TW287314B - - Google Patents

Info

Publication number
TW287314B
TW287314B TW083110217A TW83110217A TW287314B TW 287314 B TW287314 B TW 287314B TW 083110217 A TW083110217 A TW 083110217A TW 83110217 A TW83110217 A TW 83110217A TW 287314 B TW287314 B TW 287314B
Authority
TW
Taiwan
Application number
TW083110217A
Other languages
Chinese (zh)
Original Assignee
Shinetsu Chem Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chem Ind Co filed Critical Shinetsu Chem Ind Co
Application granted granted Critical
Publication of TW287314B publication Critical patent/TW287314B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
TW083110217A 1994-04-26 1994-11-04 TW287314B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8839094A JPH07297265A (en) 1994-04-26 1994-04-26 Electrostatic chuck

Publications (1)

Publication Number Publication Date
TW287314B true TW287314B (en) 1996-10-01

Family

ID=13941474

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083110217A TW287314B (en) 1994-04-26 1994-11-04

Country Status (3)

Country Link
JP (1) JPH07297265A (en)
KR (1) KR950034652A (en)
TW (1) TW287314B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7042697B2 (en) 2000-05-19 2006-05-09 Ngk Insulators, Ltd. Electrostatic chucks and electrostatically attracting structures

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09260474A (en) * 1996-03-22 1997-10-03 Sony Corp Electrostatic chuck and wafer stage
CN1127750C (en) 1996-12-27 2003-11-12 佳能株式会社 Charge-reducing film, image forming apparatus and method of manufacturing the same
JP4236292B2 (en) 1997-03-06 2009-03-11 日本碍子株式会社 Wafer adsorption apparatus and method for manufacturing the same
JPH11214491A (en) * 1998-01-22 1999-08-06 Toshiba Ceramics Co Ltd Wafer holder and production thereof
JPH11209182A (en) * 1998-01-22 1999-08-03 Sumitomo Metal Ind Ltd Plasma corrosion resistant member
WO1999059201A1 (en) * 1998-05-11 1999-11-18 Applied Materials Inc Polished ceramic chuck for low backside particles in semiconductor plasma processing
WO2001013423A1 (en) * 1999-08-10 2001-02-22 Ibiden Co., Ltd. Semiconductor production device ceramic plate
JP4529690B2 (en) * 2000-01-20 2010-08-25 住友電気工業株式会社 Wafer holder for semiconductor manufacturing apparatus, manufacturing method thereof, and semiconductor manufacturing apparatus
JP2002057207A (en) * 2000-01-20 2002-02-22 Sumitomo Electric Ind Ltd Wafer holder for semiconductor-manufacturing apparatus, manufacturing method of the same and the semiconductor-manufacturing apparatus
JP4272786B2 (en) * 2000-01-21 2009-06-03 トーカロ株式会社 Electrostatic chuck member and manufacturing method thereof
JP3808286B2 (en) * 2000-06-07 2006-08-09 住友大阪セメント株式会社 Electrostatic chuck
JP3693895B2 (en) 2000-07-24 2005-09-14 住友大阪セメント株式会社 Flexible film electrostatic adsorption apparatus, flexible film electrostatic adsorption method, and flexible film surface treatment method
KR20020064508A (en) * 2001-02-02 2002-08-09 삼성전자 주식회사 Electrostatic chuck
JP4493251B2 (en) 2001-12-04 2010-06-30 Ｔｏｔｏ株式会社 Electrostatic chuck module and substrate processing apparatus
DE10232080B4 (en) * 2002-07-15 2015-10-01 Integrated Dynamics Engineering Gmbh Electrostatic gripper and method for its production
EP1676309A1 (en) * 2003-10-09 2006-07-05 SNT Co., Ltd. Electro-static chuck with non-sintered aln and a method of preparing the same
JP2007150351A (en) * 2007-02-15 2007-06-14 Toto Ltd Electrostatic chuck
JP5270310B2 (en) * 2008-11-13 2013-08-21 東京エレクトロン株式会社 Electrostatic chuck and substrate processing apparatus
JP2010166086A (en) * 2010-04-12 2010-07-29 Fujitsu Semiconductor Ltd Semiconductor manufacturing apparatus using electrostatic chuck
JP2010177698A (en) * 2010-04-12 2010-08-12 Fujitsu Semiconductor Ltd Method for manufacturing electrostatic chuck
JP6038698B2 (en) 2013-03-22 2016-12-07 日本碍子株式会社 Ceramic member and member for semiconductor manufacturing equipment
WO2015080135A1 (en) * 2013-11-29 2015-06-04 株式会社東芝 Plasma device part and manufacturing method therefor
JP5926870B1 (en) 2014-09-16 2016-05-25 日本碍子株式会社 Ceramic structure, member for substrate holding device, and method for producing ceramic structure
JP7140183B2 (en) * 2018-02-20 2022-09-21 住友大阪セメント株式会社 Electrostatic chuck device and method for manufacturing electrostatic chuck device
KR102632768B1 (en) * 2019-06-28 2024-02-01 엔지케이 인슐레이터 엘티디 wafer placement table
US20230245918A1 (en) * 2020-07-13 2023-08-03 Kyocera Corporation Sample holder

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7042697B2 (en) 2000-05-19 2006-05-09 Ngk Insulators, Ltd. Electrostatic chucks and electrostatically attracting structures

Also Published As

Publication number Publication date
JPH07297265A (en) 1995-11-10
KR950034652A (en) 1995-12-28

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