TW278249B - - Google Patents

Info

Publication number
TW278249B
TW278249B TW084108715A TW84108715A TW278249B TW 278249 B TW278249 B TW 278249B TW 084108715 A TW084108715 A TW 084108715A TW 84108715 A TW84108715 A TW 84108715A TW 278249 B TW278249 B TW 278249B
Authority
TW
Taiwan
Application number
TW084108715A
Other languages
Chinese (zh)
Original Assignee
Casio Computer Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Casio Computer Co Ltd filed Critical Casio Computer Co Ltd
Application granted granted Critical
Publication of TW278249B publication Critical patent/TW278249B/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66477Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66742Thin film unipolar transistors
    • H01L29/6675Amorphous silicon or polysilicon transistors
    • H01L29/66765Lateral single gate single channel transistors with inverted structure, i.e. the channel layer is formed after the gate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78606Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
    • H01L29/78609Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device for preventing leakage current

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Thin Film Transistor (AREA)
TW084108715A 1994-08-23 1995-08-21 TW278249B (xx)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21956794A JP3412277B2 (ja) 1994-08-23 1994-08-23 薄膜トランジスタおよびその製造方法

Publications (1)

Publication Number Publication Date
TW278249B true TW278249B (xx) 1996-06-11

Family

ID=16737541

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084108715A TW278249B (xx) 1994-08-23 1995-08-21

Country Status (4)

Country Link
US (1) US5757028A (xx)
JP (1) JP3412277B2 (xx)
KR (1) KR100200512B1 (xx)
TW (1) TW278249B (xx)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6323034B1 (en) * 1999-08-12 2001-11-27 Industrial Technology Research Institute Amorphous TFT process
TW577176B (en) * 2003-03-31 2004-02-21 Ind Tech Res Inst Structure of thin-film transistor, and the manufacturing method thereof
TWI243484B (en) * 2004-12-10 2005-11-11 Au Optronics Corp Thin film transistor and method of making the same
JP4579012B2 (ja) * 2005-03-03 2010-11-10 シャープ株式会社 液晶表示装置の製造方法
TWI345313B (en) * 2005-09-05 2011-07-11 Au Optronics Corp Thin film transistor and method of manufacturing the same
KR101261609B1 (ko) * 2006-07-06 2013-05-06 삼성디스플레이 주식회사 박막 트랜지스터, 표시판 및 그 제조 방법
KR100701826B1 (ko) * 2006-12-29 2007-03-30 석우엔지니어링 주식회사 공동주택용 전기단자함
JP5428404B2 (ja) * 2009-03-09 2014-02-26 カシオ計算機株式会社 薄膜トランジスタ及び薄膜トランジスタの製造方法
CN107195328B (zh) * 2009-10-09 2020-11-10 株式会社半导体能源研究所 移位寄存器和显示装置以及其驱动方法
KR101836067B1 (ko) * 2009-12-21 2018-03-08 가부시키가이샤 한도오따이 에네루기 켄큐쇼 박막 트랜지스터와 그 제작 방법
TWI469356B (zh) * 2010-03-03 2015-01-11 Au Optronics Corp 薄膜電晶體及其製造方法
CN101794713A (zh) * 2010-03-18 2010-08-04 友达光电股份有限公司 薄膜晶体管及其制造方法
JP5931573B2 (ja) * 2011-05-13 2016-06-08 株式会社半導体エネルギー研究所 半導体装置の作製方法
US10032924B2 (en) * 2014-03-31 2018-07-24 The Hong Kong University Of Science And Technology Metal oxide thin film transistor with channel, source and drain regions respectively capped with covers of different gas permeability
US10504939B2 (en) 2017-02-21 2019-12-10 The Hong Kong University Of Science And Technology Integration of silicon thin-film transistors and metal-oxide thin film transistors

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61208876A (ja) * 1985-03-14 1986-09-17 Sony Corp 薄膜トランジスタ
JPH0611060B2 (ja) * 1987-08-21 1994-02-09 日本電気株式会社 薄膜トランジスタの製造方法
JPH01302769A (ja) * 1988-05-30 1989-12-06 Seikosha Co Ltd 逆スタガー型シリコン薄膜トランジスタの製造方法
JPH02109341A (ja) * 1988-10-19 1990-04-23 Fuji Xerox Co Ltd 薄膜トランジスタの製造方法

Also Published As

Publication number Publication date
KR960009075A (ko) 1996-03-22
US5757028A (en) 1998-05-26
JPH0864835A (ja) 1996-03-08
KR100200512B1 (ko) 1999-06-15
JP3412277B2 (ja) 2003-06-03

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Legal Events

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