TW274146B - - Google Patents

Info

Publication number
TW274146B
TW274146B TW082106942A TW82106942A TW274146B TW 274146 B TW274146 B TW 274146B TW 082106942 A TW082106942 A TW 082106942A TW 82106942 A TW82106942 A TW 82106942A TW 274146 B TW274146 B TW 274146B
Authority
TW
Taiwan
Application number
TW082106942A
Other languages
Chinese (zh)
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Application granted granted Critical
Publication of TW274146B publication Critical patent/TW274146B/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/22Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
    • H01L21/225Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a solid phase, e.g. a doped oxide layer
    • H01L21/2251Diffusion into or out of group IV semiconductors
    • H01L21/2252Diffusion into or out of group IV semiconductors using predeposition of impurities into the semiconductor surface, e.g. from a gaseous phase
    • H01L21/2253Diffusion into or out of group IV semiconductors using predeposition of impurities into the semiconductor surface, e.g. from a gaseous phase by ion implantation
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01Manufacture or treatment
    • H10D84/0123Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
    • H10D84/0126Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
    • H10D84/0165Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs the components including complementary IGFETs, e.g. CMOS devices
    • H10D84/0191Manufacturing their doped wells
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01Manufacture or treatment
    • H10D84/02Manufacture or treatment characterised by using material-based technologies
    • H10D84/03Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/82Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
    • H10D84/83Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
    • H10D84/85Complementary IGFETs, e.g. CMOS
    • H10D84/859Complementary IGFETs, e.g. CMOS comprising both N-type and P-type wells, e.g. twin-tub
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/112Nitridation, direct, of silicon

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Element Separation (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Thyristors (AREA)
TW082106942A 1992-04-16 1993-08-27 TW274146B (en, 2012)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/869,423 US5256563A (en) 1992-04-16 1992-04-16 Doped well structure and method for semiconductor technologies

Publications (1)

Publication Number Publication Date
TW274146B true TW274146B (en, 2012) 1996-04-11

Family

ID=25353533

Family Applications (1)

Application Number Title Priority Date Filing Date
TW082106942A TW274146B (en, 2012) 1992-04-16 1993-08-27

Country Status (6)

Country Link
US (1) US5256563A (en, 2012)
EP (1) EP0565936B1 (en, 2012)
JP (1) JPH0645543A (en, 2012)
KR (1) KR940006261A (en, 2012)
DE (1) DE69331358T2 (en, 2012)
TW (1) TW274146B (en, 2012)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5420056A (en) * 1994-01-14 1995-05-30 Texas Instruments Incorporated Junction contact process and structure for semiconductor technologies
US5455204A (en) * 1994-12-12 1995-10-03 International Business Machines Corporation Thin capacitor dielectric by rapid thermal processing
US5643825A (en) * 1994-12-29 1997-07-01 Advanced Micro Devices, Inc. Integrated circuit isolation process
US5583062A (en) * 1995-06-07 1996-12-10 Lsi Logic Corporation Self-aligned twin well process having a SiO2 -polysilicon-SiO2 barrier mask
KR0179831B1 (ko) * 1995-07-27 1999-03-20 문정환 반도체 소자의 웰 형성방법
US5891809A (en) * 1995-09-29 1999-04-06 Intel Corporation Manufacturable dielectric formed using multiple oxidation and anneal steps
US5679588A (en) * 1995-10-05 1997-10-21 Integrated Device Technology, Inc. Method for fabricating P-wells and N-wells having optimized field and active regions
US5776816A (en) * 1996-10-28 1998-07-07 Holtek Microelectronics, Inc. Nitride double etching for twin well align
US6110803A (en) * 1998-12-10 2000-08-29 United Microelectronics Corp. Method for fabricating a high-bias device
US8003455B2 (en) * 2009-05-21 2011-08-23 International Business Machines Corporation Implantation using a hardmask

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2199694A (en) * 1986-12-23 1988-07-13 Philips Electronic Associated A method of manufacturing a semiconductor device
US4786609A (en) * 1987-10-05 1988-11-22 North American Philips Corporation, Signetics Division Method of fabricating field-effect transistor utilizing improved gate sidewall spacers
IT1223571B (it) * 1987-12-21 1990-09-19 Sgs Thomson Microelectronics Procedimento per la fabbricazione di dispositivi integrati cmos con lunghezze di porta ridotte

Also Published As

Publication number Publication date
EP0565936B1 (en) 2001-12-19
KR940006261A (ko) 1994-03-23
DE69331358T2 (de) 2002-08-14
US5256563A (en) 1993-10-26
EP0565936A1 (en) 1993-10-20
JPH0645543A (ja) 1994-02-18
DE69331358D1 (de) 2002-01-31

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees