TW294836B - - Google Patents

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Publication number
TW294836B
TW294836B TW083102005A TW83102005A TW294836B TW 294836 B TW294836 B TW 294836B TW 083102005 A TW083102005 A TW 083102005A TW 83102005 A TW83102005 A TW 83102005A TW 294836 B TW294836 B TW 294836B
Authority
TW
Taiwan
Prior art keywords
patent application
combination
item
electronic device
circuit board
Prior art date
Application number
TW083102005A
Other languages
English (en)
Chinese (zh)
Original Assignee
At & T Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by At & T Corp filed Critical At & T Corp
Application granted granted Critical
Publication of TW294836B publication Critical patent/TW294836B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW083102005A 1993-12-16 1994-03-08 TW294836B (oth)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US16854393A 1993-12-16 1993-12-16

Publications (1)

Publication Number Publication Date
TW294836B true TW294836B (oth) 1997-01-01

Family

ID=51565247

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083102005A TW294836B (oth) 1993-12-16 1994-03-08

Country Status (1)

Country Link
TW (1) TW294836B (oth)

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