TW289136B - - Google Patents

Info

Publication number
TW289136B
TW289136B TW082102117A TW82102117A TW289136B TW 289136 B TW289136 B TW 289136B TW 082102117 A TW082102117 A TW 082102117A TW 82102117 A TW82102117 A TW 82102117A TW 289136 B TW289136 B TW 289136B
Authority
TW
Taiwan
Application number
TW082102117A
Original Assignee
Materials Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Materials Research Corp filed Critical Materials Research Corp
Application granted granted Critical
Publication of TW289136B publication Critical patent/TW289136B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/38—Radiation pyrometry, e.g. infrared or optical thermometry using extension or expansion of solids or fluids
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/0003—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/0003—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter
    • G01J5/0007—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter of wafers or semiconductor substrates, e.g. using Rapid Thermal Processing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/0275—Control or determination of height or distance or angle information for sensors or receivers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/07—Arrangements for adjusting the solid angle of collected radiation, e.g. adjusting or orienting field of view, tracking position or encoding angular position
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G01J5/0846—Optical arrangements having multiple detectors for performing different types of detection, e.g. using radiometry and reflectometry channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Toxicology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW082102117A 1992-04-15 1993-03-22 TW289136B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/869,241 US5350899A (en) 1992-04-15 1992-04-15 Semiconductor wafer temperature determination by optical measurement of wafer expansion in processing apparatus chamber

Publications (1)

Publication Number Publication Date
TW289136B true TW289136B (zh) 1996-10-21

Family

ID=25353178

Family Applications (1)

Application Number Title Priority Date Filing Date
TW082102117A TW289136B (zh) 1992-04-15 1993-03-22

Country Status (8)

Country Link
US (1) US5350899A (zh)
EP (1) EP0636276A1 (zh)
JP (1) JP2848704B2 (zh)
KR (1) KR950701456A (zh)
AU (1) AU3945993A (zh)
CA (1) CA2132851A1 (zh)
TW (1) TW289136B (zh)
WO (1) WO1993021656A1 (zh)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5645351A (en) * 1992-05-20 1997-07-08 Hitachi, Ltd. Temperature measuring method using thermal expansion and an apparatus for carrying out the same
US5474381A (en) * 1993-11-30 1995-12-12 Texas Instruments Incorporated Method for real-time semiconductor wafer temperature measurement based on a surface roughness characteristic of the wafer
JP3035690B2 (ja) * 1994-01-27 2000-04-24 株式会社東京精密 ウェーハ直径・断面形状測定装置及びそれを組み込んだウェーハ面取り機
KR0120730B1 (ko) * 1994-05-25 1997-10-17 김주용 반도체 웨이퍼의 급속 열처리장치
US5830277A (en) * 1995-05-26 1998-11-03 Mattson Technology, Inc. Thermal processing system with supplemental resistive heater and shielded optical pyrometry
JPH10261678A (ja) * 1997-03-18 1998-09-29 Fujitsu Ltd 製品の耐熱性を試験する試験装置および方法
US5902504A (en) * 1997-04-15 1999-05-11 Lucent Technologies Inc. Systems and methods for determining semiconductor wafer temperature and calibrating a vapor deposition device
KR100252041B1 (ko) * 1997-10-30 2000-04-15 윤종용 캐리어 내에서의 웨이퍼 로딩 상태 검출장치 및 방법
JP2000011470A (ja) * 1998-06-23 2000-01-14 Tdk Corp 樹脂ディスクの機械特性測定方法および光ディスクの機械特性測定方法
US6188323B1 (en) * 1998-10-15 2001-02-13 Asyst Technologies, Inc. Wafer mapping system
US6303411B1 (en) 1999-05-03 2001-10-16 Vortek Industries Ltd. Spatially resolved temperature measurement and irradiance control
ATE349675T1 (de) * 2000-06-09 2007-01-15 Zumbach Electronic Ag Messvorrichtung für betonstabstähle
JP2002083756A (ja) * 2000-09-06 2002-03-22 Canon Inc 基板温調装置
ITMO20010248A1 (it) * 2001-12-12 2003-06-12 Expert System Solutions Srl Dilatometro ottico perfezionato
US7734439B2 (en) * 2002-06-24 2010-06-08 Mattson Technology, Inc. System and process for calibrating pyrometers in thermal processing chambers
KR101163682B1 (ko) 2002-12-20 2012-07-09 맷슨 테크날러지 캐나다 인코퍼레이티드 피가공물 지지 장치
DE10318976B3 (de) * 2003-04-26 2005-01-13 Airbus Deutschland Gmbh Verfahren zur Erkennung eines in einem vorzugsweise geschlossenen Raum eines Flugzeuges auftretenden Feuers
US7025498B2 (en) * 2003-05-30 2006-04-11 Asml Holding N.V. System and method of measuring thermal expansion
US8104951B2 (en) * 2006-07-31 2012-01-31 Applied Materials, Inc. Temperature uniformity measurements during rapid thermal processing
US8474468B2 (en) * 2006-09-30 2013-07-02 Tokyo Electron Limited Apparatus and method for thermally processing a substrate with a heated liquid
US8454356B2 (en) 2006-11-15 2013-06-04 Mattson Technology, Inc. Systems and methods for supporting a workpiece during heat-treating
US9383138B2 (en) * 2007-03-30 2016-07-05 Tokyo Electron Limited Methods and heat treatment apparatus for uniformly heating a substrate during a bake process
US7665917B2 (en) * 2007-03-30 2010-02-23 Tokyo Electron Limited Heat treatment apparatus and methods for thermally processing a substrate using a pressurized gaseous environment
US20080241400A1 (en) * 2007-03-31 2008-10-02 Tokyo Electron Limited Vacuum assist method and system for reducing intermixing of lithography layers
US20090034582A1 (en) * 2007-08-02 2009-02-05 Tokyo Electron Limited Tbs Broadcast Center Apparatus for hot plate substrate monitoring and control
US7976216B2 (en) * 2007-12-20 2011-07-12 Mattson Technology, Inc. Determining the temperature of silicon at high temperatures
US7791720B2 (en) * 2007-12-31 2010-09-07 Texas Instruments Incorporated Semiconductor manufacturing peripheral verification tool
JP4515509B2 (ja) * 2008-03-03 2010-08-04 キヤノンアネルバ株式会社 基板表面温度計測方法、及び、これを用いた基板処理装置
CN102089873A (zh) 2008-05-16 2011-06-08 加拿大马特森技术有限公司 工件破损防止方法及设备
US8109669B2 (en) * 2008-11-19 2012-02-07 Applied Materials, Inc. Temperature uniformity measurement during thermal processing
US9255941B1 (en) * 2010-05-28 2016-02-09 The United States Of America As Represented By The Administrator Of National Aeronautics And Space Administration System and method for determining fluence of a substance
JP6057812B2 (ja) 2013-04-02 2017-01-11 株式会社神戸製鋼所 処理装置及びワークの温度計測方法
KR20170023347A (ko) * 2015-08-21 2017-03-03 삼성전자주식회사 로봇 핸드의 검사 장치
EP3236492A1 (de) * 2016-04-18 2017-10-25 Meyer Burger (Germany) AG Verfahren und system zur steuerung einer vorrichtung zum greifen oder positionieren von auf einem substratträger angeordneten substraten
US9933314B2 (en) * 2016-06-30 2018-04-03 Varian Semiconductor Equipment Associates, Inc. Semiconductor workpiece temperature measurement system
US11915953B2 (en) 2020-04-17 2024-02-27 Applied Materials, Inc. Apparatus, systems, and methods of measuring edge ring distance for thermal processing chambers

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2198636A5 (zh) * 1972-09-06 1974-03-29 France Etat
US3788746A (en) * 1972-10-02 1974-01-29 Hewlett Packard Co Optical dilatometer
DE2919858A1 (de) * 1978-05-17 1979-11-22 British Steel Corp Verfahren und vorrichtung zur bestimmung der abmessungen von werkstuecken
GB2052734B (en) * 1979-05-21 1983-10-19 Daystrom Ltd Position and dimension measuring apparaus
FR2497341A1 (fr) * 1980-12-30 1982-07-02 Socles Goudrons Derives Dispositif pour mesurer la deformation d'un materiau sous l'effet de la chaleur et son application a la determination du pouvoir mouillant des brais
KR910004158B1 (en) * 1983-08-15 1991-06-22 Sinagawa Sirotenga Co Ltd Thermal deformation measuring system of ceranics and the like
CH666547A5 (de) * 1984-12-20 1988-07-29 Fischer Ag Georg Optisch-elektronisches messverfahren, eine dafuer erforderliche einrichtung und deren verwendung.
US4775236A (en) * 1985-05-03 1988-10-04 Laser Metric Systems, Inc. Laser based roundness and diameter gaging system and method of using same
JPS61270840A (ja) * 1985-05-25 1986-12-01 Koichiro Takaoka 半導体ウエハ−の温度測定方法
JPH0640078B2 (ja) * 1989-08-21 1994-05-25 品川白煉瓦株式会社 セラミツクス等の熱間における変位測定装置
US5102231A (en) * 1991-01-29 1992-04-07 Texas Instruments Incorporated Semiconductor wafer temperature measurement system and method
US5221142A (en) * 1991-05-20 1993-06-22 Peak Systems, Inc. Method and apparatus for temperature measurement using thermal expansion

Also Published As

Publication number Publication date
WO1993021656A1 (en) 1993-10-28
AU3945993A (en) 1993-11-18
US5350899A (en) 1994-09-27
KR950701456A (ko) 1995-03-23
CA2132851A1 (en) 1993-10-28
JPH07505744A (ja) 1995-06-22
JP2848704B2 (ja) 1999-01-20
EP0636276A1 (en) 1995-02-01

Similar Documents

Publication Publication Date Title
DK0553875T3 (zh)
BR9304651A (zh)
TW250452B (zh)
DK0574087T3 (zh)
DK0571874T3 (zh)
DK0571172T3 (zh)
DE9209779U1 (zh)
AU631518B2 (zh)
AU632452B2 (zh)
ECSDI920091S (zh)
BR9304980A (zh)
BRPI9204323A2 (zh)
AU2098792A (zh)
AU1849392A (zh)
CN3014437S (zh)
AU633796B1 (zh)
AU2620092A (zh)
AU2619992A (zh)
AU2527592A (zh)
AU2202592A (zh)
AU634140B1 (zh)
AU2065592A (zh)
AU2054092A (zh)
AU1935292A (zh)
AU634143B1 (zh)