bases just to carry out the flatness correction and the spacing correction of semiconductor device outside lead serially.Therefore, owing to make before 2 the mould bases structures that have of semiconductor device outside lead straightener become 1 mould bases structure, so, can make the size of straightener approximately reduce half, the drive source of perforated portion uses 1 just, thereby can reduce manufacturing cost.In addition, can also shorten the replacing activity duration.
In addition, in the present invention, since after making the above-mentioned the 1st and the 2nd spacing correction pawl pass the outside lead of semiconductor device in the process that original location restore moves, utilize travel mechanism that the above-mentioned the 1st and the 2nd spacing correction pawl is moved to the direction away from outside lead, so, can prevent that in this process the above-mentioned the 1st contacts with outside lead with the 2nd spacing correction pawl and to cause outside lead distortion etc.
In addition, in the present invention, at first make spacing correction pawl pass above-mentioned respectively each gap between lead-in wire, carry out the spacing correction, then, make above-mentioned spacing correction pawl move 1 spacing to make it with to carry out each gap every 1 spacing that the above-mentioned spacing correction of the 1st spacing correction pawl do not pass corresponding, then, make this spacing correction pawl that moved pass above-mentioned respectively each gap between lead-in wire, make above-mentioned spacing correction pawl carry out the 2nd spacing correction, finish the spacing correction of outside lead with this.Therefore, only just can carry out the spacing correction of outside lead, thereby can realize the miniaturization and the cost degradation of outside lead straightener with 1 spacing correction pawl.
In addition, in the present invention, in order to carry out the outside lead correction, the protuberance that has ring-type on the plummer during with the enclosure of plummer bearing semiconductor device.Therefore, because the protuberance of this ring-type contacts with ring-type with the enclosure surface, so, can obtain 3 contacts arbitrarily, thereby enclosure can not become the seesaw state, can stably support enclosure, obtain the flatness of good lead-in wire.
In addition, in the present invention, will be for the flatness correction of carrying out outside lead the part of outside lead that use and last pressure punch die the contact relative angle of toe angle that forms and go between.Therefore, have only the fore-end of outside lead to contact with last pressure punch die, it is certain that the elastic recovery amount of outside lead keeps, and can obtain the flatness of good lead-in wire.
In addition, in the appearance inspection device of semiconductor device of the present invention, because the outside lead straightener of above-mentioned semiconductor device is configured in its periphery, so, can carry out the dismounting of the straightener corresponding and installation etc. at an easy rate and change operation with the alteration of form of the enclosure of semiconductor device etc.
Claims (8)
1. the outside lead straightener of a semiconductor device, it is characterized in that: the 2nd spacing correction pawl that the claw that has each gap between each lead-in wire that can pass outside lead in the outside lead straightener of this semiconductor device is arranged accordingly every not corresponding each gap every 1 spacing of the 1st spacing correction pawl of 1 spacing arrangement in above-mentioned each gap and the claw that can pass each gap between each lead-in wire of outside lead and each claw of above-mentioned the 1st spacing correction pawl, above-mentioned the 1st spacing correction pawl and above-mentioned the 2nd correction pawl are configured to different with respect to the phase mutual edge distance of the outside lead of semiconductor device, and pass above-mentioned each gap with mutual continuous action.
2. the outside lead straightener of semiconductor device as claimed in claim 1, it is characterized in that: in 1 mould bases, have above-mentioned the 1st spacing correction pawl and spacing correction pawl and the flatness correction portion of the outside lead that is provided with in order to move continuously, utilize the action of 1 mould bases to carry out the spacing correction and the flatness correction of outside lead continuously with the action of the 1st and the 2nd spacing correction pawl.
3. the outside lead straightener of semiconductor device as claimed in claim 1, it is characterized in that: in 1 mould bases, have above-mentioned the 1st spacing correction pawl and spacing correction pawl and the lead-in wire of the lead-in wire pressing down section of the flatness correction that is used for outside lead that is provided with in order to move continuously and the flatness correction that is used for outside lead that is provided with independently respectively with the above-mentioned the 1st and the 2nd spacing correction pawl with the action of the 1st and the 2nd spacing correction pawl on splenium, utilize the action of 1 mould bases, carry out the spacing corrective action of outside lead continuously and be used for the lead-in wire pressing action of flatness correction, also be used for simultaneously pressing work on the lead-in wire of flatness correction of outside lead.
4. the outside lead straightener of semiconductor device as claimed in claim 1, it is characterized in that: have travel mechanism, in order to make above-mentioned and the 2nd spacing correction pawl pass the outside lead of semiconductor device after in the process that original location restore moves, make the above-mentioned the 1st and the 2nd spacing correction pawl to outside lead away from direction move so that the above-mentioned the 1st does not contact with outside lead with the 2nd spacing correction pawl.
5. the outside lead straightener of semiconductor device is characterized in that: have the spacing correction pawl of the claw in each gap between each lead-in wire that can pass outside lead every 1 spacing arrangement in above-mentioned each gap in the outside lead straightener of this semiconductor device, thereby each gap that above-mentioned spacing correction pawl is passed between above-mentioned each lead-in wire makes this spacing correction pawl carry out the 1st spacing correction portion of the 1st spacing correction, move 1 spacing moving part of 1 spacing thereby each gap that makes 1 spacing that above-mentioned spacing correction pawl and above-mentioned spacing correction pawl when carrying out above-mentioned the 1st spacing correction do not pass after the 1st spacing correction finishes is corresponding and make above-mentioned spacing correction pawl pass the 2nd spacing correction portion that above-mentioned each gap between respectively going between makes this spacing correction pawl that moved carry out the 2nd spacing correction.
6. as the outside lead straightener of each described semiconductor device of claim 1～5, it is characterized in that: in order to carry out the outside lead correction, the protuberance that on the plummer of the enclosure of bearing semiconductor device, has the ring-type that contacts with enclosure.
7. as the outside lead straightener of each described semiconductor device of claim 1～6, it is characterized in that: the relative angle of toe angle that the part that going up of using for the flatness correction of carrying out outside lead presses punch die and outside lead to contact forms and goes between.
8. the appearance inspection device of a semiconductor device is characterized in that disposing outside lead straightener as each described semiconductor device of claim 1～6 at its periphery.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP239738/1995 | 1995-09-19 | ||
| JP7239738A JPH0982868A (en) | 1995-09-19 | 1995-09-19 | Outer lead corrector of semiconductor device and visual inspection device of semiconductor device equipped therewith |
| JP239738/95 | 1995-09-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1180241A true CN1180241A (en) | 1998-04-29 |
| CN1132237C CN1132237C (en) | 2003-12-24 |
Family
ID=17049203
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN96100698A Expired - Fee Related CN1132237C (en) | 1995-09-19 | 1996-01-19 | External lead wire corrector and visual examinator for semiconductor device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPH0982868A (en) |
| KR (1) | KR100236872B1 (en) |
| CN (1) | CN1132237C (en) |
| TW (1) | TW295715B (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06163782A (en) * | 1992-11-17 | 1994-06-10 | Sanyo Silicon Denshi Kk | Bend correction apparatus of ic lead |
-
1995
- 1995-09-19 JP JP7239738A patent/JPH0982868A/en active Pending
-
1996
- 1996-01-19 CN CN96100698A patent/CN1132237C/en not_active Expired - Fee Related
- 1996-02-01 TW TW085101256A patent/TW295715B/en active
- 1996-07-19 KR KR1019960029094A patent/KR100236872B1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0982868A (en) | 1997-03-28 |
| KR970018484A (en) | 1997-04-30 |
| KR100236872B1 (en) | 2000-01-15 |
| CN1132237C (en) | 2003-12-24 |
| TW295715B (en) | 1997-01-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1259755C (en) | Method and apparatus for mfg. wiring wire bundle | |
| CN206335013U (en) | A kind of auto parts and components production automatic punching device | |
| CN1025298C (en) | Method and device for forming a sheet-metal blank, in particular in order to make a cathode ray tube mask, and cathode ray tube mask obtained according to this method | |
| CN206241118U (en) | A kind of decompressor for auto parts and components production | |
| CN1974167A (en) | Scoring device and method and multi braking system | |
| CN105170838A (en) | Two-stage bending type LED pin bending machine | |
| CN107877610A (en) | A kind of bicker of moulding | |
| CN1061571C (en) | Method of production of poly-V groove pulley made of sheet metal, and poly-V groove pulley made of sheet metal | |
| CN1891449A (en) | Feeder for metal band-shaped unit | |
| CN1191063A (en) | Method and apparatus for mounting electronic components | |
| CN1132237C (en) | External lead wire corrector and visual examinator for semiconductor device | |
| CN1015235B (en) | Apparatus for forming long plate member | |
| CN1387208A (en) | Aluminium electrolytic capacitor forming method, temporary bending die, temporary bending lead guider, formal bending die and method for mfg same using auto-working machine | |
| CN108817465A (en) | Aluminium alloy extrusions automatic punch | |
| CN1102364A (en) | A die-punch machine | |
| CN1043892A (en) | Drawing machine | |
| CN1291067C (en) | Correction device for platy parts | |
| CN105081134A (en) | Pressing machine for agricultural steel wire mesh basket | |
| CN209407199U9 (en) | Vacuum booster upper chamber side piercing die for casings | |
| CN2715586Y (en) | Zipper and puller assembling machine | |
| CN211614031U (en) | Die for processing curtain mounting seat | |
| CN107282789A (en) | Upper casing riveter for producing vibrations motor | |
| CN207564107U (en) | The breaking of a kind of laths of metal, bending integral production line | |
| CN1790573A (en) | Hoop molding method | |
| JP2004017156A (en) | Drawing and coining die in press work process for product using undulated aluminum material |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20031224 Termination date: 20100119 |