TW279264B - Fabrication method of capacitor for DRAM cell - Google Patents

Fabrication method of capacitor for DRAM cell

Info

Publication number
TW279264B
TW279264B TW83110363A TW83110363A TW279264B TW 279264 B TW279264 B TW 279264B TW 83110363 A TW83110363 A TW 83110363A TW 83110363 A TW83110363 A TW 83110363A TW 279264 B TW279264 B TW 279264B
Authority
TW
Taiwan
Prior art keywords
layer
forming
masking
masking layer
conductive
Prior art date
Application number
TW83110363A
Other languages
Chinese (zh)
Inventor
Yuan-Ding Horng
Jenn-Chyou Shyu
Jyh-Shyang Jeng
Lih-Jer Chen
Original Assignee
United Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Microelectronics Corp filed Critical United Microelectronics Corp
Priority to TW83110363A priority Critical patent/TW279264B/en
Application granted granted Critical
Publication of TW279264B publication Critical patent/TW279264B/en

Links

Landscapes

  • Semiconductor Memories (AREA)

Abstract

A fabrication method of capacitor for DRAM cell, that is applicable to substrate with formed MOS transistor, comprises the steps of: forming insulator on the above substrate; forming the first masking layer on the above insulator; forming contact window contacting with either one of drain and source area of the above MOS transistor on the above first masking layer and insulator; in sequence forming the first conductive layer and the second masking layer on the above contact window and the first masking layer, and making the above first conductive layer and the second masking layer be formed with lateral side; forming the second conductive sidewall spacer on lateral side of the above first conductive layer and the second masking layer; removing the above first masking layer and the second masking material; forming dielectric layer on the above first conductive layer and the second conductive sidewall spacer surface; forming the second conductive layer on the above dielectric layer surface.
TW83110363A 1994-11-09 1994-11-09 Fabrication method of capacitor for DRAM cell TW279264B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW83110363A TW279264B (en) 1994-11-09 1994-11-09 Fabrication method of capacitor for DRAM cell

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW83110363A TW279264B (en) 1994-11-09 1994-11-09 Fabrication method of capacitor for DRAM cell

Publications (1)

Publication Number Publication Date
TW279264B true TW279264B (en) 1996-06-21

Family

ID=51397509

Family Applications (1)

Application Number Title Priority Date Filing Date
TW83110363A TW279264B (en) 1994-11-09 1994-11-09 Fabrication method of capacitor for DRAM cell

Country Status (1)

Country Link
TW (1) TW279264B (en)

Similar Documents

Publication Publication Date Title
EP0386947A3 (en) Dynamic random access memory cell
EP0052989A3 (en) Method of fabricating a semiconductor device
KR950021651A (en) Dynamic Random Access Memory Cell Manufacturing Method
TW359868B (en) DRAM capacitors and production process therefor
TW279264B (en) Fabrication method of capacitor for DRAM cell
TW359037B (en) Manufacturing method for DRAM capacitors
JPS6411360A (en) Semiconductor memory device
TW346672B (en) Method for fabricating a semiconductor memory cell in a DRAM
TW262587B (en) Process for capacitor structure of DRAM
TW258834B (en) Process of capacitor for DRAM cell
TW354426B (en) Method for manufacturing a DRAM capacitor
KR960009113B1 (en) Method for forming node electrode of capacitor
JPS6439762A (en) Insulated-gate memory cell and manufacture thereof
KR930015005A (en) Manufacturing method of DRAM cell
KR970054134A (en) Semiconductor device manufacturing method
TW351017B (en) Method of manufacturing of the structure forming DRAM capacitors
TW375790B (en) Process for fabricating crown capacitor for DRAM
TW278238B (en) Fabrication method of DRAM stacked capacitor
TW275147B (en) Method for manufacturing a stacked capacitor
TW239234B (en) Process of DRAM
KR940003035A (en) DRAM Cell Structure and Manufacturing Method
TW272318B (en) Fabricating method for capacitor structure of DRAM
KR960043203A (en) Manufacturing Method of Semiconductor Device
TW366552B (en) Method of manufacturing DRAM capacitor components
TW290738B (en) Fabrication method of capacitor for DRAM