TW284908B - - Google Patents
Info
- Publication number
- TW284908B TW284908B TW082100635A TW82100635A TW284908B TW 284908 B TW284908 B TW 284908B TW 082100635 A TW082100635 A TW 082100635A TW 82100635 A TW82100635 A TW 82100635A TW 284908 B TW284908 B TW 284908B
- Authority
- TW
- Taiwan
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B31/00—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor
- C30B31/06—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor by contacting with diffusion material in the gaseous state
- C30B31/16—Feed and outlet means for the gases; Modifying the flow of the gases
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
- H01L21/223—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a gaseous phase
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4040747A JPH05217929A (ja) | 1992-01-31 | 1992-01-31 | 酸化拡散処理装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW284908B true TW284908B (en:Method) | 1996-09-01 |
Family
ID=12589230
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW082100635A TW284908B (en:Method) | 1992-01-31 | 1993-02-01 |
Country Status (4)
Country | Link |
---|---|
US (1) | US5330352A (en:Method) |
JP (1) | JPH05217929A (en:Method) |
KR (1) | KR100228254B1 (en:Method) |
TW (1) | TW284908B (en:Method) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5662469A (en) * | 1991-12-13 | 1997-09-02 | Tokyo Electron Tohoku Kabushiki Kaisha | Heat treatment method |
US5429498A (en) * | 1991-12-13 | 1995-07-04 | Tokyo Electron Sagami Kabushiki Kaisha | Heat treatment method and apparatus thereof |
US5480300A (en) * | 1992-05-15 | 1996-01-02 | Shin-Etsu Quartz Products Co. Ltd. | Vertical heat-treating apparatus and heat insulator |
US5445521A (en) * | 1993-05-31 | 1995-08-29 | Tokyo Electron Kabushiki Kaisha | Heat treating method and device |
US5417803A (en) * | 1993-09-29 | 1995-05-23 | Intel Corporation | Method for making Si/SiC composite material |
KR0161417B1 (ko) * | 1995-07-11 | 1999-02-01 | 김광호 | 가스흐름이 개선된 종형확산로 |
JP3471144B2 (ja) * | 1995-09-06 | 2003-11-25 | 東京エレクトロン株式会社 | 縦型熱処理装置及びその断熱構造体並びに遮熱板 |
US5605454A (en) * | 1995-10-12 | 1997-02-25 | Vlsi Technology, Inc. | Four port tube to extend the life of quartz tubes used for the well drive process |
FR2747402B1 (fr) * | 1996-04-15 | 1998-05-22 | Sgs Thomson Microelectronics | Four a diffusion |
DE29611438U1 (de) * | 1996-06-18 | 1996-09-05 | Rohde, Jörn, 10707 Berlin | Golfschlägerschaft |
DE19626355A1 (de) * | 1996-06-18 | 1998-01-15 | Joern Rohde | Golfschlägerschaft |
JP3270730B2 (ja) | 1997-03-21 | 2002-04-02 | 株式会社日立国際電気 | 基板処理装置及び基板処理方法 |
JP3396431B2 (ja) * | 1998-08-10 | 2003-04-14 | 東京エレクトロン株式会社 | 酸化処理方法および酸化処理装置 |
JP3644880B2 (ja) * | 2000-06-20 | 2005-05-11 | 東京エレクトロン株式会社 | 縦型熱処理装置 |
JP4633269B2 (ja) * | 2001-01-15 | 2011-02-16 | 株式会社日立国際電気 | 基板処理装置及び半導体装置の製造方法 |
US7128570B2 (en) * | 2004-01-21 | 2006-10-31 | Asm International N.V. | Method and apparatus for purging seals in a thermal reactor |
JP4508893B2 (ja) * | 2004-02-02 | 2010-07-21 | エーエスエム インターナショナル エヌ.ヴェー. | 半導体処理方法、半導体処理システム及び反応チャンバにガスを供給する方法 |
US7351057B2 (en) * | 2005-04-27 | 2008-04-01 | Asm International N.V. | Door plate for furnace |
US7795157B2 (en) * | 2006-08-04 | 2010-09-14 | Hitachi Kokusai Electric, Inc. | Substrate treatment device and manufacturing method of semiconductor device |
JP2012195565A (ja) * | 2011-02-28 | 2012-10-11 | Hitachi Kokusai Electric Inc | 基板処理装置、基板処理方法及び半導体装置の製造方法 |
KR101879175B1 (ko) * | 2011-10-20 | 2018-08-20 | 삼성전자주식회사 | 화학 기상 증착 장치 |
US10208380B2 (en) * | 2015-12-04 | 2019-02-19 | Applied Materials, Inc. | Advanced coating method and materials to prevent HDP-CVD chamber arcing |
US10490431B2 (en) * | 2017-03-10 | 2019-11-26 | Yield Engineering Systems, Inc. | Combination vacuum and over-pressure process chamber and methods related thereto |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0815144B2 (ja) * | 1986-04-18 | 1996-02-14 | 株式会社日立製作所 | 縦型処理装置 |
KR890008922A (ko) * | 1987-11-21 | 1989-07-13 | 후세 노보루 | 열처리 장치 |
US4943235A (en) * | 1987-11-27 | 1990-07-24 | Tel Sagami Limited | Heat-treating apparatus |
JP2654996B2 (ja) * | 1988-08-17 | 1997-09-17 | 東京エレクトロン株式会社 | 縦型熱処理装置 |
KR0147044B1 (ko) * | 1990-01-23 | 1998-11-02 | 카자마 젠쥬 | 배기 시스템을 가지는 열처리장치 |
JPH03249178A (ja) * | 1990-02-27 | 1991-11-07 | Ulvac B T U Kk | Cvd装置 |
JP3007432B2 (ja) * | 1991-02-19 | 2000-02-07 | 東京エレクトロン株式会社 | 熱処理装置 |
JP3108459B2 (ja) * | 1991-02-26 | 2000-11-13 | 東京エレクトロン株式会社 | 縦型熱処理装置 |
JP3108460B2 (ja) * | 1991-02-26 | 2000-11-13 | 東京エレクトロン株式会社 | 縦型熱処理装置 |
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1992
- 1992-01-31 JP JP4040747A patent/JPH05217929A/ja active Pending
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1993
- 1993-01-29 KR KR1019930001172A patent/KR100228254B1/ko not_active Expired - Fee Related
- 1993-01-29 US US08/011,372 patent/US5330352A/en not_active Expired - Lifetime
- 1993-02-01 TW TW082100635A patent/TW284908B/zh active
Also Published As
Publication number | Publication date |
---|---|
KR100228254B1 (ko) | 1999-11-01 |
KR930016142A (ko) | 1993-08-26 |
JPH05217929A (ja) | 1993-08-27 |
US5330352A (en) | 1994-07-19 |