TW290715B - Fabrication method of lateral bipolar transistor on silicon-on-insulator(SOI) - Google Patents

Fabrication method of lateral bipolar transistor on silicon-on-insulator(SOI)

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Publication number
TW290715B
TW290715B TW85100960A TW85100960A TW290715B TW 290715 B TW290715 B TW 290715B TW 85100960 A TW85100960 A TW 85100960A TW 85100960 A TW85100960 A TW 85100960A TW 290715 B TW290715 B TW 290715B
Authority
TW
Taiwan
Prior art keywords
bjt
growing
soi
oxide
ion implantation
Prior art date
Application number
TW85100960A
Other languages
Chinese (zh)
Inventor
Ching-Shyang Shyu
Shaw-Shiun Juang
Shyh-Chyi Wang
Menq-Song Liang
Original Assignee
Taiwan Semiconductor Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Semiconductor Mfg filed Critical Taiwan Semiconductor Mfg
Priority to TW85100960A priority Critical patent/TW290715B/en
Application granted granted Critical
Publication of TW290715B publication Critical patent/TW290715B/en

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  • Bipolar Transistors (AREA)
  • Element Separation (AREA)
  • Thin Film Transistor (AREA)

Abstract

A fabrication method of lateral bipolar transistor on SOI with base width controlled by grown spacer comprises of: (1) with SOI with buried oxide and separation by implanted oxygen(SIMOX) as initial material; (2) with ion implantation forming well region; (3) growing one thick field oxide(FOX) as isolation; (4) growing one oxide as gate oxide; (5) with chemical deposition growing and doping polysilicon, and etching with photomask to form gate of MOS element; (6) with ion implantation forming base region of BJT; (7) with photoresist overlaying one first side of BJT element, and with high-density ion implanting forming collector on one second side of BJT element; (8) on two lateral sides of gate growing one spacer and by etching back achieving needed spacer thickness; (9) with high-density ion implanting to form one emitter on BJT element; and (10) with photoresist overlaying BJT, then performing high-density ion implantation, simultaneously forming drain and source of MOS element and base of BJT element.
TW85100960A 1996-01-26 1996-01-26 Fabrication method of lateral bipolar transistor on silicon-on-insulator(SOI) TW290715B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW85100960A TW290715B (en) 1996-01-26 1996-01-26 Fabrication method of lateral bipolar transistor on silicon-on-insulator(SOI)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW85100960A TW290715B (en) 1996-01-26 1996-01-26 Fabrication method of lateral bipolar transistor on silicon-on-insulator(SOI)

Publications (1)

Publication Number Publication Date
TW290715B true TW290715B (en) 1996-11-11

Family

ID=51398279

Family Applications (1)

Application Number Title Priority Date Filing Date
TW85100960A TW290715B (en) 1996-01-26 1996-01-26 Fabrication method of lateral bipolar transistor on silicon-on-insulator(SOI)

Country Status (1)

Country Link
TW (1) TW290715B (en)

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